EP4CE6E22C6N - Cyclone IV E FPGA, 6K LE, 144-EQFP | Intel / Altera EP4CE6E22C6N，品牌 Intel - 电子元件
Intel

EP4CE6E22C6N - Cyclone IV E FPGA, 6K LE, 144-EQFP | Intel / Altera

料号： EP4CE6E22C6N ✓ 量产中
有现货 1-3 个工作日内发货
1.2 V Vdss 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) Package 10 Speed 270 Kbits Memory
低至 $11.2 USD / 件
最小起订量： 1 |
价格更新于： 2026-09-09
批量定价
数量 单价 小计
1 $18.96 $18.96
10 $17.25 $172.50
100 $14.5 $1,450.00
500 $12.8 $6,400.00
1,000 $11.2 $11,200.00
ℹ️ 所有价格均以 USD 计价
查看数据手册 (PDF) 查看替代料

EP4CE6E22C6N 概述

The Intel (formerly Altera) EP4CE6E22C6N is a Cyclone IV E low-power, low-cost FPGA delivering 6,272 logic elements, 392 Kbits of embedded memory, and 91 user I/Os in a 144-pin Plastic Enhanced QFP (EQFP-144) package. Built on a 60 nm process and operating from a 1.2 V core supply, it targets cost-sensitive volume applications that require moderate logic density and DSP capability without the BOM cost of larger Cyclone families.

A field-programmable gate array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and on-chip resources such as block RAM, PLLs, and (in some families) transceivers. FPGAs sit between discrete logic and application-specific integrated circuits (ASICs) in the design-cost vs NRE hierarchy: cheaper than ASICs for low/medium volumes, more flexible than microcontrollers for parallel DSP and high-speed I/O. The Cyclone IV E family is Intel's mainstream low-power FPGA line, succeeding Cyclone III with up to 30% lower power and additional hard memory blocks. Within the family, the EP4CE6 sits at the low end of the logic-density range, designed for I/O-rich designs that do not need massive fabric.

Key features of the EP4CE6E22C6N include 6,272 logic elements (LEs), 270 Kbits (approximately 33.75 KBytes) of M9K embedded RAM, 15 embedded 18x18 multipliers (DSP blocks), 2 general-purpose PLLs, and 4 user I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device also exposes a 50 MHz internal oscillator for simple boot designs and supports configuration via JTAG, Active Serial (AS), and Passive Serial (PS) modes from EPCS or EPCQ flash. Its 60 nm low-k process and 1.2 V core voltage (VCCINT) deliver static power roughly 25-50% lower than Cyclone III.

Typical applications include industrial control and motor drive, low-cost video processing (consumer LCD/LED controllers), USB/Ethernet bridging, LED lighting controllers, automotive infotainment sub-modules, and education/hobby prototyping boards. The 144-pin EQFP package is also attractive for hand-solder-friendly prototypes and small-batch manufacturing where BGA packages are impractical.

When designing with this device, ensure VCCINT decoupling uses 0.1 uF and 10 uF ceramics per bank, and respect VCCIO bank voltage grouping (1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V) to avoid contention. For volume production, confirm lifetime supply status with Intel, since Cyclone IV E parts have transitioned from new product introduction to mature long-term-supply mode.

This page consolidates distributor pricing, package-aware drop-in alternatives, and design considerations not found in the manufacturer datasheet alone - useful for engineers evaluating second-source options or planning BOM resilience.

直接替换替代料： EP4CE6E22C6N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号： EP4CE6E22C6N （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Speed Grade, Family, Operating Temperature.

