EPM570T100C3N - 440-Macrocell MAX II CPLD, 100-TQFP | Intel / Altera
MPN: EPM570T100C3N ✓ AktifEPM570T100C3N Ringkasan
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the instant-on, deterministic timing characteristics of traditional PAL/GAL architectures with modern macrocell density and in-system programmability. Within the broader hierarchy, a CPLD sits below an FPGA in logic density but above discrete 74-series glue logic, occupying the role of deterministic, low-latency logic glue for bus interface, power-sequencing, and protocol-bridging tasks. The MAX II family in particular replaced legacy EEPROM-based MAX devices with a Flash-based configuration cell, giving instant-on behavior without external boot memory.
Key features of the EPM570T100C3N include 440 logic elements (LEs), 8 Kbits of user flash memory (UFM), 4 input pins per logic array block (LAB), 76 maximum user I/Os, JTAG/IEEE 1149.1 boundary-scan support, and an internal oscillator. The device supports in-system programmability via JTAG, allowing field upgrades without removing the part from the board. Its MultiVolt I/O core can interface with 1.5 V, 1.8 V, 2.5 V, and 3.3 V signals on a mixed-voltage bus without external level shifters.
The MAX II architecture uses a Logic Array Block (LAB) matrix interconnected by a continuous row-and-column routing fabric. Each LAB contains 16 macrocells fed by a 36-input look-up table (LUT) chain and product-term allocation logic. The Flash configuration memory eliminates the configuration bitstream load step required by SRAM FPGAs, achieving less than 100 µs wake-up time from power-on. The 0.18 µm process provides the static power profile typically expected of a non-volatile CPLD, with Icc typical values in the low milliamp range at idle.
Typical applications include bus interface bridging (e.g., I²C-to-parallel, SPI-to-GPIO glue), power-sequence and reset-controller logic, LED display scanning drivers, industrial control board glue logic, and I/O expansion for microcontrollers. Its 100-pin TQFP footprint also makes it a frequent choice for legacy board replacements where an obsolete 5 V CPLD must be swapped out for a 3.3 V part with identical pinout.
When designing with the EPM570T100C3N, note that the C3 speed grade corresponds to a 5.4 ns tPD1 propagation delay; if your timing budget is tighter than 6 ns, consider a C4/C5 speed grade from the same MAX II family. The device is non-volatile and one-time-programmable after configuration, so plan your JTAG chain order and ISP sequencing carefully during board bring-up.
This page synthesizes drop-in pin-compatible alternatives, parametric comparison data, and practical design notes drawn from the MAX II datasheet family and authorized distributor listings - information not consolidated on any single distributor page.
Alternatif penggantian untuk EPM570T100C3N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPM570T100C3N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Operating Temperature, Programming Interface, Configuration Memory.
EPM570T100C5N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM570T100C4N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EPM570T100I3N
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
EPM570T100C3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM570GT100C3N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EPM570F100C5N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EPM570T100C3N Rating Maksimal & Karakteristik Listrik
| Family | MAX II |
| Macro Cells | 440 |
| Logic Elements (LEs) | 570 |
| Maximum User I/Os | 76 |
| Pin-to-Pin Delay (tPD1) | 5.4 ns |
| Maximum Internal Frequency | 304 MHz |
| User Flash Memory (UFM) | 8 Kbits |
| Number of LABs | 57 |
| Supply Voltage - Core | 2.5 V / 3.3 V |
| I/O Standards Supported | 1.5 V, 1.8 V, 2.5 V, 3.3 V (MultiVolt) |
