Intel

EP4CE6E22C6N - Cyclone IV E FPGA, 6K LE, 144-EQFP | Intel / Altera

MPN: EP4CE6E22C6N ✓ Aktif

1.2 V Vdss 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) Package 10 Speed 270 Kbits Memory

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EP4CE6E22C6N Ringkasan

The Intel (formerly Altera) EP4CE6E22C6N is a Cyclone IV E low-power, low-cost FPGA delivering 6,272 logic elements, 392 Kbits of embedded memory, and 91 user I/Os in a 144-pin Plastic Enhanced QFP (EQFP-144) package. Built on a 60 nm process and operating from a 1.2 V core supply, it targets cost-sensitive volume applications that require moderate logic density and DSP capability without the BOM cost of larger Cyclone families.

A field-programmable gate array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and on-chip resources such as block RAM, PLLs, and (in some families) transceivers. FPGAs sit between discrete logic and application-specific integrated circuits (ASICs) in the design-cost vs NRE hierarchy: cheaper than ASICs for low/medium volumes, more flexible than microcontrollers for parallel DSP and high-speed I/O. The Cyclone IV E family is Intel's mainstream low-power FPGA line, succeeding Cyclone III with up to 30% lower power and additional hard memory blocks. Within the family, the EP4CE6 sits at the low end of the logic-density range, designed for I/O-rich designs that do not need massive fabric.

Key features of the EP4CE6E22C6N include 6,272 logic elements (LEs), 270 Kbits (approximately 33.75 KBytes) of M9K embedded RAM, 15 embedded 18x18 multipliers (DSP blocks), 2 general-purpose PLLs, and 4 user I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device also exposes a 50 MHz internal oscillator for simple boot designs and supports configuration via JTAG, Active Serial (AS), and Passive Serial (PS) modes from EPCS or EPCQ flash. Its 60 nm low-k process and 1.2 V core voltage (VCCINT) deliver static power roughly 25-50% lower than Cyclone III.

Typical applications include industrial control and motor drive, low-cost video processing (consumer LCD/LED controllers), USB/Ethernet bridging, LED lighting controllers, automotive infotainment sub-modules, and education/hobby prototyping boards. The 144-pin EQFP package is also attractive for hand-solder-friendly prototypes and small-batch manufacturing where BGA packages are impractical.

When designing with this device, ensure VCCINT decoupling uses 0.1 uF and 10 uF ceramics per bank, and respect VCCIO bank voltage grouping (1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V) to avoid contention. For volume production, confirm lifetime supply status with Intel, since Cyclone IV E parts have transitioned from new product introduction to mature long-term-supply mode.

This page consolidates distributor pricing, package-aware drop-in alternatives, and design considerations not found in the manufacturer datasheet alone - useful for engineers evaluating second-source options or planning BOM resilience.

Alternatif penggantian untuk EP4CE6E22C6N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EP4CE6E22C6N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Speed Grade, Family, Operating Temperature.

EP4CE10E22C8N

Intel

Package: 144-LQFP Exposed Pad (E22)

Process Technology: 60 nm low-power

Speed Grade: 8