FPGA & CPLD
製品 (6666)
A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE3000L-FG484M is a low-power, flash-based ProASIC3L FPGA delivering 3 million system gates, 75264 logic elements, 504 kbits of true dual-port SRAM, and up to 341 user I/Os in a 484-ball FBGA package with 1 mm ball pitch. An FPGA (Field-Programmable Gate Array) is a semiconductor device that implements user-defined digital logic through a configurable fabric of logic blocks, routing resources, and I/O cells. The ProASIC3L family sits within Microchip's broader flash FPGA hierarchy, positioned above the ProASIC3E in power efficiency and below Fusion/M1 series in system integration. Unlike SRAM-based FPGAs, flash-based FPGAs are nonvolatile, live at power-up (Instant On), and require no external configuration ROM. Key features include the Flash*Freeze technology, which drops static and dynamic power to microwatt levels while retaining state, a 1.2 V to 1.5 V core voltage, and a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. Security is enhanced because the configuration bitstream is stored on-chip in flash, immune to readback attacks. Architecturally, the device provides VersaTiles as its universal logic element, embedded block RAM organized as true dual-port SRAM, and banked I/O supporting multiple voltage standards. Performance reaches approximately 250 MHz system speeds, sufficient for glue logic, bus bridging, and control-plane functions. Typical applications include industrial control, portable and battery-powered instrumentation, communications line cards, aerospace subsystems, and ASIC prototyping, where single-chip instant-on operation and low standby power matter. Designers should budget power using the Microchip Libero SoC power calculator and watch I/O bank voltage assignments, since 484 balls share limited bank resources. This page adds verified distributor pricing tiers, same-package drop-in alternatives, and practical design notes not found in the datasheet alone.
A3PE3000L-FG896 - ProASIC3L Low Power FPGA 620 I/O | Microchip
The Microchip Technology A3PE3000L-FG896 is a ProASIC3L low-power, nonvolatile flash FPGA with 620 user I/Os, 3 million system gates, and a 1.2 V core voltage, housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package. A field-programmable gate array (FPGA) is a semiconductor device that can be configured by the designer after manufacturing, sitting within the broader hierarchy of programmable logic devices that ranges from SPLDs and CPLDs up to high-density FPGAs. Unlike SRAM-based FPGAs, the ProASIC3L family uses nonvolatile flash technology, meaning the configuration is stored on-chip and no external boot flash is required, making it a secure, single-chip, Instant On solution. Key features of the A3PE3000L-FG896 include its low total cost of ownership, single-chip operation, reprogrammability, and the ProASIC3L family's Flash*Freeze technology, which dramatically reduces static and dynamic power consumption without losing SRAM state or I/O activity. The 1.2 V to 1.5 V core voltage range supports low-power system design. Technically, the device is fabricated on a 130 nm flash process and built around ProASIC3L VersaTile logic architecture, where each tile can act as a lookup table, flip-flop, or embedded memory. The 896-BGA package provides a large 620 I/O budget for wide bus interfaces, memory controllers, and glue logic consolidation in board designs that previously needed multiple ASICs or ASSPs. Typical applications include industrial control, portable and battery-powered instrumentation, secure single-chip logic, and power-sensitive embedded systems where FPGA reprogrammability and instant-on startup are essential. A key design consideration is power: while Flash*Freeze mode can substantially cut dynamic and static power, designers should budget I/O bank loading and configure unused I/Os appropriately to maximize savings. This page synthesizes distributor availability, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, with pricing and stock data verified as of 2026-09-02.
A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip
The Microchip Technology (Microsemi) A3PE3000L-FG896I is a ProASIC3L low-power flash FPGA with 620 user I/Os, approximately 3 million system gates (516096 logic capacity), housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA/896-BGA) package for the industrial temperature range. A flash FPGA is a field-programmable gate array that stores its configuration in on-chip flash memory rather than an external configuration ROM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> semiconductor), flash FPGAs such as the ProASIC3L family offer a true single-chip solution: no external boot device is required, configuration is instant-on at power-up, and the device is reprogrammable in-system. Key features of the ProASIC3L family include 1.2V to 1.5V core voltage operation, I/O operation as low as 1.2V, and Flash*Freeze technology that dramatically reduces dynamic power consumption by up to 40% and static power by 50% compared with the equivalent standard ProASIC3 device, according to the Microchip ProASIC3L datasheet (DS50003268). The low total cost of ownership, reprogrammability, and small-footprint packaging make the family attractive for cost- and power-sensitive designs. Architecturally, the A3PE3000L combines fine-grained Versatile logic elements with embedded flash and SRAM resources, supporting high-performance single-chip designs in industrial, communications, and aerospace/defense systems. The -FG896I designation indicates the industrial temperature variant in the 896-ball package with 620 available I/O. Typical applications include industrial automation and control, medical equipment, communications infrastructure, and military/aerospace systems where nonvolatile, secure, low-power programmable logic is required. Design consideration: because the -I suffix denotes the industrial temperature grade, verify soldering and assembly processes; this specific grade is listed by some sources as RoHS non-compliant and lead-containing, so confirm compliance requirements for your end market. This page synthesizes distributor availability, drop-in alternatives, and practical design guidance not found in the manufacturer datasheet, with pricing referenced as of 2026-09-02.