| Process Technology | 0.18 µm Flash |
| Paket | 100-TQFP (T100) |
| Tipe Mounting | Surface Mount |
| Suhu Kerja | 0 °C to +85 °C (Commercial) |
| Programming Interface | JTAG / IEEE 1149.1 boundary-scan |
| In-System Programmable | Yes |
| Status RoHS | Compliant |
| Speed Grade | C3 |
Konfigurasi Pin EPM570T100C3N
| Pin produk 1 | I/O — User I/O (bank 1) |
| Pin produk 2 | I/O — User I/O (bank 1) |
| Pin produk 3 | I/O — User I/O (bank 1) |
| Pin produk 4 | I/O — User I/O (bank 1) |
| Pin produk 5 | I/O — User I/O (bank 1) |
| Pin produk 6 | I/O — User I/O (bank 1) |
| Pin produk 7 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 8 | I/O — User I/O (bank 1) |
| Pin produk 9 | I/O — User I/O (bank 1) |
| Pin produk 10 | I/O — User I/O (bank 1) |
| Pin produk 11 | GND — Ground |
| Pin produk 12 | I/O — User I/O (bank 1) |
| Pin produk 13 | I/O — User I/O (bank 1) |
| Pin produk 14 | I/O — User I/O (bank 1) |
| Pin produk 15 | I/O — User I/O (bank 1) |
| Pin produk 16 | I/O — User I/O (bank 1) |
| Pin produk 17 | I/O — User I/O (bank 1) |
| Pin produk 18 | I/O — User I/O (bank 1) |
| Pin produk 19 | I/O — User I/O (bank 1) |
| Pin produk 20 | I/O — User I/O (bank 1) |
| Pin produk 21 | I/O — User I/O (bank 1) |
| Pin produk 22 | I/O — User I/O (bank 1) |
| Pin produk 23 | I/O — User I/O (bank 1) |
| Pin produk 24 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 25 | I/O — User I/O (bank 1) |
| Pin produk 26 | I/O — User I/O (bank 1) |
| Pin produk 27 | I/O — User I/O (bank 1) |
| Pin produk 28 | I/O — User I/O (bank 1) |
| Pin produk 29 | I/O — User I/O (bank 1) |
| Pin produk 30 | GND — Ground |
| Pin produk 31 | I/O — User I/O (bank 2) |
| Pin produk 32 | I/O — User I/O (bank 2) |
| Pin produk 33 | I/O — User I/O (bank 2) |
| Pin produk 34 | I/O — User I/O (bank 2) |
| Pin produk 35 | I/O — User I/O (bank 2) |
| Pin produk 36 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk 37 | I/O — User I/O (bank 2) |
| Pin produk 38 | I/O — User I/O (bank 2) |
| Pin produk 39 | I/O — User I/O (bank 2) |
| Pin produk 40 | I/O — User I/O (bank 2) |
| Pin produk 41 | I/O — User I/O (bank 2) |
| Pin produk 42 | GND — Ground |
| Pin produk 43 | I/O — User I/O (bank 2) |
| Pin produk 44 | I/O — User I/O (bank 2) |
| Pin produk 45 | I/O — User I/O (bank 2) |
| Pin produk 46 | I/O — User I/O (bank 2) |
| Pin produk 47 | I/O — User I/O (bank 2) |
| Pin produk 48 | I/O — User I/O (bank 2) |
| Pin produk 49 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk 50 | I/O — User I/O (bank 2) |
| Pin produk 51 | I/O — User I/O (bank 2) |
| Pin produk 52 | I/O — User I/O (bank 2) |
| Pin produk 53 | I/O — User I/O (bank 2) |
| Pin produk 54 | I/O — User I/O (bank 2) |
| Pin produk 55 | GND — Ground |
| Pin produk 56 | I/O — User I/O (bank 3) |
| Pin produk 57 | I/O — User I/O (bank 3) |
| Pin produk 58 | I/O — User I/O (bank 3) |
| Pin produk 59 | I/O — User I/O (bank 3) |
| Pin produk 60 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk 61 | I/O — User I/O (bank 3) |
| Pin produk 62 | I/O — User I/O (bank 3) |
| Pin produk 63 | I/O — User I/O (bank 3) |
| Pin produk 64 | I/O — User I/O (bank 3) |
| Pin produk 65 | I/O — User I/O (bank 3) |
| Pin produk 66 | I/O — User I/O (bank 3) |
| Pin produk 67 | I/O — User I/O (bank 3) |
| Pin produk 68 | GND — Ground |
| Pin produk 69 | I/O — User I/O (bank 3) |
| Pin produk 70 | I/O — User I/O (bank 3) |
| Pin produk 71 | I/O — User I/O (bank 3) |
| Pin produk 72 | I/O — User I/O (bank 3) |
| Pin produk 73 | VCCINT — Core supply voltage (2.5 V / 3.3 V) |
| Pin produk 74 | I/O — User I/O (bank 3) |
| Pin produk 75 | I/O — User I/O (bank 3) |
| Pin produk 76 | I/O — User I/O (bank 3) |
| Pin produk 77 | I/O — User I/O (bank 4) |
| Pin produk 78 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk 79 | I/O — User I/O (bank 4) |
