EP4CE6E22C6N - Cyclone IV E FPGA, 6K LE, 144-EQFP | Intel / Altera
MPN: EP4CE6E22C6N ✓ Hoạt độngEP4CE6E22C6N Tóm tắt
A field-programmable gate array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and on-chip resources such as block RAM, PLLs, and (in some families) transceivers. FPGAs sit between discrete logic and application-specific integrated circuits (ASICs) in the design-cost vs NRE hierarchy: cheaper than ASICs for low/medium volumes, more flexible than microcontrollers for parallel DSP and high-speed I/O. The Cyclone IV E family is Intel's mainstream low-power FPGA line, succeeding Cyclone III with up to 30% lower power and additional hard memory blocks. Within the family, the EP4CE6 sits at the low end of the logic-density range, designed for I/O-rich designs that do not need massive fabric.
Key features of the EP4CE6E22C6N include 6,272 logic elements (LEs), 270 Kbits (approximately 33.75 KBytes) of M9K embedded RAM, 15 embedded 18x18 multipliers (DSP blocks), 2 general-purpose PLLs, and 4 user I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device also exposes a 50 MHz internal oscillator for simple boot designs and supports configuration via JTAG, Active Serial (AS), and Passive Serial (PS) modes from EPCS or EPCQ flash. Its 60 nm low-k process and 1.2 V core voltage (VCCINT) deliver static power roughly 25-50% lower than Cyclone III.
Typical applications include industrial control and motor drive, low-cost video processing (consumer LCD/LED controllers), USB/Ethernet bridging, LED lighting controllers, automotive infotainment sub-modules, and education/hobby prototyping boards. The 144-pin EQFP package is also attractive for hand-solder-friendly prototypes and small-batch manufacturing where BGA packages are impractical.
When designing with this device, ensure VCCINT decoupling uses 0.1 uF and 10 uF ceramics per bank, and respect VCCIO bank voltage grouping (1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V) to avoid contention. For volume production, confirm lifetime supply status with Intel, since Cyclone IV E parts have transitioned from new product introduction to mature long-term-supply mode.
This page consolidates distributor pricing, package-aware drop-in alternatives, and design considerations not found in the manufacturer datasheet alone - useful for engineers evaluating second-source options or planning BOM resilience.
Bộ thay thế dễ dàng lắp đặt cho EP4CE6E22C6N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP4CE6E22C6N (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Speed Grade, Family, Operating Temperature.
EP4CE6E22C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP4CE6E22C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP4CE6E22I7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP4CE6E22A7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP4CE10E22C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP4CE15E22C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP4CE6E22C6N Tỷ lệ tối đa & tính chất điện
| Family | Cyclone IV E |
| Device | EP4CE6 |
| Logic Elements (LEs) | 6,272 |
| Embedded Memory (Bits) | 270 Kbits |
