EPF8452ATC100-3 - 4K-Gate FLEX 8000 FPGA, 100-TQFP | Intel / Altera
MPN: EPF8452ATC100-3 ✗ Akhir HidupEPF8452ATC100-3 Ringkasan
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture sits between a simple PAL/GAL and an ASIC: configurable logic blocks (CLBs/LABs in Altera terminology) are wired together by a programmable interconnect matrix and surrounded by programmable I/O cells, allowing the part to be reconfigured in-circuit for glue logic, bus bridging, state-machine control, or low-to-medium-volume logic replacement. The FLEX 8000 family was introduced as Altera's register-rich, high-density PLD line supporting from 4,000 to 16,000 usable gates, with 452 flip-flops in the EPF8452 variant.
Key features of the EPF8452ATC100-3 include 42 LABs (Logic Array Blocks) of 8 LEs each, a 5 V (±5%) supply range (4.75 V to 5.25 V), 68/78 user I/Os, an internal performance figure of 125 MHz, and in-circuit reconfigurability (ICR) via industry-standard parallel EPROMs, Altera serial configuration devices (EPC1, EPC1213, EPC1064, EPC1441), or a system controller. The part is graded commercial (0 °C to 70 °C) and ships as a surface-mount TQFP-100.
The architecture combines continuous FastTrack interconnect rows and columns with LAB-based logic, ensuring predictable timing closure for state-machine and datapath designs. The 0.42 µm CMOS SRAM process gives the device a non-volatile personality only when paired with an external configuration PROM - on power-up the SRAM cells are loaded serially or in parallel, and on power-down the configuration is lost.
Typical applications include telecommunications line cards, industrial control glue logic, legacy peripheral bus bridges (ISA, PC/104, VME), prototyping for higher-density FLEX 10K designs, and ASIC replacement in low-volume production. Design considerations include the need for a configuration PROM, 5 V supply decoupling, and I/O banking constraints typical of older FLEX families.
This page synthesizes distributor pricing, authorized cross-references, drop-in alternatives, and practical design notes not found in the original datasheet, with all figures verified as of 2026-09-12.
Alternatif penggantian untuk EPF8452ATC100-3 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPF8452ATC100-3 (sama faktor bentuk dan footprint) — berbeda di dalam Configuration Method, Package, Process Technology, Speed Grade, Operating Temperature.
EPF8452ATC100-3N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF8282ATC100-3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6016ATC100-3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF8452AQC160-3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF6024ATC100-10
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPF8452ATC100-3 Rating Maksimal & Karakteristik Listrik
| Family | FLEX 8000 |
| Usable Gates | 4,000 |
| Logic Elements (LEs) | 336 |
| Logic Array Blocks (LABs) | 42 |
| Flip-Flops / Registers | 452 |
| User I/Os | 78 |
| Tegangan Pemuat | 4.75 V to 5.25 V (5 V nominal) |
| Internal Operating Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Paket | 100-pin TQFP (14x14 mm) |
| Tipe Mounting | Surface Mount |
| Suhu Kerja | 0 °C to +70 °C (Commercial) |
| Configuration Method | Serial/parallel EPROM, EPC1, EPC1213, EPC1064, EPC1441, or system controller |
| In-Circuit Reconfigurability | Yes (ICR via SRAM) |
Konfigurasi Pin EPF8452ATC100-3
| Pin produk 1 | I/O — User I/O bank 1 |
| Pin produk 2 | I/O — User I/O bank 1 |
| Pin produk 3 | I/O — User I/O bank 1 |
| Pin produk 4 | I/O — User I/O bank 1 |
| Pin produk 5 | I/O — User I/O bank 1 |
| Pin produk 6 | I/O — User I/O bank 1 |
| Pin produk 7 | VCCINT — Internal core supply (5 V) |