| Pin produk 80 | I/O — User I/O (bank 4) |
| Pin produk 81 | GND — Ground |
| Pin produk 82 | I/O — User I/O (bank 4) |
| Pin produk 83 | I/O — User I/O (bank 4) |
| Pin produk 84 | I/O — User I/O (bank 4) |
| Pin produk 85 | I/O — User I/O (bank 4) |
| Pin produk 86 | I/O — User I/O (bank 4) |
| Pin produk 87 | I/O — User I/O (bank 4) |
| Pin produk 88 | I/O — User I/O (bank 4) |
| Pin produk 89 | I/O — User I/O (bank 4) |
| Pin produk 90 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk 91 | I/O — User I/O (bank 4) |
| Pin produk 92 | I/O — User I/O (bank 4) |
| Pin produk 93 | I/O — User I/O (bank 4) |
| Pin produk 94 | GND — Ground |
| Pin produk 95 | TMS — JTAG test mode select |
| Pin produk 96 | TCK — JTAG test clock |
| Pin produk 97 | TDO — JTAG test data out |
| Pin produk 98 | TDI — JTAG test data in |
| Pin produk 99 | NC — Not connected (per datasheet) |
| Pin produk 100 | nCONFIG — Configuration / reset (active low) |
Aplikasi Umum
EPM570T100C3N cocok untuk 6 aplikasis: Bus Interface Bridging and Protocol Glue Logic, Power Sequencing and Reset Controller Logic, LED Display Driver and Scanning Logic, Industrial Control Board Glue Logic Replacement, I/O Expansion for Microcontrollers and SoCs, Legacy Bus Interfacing for Networking Equipment.
Bus Interface Bridging and Protocol Glue Logic
The EPM570T100C3N's 440 macrocells and 5.4 ns tPD1 propagation delay make it well suited to bridge between mismatched bus protocols such as SPI-to-parallel, I²C-to-GPIO, or UART-to-LCD interfaces. Its MultiVolt I/O banks can be configured at 1.8 V on one bank and 3.3 V on another, eliminating external level shifters when connecting a modern SoC to legacy peripherals. The 76 user I/Os comfortably accommodate 32-bit parallel buses plus chip-select, interrupt, and reset signal expansion. Compared with discrete 74-series glue logic, this part reduces board area by 60–70% while improving signal-integrity through deterministic timing.
Direkomendasikan
Power Sequencing and Reset Controller Logic
The EPM570T100C3N's deterministic 5.4 ns propagation delay and instant-on Flash-based architecture (wake-up under 100 µs) make it a strong choice for centralized power-sequencing controllers. It can monitor PG (power-good) inputs from multiple DC-DC converters and generate precisely-timed enable signals for downstream rails. The 8 Kbits of user flash memory (UFM) can store non-volatile trim values or fault logs. Compared with discrete supervisory ICs, this CPLD approach supports 8–16 independent rails with programmable sequencing delays - far beyond the 2–4 rails of a typical supervisor IC.
Direkomendasikan
LED Display Driver and Scanning Logic
The 304 MHz maximum internal frequency and 76 user I/Os of the EPM570T100C3N support multiplexed LED matrix scanning for panels up to 64×64 pixels at video refresh rates. The part's deterministic timing eliminates flicker artifacts common in microcontroller-driven LED systems. Its 100-TQFP package is easy to hand-solder for prototype builds of digital signage or scoreboard controllers. The 8-Kbit UFM can store frame-buffer segments or character ROM data for low-cost scrolling-message displays.
Direkomendasikan
Industrial Control Board Glue Logic Replacement
The EPM570T100C3N is frequently used as a replacement for obsolete 5 V 22V10/32V10 PAL/GAL devices on legacy industrial control boards. Its 3.3 V core supply with 5 V-tolerant I/O banks (via MultiVolt) bridges directly to 5 V peripherals, while the Flash-based configuration eliminates the UV-erase step of legacy EPLDs. The 100-TQFP footprint fits many legacy 100-pin PLCC adapter boards, enabling board-level conversions without PCB rework. Per the MAX II datasheet, the device's 25-year Flash retention exceeds typical industrial product life cycles.