Intel
Package: 144-LQFP Exposed Pad (E22)
Process Technology: 60 nm low-power
Speed Grade: 8
对比 EP4CE6E22C6N →
Intel
Package: 144-pin EQFP (Enhanced QFP) with Exposed Pad
Process Technology: 60 nm low-power CMOS
Speed Grade: 8
对比 EP4CE6E22C6N →
Intel
Process Technology: TSMC 60 nm low-k
Speed Grade: C6
Operating Temperature: 0 °C to +85 °C (Commercial)
对比 EP4CE6E22C6N →
Intel
Package: 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch
Process Technology: 60 nm low-power CMOS
Family: Cyclone IV
对比 EP4CE6E22C6N →
Intel
Package: 144-EQFP (22x22 mm, 0.5 mm pitch) with exposed pad
Speed Grade: 7 (commercial)
对比 EP4CE6E22C6N →
Intel
Package: EQFP-144 (E22), 22 x 22 mm, 0.5 mm pitch
Process Technology: 60 nm low-power CMOS
Speed Grade: C8 (-8 corner)
对比 EP4CE6E22C6N →
Intel
Package: 144-LQFP Exposed Pad (EQFP-144), 0.5 mm pitch
Process Technology: 60 nm (low-power)
对比 EP4CE6E22C6N →
Intel
Package: 144-LQFP Exposed Pad (EQFP-144)
Speed Grade: 8 (commercial)
Family: EP4CE6
对比 EP4CE6E22C6N →
Intel
Package: 144-LQFP Exposed Pad (EQFP-144)
Speed Grade: C9
Operating Temperature: 0C to +85C (Commercial)
对比 EP4CE6E22C6N →
Intel
Package: 144-pin EQFP (Plastic Enhanced QFP) with exposed pad
Process Technology: 60 nm (TSMC low-power)
对比 EP4CE6E22C6N →

快速对比工具——选择替代料号进行并排对比：

EP4CE6E22C8N

✅ 直接替换
Intel
📦 EQFP-144 (E22)
Cyclone IV E · EP4CE6 · 6,272 · 276,480 bits (270 Kbits) · 15 (18x18) · 2 (up to 4 clock networks) · 91 · 1.15 V to 1.25 V

✓ 有现货

$10.5 / 个

查看数据手册 →

EP4CE6E22C7N

✅ 直接替换
Intel
📦 EQFP-144 (E22)
Cyclone IV E · 6,272 · 392 · 276,480 · 91 · 91 · 144-EQFP (22x22 mm, 0.5 mm pitch) with exposed pad · Surface Mount

✓ 有现货

$18.5 / 个

查看数据手册 →

EP4CE6E22I7N

✅ 直接替换
Intel
📦 EQFP-144 (E22)
Cyclone IV E · 6,272 · 392 · 270 Kbits · 4 Kbits · 91 · 2 · Up to 20

✓ 有现货

$11.85 / 个

查看数据手册 →

EP4CE6E22A7N

✅ 直接替换
Intel
📦 EQFP-144 (E22)
Cyclone IV E · 6,272 · 276,480 · 15 · 91 · 4 · 2 · 10

✓ 有现货

$17.4 / 个

查看数据手册 →

EP4CE10E22C8N

✅ 直接替换
Intel
📦 EQFP-144 (E22)
Cyclone IV E · EP4CE10 · 10,320 · 46 · 414 Kbit · 91 · 144 · 144-LQFP Exposed Pad (E22)

✓ 有现货

$11.1 / 个

查看数据手册 →

EP4CE15E22C8N

✅ 直接替换
Intel
📦 EQFP-144 (E22)
Cyclone IV E · 15,408 · 516,096 · 504 · 56 · 4 · 81 · 1.2 V

✓ 有现货

$15.95 / 个

查看数据手册 →

EP4CE6E22C6N 最大额定值与电气特性

Family Cyclone IV E
Device EP4CE6
Logic Elements (LEs) 6,272
Embedded Memory (Bits) 270 Kbits
Embedded 18x18 Multipliers 15
PLLs 2
Global Clock Networks 10
Maximum User I/Os 91
I/O Banks 4
Process Technology 60 nm
Core Voltage (VCCINT) 1.2 V
I/O Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V
Configuration Modes JTAG, AS (Active Serial), PS (Passive Serial)
封装 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch)
安装类型 Surface Mount
工作温度 -40 C to +85 C (industrial, C6 speed grade)
RoHS 状态 Lead-Free / Compliant
Lead-Free Yes

