Altera

EPM570GF100C5N - MAX II 570 LE CPLD, 100-FBGA | Altera

MPN: EPM570GF100C5N ✓ Aktif

1.8 V (internal) Vdss 100-LBGA (FBGA-100), 11 x 11 mm, 1.0 mm pitch Package On-chip Flash (non-volatile) Memory

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EPM570GF100C5N Ringkasan

The Altera (now Intel) EPM570GF100C5N is a 570-logic-element MAX II family Complex Programmable Logic Device (CPLD) housed in a 100-ball FineLine BGA package with 76 user I/Os and a 5.4 ns pin-to-pin propagation delay. The device integrates non-volatile Flash configuration memory on-chip, eliminating the need for an external boot PROM and enabling instant-on operation at power-up.

What is a MAX II CPLD? A Complex Programmable Logic Device is a non-volatile, instant-on programmable logic IC that implements glue logic, bus interfacing, state-machine control, and I/O expansion. The MAX II family uses a look-up-table (LUT) architecture backed by embedded Flash, distinguishing it from SRAM-based FPGAs that require external boot configuration. Within the broader taxonomy, the EPM570 sits in the CPLD -> programmable logic -> digital IC -> semiconductor family hierarchy, and is a low-cost, low-power alternative to small FPGAs for cost-sensitive glue-logic designs.

Key specifications include 440 macrocells, 76 user I/Os, a 1.8 V, 2.5 V, 3.3 V multi-voltage I/O interface with 5.0 V tolerant inputs, an internal core voltage of 1.8 V, and an industrial operating temperature range of -40C to +125C. The device supports in-system programmability via IEEE 1532 / IEEE 1149.1 JTAG and is fully RoHS compliant in a lead-free FBGA-100 package measuring 11 mm x 11 mm with a 1.0 mm ball pitch.

Architecturally, the EPM570 divides its 570 logic elements into four Logic Array Blocks (LABs), each with 16 macrocells, and connects them through a programmable interconnect array (PIA). Eight user I/O pins per LAB feed signals into the PIA, while the LAB outputs drive the global interconnect and I/O pins, providing predictable, deterministic timing that is characteristic of CPLDs.

Typical applications include bus bridging and glue logic in industrial controllers, I/O expansion for microcontrollers and ASICs, power-sequencing and reset distribution, LED drive multiplexing, and portable consumer devices where instant-on, low power, and small footprint are essential. The combination of Flash memory, JTAG ISP, and a small BGA footprint also makes the part attractive for space-constrained designs.

When designing with the EPM570GF100C5N, observe the multi-voltage I/O banking constraints of MAX II devices and consult the Quartus II support for the legacy MAX II tool flow. For new designs, consider MAX V (5M570ZE64C5N, 5M570ZT100C5N) as the recommended migration path with improved I/O support.

This page synthesizes distributor pricing, drop-in same-package MAX II alternatives, application references, and design notes not assembled in the manufacturer datasheet alone.

Alternatif penggantian untuk EPM570GF100C5N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPM570GF100C5N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Programming Interface, Operating Temperature, Process Technology, RoHS Status.

EPM240GF100C5N

Intel

Package: 100-ball FBGA (11 x 11 mm, 1.0 mm pitch)

Programming Interface: JTAG (IEEE 1149.1) / Jam STAPL

Operating Temperature: -40 C to +125 C