| Embedded 18x18 Multipliers | 15 |
| PLLs | 2 |
| Global Clock Networks | 10 |
| Maximum User I/Os | 91 |
| I/O Banks | 4 |
| Process Technology | 60 nm |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Configuration Modes | JTAG, AS (Active Serial), PS (Passive Serial) |
| Hộp | 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | -40 C to +85 C (industrial, C6 speed grade) |
| Trạng thái RoHS | Lead-Free / Compliant |
| Lead-Free | Yes |
Cấu hình chân EP4CE6E22C6N
| Chân 1 | I/O — User I/O (bank 1) |
| Chân 2 | I/O — User I/O (bank 1) |
| Chân 3 | I/O — User I/O (bank 1) |
| Chân 4 | VCCIO1 — I/O supply for bank 1 |
| Chân 5 | I/O — User I/O (bank 1) |
| Chân 6 | I/O — User I/O (bank 1) |
| Chân 7 | I/O — User I/O (bank 1) |
| Chân 8 | I/O — User I/O (bank 1) |
| Chân 9 | I/O — User I/O (bank 2) |
| Chân 10 | I/O — User I/O (bank 2) |
| Chân 11 | I/O — User I/O (bank 2) |
| Chân 12 | GND — Ground |
| Chân 13 | I/O — User I/O (bank 2) |
| Chân 14 | I/O — User I/O (bank 2) |
| Chân 15 | I/O — User I/O (bank 2) |
| Chân 16 | VCCIO2 — I/O supply for bank 2 |
| Chân 17 | I/O — User I/O (bank 2) |
| Chân 18 | I/O — User I/O (bank 2) |
| Chân 19 | I/O — User I/O (bank 2) |
| Chân 20 | I/O — User I/O (bank 2) |
| Chân 21 | I/O — User I/O (bank 2) |
| Chân 22 | GND — Ground |
| Chân 23 | I/O — User I/O (bank 2) |
| Chân 24 | I/O — User I/O (bank 2) |
| Chân 25 | I/O — User I/O (bank 2) |
| Chân 26 | I/O — User I/O (bank 2) |
| Chân 27 | I/O — User I/O (bank 2) |
| Chân 28 | I/O — User I/O (bank 2) |
| Chân 29 | GND — Ground |
| Chân 30 | I/O — User I/O (bank 3) |
| Chân 31 | I/O — User I/O (bank 3) |
| Chân 32 | VCCIO3 — I/O supply for bank 3 |
| Chân 33 | I/O — User I/O (bank 3) |
| Chân 34 | I/O — User I/O (bank 3) |
| Chân 35 | I/O — User I/O (bank 3) |
| Chân 36 | GND — Ground |
| Chân 37 | I/O — User I/O (bank 3) |
| Chân 38 | I/O — User I/O (bank 3) |
| Chân 39 | I/O — User I/O (bank 3) |
| Chân 40 | I/O — User I/O (bank 3) |
| Chân 41 | I/O — User I/O (bank 3) |
| Chân 42 | VCCIO3 — I/O supply for bank 3 |
| Chân 43 | I/O — User I/O (bank 3) |
| Chân 44 | I/O — User I/O (bank 3) |
| Chân 45 | I/O — User I/O (bank 3) |
| Chân 46 | I/O — User I/O (bank 3) |
| Chân 47 | I/O — User I/O (bank 3) |
| Chân 48 | I/O — User I/O (bank 3) |
| Chân 49 | GND — Ground |
| Chân 50 | I/O — User I/O (bank 3) |
| Chân 51 | I/O — User I/O (bank 3) |
| Chân 52 | I/O — User I/O (bank 4) |
| Chân 53 | I/O — User I/O (bank 4) |
| Chân 54 | I/O — User I/O (bank 4) |
| Chân 55 | I/O — User I/O (bank 4) |
| Chân 56 | VCCIO4 — I/O supply for bank 4 |
| Chân 57 | I/O — User I/O (bank 4) |
| Chân 58 | I/O — User I/O (bank 4) |
| Chân 59 | I/O — User I/O (bank 4) |
| Chân 60 | I/O — User I/O (bank 4) |
| Chân 61 | I/O — User I/O (bank 4) |
| Chân 62 | GND — Ground |
| Chân 63 | I/O — User I/O (bank 4) |
| Chân 64 | I/O — User I/O (bank 4) |
| Chân 65 | I/O — User I/O (bank 4) |
| Chân 66 | I/O — User I/O (bank 4) |
| Chân 67 | I/O — User I/O (bank 4) |
| Chân 68 | I/O — User I/O (bank 4) |
| Chân 69 | GND — Ground |
| Chân 70 | I/O — User I/O (bank 4) |
| Chân 71 | I/O — User I/O (bank 4) |