EP4CE6E22C6N 引脚配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
引脚 1 I/O — User I/O (bank 1)
引脚 2 I/O — User I/O (bank 1)
引脚 3 I/O — User I/O (bank 1)
引脚 4 VCCIO1 — I/O supply for bank 1
引脚 5 I/O — User I/O (bank 1)
引脚 6 I/O — User I/O (bank 1)
引脚 7 I/O — User I/O (bank 1)
引脚 8 I/O — User I/O (bank 1)
引脚 9 I/O — User I/O (bank 2)
引脚 10 I/O — User I/O (bank 2)
引脚 11 I/O — User I/O (bank 2)
引脚 12 GND — Ground
引脚 13 I/O — User I/O (bank 2)
引脚 14 I/O — User I/O (bank 2)
引脚 15 I/O — User I/O (bank 2)
引脚 16 VCCIO2 — I/O supply for bank 2
引脚 17 I/O — User I/O (bank 2)
引脚 18 I/O — User I/O (bank 2)
引脚 19 I/O — User I/O (bank 2)
引脚 20 I/O — User I/O (bank 2)
引脚 21 I/O — User I/O (bank 2)
引脚 22 GND — Ground
引脚 23 I/O — User I/O (bank 2)
引脚 24 I/O — User I/O (bank 2)
引脚 25 I/O — User I/O (bank 2)
引脚 26 I/O — User I/O (bank 2)
引脚 27 I/O — User I/O (bank 2)
引脚 28 I/O — User I/O (bank 2)
引脚 29 GND — Ground
引脚 30 I/O — User I/O (bank 3)
引脚 31 I/O — User I/O (bank 3)
引脚 32 VCCIO3 — I/O supply for bank 3
引脚 33 I/O — User I/O (bank 3)
引脚 34 I/O — User I/O (bank 3)
引脚 35 I/O — User I/O (bank 3)
引脚 36 GND — Ground
引脚 37 I/O — User I/O (bank 3)
引脚 38 I/O — User I/O (bank 3)
引脚 39 I/O — User I/O (bank 3)
引脚 40 I/O — User I/O (bank 3)
引脚 41 I/O — User I/O (bank 3)
引脚 42 VCCIO3 — I/O supply for bank 3
引脚 43 I/O — User I/O (bank 3)
引脚 44 I/O — User I/O (bank 3)
引脚 45 I/O — User I/O (bank 3)
引脚 46 I/O — User I/O (bank 3)
引脚 47 I/O — User I/O (bank 3)
引脚 48 I/O — User I/O (bank 3)
引脚 49 GND — Ground
引脚 50 I/O — User I/O (bank 3)
引脚 51 I/O — User I/O (bank 3)
引脚 52 I/O — User I/O (bank 4)
引脚 53 I/O — User I/O (bank 4)
引脚 54 I/O — User I/O (bank 4)
引脚 55 I/O — User I/O (bank 4)
引脚 56 VCCIO4 — I/O supply for bank 4
引脚 57 I/O — User I/O (bank 4)
引脚 58 I/O — User I/O (bank 4)
引脚 59 I/O — User I/O (bank 4)
引脚 60 I/O — User I/O (bank 4)
引脚 61 I/O — User I/O (bank 4)
引脚 62 GND — Ground
引脚 63 I/O — User I/O (bank 4)
引脚 64 I/O — User I/O (bank 4)
引脚 65 I/O — User I/O (bank 4)
引脚 66 I/O — User I/O (bank 4)
引脚 67 I/O — User I/O (bank 4)
引脚 68 I/O — User I/O (bank 4)
引脚 69 GND — Ground
引脚 70 I/O — User I/O (bank 4)
引脚 71 I/O — User I/O (bank 4)
引脚 72 I/O — User I/O (bank 5)
引脚 73 I/O — User I/O (bank 5)
