EPM570T100C3N - 440-Macrocell MAX II CPLD, 100-TQFP | Intel / Altera
Référence : EPM570T100C3N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.2 | $14,20 |
| 10 | $12.75 | $127,50 |
| 100 | $11.05 | $1 105,00 |
| 500 | $9.4 | $4 700,00 |
| 1 000 | $8.1 | $8 100,00 |
EPM570T100C3N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the instant-on, deterministic timing characteristics of traditional PAL/GAL architectures with modern macrocell density and in-system programmability. Within the broader hierarchy, a CPLD sits below an FPGA in logic density but above discrete 74-series glue logic, occupying the role of deterministic, low-latency logic glue for bus interface, power-sequencing, and protocol-bridging tasks. The MAX II family in particular replaced legacy EEPROM-based MAX devices with a Flash-based configuration cell, giving instant-on behavior without external boot memory.
Key features of the EPM570T100C3N include 440 logic elements (LEs), 8 Kbits of user flash memory (UFM), 4 input pins per logic array block (LAB), 76 maximum user I/Os, JTAG/IEEE 1149.1 boundary-scan support, and an internal oscillator. The device supports in-system programmability via JTAG, allowing field upgrades without removing the part from the board. Its MultiVolt I/O core can interface with 1.5 V, 1.8 V, 2.5 V, and 3.3 V signals on a mixed-voltage bus without external level shifters.
The MAX II architecture uses a Logic Array Block (LAB) matrix interconnected by a continuous row-and-column routing fabric. Each LAB contains 16 macrocells fed by a 36-input look-up table (LUT) chain and product-term allocation logic. The Flash configuration memory eliminates the configuration bitstream load step required by SRAM FPGAs, achieving less than 100 µs wake-up time from power-on. The 0.18 µm process provides the static power profile typically expected of a non-volatile CPLD, with Icc typical values in the low milliamp range at idle.
Typical applications include bus interface bridging (e.g., I²C-to-parallel, SPI-to-GPIO glue), power-sequence and reset-controller logic, LED display scanning drivers, industrial control board glue logic, and I/O expansion for microcontrollers. Its 100-pin TQFP footprint also makes it a frequent choice for legacy board replacements where an obsolete 5 V CPLD must be swapped out for a 3.3 V part with identical pinout.
When designing with the EPM570T100C3N, note that the C3 speed grade corresponds to a 5.4 ns tPD1 propagation delay; if your timing budget is tighter than 6 ns, consider a C4/C5 speed grade from the same MAX II family. The device is non-volatile and one-time-programmable after configuration, so plan your JTAG chain order and ISP sequencing carefully during board bring-up.
This page synthesizes drop-in pin-compatible alternatives, parametric comparison data, and practical design notes drawn from the MAX II datasheet family and authorized distributor listings - information not consolidated on any single distributor page.
Alternatives de remplacement direct pour EPM570T100C3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570T100C3N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Programming Interface, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570T100C5N
✅ Remplacement direct✓ En stock
$10.2 / unité
Voir la fiche technique →EPM570T100C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.05 / unité
Voir la fiche technique →EPM570T100I3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPM570T100C3
✅ Remplacement direct✓ En stock
$8.5 / unité
Voir la fiche technique →EPM570GT100C3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$12.9 / unité
Voir la fiche technique →EPM570F100C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.2 / unité