A3PE3000L-FG896M - 3M-Gate Low-Power Flash FPGA | Microchip
The Microchip (formerly Microsemi/Actel) A3PE3000L-FG896M is a 3-million-gate ProASIC3L low-power flash FPGA with 75,264 logic cells and 620 user I/O, fabricated on a 130nm CMOS flash process and housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package operating from a 1.2V/1.5V core supply. A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that do not require an external configuration PROM, power up instantly, and are inherently more secure because the bitstream is not stored externally. Within the power management hierarchy of programmable logic, the ProASIC3L family sits as Microchip's low-power variant of the ProASIC3/ProASIC3E families, adding Flash*Freeze technology. Key differentiating features include Flash*Freeze technology, which allows the device to enter an ultra-low-power sleep mode while retaining state and waking in microseconds; 1.2V to 1.5V core operation for reduced dynamic and static power; single-chip reprogrammable flash configuration; Schmitt-trigger option on single-ended inputs; and weak pull-up/pull-down support on I/O. Technically, the device uses a sea-of-gates flash architecture with versatile logic elements, embedded block RAM, and supports IEEE 1149.1 (JTAG) boundary scan testing. The pin-compatible package strategy across the ProASIC3L family (except PQ208) allows design migration between density grades without PCB rework. Typical applications include military and aerospace systems, industrial automation, portable instrumentation, and low-power embedded control where nonvolatile single-chip configuration and minimal standby power are essential. Design consideration: the M temperature grade suffix indicates a military-grade screening level; verify supply sequencing and use Microchip Libero SoC design tools for implementation. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
The Microchip Technology A3PE3000L-FGG324 is a ProASIC3L low-power Flash-based FPGA with 3,000,000 system gates, 221 user I/Os, and support for core voltages from 1.2V to 1.5V, housed in a 324-ball fine-pitch FBGA (324-BGA) surface-mount package. An FPGA (Field-Programmable Gate Array) is a semiconductor device that implements custom digital logic through a fabric of configurable logic blocks (CLBs) connected by programmable interconnects. Unlike SRAM-based FPGAs, the ProASIC3L family stores its configuration in on-chip nonvolatile Flash, giving a single-chip, instant-on solution with no external configuration device required - a key advantage in the programmable logic hierarchy spanning SPLDs, CPLDs, and FPGAs. Key features of the A3PE3000L include Flash*Freeze technology for ultra-low static power, up to 75,264 configurable logic cells, support for single-ended and differential I/O standards, Schmitt Trigger option on single-ended inputs (A3PE3000L), weak pull-up/pull-downs, and IEEE 1149.1 (JTAG) boundary scan test per the Microchip ProASIC3L datasheet (DS50003268). The device operates from a 1.5V operating supply (commercial range 0C to +70C for this speed grade) with pin-compatible packages across the ProASIC3L family. Architecturally, the fabric combines VersaTiles with embedded Flash technology built on a standard CMOS process, delivering reprogrammability with inherently low power and high security versus SRAM FPGAs. The low total cost of ownership (TOC) makes the family attractive for high-volume designs where an external boot Flash and power-up configuration time are undesirable. Typical applications include industrial automation controllers, portable and battery-powered instrumentation, communications line cards, and medical monitoring equipment where the Flash*Freeze mode cuts standby power dramatically. Designers should budget the 1.2V to 1.5V core rail carefully: lowering VCORE to 1.2V maximizes power savings, while 1.5V supports higher performance up to the 250MHz-class timing limits. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet. Pricing is referenced as of 2026-09-02.
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
The Microchip (Microsemi) A3PE3000L-FGG324I is a ProASIC3L low-power flash FPGA with 3 million system gates, 221 user I/Os, and 516,096 total RAM bits, housed in a 324-ball Fine-Pitch Ball Grid Array (FBGA, 19x19 mm) and rated for the industrial temperature range of -40C to +100C. A flash FPGA is a field-programmable gate array that stores its configuration in on-chip nonvolatile flash memory rather than an external configuration PROM. Within the power-management hierarchy of programmable logic, ProASIC3L sits in the low-power segment: unlike SRAM FPGAs it is Instant On, single-chip, and secure, because no bitstream is loaded at power-up. Key features include the 130nm CMOS flash process, a 1.2 V to 1.5 V core voltage option, Flash*Freeze technology that dramatically cuts dynamic and static power, and reprogrammability without an external boot device. These attributes reduce total cost of ownership and board complexity. Architecturally, the device integrates flash-based logic elements plus embedded SRAM blocks totaling 516 kbit, supporting pipelined datapaths, FIFOs, and small soft-core processor systems. Performance is sufficient for glue logic consolidation, interface bridging, and control-plane designs at moderate clock rates. Typical applications include industrial automation controllers, portable and battery-powered instruments, communications line cards, and medical monitoring equipment where low standby power is decisive. Design consideration: exploit Flash*Freeze mode to hold state while cutting power during idle periods; plan I/O banking and 1.2 V core rail sequencing early in layout. This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing tiers, drop-in same-package alternatives, and practical design notes in one place.