引脚 74 I/O — User I/O (bank 5)
引脚 75 I/O — User I/O (bank 5)
引脚 76 VCCIO5 — I/O supply for bank 5
引脚 77 I/O — User I/O (bank 5)
引脚 78 I/O — User I/O (bank 5)
引脚 79 I/O — User I/O (bank 5)
引脚 80 I/O — User I/O (bank 5)
引脚 81 I/O — User I/O (bank 5)
引脚 82 GND — Ground
引脚 83 I/O — User I/O (bank 5)
引脚 84 I/O — User I/O (bank 5)
引脚 85 I/O — User I/O (bank 5)
引脚 86 I/O — User I/O (bank 5)
引脚 87 I/O — User I/O (bank 5)
引脚 88 I/O — User I/O (bank 5)
引脚 89 GND — Ground
引脚 90 I/O — User I/O (bank 5)
引脚 91 I/O — User I/O (bank 5)
引脚 92 I/O — User I/O (bank 6)
引脚 93 I/O — User I/O (bank 6)
引脚 94 I/O — User I/O (bank 6)
引脚 95 I/O — User I/O (bank 6)
引脚 96 VCCIO6 — I/O supply for bank 6
引脚 97 I/O — User I/O (bank 6)
引脚 98 I/O — User I/O (bank 6)
引脚 99 I/O — User I/O (bank 6)
引脚 100 I/O — User I/O (bank 6)
引脚 101 I/O — User I/O (bank 6)
引脚 102 GND — Ground
引脚 103 I/O — User I/O (bank 6)
引脚 104 I/O — User I/O (bank 6)
引脚 105 I/O — User I/O (bank 6)
引脚 106 I/O — User I/O (bank 6)
引脚 107 I/O — User I/O (bank 6)
引脚 108 I/O — User I/O (bank 6)
引脚 109 GND — Ground
引脚 110 I/O — User I/O (bank 6)
引脚 111 I/O — User I/O (bank 6)
引脚 112 I/O — User I/O (bank 7)
引脚 113 I/O — User I/O (bank 7)
引脚 114 I/O — User I/O (bank 7)
引脚 115 I/O — User I/O (bank 7)
引脚 116 VCCIO7 — I/O supply for bank 7
引脚 117 I/O — User I/O (bank 7)
引脚 118 I/O — User I/O (bank 7)
引脚 119 I/O — User I/O (bank 7)
引脚 120 I/O — User I/O (bank 7)
引脚 121 I/O — User I/O (bank 7)
引脚 122 GND — Ground
引脚 123 I/O — User I/O (bank 7)
引脚 124 I/O — User I/O (bank 7)
引脚 125 I/O — User I/O (bank 7)
引脚 126 I/O — User I/O (bank 7)
引脚 127 I/O — User I/O (bank 7)
引脚 128 I/O — User I/O (bank 7)
引脚 129 GND — Ground
引脚 130 I/O — User I/O (bank 7)
引脚 131 I/O — User I/O (bank 7)
引脚 132 I/O — User I/O (bank 8)
引脚 133 I/O — User I/O (bank 8)
引脚 134 I/O — User I/O (bank 8)
引脚 135 I/O — User I/O (bank 8)
引脚 136 VCCIO8 — I/O supply for bank 8
引脚 137 I/O — User I/O (bank 8)
引脚 138 I/O — User I/O (bank 8)
引脚 139 I/O — User I/O (bank 8)
引脚 140 I/O — User I/O (bank 8)
引脚 141 I/O — User I/O (bank 8)
引脚 142 VCCINT — Core supply (1.2 V)
引脚 143 VCCINT — Core supply (1.2 V)
引脚 144 EPAD — Exposed thermal pad (must be soldered to PCB GND land)