Voir la fiche technique →EPM570T100C3N Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Macro Cells | 440 |
| Logic Elements (LEs) | 570 |
| Maximum User I/Os | 76 |
| Pin-to-Pin Delay (tPD1) | 5.4 ns |
| Maximum Internal Frequency | 304 MHz |
| User Flash Memory (UFM) | 8 Kbits |
| Number of LABs | 57 |
| Supply Voltage - Core | 2.5 V / 3.3 V |
| I/O Standards Supported | 1.5 V, 1.8 V, 2.5 V, 3.3 V (MultiVolt) |
| Process Technology | 0.18 µm Flash |
| Boîtier | 100-TQFP (T100) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 °C to +85 °C (Commercial) |
| Programming Interface | JTAG / IEEE 1149.1 boundary-scan |
| In-System Programmable | Yes |
| Statut RoHS | Compliant |
| Speed Grade | C3 |
Configuration des broches de EPM570T100C3N
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | I/O — User I/O (bank 1) |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 8 | I/O — User I/O (bank 1) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | I/O — User I/O (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O (bank 1) |
| Broche 13 | I/O — User I/O (bank 1) |
| Broche 14 | I/O — User I/O (bank 1) |
| Broche 15 | I/O — User I/O (bank 1) |
| Broche 16 | I/O — User I/O (bank 1) |
| Broche 17 | I/O — User I/O (bank 1) |
| Broche 18 | I/O — User I/O (bank 1) |
| Broche 19 | I/O — User I/O (bank 1) |
| Broche 20 | I/O — User I/O (bank 1) |
| Broche 21 | I/O — User I/O (bank 1) |
| Broche 22 | I/O — User I/O (bank 1) |
| Broche 23 | I/O — User I/O (bank 1) |
| Broche 24 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 25 | I/O — User I/O (bank 1) |
| Broche 26 | I/O — User I/O (bank 1) |
| Broche 27 | I/O — User I/O (bank 1) |
| Broche 28 | I/O — User I/O (bank 1) |
| Broche 29 | I/O — User I/O (bank 1) |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O (bank 2) |
| Broche 32 | I/O — User I/O (bank 2) |
| Broche 33 | I/O — User I/O (bank 2) |
| Broche 34 | I/O — User I/O (bank 2) |
| Broche 35 | I/O — User I/O (bank 2) |
| Broche 36 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 37 | I/O — User I/O (bank 2) |
| Broche 38 | I/O — User I/O (bank 2) |
| Broche 39 | I/O — User I/O (bank 2) |
| Broche 40 | I/O — User I/O (bank 2) |
| Broche 41 | I/O — User I/O (bank 2) |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O (bank 2) |
| Broche 44 | I/O — User I/O (bank 2) |
| Broche 45 | I/O — User I/O (bank 2) |
| Broche 46 | I/O — User I/O (bank 2) |
| Broche 47 | I/O — User I/O (bank 2) |
| Broche 48 | I/O — User I/O (bank 2) |
| Broche 49 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 50 | I/O — User I/O (bank 2) |
| Broche 51 | I/O — User I/O (bank 2) |
| Broche 52 | I/O — User I/O (bank 2) |
| Broche 53 | I/O — User I/O (bank 2) |
| Broche 54 | I/O — User I/O (bank 2) |
| Broche 55 | GND — Ground |
| Broche 56 | I/O — User I/O (bank 3) |
| Broche 57 | I/O — User I/O (bank 3) |
| Broche 58 | I/O — User I/O (bank 3) |
| Broche 59 | I/O — User I/O (bank 3) |
| Broche 60 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 61 | I/O — User I/O (bank 3) |
| Broche 62 | I/O — User I/O (bank 3) |
| Broche 63 | I/O — User I/O (bank 3) |
| Broche 64 | I/O — User I/O (bank 3) |
| Broche 65 | I/O — User I/O (bank 3) |
| Broche 66 | I/O — User I/O (bank 3) |
| Broche 67 | I/O — User I/O (bank 3) |
| Broche 68 | GND — Ground |
| Broche 69 | I/O — User I/O (bank 3) |
| Broche 70 | I/O — User I/O (bank 3) |
| Broche 71 | I/O — User I/O (bank 3) |
| Broche 72 | I/O — User I/O (bank 3) |
| Broche 73 | VCCINT — Core supply voltage (2.5 V / 3.3 V) |
| Broche 74 | I/O — User I/O (bank 3) |
| Broche 75 | I/O — User I/O (bank 3) |
| Broche 76 | I/O — User I/O (bank 3) |
| Broche 77 | I/O — User I/O (bank 4) |
| Broche 78 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 79 | I/O — User I/O (bank 4) |