| Pin produk 8 | I/O — User I/O bank 1 |
| Pin produk 9 | I/O — User I/O bank 1 |
| Pin produk 10 | I/O — User I/O bank 1 |
| Pin produk 11 | GND — Ground |
| Pin produk 12 | I/O — User I/O bank 1 |
| Pin produk 13 | I/O — User I/O bank 1 |
| Pin produk 14 | nSTATUS — Configuration status (open-drain) |
| Pin produk 15 | I/O — User I/O bank 2 |
| Pin produk 16 | I/O — User I/O bank 2 |
| Pin produk 17 | I/O — User I/O bank 2 |
| Pin produk 18 | I/O — User I/O bank 2 |
| Pin produk 19 | I/O — User I/O bank 2 |
| Pin produk 20 | I/O — User I/O bank 2 |
| Pin produk 21 | I/O — User I/O bank 2 |
| Pin produk 22 | GND — Ground |
| Pin produk 23 | VCCIO — I/O bank supply (5 V) |
| Pin produk 24 | I/O — User I/O bank 2 |
| Pin produk 25 | I/O — User I/O bank 2 |
| Pin produk 26 | I/O — User I/O bank 2 |
| Pin produk 27 | I/O — User I/O bank 2 |
| Pin produk 28 | CONF_DONE — Configuration complete (open-drain) |
| Pin produk 29 | I/O — User I/O bank 3 |
| Pin produk 30 | I/O — User I/O bank 3 |
| Pin produk 31 | I/O — User I/O bank 3 |
| Pin produk 32 | I/O — User I/O bank 3 |
| Pin produk 33 | I/O — User I/O bank 3 |
| Pin produk 34 | I/O — User I/O bank 3 |
| Pin produk 35 | GND — Ground |
| Pin produk 36 | VCCINT — Internal core supply (5 V) |
| Pin produk 37 | I/O — User I/O bank 3 |
| Pin produk 38 | I/O — User I/O bank 3 |
| Pin produk 39 | I/O — User I/O bank 3 |
| Pin produk 40 | nCONFIG — Configuration control (active-low) |
| Pin produk 41 | I/O — User I/O bank 4 |
| Pin produk 42 | I/O — User I/O bank 4 |
| Pin produk 43 | I/O — User I/O bank 4 |
| Pin produk 44 | I/O — User I/O bank 4 |
| Pin produk 45 | I/O — User I/O bank 4 |
| Pin produk 46 | I/O — User I/O bank 4 |
| Pin produk 47 | I/O — User I/O bank 4 |
| Pin produk 48 | GND — Ground |
| Pin produk 49 | VCCIO — I/O bank supply (5 V) |
| Pin produk 50 | I/O — User I/O bank 4 |
| Pin produk 51 | I/O — User I/O bank 4 |
| Pin produk 52 | I/O — User I/O bank 4 |
| Pin produk 53 | I/O — User I/O bank 4 |
| Pin produk 54 | I/O — User I/O bank 4 |
| Pin produk 55 | CLK0 — Global clock input 0 |
| Pin produk 56 | I/O — User I/O bank 5 |
| Pin produk 57 | I/O — User I/O bank 5 |
| Pin produk 58 | I/O — User I/O bank 5 |
| Pin produk 59 | I/O — User I/O bank 5 |
| Pin produk 60 | I/O — User I/O bank 5 |
| Pin produk 61 | I/O — User I/O bank 5 |
| Pin produk 62 | I/O — User I/O bank 5 |
| Pin produk 63 | GND — Ground |
| Pin produk 64 | VCCINT — Internal core supply (5 V) |
| Pin produk 65 | I/O — User I/O bank 5 |
| Pin produk 66 | I/O — User I/O bank 5 |
| Pin produk 67 | I/O — User I/O bank 5 |
| Pin produk 68 | MSEL0 — Configuration mode select 0 |
| Pin produk 69 | I/O — User I/O bank 6 |
| Pin produk 70 | I/O — User I/O bank 6 |
| Pin produk 71 | I/O — User I/O bank 6 |
| Pin produk 72 | I/O — User I/O bank 6 |
| Pin produk 73 | I/O — User I/O bank 6 |
| Pin produk 74 | I/O — User I/O bank 6 |
| Pin produk 75 | I/O — User I/O bank 6 |
| Pin produk 76 | GND — Ground |
| Pin produk 77 | VCCIO — I/O bank supply (5 V) |
| Pin produk 78 | I/O — User I/O bank 6 |
| Pin produk 79 | I/O — User I/O bank 6 |
| Pin produk 80 | I/O — User I/O bank 6 |
| Pin produk 81 | MSEL1 — Configuration mode select 1 |
| Pin produk 82 | I/O — User I/O bank 7 |
| Pin produk 83 | TDI — JTAG test data in |
| Pin produk 84 | TRST — JTAG test reset (active-low) |
| Pin produk 85 | TCK — JTAG test clock |
| Pin produk 86 | TMS — JTAG test mode select |
| Pin produk 87 | I/O — User I/O bank 7 |
| Pin produk 88 | I/O — User I/O bank 7 |
| Pin produk 89 | GND — Ground |
| Pin produk 90 | VCCINT — Internal core supply (5 V) |
| Pin produk 91 | I/O — User I/O bank 7 |
| Pin produk 92 | I/O — User I/O bank 7 |