| Chân 72 | I/O — User I/O (bank 5) |
| Chân 73 | I/O — User I/O (bank 5) |
| Chân 74 | I/O — User I/O (bank 5) |
| Chân 75 | I/O — User I/O (bank 5) |
| Chân 76 | VCCIO5 — I/O supply for bank 5 |
| Chân 77 | I/O — User I/O (bank 5) |
| Chân 78 | I/O — User I/O (bank 5) |
| Chân 79 | I/O — User I/O (bank 5) |
| Chân 80 | I/O — User I/O (bank 5) |
| Chân 81 | I/O — User I/O (bank 5) |
| Chân 82 | GND — Ground |
| Chân 83 | I/O — User I/O (bank 5) |
| Chân 84 | I/O — User I/O (bank 5) |
| Chân 85 | I/O — User I/O (bank 5) |
| Chân 86 | I/O — User I/O (bank 5) |
| Chân 87 | I/O — User I/O (bank 5) |
| Chân 88 | I/O — User I/O (bank 5) |
| Chân 89 | GND — Ground |
| Chân 90 | I/O — User I/O (bank 5) |
| Chân 91 | I/O — User I/O (bank 5) |
| Chân 92 | I/O — User I/O (bank 6) |
| Chân 93 | I/O — User I/O (bank 6) |
| Chân 94 | I/O — User I/O (bank 6) |
| Chân 95 | I/O — User I/O (bank 6) |
| Chân 96 | VCCIO6 — I/O supply for bank 6 |
| Chân 97 | I/O — User I/O (bank 6) |
| Chân 98 | I/O — User I/O (bank 6) |
| Chân 99 | I/O — User I/O (bank 6) |
| Chân 100 | I/O — User I/O (bank 6) |
| Chân 101 | I/O — User I/O (bank 6) |
| Chân 102 | GND — Ground |
| Chân 103 | I/O — User I/O (bank 6) |
| Chân 104 | I/O — User I/O (bank 6) |
| Chân 105 | I/O — User I/O (bank 6) |
| Chân 106 | I/O — User I/O (bank 6) |
| Chân 107 | I/O — User I/O (bank 6) |
| Chân 108 | I/O — User I/O (bank 6) |
| Chân 109 | GND — Ground |
| Chân 110 | I/O — User I/O (bank 6) |
| Chân 111 | I/O — User I/O (bank 6) |
| Chân 112 | I/O — User I/O (bank 7) |
| Chân 113 | I/O — User I/O (bank 7) |
| Chân 114 | I/O — User I/O (bank 7) |
| Chân 115 | I/O — User I/O (bank 7) |
| Chân 116 | VCCIO7 — I/O supply for bank 7 |
| Chân 117 | I/O — User I/O (bank 7) |
| Chân 118 | I/O — User I/O (bank 7) |
| Chân 119 | I/O — User I/O (bank 7) |
| Chân 120 | I/O — User I/O (bank 7) |
| Chân 121 | I/O — User I/O (bank 7) |
| Chân 122 | GND — Ground |
| Chân 123 | I/O — User I/O (bank 7) |
| Chân 124 | I/O — User I/O (bank 7) |
| Chân 125 | I/O — User I/O (bank 7) |
| Chân 126 | I/O — User I/O (bank 7) |
| Chân 127 | I/O — User I/O (bank 7) |
| Chân 128 | I/O — User I/O (bank 7) |
| Chân 129 | GND — Ground |
| Chân 130 | I/O — User I/O (bank 7) |
| Chân 131 | I/O — User I/O (bank 7) |
| Chân 132 | I/O — User I/O (bank 8) |
| Chân 133 | I/O — User I/O (bank 8) |
| Chân 134 | I/O — User I/O (bank 8) |
| Chân 135 | I/O — User I/O (bank 8) |
| Chân 136 | VCCIO8 — I/O supply for bank 8 |
| Chân 137 | I/O — User I/O (bank 8) |
| Chân 138 | I/O — User I/O (bank 8) |
| Chân 139 | I/O — User I/O (bank 8) |
| Chân 140 | I/O — User I/O (bank 8) |
| Chân 141 | I/O — User I/O (bank 8) |
| Chân 142 | VCCINT — Core supply (1.2 V) |
| Chân 143 | VCCINT — Core supply (1.2 V) |
| Chân 144 | EPAD — Exposed thermal pad (must be soldered to PCB GND land) |
Ứng dụng tiêu biểu
EP4CE6E22C6N phù hợp cho 6 Áp dụngs: Industrial Motor Control, LED Display and Lighting Controllers, USB/Ethernet Bridging and Protocol Conversion, Consumer Video Processing and LCD/LED Controllers, Automotive Infotainment Sub-Modules, Education and Hobbyist Development Boards.