| Broche 80 | I/O — User I/O (bank 4) |
| Broche 81 | GND — Ground |
| Broche 82 | I/O — User I/O (bank 4) |
| Broche 83 | I/O — User I/O (bank 4) |
| Broche 84 | I/O — User I/O (bank 4) |
| Broche 85 | I/O — User I/O (bank 4) |
| Broche 86 | I/O — User I/O (bank 4) |
| Broche 87 | I/O — User I/O (bank 4) |
| Broche 88 | I/O — User I/O (bank 4) |
| Broche 89 | I/O — User I/O (bank 4) |
| Broche 90 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 91 | I/O — User I/O (bank 4) |
| Broche 92 | I/O — User I/O (bank 4) |
| Broche 93 | I/O — User I/O (bank 4) |
| Broche 94 | GND — Ground |
| Broche 95 | TMS — JTAG test mode select |
| Broche 96 | TCK — JTAG test clock |
| Broche 97 | TDO — JTAG test data out |
| Broche 98 | TDI — JTAG test data in |
| Broche 99 | NC — Not connected (per datasheet) |
| Broche 100 | nCONFIG — Configuration / reset (active low) |
Applications typiques
EPM570T100C3N convient pour 6 applications: Bus Interface Bridging and Protocol Glue Logic, Power Sequencing and Reset Controller Logic, LED Display Driver and Scanning Logic, Industrial Control Board Glue Logic Replacement, I/O Expansion for Microcontrollers and SoCs, Legacy Bus Interfacing for Networking Equipment.
Bus Interface Bridging and Protocol Glue Logic
The EPM570T100C3N's 440 macrocells and 5.4 ns tPD1 propagation delay make it well suited to bridge between mismatched bus protocols such as SPI-to-parallel, I²C-to-GPIO, or UART-to-LCD interfaces. Its MultiVolt I/O banks can be configured at 1.8 V on one bank and 3.3 V on another, eliminating external level shifters when connecting a modern SoC to legacy peripherals. The 76 user I/Os comfortably accommodate 32-bit parallel buses plus chip-select, interrupt, and reset signal expansion. Compared with discrete 74-series glue logic, this part reduces board area by 60–70% while improving signal-integrity through deterministic timing.
Recommandé
Power Sequencing and Reset Controller Logic
The EPM570T100C3N's deterministic 5.4 ns propagation delay and instant-on Flash-based architecture (wake-up under 100 µs) make it a strong choice for centralized power-sequencing controllers. It can monitor PG (power-good) inputs from multiple DC-DC converters and generate precisely-timed enable signals for downstream rails. The 8 Kbits of user flash memory (UFM) can store non-volatile trim values or fault logs. Compared with discrete supervisory ICs, this CPLD approach supports 8–16 independent rails with programmable sequencing delays - far beyond the 2–4 rails of a typical supervisor IC.
Recommandé
LED Display Driver and Scanning Logic
The 304 MHz maximum internal frequency and 76 user I/Os of the EPM570T100C3N support multiplexed LED matrix scanning for panels up to 64×64 pixels at video refresh rates. The part's deterministic timing eliminates flicker artifacts common in microcontroller-driven LED systems. Its 100-TQFP package is easy to hand-solder for prototype builds of digital signage or scoreboard controllers. The 8-Kbit UFM can store frame-buffer segments or character ROM data for low-cost scrolling-message displays.
Recommandé
Industrial Control Board Glue Logic Replacement
The EPM570T100C3N is frequently used as a replacement for obsolete 5 V 22V10/32V10 PAL/GAL devices on legacy industrial control boards. Its 3.3 V core supply with 5 V-tolerant I/O banks (via MultiVolt) bridges directly to 5 V peripherals, while the Flash-based configuration eliminates the UV-erase step of legacy EPLDs. The 100-TQFP footprint fits many legacy 100-pin PLCC adapter boards, enabling board-level conversions without PCB rework. Per the MAX II datasheet, the device's 25-year Flash retention exceeds typical industrial product life cycles.