A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE3000L-FGG484 is a ProASIC3L low-power nonvolatile flash FPGA with 3 million system gates (75,264 logic cells), 341 user I/Os, and 516,096 bits of embedded RAM, housed in a 484-ball fine-pitch BGA (FGG484, 23 x 23 mm, 1.0 mm ball pitch) package. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program to implement custom digital circuits. Unlike SRAM-based FPGAs, the ProASIC3L family uses nonvolatile flash technology, placing it in the flash-FPGA branch of the programmable logic hierarchy (FPGA -> flash FPGA -> ProASIC3L family), which means the configuration is stored on-chip and the device is Instant On at power-up with no external boot flash required. Key features include a 1.2 V to 1.5 V core voltage option for reduced dynamic power, the Flash*Freeze technology that dramatically cuts static and dynamic power during idle periods, single-chip secure operation immune to configuration readback, and reprogrammability without a host microcontroller. The FGG484 package supplies abundant I/O for wide parallel buses and memory interfaces. Architecturally, the device is built on a 130 nm flash process with VersaNet low-skew global networks for clock and high-fanout signal distribution, as documented in the ProASIC3E fabric user guide. Typical applications include industrial automation control, battery-powered portable instrumentation, aerospace and defense systems requiring secure nonvolatile configuration, and communications line cards. A key design consideration is that flash FPGAs trade some maximum fabric speed versus high-end SRAM FPGAs, so verify timing closure in Libero SoC before committing the design. This page adds value beyond the datasheet by consolidating distributor availability from Mouser, DigiKey, Arrow, and Newark, drop-in same-package alternatives, and practical design notes.
A3PE3000L-FGG484M - ProASIC3L 3M-Gate Flash FPGA | Microchip
The Microchip Technology (Microsemi/Actel) A3PE3000L-FGG484M is a ProASIC3L low-power flash FPGA offering approximately 3 million system gates (75,264 cells) with 341 user I/Os and 516,096 bits of embedded flash memory, housed in a 484-ball FBGA (FGG484) package with military-grade temperature rating from -55C to +125C. A flash-based FPGA is a field-programmable gate array that stores its configuration in non-volatile on-chip flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, it sits as an FPGA -> programmable logic device -> semiconductor. Unlike SRAM FPGAs, ProASIC3L devices are single-chip, instant-on, and inherently more secure because the bitstream is stored internally. Key features of the ProASIC3L family include 1.2V to 1.5V core voltage operation, Flash*Freeze technology that dramatically cuts static power while retaining state, and per the Microchip datasheet roughly 40% lower dynamic power and 50% lower static power than the equivalent ProASIC3 device. The non-volatile flash fabric eliminates configuration PROMs, reduces bill-of-material cost, and improves supply-chain security. The A3PE3000L fabric provides versatile logic elements, embedded SRAM, and supports soft-core processors and common IP cores. The 23 x 23 mm, 1.0 mm pitch FGG484 package with 2.23 mm height suits high-I/O-count designs where board area and solderable inspection matter. Typical applications include military and aerospace systems needing -55C to +125C operation, industrial automation controllers, communications line cards, and medical instrumentation where low static power extends battery or conduction-cooled system budgets. Design consideration: allocate adequate decoupling on the 1.2V/1.5V core rails and plan the power-up sequence early; Flash*Freeze pin usage should be fixed before layout freeze. This page synthesizes distributor pricing, same-footprint drop-in alternatives, and practical design notes not found in the manufacturer datasheet, as of 2026-09-02.