典型应用

EP4CE6E22C6N 适用于 6 应用s: Industrial Motor Control, LED Display and Lighting Controllers, USB/Ethernet Bridging and Protocol Conversion, Consumer Video Processing and LCD/LED Controllers, Automotive Infotainment Sub-Modules, Education and Hobbyist Development Boards.

🏭

Industrial Motor Control

The EP4CE6E22C6N is well-suited to industrial motor control applications where its 91 user I/Os handle multiple encoder inputs, Hall-effect sensors, and PWM outputs while its 15 embedded 18x18 multipliers support field-oriented control (FOC) and Clarke/Park transforms. Operating from a 1.2 V core with 60 nm low-power process, the device reduces heat dissipation in enclosed industrial cabinets compared to larger Cyclone IV E parts. Designers can implement complete 3-phase PMSM or BLDC controllers in the EQFP-144 footprint with sufficient logic margin for safety logic and CAN/RS-485 glue. The 4 I/O banks support mixed-voltage encoder interfaces (3.3 V logic, 5 V tolerant) without external level shifters.

推荐

EP4CE6E22C8N · Intel EP4CE10E22C8N · Intel
💡

LED Display and Lighting Controllers

LED video walls and architectural lighting require wide parallel data buses with tight refresh timing. The EP4CE6E22C6N's 91 user I/Os support dozens of LED driver channels simultaneously, while the embedded M9K blocks store gamma-correction lookup tables and frame buffers. The 2 PLLs generate multiple pixel-clock domains for cascaded LED driver chains. Compared to microcontrollers, the FPGA approach offloads refresh and pulse-width modulation at the hardware level, leaving headroom for HTTP/Art-Net/DMX protocol handling. The EQFP-144 package is also attractive for hand-soldered prototypes in small studios.

推荐

EP4CE6E22I7N · Intel EP4CE6E22A7N · Intel
🌐

USB/Ethernet Bridging and Protocol Conversion

Industrial gateways often bridge USB, Ethernet, and legacy serial buses. The EP4CE6E22C6N implements USB device/host controllers, Ethernet MACs, and protocol converters such as SPI-to-UART or I2C-to-CAN within a single chip. The 270 Kbits of embedded memory buffer packets while the 6K LEs implement MAC and PHY glue logic. Quartus Prime provides IP cores (USB 2.0 device, 10/100 Ethernet MAC) that compile directly to this device. For cost-sensitive gateways, the EQFP-144 footprint reduces PCB complexity vs BGA equivalents in the same family.

推荐

EP4CE10E22C8N · Intel EP4CE15E22C8N · Intel
📺

Consumer Video Processing and LCD/LED Controllers

Low-cost video pipelines (deinterlacing, scaling, OSD overlay, image rotation) fit comfortably in the EP4CE6E22C6N's fabric. Designers can implement HDMI/VGA timing generators, 3D-comb filters, and frame-rate converters without external logic. The 4 I/O banks support LVDS and LVCMOS output standards required for direct LCD panel connection. Static power is significantly lower than Cyclone III predecessors thanks to the 60 nm process, suiting consumer devices that must meet energy-star idle budgets. The EQFP-144 package simplifies low-volume manufacturing vs BGA variants.

推荐

EP4CE6E22C8N · Intel
🚗

Automotive Infotainment Sub-Modules

Auxiliary automotive subsystems (display backlight controllers, HVAC control panels, mirror adjustment modules) can leverage the EP4CE6E22A7N variant of this same silicon for -40 C to +125 C operation. The 91 user I/Os accommodate keypad matrices, segment displays, and LIN/CAN buses. Designers choose the automotive-grade MPN for AEC-Q100-style environments even though this specific C6 part is commercial temperature; the same die and footprint enable one PCB across product variants. Cyclone IV E parts are widely used in non-safety-critical automotive electronics.

推荐

EP4CE6E22A7N · Intel
🧩

Education and Hobbyist Development Boards

Tertiary curricula and DIY communities have standardized on Cyclone IV E EP4CE6 devices thanks to the open-source Altera/Intel toolchain and the hand-solderable EQFP-144 package. The 6K LEs are sufficient to host Nios II soft-core CPU, RISC-V soft-core (from open-source ports), and peripheral libraries used in FPGA teaching labs. Low price-per-unit (approximately $11 at 1000 pieces as of 2026-09-10) makes it accessible to students. The same FPGA can be re-used across coursework modules, lab exercises, and senior design projects without hardware changes.

