Intel

EPF8452ATC100-4 - FLEX 8000 FPGA, 4K Gates, 68 I/O, 100-TQFP | Intel / Altera

Name: EPF8452ATC100-4 - FLEX 8000 FPGA, 4K Gates, 68 I/O, 100-TQFP | Intel / Altera
Brand: Intel
SKU: EPF8452ATC100-4

MPN: EPF8452ATC100-4 ⚠ Waktu Beli Terakhir

5 V Vdss 100-TQFP (14 x 14 mm, surface mount) Package -4 Speed

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EPF8452ATC100-4 Ringkasan

The Intel / Altera EPF8452ATC100-4 is a FLEX 8000 series Field Programmable Gate Array (FPGA) delivering approximately 4,000 usable gates, 336 logic elements and 42 Logic Array Blocks (LABs) in a 100-pin Thin Quad Flat Pack (TQFP) package. It is fabricated on a 5V CMOS SRAM process with 68 user I/O pins, in-system configurability through SRAM configuration elements, and a commercial 0 to 70 C operating temperature range. The part is graded for the -4 speed bin.

A Field Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) that combines the high gate density of gate arrays with the design flexibility of in-circuit reprogrammability. Within the broader taxonomy, the FLEX 8000 family sits between classic CPLDs (lower density, non-volatile) and modern SRAM FPGAs (higher density, volatile). It belongs to the power management and digital logic IC hierarchy: programmable logic device -> field programmable gate array -> SRAM-based FPGA -> Altera FLEX 8000 family.

Key features include MultiVolt I/O support for 3.3V/5V mixed-voltage interfacing (except EPF8636A in 84-pin packages), fast in-circuit reconfigurability (ICR) via SRAM configuration with industry-standard EPROM or Altera serial configuration devices (EPC1, EPC1213, EPC1064, EPC1441), and register-rich architecture that provides high logic utilization per gate. The TQFP-100 surface-mount package supports automated assembly.

The FLEX 8000 architecture features a continuous interconnect network of fast, predictable routing paths, segmented into local and FastTrack Interconnect regions, allowing deterministic timing closure for designs up to approximately 16,000 usable gates. Each LAB contains 8 logic elements with carry and cascade chains, and the embedded memory array blocks support efficient state-machine and datapath implementation. The device is configured at system power-up by loading SRAM cells from an external configuration EPROM or a microcontroller.

Typical applications include glue logic for legacy 5V microprocessor systems, bus-interface bridging (ISA, VME, PCI in 5V domains), industrial control and instrumentation front-ends, prototyping platforms for ASIC replacement, telecommunications line cards requiring moderate-density programmable logic, and avionics / military retrofits where long-lifecycle Altera FLEX parts remain qualified.

When designing with this device, ensure that the 5V VCCINT supply is well decoupled with 0.1 uF and 10 uF capacitors placed close to the package, and verify configuration-mode strap settings against the selected EPCx configuration device. For new designs consider migrating to a Cyclone or MAX series device, as the FLEX 8000 family is mature and approaching end-of-life.

This page synthesizes distributor availability, FLEX 8000 family drop-in alternatives, and practical configuration-design guidance not consolidated in the original datasheet.

Alternatif penggantian untuk EPF8452ATC100-4 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF8452ATC100-4 (sama faktor bentuk dan footprint) — berbeda di dalam Configuration Method, Process Technology, Package, Usable Gates, Operating Temperature.

EPF8282ATC100-3

Intel

Configuration Method: SRAM, EPC1/EPC1064/EPC1213/EPC1441, microprocessor

Process Technology: 0.42 micron CMOS SRAM

Package: 100-pin TQFP (100-TQFP)