A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology
The Microchip Technology A3PE3000L-FGG896 is a 3,000,000-system-gate ProASIC3L low-power flash FPGA with 75,264 logic cells, 504 kbits of true dual-port SRAM, and 620 user I/Os, housed in an 896-ball FBGA (FGG896) package with 1.0 mm pitch. This device is part of Microchip's flash-based FPGA family that combines non-volatile configuration, instant-on operation, and low power consumption for high-reliability applications. An FPGA (Field Programmable Gate Array) is an integrated circuit whose logic fabric can be configured after manufacturing. The ProASIC3L family uses flash-based configuration cells, enabling non-volatile, live-at-power-up operation without an external boot device. FPGAs sit in the digital logic hierarchy between CPLDs and ASICs, balancing flexibility, density, and time-to-market. The A3PE3000L-FGG896 is a mid-density ProASIC3L device, positioned for applications that need substantial logic but not the complexity of the largest FPGA families. Key features of the A3PE3000L-FGG896 include Flash*Freeze technology, which reduces standby power by entering an ultra-low-power mode while retaining register states, 1.2V to 1.5V core operation, and up to 620 user I/Os. The device is manufactured on a 130-nm, 7-layer metal (6 copper) flash-based CMOS process, making it inherently secure and resistant to configuration bitstream loss. It supports Level 0 live-at-power-up, meaning the FPGA is operational immediately after power rail stabilization. The ProASIC3L architecture provides true single-chip operation, with configuration stored in on-chip flash cells, eliminating the need for external configuration memory and reducing system component count. The device offers 504 kbits of true dual-port SRAM, which supports concurrent read/write accesses for FIFO and buffer applications. The 620 user I/Os are arranged in banks with flexible I/O standards, although the exact voltage and standard options are detailed in the manufacturer datasheet. Typical applications include industrial automation and control, communications infrastructure, defense and aerospace electronics, medical imaging, broadcast and machine vision, and secure IoT edge computing. The low static power and Flash*Freeze mode make the A3PE3000L-FGG896 particularly attractive for battery-powered and thermally constrained systems. When designing with the A3PE3000L-FGG896, pay close attention to core supply decoupling: place 100nF ceramic capacitors close to each core supply ball and a bulk capacitor on the board. The 1.2-1.5V core supply should be stable and clean; the Flash*Freeze input can be driven from a GPIO or power management IC to reduce standby current. Thermal vias under the BGA should be used to improve heat transfer. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for selection and design-in information.
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
The Microchip (Microsemi) A3PE3000L-FGG896I is a 3-million-system-gate low-power flash-based FPGA from the ProASIC3L family, offering 620 user I/Os and 516096 bits (504 kbits) of embedded true dual-port SRAM in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package, with industrial-grade temperature rating and a 1.14V to 1.575V core supply. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and embedded memory that designers program to implement custom digital circuits. Within the programmable logic hierarchy, the A3PE3000L sits at the top of the ProASIC3L low-power family, positioned below the Fusion and Igloo families in the broader power management and embedded processing ecosystem. Unlike SRAM-based FPGAs, it uses nonvolatile flash cells for configuration. Key features include flash-based nonvolatile configuration enabling single-chip, Live-at-Power-Up (Level 0) operation with no external boot PROM, the Flash*Freeze technology unique to the ProASIC3L family that dramatically cuts static and dynamic power while retaining SRAM state, and 130-nm 7-layer-metal (6 copper) flash-based CMOS process technology. The device supports 1.2V to 1.5V core voltage operation for low total cost of ownership. Technically, the ProASIC3L fabric combines versatile logic elements with embedded block SRAM organized as true dual-port memories, supporting high-bandwidth pipelined designs. The flash switch architecture is inherently secure and immune to configuration readback, and the single-chip solution reduces board cost, boot time, and reliability risks compared with SRAM FPGA boot architectures. Typical applications include industrial automation controllers, portable and battery-powered instrumentation, secure communications equipment, and aerospace/defense systems where instant-on operation, low static power, and configuration security are mandatory. When designing with this device, budget core voltage within the 1.14V to 1.575V window and exploit Flash*Freeze mode to extend battery life; the 896-FBGA footprint requires careful ball-mapping to escape all 620 I/Os. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
A3PE3000L-FGG896M - 3M-Gate Low-Power Flash FPGA | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE3000L-FGG896M is a low-power flash-based FPGA from the ProASIC3L family, offering 3,000,000 system gates, up to 616 user I/Os, and 504 kbits of true dual-port SRAM, housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package with 1 mm ball pitch. A field-programmable gate array (FPGA) is a semiconductor device that can be configured by the designer after manufacturing, sitting within the programmable logic hierarchy of FPGA -> programmable logic device -> digital logic IC. Unlike SRAM-based FPGAs, the ProASIC3L family uses a 130-nm, 7-layer-metal (6 copper) flash-based CMOS process, giving it a non-volatile fabric. Key features include Flash*Freeze technology for near-zero-power standby, live-at-power-up (Level 0) operation for single-chip solutions without an external configuration device, and pin compatibility across the ProASIC3L family (except PQ208). The flash-based fabric eliminates configuration time and configuration-readout security concerns common to SRAM FPGAs. Technically, the device integrates 75,264 logic cells (DigiKey lists 516,096 block figures for the 896-ball option) on the 1.2 V/1.5 V core architecture. Weak pull-up/pull-down options and Schmitt-trigger inputs on single-ended I/Os (A3PE3000L) improve signal integrity, while IEEE 1149.1 (JTAG) boundary scan supports board-level test. The military ProASIC3/EL variant datasheet confirms the low-power focus of the L-suffix grade. Typical applications include low-power industrial control, portable and battery-operated instrumentation, military and avionic glue logic consolidation, communications line cards, and single-chip secure boot designs where an external configuration flash would be a liability. When designing with this device, keep core voltage rails tightly regulated and use the Flash*Freeze mode to exploit its static-power advantage; verify I/O banking rules before fixing the pinout. This page synthesizes distributor pricing, drop-in alternatives, FAQs, and practical design notes not found in the manufacturer datasheet, with data verified as of 2026-09-02.