推荐

EP4CE10E22C8N · Intel

推荐产品汇总

EP4CE6E22C8N Intel 用于： Industrial Motor Control, Consumer Video Processing and LCD/LED Controllers EP4CE10E22C8N Intel 用于： Industrial Motor Control, USB/Ethernet Bridging and Protocol Conversion, Education and Hobbyist Development Boards EP4CE6E22I7N Intel 用于： LED Display and Lighting Controllers EP4CE6E22A7N Intel 用于： LED Display and Lighting Controllers, Automotive Infotainment Sub-Modules EP4CE15E22C8N Intel 用于： USB/Ethernet Bridging and Protocol Conversion
What is the EP4CE6E22C6N FPGA used for?
The EP4CE6E22C6N is a low-density Cyclone IV E FPGA used in cost-sensitive embedded applications such as industrial control, motor drive, LED lighting controllers, low-cost video processing, USB/Ethernet bridging, and hobbyist/educational development boards. According to Intel's Cyclone IV Device Handbook, the EP4CE6 family targets designs requiring 6,000-15,000 logic elements with low static power and 91 user I/Os in a hand-solderable QFP package.
How many logic elements does the EP4CE6E22C6N have?
The EP4CE6E22C6N contains 6,272 logic elements (LEs). This is the baseline density in the Cyclone IV E family; the EP4CE10, EP4CE15, and larger devices scale up from this floor. For most glue-logic, simple state machines, and modest DSP/buffering tasks, 6K LEs is sufficient when paired with the 270 Kbits of embedded M9K memory.
What package does the EP4CE6E22C6N use?
The EP4CE6E22C6N ships in a 144-pin Plastic Enhanced QFP (EQFP-144) measuring 22 x 22 mm with a 0.5 mm lead pitch. The 'E' suffix in 'E22' denotes this EQFP package. The exposed pad aids thermal dissipation and must be soldered to the PCB land pattern for electrical and thermal performance.
What is the difference between EP4CE6E22C6N and EP4CE6E22C8N?
Both parts are identical silicon and identical 144-pin EQFP packages; they differ only in speed grade. The 'C6' suffix denotes speed grade 6 (slower, more affordable), while 'C8' denotes speed grade 8 (faster, slightly more expensive). They are drop-in pin-compatible in the same footprint - you can substitute a C6 with a C8 for timing margin improvement without any PCB change.
What is the difference between EP4CE6E22C6N and EP4CE6E22A7N?
The 'C' suffix indicates a commercial temperature range (0 C to +85 C) while 'A' indicates an automotive-grade temperature range (-40 C to +125 C). The 'C6' speed grade pairs with the commercial range; 'A7' pairs with the automotive range. Both use the same 144-pin EQFP package, but the EP4CE6E22A7N is qualified for harsher environments and costs more.
Where can I buy the EP4CE6E22C6N at the best price?
According to distributor listings as of 2026-09-10, the EP4CE6E22C6N is in stock at DigiKey, Mouser, LCSC, and Heisener. LCSC shows the lowest unit price at approximately $5.05 at high volumes, while DigiKey and Mouser typically range from $11-19 depending on quantity breaks. Octopart can be used to compare live distributor pricing across all sources.
What is the lead time for the EP4CE6E22C6N?
According to Heisener's listing as of 2026-09-10, the EP4CE6E22C6N ships with a typical lead time of approximately 5-7 days for stock-on-hand units. Major distributors like DigiKey and Mouser generally ship same-day for in-stock orders. Volume orders (1000+ pieces) may require 4-6 weeks if distributor stock is depleted and the order must be back-filled from Intel's channel.
Is the EP4CE6E22C6N in stock today?