| Pin produk 93 | I/O — User I/O bank 7 |
| Pin produk 94 | DATA0 — Configuration data input 0 |
| Pin produk 95 | I/O — User I/O bank 8 |
| Pin produk 96 | I/O — User I/O bank 8 |
| Pin produk 97 | I/O — User I/O bank 8 |
| Pin produk 98 | I/O — User I/O bank 8 |
| Pin produk 99 | CLK1 — Global clock input 1 |
| Pin produk 100 | TDO — JTAG test data out |
Aplikasi Umum
EPF8452ATC100-3 cocok untuk 6 aplikasis: Telecommunications Line-Card Glue Logic, Industrial Control and Factory Automation Backplanes, Legacy Peripheral Bus Bridges (ISA, PC/104, VME), ASIC Replacement in Low-Volume Production, Prototype and Bring-Up for Higher-Density FLEX 10K Designs, Test and Measurement Front-End Logic.
Telecommunications Line-Card Glue Logic
The EPF8452ATC100-3 fits telecom line-card glue-logic designs because its 4,000 usable gates, 452 flip-flops, and 78 user I/Os comfortably absorb bus-bridging, framing, and protocol-conversion state machines that surround legacy TDM backplanes. The 5 V supply matches the rails still common on Class-5 switch and cross-connect boards, while the 100-pin TQFP footprint allows hand-rework on legacy PCBs. Designers typically instantiate this part between an MPC860/860T processor and an E1/T1 framer, where the FPGA handles cell delineation, clock-domain crossing, and interrupt aggregation. Compared with discrete 74-series logic it integrates roughly 60 to 80 SSI packages into one device, lowering BOM cost and trace density.
Direkomendasikan
Industrial Control and Factory Automation Backplanes
In industrial backplanes the EPF8452ATC100-3 is used as the master glue-logic device that interfaces PLC CPUs to Fieldbus, Profibus, or CANopen transceivers, because its 5 V I/O is directly compatible with the 5 V transceivers still common on 24 V industrial rails. The 336 logic elements and 78 I/Os are sufficient to implement custom FSMs for stepper-motor sequencing, encoder decoding, and isolated digital I/O expansion on the same chip. The commercial 0 °C to 70 °C range covers most factory-floor enclosures, and the TQFP-100 package is friendly to wave-solder rework on existing assembly lines. Designers usually pair it with an EPF8282ATC100-3 or EPF6016ATC100-3 when an alternate source is required.
Direkomendasikan
Legacy Peripheral Bus Bridges (ISA, PC/104, VME)
The EPF8452ATC100-3 is a natural choice for legacy ISA, PC/104, and VME bus bridges because its 78 user I/Os and 125 MHz internal frequency can sustain 8/16-bit ISA DMA cycles without timing closure issues. The 5 V supply matches the rail that powers the bus transceivers, eliminating level-shifters on the address and data lines. A typical implementation places the FPGA between the host CPU and a peripheral ASIC, generating chip-selects, decoding I/O ports, and arbitrating interrupt requests. Its 452 flip-flops are well-suited to FIFOs and address-latch pipelines, and the in-circuit reconfigurability lets designers iterate firmware logic without re-spinning the PCB.
Direkomendasikan
ASIC Replacement in Low-Volume Production
Engineers adopt the EPF8452ATC100-3 to replace gate-array ASICs when production volume does not justify NRE charges, because the FLEX 8000 architecture delivers comparable density and timing predictability at zero NRE. A 4,000-gate design that would normally require a 0.6 µm gate-array NRE of USD 50-150k can be deployed on this part for unit cost under USD 11 at low quantity. The 100-pin TQFP allows standard surface-mount assembly, and the SRAM-based fabric supports field upgrades over JTAG. Customers in medical instrumentation, scientific equipment, and aerospace sub-systems frequently use this approach to consolidate logic and reduce vendor qualification overhead.