A3PE3000L-PQ208 - 3M Gate Low-Power Flash FPGA | Microchip
The Microchip (Microsemi/Actel) A3PE3000L-PQ208 is a 3-million-system-gate ProASIC3L low-power flash-based FPGA with 504 kbits of true dual-port SRAM, 147 user I/Os in the 208-pin BFQFP (PQ208) package, a 1.2 V core voltage, and a maximum operating frequency of 781.25 MHz. A flash-based FPGA stores its configuration in on-chip flash memory cells rather than external configuration devices. Unlike SRAM FPGAs, flash FPGAs are live-at-power-up (Level 0 support), single-chip solutions that retain their configuration through power cycles. Within the programmable logic hierarchy, the A3PE3000L sits in the mid-density ProASIC3L family, a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. Key features include nonvolatile flash programming requiring no external boot PROM, low-power operation from a 1.2 V core rail, up to 504 kbits of embedded true dual-port SRAM for FIFOs and buffering, and IEEE 1149.1 (JTAG) boundary scan test support. Schmitt trigger options on single-ended inputs improve noise immunity in industrial environments. The ProASIC3L architecture provides Sea-of-Gates style fabric with versatile logic tiles, making it a cost-effective ASIC replacement in systems where NRE costs and mask charges are prohibitive. Typical applications include industrial automation control, networking and communications equipment, consumer electronics, and avionics subsystems where single-chip, instantly-on programmable logic simplifies the bill of materials and improves board reliability. A key design consideration is supply sequencing and power estimation: the 208-pin QFP has moderate thermal performance, so designers should estimate static plus dynamic power using Microchip Libero power tools before finalizing the power budget. This page synthesizes distributor pricing, drop-in alternatives, pinout guidance, and practical design notes not consolidated in the manufacturer datasheet.
A3PE3000L-PQ208I - 3M-Gate Low-Power Flash FPGA | Microchip
The Microchip Technology (Microsemi) A3PE3000L-PQ208I is a 3-million-system-gate ProASIC3L low-power flash-based FPGA with 516,096 bits (504 kbits) of true dual-port SRAM, 147 user I/Os, and a 1.14V to 1.575V supply range, housed in a 208-pin BFQFP (PQ208) surface-mount package with an industrial operating grade. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. Within the programmable logic hierarchy - FPGA -> programmable logic device -> logic IC -> semiconductor - flash FPGAs occupy the single-chip, Instant-On niche: unlike SRAM FPGAs, they require no external boot flash and are live at power-up (Level 0 support). Key features include 3,000,000 system gates (75,264 logic cells/CLBs), 504 kbits of true dual-port SRAM, the Flash*Freeze low-power mode that dramatically cuts dynamic power, and a 1.2V core with 1.2V to 1.5V core voltage options. The 130-nm, 7-layer-metal (6 copper) flash-based CMOS process delivers a secure, reprogrammable, single-chip solution with a low total cost of ownership. Architecturally, the ProASIC3L fabric combines fine-grained Versatile logic elements with embedded true dual-port SRAM blocks, supporting clock rates into the hundreds of MHz range per family data. Because configuration is flash-based, the bitstream is inherently more resistant to cloning than SRAM FPGAs, supporting secure ASIC-replacement designs. Typical applications include industrial control and automation, networking and communications line cards, avionics and defense systems requiring single-chip instant-on logic, and portable or power-sensitive equipment exploiting Flash*Freeze dynamic power savings. Design consideration: budget I/O bank assignments early - the PQ208 package exposes 147 of the device's user I/Os, so confirm pin availability against your full I/O list before layout. This page synthesizes distributor pricing, drop-in PQ208 alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE3000L-PQG208I - ProASIC3L Flash FPGA 3M Gates | Microchip
The Microchip Technology (Microsemi) A3PE3000L-PQG208I is a ProASIC3L low-power flash FPGA delivering 3,000,000 system gates, 516,096 bits of embedded flash memory, and 147 user I/Os in a 208-pin PQFP (BFQFP, 28x28 mm) surface-mount package. It operates from a 1.14 V to 1.575 V supply with a 1.2 V core voltage option and supports junction temperatures from -40C to +100C for industrial applications. A flash FPGA is a field-programmable gate array that stores its configuration in non-volatile on-chip flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, the A3PE3000L sits in the ProASIC3L family of flash FPGAs, under the broader FPGA and programmable logic device category, and functions as a single-chip system logic solution for power-sensitive designs. Key features include FlashFreeze technology, which dynamically cuts dynamic and static power with no external components and near-instant wake-up; a 1.2 V core option that yields roughly 40% dynamic and 50% static power savings versus the standard ProASIC3 at equivalent density; single-chip operation requiring no boot PROM; and reprogrammability with security features inherent to flash-based configuration. Maximum operating frequency reaches 781.25 MHz in high-speed I/O contexts per distributor data. The device is fabricated on a 130 nm flash process and uses a fine-grained architecture of Versatile logic elements organized into Versatile tiles, with embedded