Direkomendasikan
I/O Expansion for Microcontrollers and SoCs
When a microcontroller or SoC runs out of GPIO pins, the EPM570T100C3N can add 76 additional I/Os via simple SPI or I²C control from the host. Its 5.4 ns propagation delay ensures that interrupt-generating inputs are responded to within 2–3 clock cycles, suitable for real-time control loops. The JTAG interface supports in-field firmware updates to reconfigure the I/O map without changing hardware, ideal for platform designs that need flexible pin assignments across SKUs. The part consumes less than 2 mA typical Icc, making it viable for always-on peripherals.
Direkomendasikan
Legacy Bus Interfacing for Networking Equipment
The EPM570T100C3N is commonly deployed in router, switch, and base-station boards to interface legacy 8-bit/16-bit microprocessor buses to modern high-speed SERDES links. Its 5.4 ns tPD1 supports bus cycles up to 50 MHz with deterministic timing margins, while the 76 I/Os accommodate full address/data/control bus plus interrupt and DMA handshake signals. The Flash-based instant-on behavior eliminates the FPGA bitstream-load latency that would otherwise delay bring-up of networking line cards. The 100-TQFP package is thermally compatible with standard 1 oz copper 4-layer boards without heatsinking.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPM570T100C3N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPM570T100C5N | EPM570T100C4N | EPM570T100I3N | EPM570T100C3 | EPM570GT100C3N |
|---|---|---|---|---|---|---|
| Package | 100-TQFP (T100) | 100-TQFP (T100) - same | 100-TQFP (T100) - same | 100-TQFP (T100) - same | 100-TQFP (T100) - same | 100-TQFP (T100) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Altera | Intel / Altera |
| Speed Grade | C3 (5.4 ns tPD1) | C5 (4.0 ns tPD1) | C4 (4.5 ns tPD1) | I3 (5.4 ns tPD1, industrial) | C3 (5.4 ns tPD1) | C3 (5.4 ns tPD1, MAX II G) |
| Macro Cells | 440 | 440 | 440 | 440 | 440 | 440 |
| Maximum User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +100 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| RoHS Compliance | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Pre-RoHS variant | Yes (Pb-free) |
| Maximum Internal Frequency | 304 MHz | 304 MHz | 304 MHz | 304 MHz | 304 MHz | 304 MHz |
| UFM (User Flash Memory) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Diferensiator Kunci
- Non-volatile Flash-based instant-on architecture (vsSRAM-based FPGAs (e.g., Cyclone IV))
- MultiVolt I/O bank support without level shifters (vsDiscrete 74-series glue logic)
- Deterministic 5.4 ns pin-to-pin propagation delay (vsMicrocontroller-driven logic (e.g., GPIO toggling))
Catatan Desain
The EPM570T100C3N requires separate VCCINT (2.5 V or 3.3 V core) and per-bank VCCIO supplies (1.5/1.8/2.5/3.3 V). Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and add a 10 µF bulk capacitor near the IC. Each VCCIO bank pin should have its own 0.1 µF + 10 µF pair. Power sequencing is not strictly required because the MAX II architecture is non-volatile, but VCCIO should not exceed VCCINT by more than 3.6 V during power-up to avoid latch-up.
Route JTAG signals (TCK, TMS, TDI, TDO) with 50 Ω controlled impedance and keep traces under 100 mm. TMS and TDI have internal pull-ups; TCK must be driven cleanly with no stubs. Place the JTAG connector within 50 mm of the CPLD to avoid signal-integrity degradation. For multi-device JTAG chains, include a 4.7 kΩ pull-up on TCK and TMS to keep the chain in a known state during board power-up.
Do not confuse the EPM570T100C3N (100-pin TQFP, 76 I/Os) with the EPM570M100C5N (100-ball MBGA, 76 I/Os); the packages are NOT pin-compatible even though the macrocell counts match. Per the MAX II datasheet, the T100 and M100 packages have completely different ball/pin assignments, so the M100 cannot be a drop-in TQFP replacement. Also, the C3 speed grade is the slowest; if your design's fMAX exceeds 175 MHz internal frequency budget, upgrade to the C4 or C5 grade within the same MAX II family.
Informasi Konformitas
RoHS and REACH compliant per Intel product page; commercial-grade (0–85 °C) only - not AEC-Q100 qualified. Choose EPM570T100I3N for industrial temperature grade.