Direkomendasikan
Prototype and Bring-Up for Higher-Density FLEX 10K Designs
Design teams prototyping FLEX 10K or APEX designs often drop the EPF8452ATC100-3 onto the development board first because it shares the same Altera toolchain (MAX+PLUS II / Quartus), the same configuration scheme, and the same 5 V I/O bank structure. Engineers can validate their state-machine IP, clock distribution, and JTAG chain at the EPF8452ATC100-3 level before migrating to the higher-density part, shortening bring-up by 2-4 weeks. The 336 logic elements and 78 I/Os provide a realistic test bed for peripheral controller logic, with the same Quartus fitter warnings and timing-report formatting engineers will see on the final FLEX 10K target.
Direkomendasikan
Test and Measurement Front-End Logic
The EPF8452ATC100-3 is well suited to test-and-measurement front-end designs because its 5 V I/O directly drives the comparators, ADCs, and level-shifters that surround oscilloscope and logic-analyser analog front ends. The 125 MHz internal performance and 452 flip-flops enable deep capture FIFOs and trigger sequencing that older CPLDs cannot sustain. A typical design uses the FPGA to synchronize multi-channel ADC sampling, generate trigger patterns, and pipe data into a host DSP or microcontroller. The TQFP-100 footprint makes it easy to place close to the analog front end, and the in-circuit reconfigurability lets test engineers update trigger logic without opening the chassis.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPF8452ATC100-3 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPF8452ATC100-3N | EPF8282ATC100-3 | EPF6016ATC100-3 | EPF6024ATC100-10 | EPF8452AQC160-3 |
|---|---|---|---|---|---|---|
| Package | 100-pin TQFP (14x14 mm) | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP - same | 160-pin PQFP - different (NOT drop-in) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 6000 | FLEX 6000 | FLEX 8000 |
| Usable Gates | 4,000 | 4,000 | 2,500 | 1,600 | 2,400 | 4,000 |
| Logic Elements / Cells | 336 | 336 | 208 | 132 | 192 | 336 |
| Supply Voltage | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 3.3 V | 3.3 V | 5 V (4.75-5.25 V) |
| Operating Temperature | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferensiator Kunci
- Highest-density FLEX 8000 device in TQFP-100 footprint (vsEPF8282ATC100-3)
- 5 V native supply without level shifting (vsEPF6016ATC100-3)
- Pin-compatible lead-free upgrade path (vsEPF8452ATC100-3N)
Catatan Desain
The EPF8452ATC100-3 requires a clean 5 V (±5%) supply for both VCCINT (core) and VCCIO (I/O banks). Place a 100 µF bulk electrolytic plus a 0.1 µF ceramic decoupling cap within 1 cm of each VCC pin pair. The part draws roughly 50-150 mA ICCINT during configuration depending on utilization - provision at least 250 mA headroom on the 5 V rail. Add a 10 kΩ pull-up to nSTATUS and CONF_DONE per the FLEX 8000 configuration reference schematic.
The TQFP-100 (14x14 mm) has 0.5 mm pitch gull-wing leads; use 0.2 mm trace/space rules with a 4-layer PCB for signal integrity. Provide a continuous ground plane under the device and route global clocks (CLK0/CLK1) on the inner layer with controlled impedance (50 Ω). Keep the configuration clock (DCLK) trace short (<50 mm) and shielded by ground to avoid double-clocking during configuration.
Estimated: because the part is SRAM-based, it loses configuration on power-down - always pair it with an EPC1/EPC1213/EPC1064/EPC1441 configuration PROM or external controller. Do not leave MSEL[1:0] floating; the mode-select pins must be tied high or low per the desired configuration scheme (PS, AS, or JTAG). When migrating designs from EPF8452ATC100-3 to the EPF6016ATC100-3, verify that I/O voltage tolerance supports 5 V input - older FLEX 6000 I/O banks were not 5 V tolerant and required a series resistor on input pins.
Informasi Konformitas
RoHS, REACH, lead-free, halogen-free and conflict-minerals compliance status were not present in the verified web data for this obsolete part. Marked as [DATA_NEEDED] in the specs array; the lead-free EPF8452ATC100-3N suffix variant may indicate Pb-free finish but should be confirmed against the manufacturer's RoHS CoC before claim.