flash blocks (516 kbits) usable as dual-port SRAM or flash ROM. The low-power core variant and Power Driven Layout support in Libero SoC can deliver up to 30% additional power reduction over standard timing-driven place-and-route. Typical applications include industrial automation controllers, portable and battery-powered instrumentation, medical monitoring equipment, and secure communications interfaces - anywhere non-volatile, single-chip logic with low static power is required. Flash configuration also eliminates configuration data readout, improving design security against cloning. A key design consideration is thermal management: at 208-BFQFP with a plastic thermal-enhanced body, verify junction temperature stays below +100C at maximum switching activity, using ground-plane copper pour under the exposed die-attach area. Also budget the 1.14 V to 1.575 V supply window against the chosen core voltage setting. This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet, based on data verified as of 2026-09-01.
A3PE600-1FG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
The Microchip Technology (Microsemi) A3PE600-1FG256 is a 600,000-system-gate ProASIC3E flash-based FPGA with 110592 bits of configuration capacity, up to 165 user I/Os in the 256-ball FBGA (FG256) package, fabricated on a 130-nm, 7-layer-metal (6 copper) flash-based CMOS process with a 1.5V core supply and a maximum system frequency of 272 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field after manufacturing. Unlike SRAM-based FPGAs, the ProASIC3E family stores its configuration in on-chip flash, which means it is live-at-power-up (Level 0 support) and requires no external boot configuration device - a true single-chip solution within the broader hierarchy: FPGA -> programmable logic device -> digital IC -> semiconductor. Key features include flash-based nonvolatile configuration enabling instant-on operation, up to 504 kbits of true dual-port SRAM for on-chip buffering, optional soft ARM support via Cortex-M1 compatible fabric, and reprogrammability without a configuration PROM. The low total cost of ownership (TOC) results from the single-chip, no-boot-device architecture, and system performance reaches 272 MHz on the -1 speed grade. The architecture uses 130-nm flash-based CMOS with metal interconnect routing. Logic is implemented in VersTile-compatible fabric elements, and embedded true dual-port SRAM blocks support FIFOs and data buffering. Because configuration is stored in flash cells, security is inherently higher than SRAM FPGAs - there is no bitstream to intercept at power-up. Typical applications include industrial control and automation, communications and networking line cards, aerospace and defense systems requiring instant-on secure boot, and portable instrumentation where a single-chip FPGA reduces board area and BOM count. A key design consideration: the -1 speed grade limits maximum system frequency to 272 MHz, so verify timing closure with Libero SoC before committing; the FG256 package provides 165 I/Os, versus 616 I/Os max in larger family packages. This page synthesizes distributor pricing, drop-in same-package alternatives, pinout resources, and practical design notes not found in the manufacturer datasheet.
A3PE600-1FG256I - ProASIC3E FPGA 600K Gates 256-FBGA | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE600-1FG256I is a ProASIC3E family flash-based FPGA with 600K gates, up to 165 user I/Os, and a 272 MHz system performance, housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA/256-LBGA) package for industrial temperature operation. A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip flash memory cells rather than the SRAM cells used by most Xilinx or Intel (Altera) devices. Within the programmable logic hierarchy, the A3PE600 sits as a low-density member of the ProASIC3E family, which itself belongs to the broader category of nonvolatile FPGAs and programmable system-on-chip devices. Key features include single-chip operation with no external configuration PROM, instant-on power-up, live reprogrammability, and 130nm flash process technology. The 1.5V core supply and low total cost of ownership (TOC) make it attractive for cost-sensitive designs. The FG256 package provides fine-pitch ball interconnect for compact surface-mount assemblies. Architecturally, the ProASIC3E fabric is built from VersaTiles - fine-grained logic tiles that implement both combinational and sequential functions - complemented by embedded memory and optional high-performance I/O banks. Flash switching technology eliminates configuration loading time and gives inherent resistance to configuration upset from radiation or power glitches, a key reason these parts are used in aerospace-adjacent and industrial applications. Typical applications include industrial automation controllers, communications line cards, test and measurement instrumentation, medical equipment, and glue-logic consolidation where instant-on behavior and single-chip BOM simplicity matter. For design, confirm the -1 speed grade timing against your timing closure targets in Libero SoC before committing, since the -2 grade offers faster performance at higher cost. Verify supported I/O standards for the FG256 package in the datasheet. This page synthesizes distributor pricing, drop-in alternatives, design notes, and sourcing context not found in the manufacturer datasheet alone.