Based on distributor listings retrieved on 2026-09-10, the EP4CE6E22C6N is reported in stock at Heisener (5,600 pieces), LCSC, and via the Altera/Intel channel. DigiKey and Mouser listings indicate limited stock with some back-order. For real-time availability, consult Octopart or contact the distributor directly before placing a purchase order.
EP4CE6E22C6N vs Lattice ECP5 - which is better for low-power FPGA designs?
The EP4CE6E22C6N (Cyclone IV E) and Lattice ECP5 (LFE5U-12 / LFE5U-25) both target low-power FPGA applications but differ in architecture. Cyclone IV E uses a 60 nm process with 1.2 V core; ECP5 uses 40 nm with 1.1 V core and offers hardened SERDES lanes, which the EP4CE6 lacks. For pure glue-logic designs in hand-solderable QFP, the EP4CE6E22C6N is preferable; for designs requiring SERDES, ECP5 in TQFP-144 is the better fit.
What is the best drop-in replacement for the EP4CE6E22C6N?
The closest drop-in replacements for the EP4CE6E22C6N are EP4CE6E22C8N (faster speed grade, same 144-pin EQFP package) and EP4CE6E22I7N (industrial temperature grade, same 144-pin EQFP package). All three share identical pinouts in the EQFP-144 footprint, so they can be soldered onto the same PCB without modification. For higher logic density, the EP4CE10E22C8N offers ~10K LEs in the same package.
Can the EP4CE6E22C6N replace a Cyclone III EP3C5 in the same footprint?
No, the EP4CE6E22C6N and Cyclone III EP3C5E22/EP3C16E22 are not pin-compatible - Cyclone III and Cyclone IV E use different EQFP-144 pin assignments. A PCB redesign is required when migrating between generations, even though the packages look similar. Use the Cyclone III to Cyclone IV E migration guide to map pin functions if a drop-in is required.
Is the EP4CE6E22C6N still in production by Intel?
The Cyclone IV E family was moved by Intel from new product introduction to mature long-term-supply (LTS) status. As of 2026-09-10, the EP4CE6E22C6N remains orderable from the Intel authorized channel and from authorized distributors, but new design wins should evaluate Cyclone 10 LP (10CL006) for long-term continuity. Lifecycle details are available on Intel's product change notification page.
Where can I download the EP4CE6E22C6N datasheet PDF?
The official Intel Cyclone IV Device Datasheet can be downloaded from Intel's FPGA documentation library at intel.com/content/www/us/en/products/details/fpga/cyclone/iv/e.html. The datasheet covers device features, package information, electrical characteristics, and configuration specifications. Mirror copies of the legacy Altera datasheet are also available on alldatasheet.com and findic.us.
Where can I find the EP4CE6E22C6N pinout for the EQFP-144 package?
The complete EQFP-144 pinout is documented in Chapter 7 (Pin Information) of the Cyclone IV Device Datasheet. The same pinout table is reproduced on distributor product pages and in the Altera/Intel device pin-out files (.pin) which are part of the Quartus Prime installation under /quartus/bin. For the E22 (EQFP-144) package, the I/O ball/pin assignment is identical across speed grades C6, C7, C8, I7, I8, and A7.
What tools support the EP4CE6E22C6N for FPGA development?
The EP4CE6E22C6N is fully supported by Intel Quartus Prime Lite Edition (free) and Quartus Prime Standard/Pro editions. The device is mature enough that Quartus II 13.1 also supports it. Common HDL tools (Verilog, VHDL, SystemVerilog) and IP cores (DDR2/DDR3 controllers, Nios II soft processor, Ethernet MAC) work out-of-the-box. ModelSim-Intel FPGA Starter Edition is the default simulator bundled with Quartus.