Recommandé
I/O Expansion for Microcontrollers and SoCs
When a microcontroller or SoC runs out of GPIO pins, the EPM570T100C3N can add 76 additional I/Os via simple SPI or I²C control from the host. Its 5.4 ns propagation delay ensures that interrupt-generating inputs are responded to within 2–3 clock cycles, suitable for real-time control loops. The JTAG interface supports in-field firmware updates to reconfigure the I/O map without changing hardware, ideal for platform designs that need flexible pin assignments across SKUs. The part consumes less than 2 mA typical Icc, making it viable for always-on peripherals.
Recommandé
Legacy Bus Interfacing for Networking Equipment
The EPM570T100C3N is commonly deployed in router, switch, and base-station boards to interface legacy 8-bit/16-bit microprocessor buses to modern high-speed SERDES links. Its 5.4 ns tPD1 supports bus cycles up to 50 MHz with deterministic timing margins, while the 76 I/Os accommodate full address/data/control bus plus interrupt and DMA handshake signals. The Flash-based instant-on behavior eliminates the FPGA bitstream-load latency that would otherwise delay bring-up of networking line cards. The 100-TQFP package is thermally compatible with standard 1 oz copper 4-layer boards without heatsinking.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570T100C3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570T100C5N | EPM570T100C4N | EPM570T100I3N | EPM570T100C3 | EPM570GT100C3N |
|---|---|---|---|---|---|---|
| Package | 100-TQFP (T100) | 100-TQFP (T100) - same | 100-TQFP (T100) - same | 100-TQFP (T100) - same | 100-TQFP (T100) - same | 100-TQFP (T100) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Altera | Intel / Altera |
| Speed Grade | C3 (5.4 ns tPD1) | C5 (4.0 ns tPD1) | C4 (4.5 ns tPD1) | I3 (5.4 ns tPD1, industrial) | C3 (5.4 ns tPD1) | C3 (5.4 ns tPD1, MAX II G) |
| Macro Cells | 440 | 440 | 440 | 440 | 440 | 440 |
| Maximum User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +100 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| RoHS Compliance | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Pre-RoHS variant | Yes (Pb-free) |
| Maximum Internal Frequency | 304 MHz | 304 MHz | 304 MHz | 304 MHz | 304 MHz | 304 MHz |
| UFM (User Flash Memory) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Principaux différenciateurs
- Non-volatile Flash-based instant-on architecture (vs SRAM-based FPGAs (e.g., Cyclone IV))
- MultiVolt I/O bank support without level shifters (vs Discrete 74-series glue logic)
- Deterministic 5.4 ns pin-to-pin propagation delay (vs Microcontroller-driven logic (e.g., GPIO toggling))
Notes de conception
The EPM570T100C3N requires separate VCCINT (2.5 V or 3.3 V core) and per-bank VCCIO supplies (1.5/1.8/2.5/3.3 V). Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and add a 10 µF bulk capacitor near the IC. Each VCCIO bank pin should have its own 0.1 µF + 10 µF pair. Power sequencing is not strictly required because the MAX II architecture is non-volatile, but VCCIO should not exceed VCCINT by more than 3.6 V during power-up to avoid latch-up.
Route JTAG signals (TCK, TMS, TDI, TDO) with 50 Ω controlled impedance and keep traces under 100 mm. TMS and TDI have internal pull-ups; TCK must be driven cleanly with no stubs. Place the JTAG connector within 50 mm of the CPLD to avoid signal-integrity degradation. For multi-device JTAG chains, include a 4.7 kΩ pull-up on TCK and TMS to keep the chain in a known state during board power-up.
Do not confuse the EPM570T100C3N (100-pin TQFP, 76 I/Os) with the EPM570M100C5N (100-ball MBGA, 76 I/Os); the packages are NOT pin-compatible even though the macrocell counts match. Per the MAX II datasheet, the T100 and M100 packages have completely different ball/pin assignments, so the M100 cannot be a drop-in TQFP replacement. Also, the C3 speed grade is the slowest; if your design's fMAX exceeds 175 MHz internal frequency budget, upgrade to the C4 or C5 grade within the same MAX II family.
Informations de conformité
RoHS and REACH compliant per Intel product page; commercial-grade (0–85 °C) only - not AEC-Q100 qualified. Choose EPM570T100I3N for industrial temperature grade.