A3PE600-1FG484 - ProASIC3E FPGA 600K Gates 484-BGA | Microchip
The Microchip Technology A3PE600-1FG484 (originally Microsemi) is a ProASIC3E flash-based FPGA with 600,000 system gates (approximately 56,000 equivalent system gates, 7K LUT-based logic elements), 270 user I/Os, and 110,592 bits of embedded RAM, housed in a 484-ball FBGA (23 x 23 mm, 1 mm pitch) package operating from a 1.5V core supply (1.425V to 1.575V) at a junction temperature of 0C to +85C. A flash-based FPGA stores its configuration in on-chip flash memory rather than SRAM, so it boots instantly at power-up without an external configuration PROM and is inherently single-chip. Within the programmable logic hierarchy, the A3PE600 belongs to the ProASIC3E family -> flash FPGA -> field-programmable gate array -> programmable logic device, built on a 130nm CMOS flash process. Key features include reprogrammable flash fabric with a maximum operating frequency of about 231-272 MHz depending on speed grade, LiveSequence/instant-on capability, optional soft ARM Cortex-M1 support, low total cost of ownership through elimination of configuration devices, and abundant user I/O for system integration. Technically, the ProASIC3E fabric uses a sea-of-gates architecture of versatile VersaNets and buffered routing, with embedded block RAM (4,608-bit blocks totaling 110,592 bits). The '-1' speed grade targets cost-optimized, moderate-frequency designs, while the FG484 footprint provides high I/O count for bus-width interfaces. 130nm flash cells retain configuration across power cycles, supporting secure, tamper-resistant designs without bitstream loading. Typical applications include industrial automation controllers, communication line cards and bridge logic, medical instrument control, and aerospace/defense systems needing instant-on and high design security. Design consideration: the part is RoHS non-compliant (lead-bearing balls), so it is restricted from new RoHS-mandated designs; use A3PE600-1FGG484 (green) instead. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-1FG484I - 600K-Gate Flash FPGA, 270 I/O | Microchip
The Microchip Technology (Microsemi) A3PE600-1FG484I is a 600,000-system-gate flash-based FPGA from the ProASIC3E family with 270 user I/Os and 13,824 logic cells, housed in a 484-ball FBGA package with 1.0 mm ball pitch (23 x 23 mm body). An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that the designer programs after manufacturing. The ProASIC3E family belongs to the nonvolatile flash FPGA class within the broader FPGA -> programmable logic -> digital IC hierarchy, meaning configuration data is stored on-chip in flash cells rather than an external configuration PROM. Key features include Live-at-Power-Up (Level 0) operation for single-chip solutions, true dual-port SRAM of up to 504 kbits across the family, and a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. The -1 speed grade supports system performance up to 231 MHz, and the industrial-grade -I suffix supports extended temperature operation for harsh environments. Architecturally, the A3PE600 uses VersaTiles - fine-grained logic modules that implement both combinational and sequential functions - plus embedded block RAM and flash-based switch routing that eliminates the configuration time and volatility of SRAM FPGAs. The E variant of ProASIC3 adds a higher effective system-gate density and abundant embedded memory versus base ProASIC3. Typical applications include industrial automation controllers, communications and networking line cards, medical instrumentation, aerospace/defense systems requiring instant-on operation, and test equipment glue-logic consolidation. A key design consideration: the FBGA-484 footprint requires careful PCB escape routing at 1.0 mm pitch, and core supply (1.5 V) versus I/O bank supplies must be decoupled per the Microchip power guidelines in the manufacturer datasheet. This page synthesizes distributor pricing, drop-in same-footprint alternatives, practical design notes, and comparison data not consolidated in the manufacturer datasheet.
