Altera

EPF8282ATI100-3NGZ - FLEX 8000 FPGA 78 I/O 100-TQFP | Altera

MPN: EPF8282ATI100-3NGZ ✗ Akhir Hidup

5 V Vdss 100-pin TQFP Package 125 MHz Speed SRAM (volatile, requires external load) Memory

Ajukan Diskon

MOQ: 1 |

Lihat Datasheet (PDF) Lihat Alternatif

Kuantitas

EPF8282ATI100-3NGZ Ringkasan

The Altera (Intel Programmable Solutions Group) EPF8282ATI100-3NGZ is a member of the legacy FLEX 8000 family of Field-Programmable Gate Arrays, fabricated on a 0.42 µm CMOS SRAM-lookup-table architecture and offered in a 100-pin Thin Quad Flat Pack (TQFP) package. The device integrates 208 logic cells organized into 26 Logic Array Blocks (LABs), delivers approximately 2,500 usable gates, and exposes 78 user I/O pins. The "-3" speed grade targets a maximum flip-flop toggle frequency of 125 MHz at 5 V core supply.

An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) interconnected by a programmable routing matrix. The FLEX 8000 family belongs to the first-generation SRAM-based programmable logic hierarchy, sitting between simple PLDs and modern high-density FPGAs. After Altera's 2015 acquisition by Intel, the family has been formally classified as mature/obsolete; the manufacturer recommends migration to MAX 10 or Cyclone IV families for new designs.

Key features of the EPF8282ATI100-3NGZ include SRAM-based configuration (allowing in-system re-programmability), 78 general-purpose I/Os, dedicated input registers, fast continuous interconnect (FastTrack), and JTAG-compliant boundary-scan test support per IEEE 1149.1. The device is well suited to glue-logic, bus-interface bridging, and state-machine consolidation tasks that previously required multiple 74-series TTL parts.

From an architectural standpoint, the FLEX 8000 LAB combines 8 logic cells with a local interconnect that feeds the row and column FastTrack routing. Each logic cell contains a 4-input LUT, a programmable flip-flop, and dedicated carry/cascade chains. Configuration bitstream is loaded from an external EPROM or via JTAG, with the device entering user mode once all frames are loaded.

Typical applications include industrial glue logic, legacy peripheral replacement (bus bridges such as ISA-to-local bus), prototyping of medium-complexity state machines, factory automation controllers, and educational FPGA platforms. The 100-pin TQFP footprint also makes the part attractive for hand-soldered prototypes and through-hole-friendly designs where a BGA would be impractical.

When designing with this part, supply decoupling is critical: place 0.1 µF ceramic capacitors on every VCCINT/VCCIO pin and use a bulk 33 µF tantalum near the package. PCB traces carrying high-speed clocks must be length-matched and isolated from switching I/O. Because the FLEX 8000 family is now NRND/obsolete, designers should verify long-term availability before committing to new production.

This page synthesizes distributor pricing, FLEX 8000 family positioning, and migration guidance to MAX 10/Cyclone IV alternatives not all collated in a single manufacturer document.

Alternatif penggantian untuk EPF8282ATI100-3NGZ — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF8282ATI100-3NGZ (sama faktor bentuk dan footprint) — berbeda di dalam Configuration Memory, Operating Temperature, Usable Gates, Process Technology, Family.

EPF8282ATC100-2

Intel

Configuration Memory: SRAM (volatile, requires external boot)

Operating Temperature: 0 °C to 70 °C (Commercial)

Usable Gates: 2,500