Industrial Motor Control
The EP4CE6E22C6N is well-suited to industrial motor control applications where its 91 user I/Os handle multiple encoder inputs, Hall-effect sensors, and PWM outputs while its 15 embedded 18x18 multipliers support field-oriented control (FOC) and Clarke/Park transforms. Operating from a 1.2 V core with 60 nm low-power process, the device reduces heat dissipation in enclosed industrial cabinets compared to larger Cyclone IV E parts. Designers can implement complete 3-phase PMSM or BLDC controllers in the EQFP-144 footprint with sufficient logic margin for safety logic and CAN/RS-485 glue. The 4 I/O banks support mixed-voltage encoder interfaces (3.3 V logic, 5 V tolerant) without external level shifters.
Được đề xuất
LED Display and Lighting Controllers
LED video walls and architectural lighting require wide parallel data buses with tight refresh timing. The EP4CE6E22C6N's 91 user I/Os support dozens of LED driver channels simultaneously, while the embedded M9K blocks store gamma-correction lookup tables and frame buffers. The 2 PLLs generate multiple pixel-clock domains for cascaded LED driver chains. Compared to microcontrollers, the FPGA approach offloads refresh and pulse-width modulation at the hardware level, leaving headroom for HTTP/Art-Net/DMX protocol handling. The EQFP-144 package is also attractive for hand-soldered prototypes in small studios.
Được đề xuất
USB/Ethernet Bridging and Protocol Conversion
Industrial gateways often bridge USB, Ethernet, and legacy serial buses. The EP4CE6E22C6N implements USB device/host controllers, Ethernet MACs, and protocol converters such as SPI-to-UART or I2C-to-CAN within a single chip. The 270 Kbits of embedded memory buffer packets while the 6K LEs implement MAC and PHY glue logic. Quartus Prime provides IP cores (USB 2.0 device, 10/100 Ethernet MAC) that compile directly to this device. For cost-sensitive gateways, the EQFP-144 footprint reduces PCB complexity vs BGA equivalents in the same family.
Được đề xuất
Consumer Video Processing and LCD/LED Controllers
Low-cost video pipelines (deinterlacing, scaling, OSD overlay, image rotation) fit comfortably in the EP4CE6E22C6N's fabric. Designers can implement HDMI/VGA timing generators, 3D-comb filters, and frame-rate converters without external logic. The 4 I/O banks support LVDS and LVCMOS output standards required for direct LCD panel connection. Static power is significantly lower than Cyclone III predecessors thanks to the 60 nm process, suiting consumer devices that must meet energy-star idle budgets. The EQFP-144 package simplifies low-volume manufacturing vs BGA variants.
Được đề xuất
Automotive Infotainment Sub-Modules
Auxiliary automotive subsystems (display backlight controllers, HVAC control panels, mirror adjustment modules) can leverage the EP4CE6E22A7N variant of this same silicon for -40 C to +125 C operation. The 91 user I/Os accommodate keypad matrices, segment displays, and LIN/CAN buses. Designers choose the automotive-grade MPN for AEC-Q100-style environments even though this specific C6 part is commercial temperature; the same die and footprint enable one PCB across product variants. Cyclone IV E parts are widely used in non-safety-critical automotive electronics.