工程参考数据： EP4CE6E22C6N ——对比、设计指导和合规信息。

选型指南

Choose the EP4CE6E22C6N when you need the lowest-cost entry into the Cyclone IV E family for designs using 5-6K logic elements and 91 user I/Os in a hand-solderable package. Choose EP4CE6E22C8N if timing closure requires the faster speed grade. Choose EP4CE6E22I7N for industrial temperature environments and EP4CE6E22A7N for automotive-grade applications. Step up to EP4CE10E22C8N or EP4CE15E22C8N only when the EP4CE6 fabric is insufficient - all four share the same EQFP-144 footprint, so one PCB supports the entire family. For new long-life designs, evaluate the Cyclone 10 LP (10CL006) family instead, since Cyclone IV E is in mature LTS status.

与替代料对比

参数 本产品 EP4CE6E22C8N EP4CE6E22C7N EP4CE6E22I7N EP4CE6E22A7N EP4CE10E22C8N EP4CE15E22C8N
Package EQFP-144 (E22) EQFP-144 (E22) - same EQFP-144 (E22) - same EQFP-144 (E22) - same EQFP-144 (E22) - same EQFP-144 (E22) - same EQFP-144 (E22) - same
Brand Intel Intel Intel Intel Intel Intel Intel
Logic Elements 6,272 6,272 6,272 6,272 6,272 10,320 (+64%) 15,408 (+145%)
Speed Grade C6 C8 (faster) C7 I7 (industrial) A7 (automotive) C8 C8
Temperature Grade Commercial 0 C to +85 C Commercial 0 C to +85 C Commercial 0 C to +85 C Industrial -40 C to +100 C Automotive -40 C to +125 C Commercial Commercial
Embedded Memory 270 Kbits 270 Kbits 270 Kbits 270 Kbits 270 Kbits 414 Kbits 504 Kbits
Embedded 18x18 Multipliers 15 15 15 15 15 23 56
Maximum User I/Os 91 91 91 91 91 91 91

关键差异点

  • Lowest-density Cyclone IV E in hand-solderable EQFP-144 footprint （对比 EP4CE10E22C8N)
  • Hand-solderable EQFP-144 package (no BGA required) （对比 Lattice ECP5 LFE5U-12 in TQFP-144)
  • Multi-temperature variants in the same EQFP-144 footprint （对比 Cyclone III EP3C5E22 (single temperature option))

设计说明

The EP4CE6E22C6N requires separate VCCINT (1.2 V core) and VCCIOx (per-bank I/O) supplies. Per Intel's Cyclone IV Device Handbook, each VCCIO bank may be independently set to 1.2 / 1.5 / 1.8 / 2.5 / 3.0 / 3.3 V but mixing voltages within one bank is not allowed. Decouple each VCCINT pin with one 0.1 uF X7R ceramic plus one 10 uF bulk per supply plane; decouple each VCCIO bank with one 0.1 uF ceramic. Total quiescent current scales with logic utilization - estimate 200-400 mA typical at 6K LEs fully routed.

The exposed thermal pad (EPAD, pin 144) must be soldered to a PCB land pattern of at least the same area as the package EPAD, with thermal vias to the inner GND plane for heat dissipation. Although the EP4CE6 is low-power, neglecting the EPAD solder connection degrades thermal performance and increases junction temperature during sustained logic activity. Per IPC-7351 land pattern guidelines, place 0.5 mm-pitch QFP leads on 0.3 mm-wide pads with 0.2 mm solder mask expansion for reliable paste deposition.

Route configuration pins (MSEL, nCE, nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) carefully - they are sensitive to noise and stub lengths. Keep configuration trace lengths under 50 mm and avoid running them parallel to high-speed switching signals. JTAG signals (TCK, TMS, TDI, TDO) require a 10 kohm pull-up on TCK as specified by IEEE 1149.1 - the EP4CE6E22C6N does not include internal TCK pull-up on all variants.

Do not migrate directly from Cyclone III EP3C5/EP3C16 EQFP-144 to Cyclone IV E EP4CE6E22 - the pinouts differ even though packages look identical. Use the Cyclone III to Cyclone IV E migration guide from Intel to remap pins. Also note that the EP4CE6E22C6N does not include hard PCIe or SERDES; if your design requires transceivers, choose Cyclone IV GX or Cyclone V instead. Do not exceed the absolute maximum junction temperature of 125 C - derate by 10 C in enclosed industrial enclosures.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
无铅
Yes
无卤
Unknown
冲突矿物
Compliant

Lead-free per Cyclone IV E product page. The C6 part is commercial temperature and not AEC-Q100 qualified; choose EP4CE6E22A7N for AEC-Q100-grade automotive applications. RoHS and REACH compliance confirmed via Heisener and DigiKey product listings.

数据核验日期： 2026-09-10 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

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