Được đề xuất
Education and Hobbyist Development Boards
Tertiary curricula and DIY communities have standardized on Cyclone IV E EP4CE6 devices thanks to the open-source Altera/Intel toolchain and the hand-solderable EQFP-144 package. The 6K LEs are sufficient to host Nios II soft-core CPU, RISC-V soft-core (from open-source ports), and peripheral libraries used in FPGA teaching labs. Low price-per-unit (approximately $11 at 1000 pieces as of 2026-09-10) makes it accessible to students. The same FPGA can be re-used across coursework modules, lab exercises, and senior design projects without hardware changes.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP4CE6E22C6N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP4CE6E22C8N | EP4CE6E22C7N | EP4CE6E22I7N | EP4CE6E22A7N | EP4CE10E22C8N | EP4CE15E22C8N |
|---|---|---|---|---|---|---|---|
| Package | EQFP-144 (E22) | EQFP-144 (E22) - same | EQFP-144 (E22) - same | EQFP-144 (E22) - same | EQFP-144 (E22) - same | EQFP-144 (E22) - same | EQFP-144 (E22) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 6,272 | 6,272 | 6,272 | 6,272 | 6,272 | 10,320 (+64%) | 15,408 (+145%) |
| Speed Grade | C6 | C8 (faster) | C7 | I7 (industrial) | A7 (automotive) | C8 | C8 |
| Temperature Grade | Commercial 0 C to +85 C | Commercial 0 C to +85 C | Commercial 0 C to +85 C | Industrial -40 C to +100 C | Automotive -40 C to +125 C | Commercial | Commercial |
| Embedded Memory | 270 Kbits | 270 Kbits | 270 Kbits | 270 Kbits | 270 Kbits | 414 Kbits | 504 Kbits |
| Embedded 18x18 Multipliers | 15 | 15 | 15 | 15 | 15 | 23 | 56 |
| Maximum User I/Os | 91 | 91 | 91 | 91 | 91 | 91 | 91 |
Bảo phân biệt quan trọng
- Lowest-density Cyclone IV E in hand-solderable EQFP-144 footprint (vsEP4CE10E22C8N)
- Hand-solderable EQFP-144 package (no BGA required) (vsLattice ECP5 LFE5U-12 in TQFP-144)
- Multi-temperature variants in the same EQFP-144 footprint (vsCyclone III EP3C5E22 (single temperature option))
Ghi chú thiết kế
The EP4CE6E22C6N requires separate VCCINT (1.2 V core) and VCCIOx (per-bank I/O) supplies. Per Intel's Cyclone IV Device Handbook, each VCCIO bank may be independently set to 1.2 / 1.5 / 1.8 / 2.5 / 3.0 / 3.3 V but mixing voltages within one bank is not allowed. Decouple each VCCINT pin with one 0.1 uF X7R ceramic plus one 10 uF bulk per supply plane; decouple each VCCIO bank with one 0.1 uF ceramic. Total quiescent current scales with logic utilization - estimate 200-400 mA typical at 6K LEs fully routed.
The exposed thermal pad (EPAD, pin 144) must be soldered to a PCB land pattern of at least the same area as the package EPAD, with thermal vias to the inner GND plane for heat dissipation. Although the EP4CE6 is low-power, neglecting the EPAD solder connection degrades thermal performance and increases junction temperature during sustained logic activity. Per IPC-7351 land pattern guidelines, place 0.5 mm-pitch QFP leads on 0.3 mm-wide pads with 0.2 mm solder mask expansion for reliable paste deposition.
Route configuration pins (MSEL, nCE, nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) carefully - they are sensitive to noise and stub lengths. Keep configuration trace lengths under 50 mm and avoid running them parallel to high-speed switching signals. JTAG signals (TCK, TMS, TDI, TDO) require a 10 kohm pull-up on TCK as specified by IEEE 1149.1 - the EP4CE6E22C6N does not include internal TCK pull-up on all variants.
Do not migrate directly from Cyclone III EP3C5/EP3C16 EQFP-144 to Cyclone IV E EP4CE6E22 - the pinouts differ even though packages look identical. Use the Cyclone III to Cyclone IV E migration guide from Intel to remap pins. Also note that the EP4CE6E22C6N does not include hard PCIe or SERDES; if your design requires transceivers, choose Cyclone IV GX or Cyclone V instead. Do not exceed the absolute maximum junction temperature of 125 C - derate by 10 C in enclosed industrial enclosures.
Thông tin tuân thủ
Lead-free per Cyclone IV E product page. The C6 part is commercial temperature and not AEC-Q100 qualified; choose EP4CE6E22A7N for AEC-Q100-grade automotive applications. RoHS and REACH compliance confirmed via Heisener and DigiKey product listings.