A3PE600-1FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
The Microchip Technology (formerly Microsemi) A3PE600-1FGG256 is a 600,000-system-gate ProASIC3E flash-based FPGA with approximately 7K logic elements, 165 user I/Os, and a 272 MHz system performance ceiling, housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA-256) package with commercial 0 C to +70 C operating range and a 1.5V core supply. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program to implement custom digital circuits. Unlike SRAM-based FPGAs, the ProASIC3E family stores its configuration in on-chip flash, making it a single-chip, live-at-power-up solution that needs no external boot PROM and offers high resistance to configuration tampering. Key features include flash-based, reprogrammable fabric on a 130-nm, 7-layer-metal (6 copper) CMOS process, true dual-port SRAM of up to 504 kbits across the family, single-chip operation with Live-At-Power-Up Level 0 support, and a low total cost of ownership as an ASIC replacement. The -1 speed grade balances performance with power, and FG256/FG484 packages are footprint-compatible, easing future migration. The ProASIC3E architecture combines programmable logic tiles with embedded flash switching, delivering deterministic, instant-on behavior suited to glue logic consolidation, bus bridging, and secure control functions. Differential I/O support reduces single-ended I/O counts by two per pair when used. Typical applications include consumer electronics, networking and communications equipment, computing platforms, industrial control, and avionics subsystems, where its instant-on flash fabric and single-chip footprint simplify power sequencing and board design. A key design consideration: each differential pair consumes two single-ended I/Os, so budget I/O accordingly; voltage-referenced standards require one VREF pin per I/O minibank. This page synthesizes distributor availability data, same-package drop-in variants, and practical design notes not found in the manufacturer datasheet.
A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip
The Microchip Technology A3PE600-1FGG256I is a 600,000-system-gate flash-based FPGA from the ProASIC3E family with 165 user I/Os, 110592 bits of embedded true dual-port SRAM (504 kbits family maximum density block option), and a 1.5 V core supply, housed in a 256-ball LBGA (FBGA-256, 1.0 mm ball pitch) industrial-grade package rated for -40C to +100C junction temperature. A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip flash memory cells rather than volatile SRAM or an external configuration device. Within the programmable logic hierarchy, the A3PE600-1FGG256I sits as a mid-density member of the ProASIC3E flash FPGA family, below the A3PE1500 and A3PE3000, and belongs to the broader class of power management system components used for glue logic, control, and data-path integration. Key differentiating features include single-chip, Live-at-Power-Up (Level 0) operation enabled by the 130-nm, 7-layer metal (6 copper) flash-based CMOS process, which removes the external boot PROM required by SRAM FPGAs and improves system security. The ProASIC3E fabric delivers system performance up to 272 MHz, abundant embedded SRAM, and reprogrammability without a configuration controller. Architecturally, the device combines VersaTiles (fine-grained logic tiles) with embedded true dual-port SRAM blocks and a flexible I/O structure supporting multiple single-ended and differential standards. The FlashFreeze-style low-power characteristics of the flash fabric reduce static power compared with SRAM FPGA alternatives, and the 1.425 V to 1.575 V core supply range accommodates typical 1.5 V rail tolerance. Typical applications include industrial automation control, communications line-card glue logic, medical instrumentation data-path bridging, aerospace/defense secure single-chip designs, and test-and-measurement subsystems where instant-on operation is required. A key design consideration is supply sequencing: the 1.5 V core and I/O rails should ramp within datasheet limits, and BGA fanout on a 1.0 mm pitch requires via-in-pad or dog-bone escape routing on at least 6 signal layers. This page synthesizes distributor pricing tiers, drop-in same-family alternatives, design guidance, and comparison data not consolidated in the manufacturer datasheet.
A3PE600-1FGG484 - 600K Gate Flash FPGA 484-FBGA | Microchip
The Microchip Technology (Microsemi) A3PE600-1FGG484 is a 600,000-system-gate ProASIC3E flash-based FPGA with 13,824 configurable logic blocks (CLBs), 270 user I/Os in the 484-ball FBGA package, and 1.5V core supply, fabricated on a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory cells rather than SRAM. This places the ProASIC3E family in the power-management and system-logic hierarchy as a single-chip, live-at-power-up solution: no external configuration PROM or boot flash is required, and the fabric is functional immediately after power application (Level 0 support). This distinguishes flash FPGAs from SRAM FPGAs such as Xilinx Virtex or Altera Stratix families. Key features include 600K system gates, up to 504 kbits of true dual-port SRAM (110592 bits per DigiKey listing), reprogrammability without an external controller, and a low total cost of ownership through single-chip integration. The -1 speed grade supports system performance suited to glue logic, control, and data-path applications. Architecturally, the A3PE600 uses a sea-of-vanilla-physics fabric with flash switch elements, giving inherently low static power and instant-on behavior. The 484-FPBGA (23 x 23 mm, 1 mm pitch) package exposes 270 user I/Os with configurable standards, and supply operation over 1.425V to 1.575V per the Microchip USA product listing. Operating range is 0C to +85C (TJ) for the commercial -1 grade. Typical applications include industrial control and automation, aerospace and defense subsystems, communications line cards, test instrumentation, and secure single-chip designs where configuration readback attacks are a concern because the bitstream resides in flash, not external SRAM. Design consideration: budget the 1.5V core rail and I/O bank rails independently, and confirm the -1 speed grade meets timing closure in Microchip Libero SoC before committing layout, since the -2 grade offers higher performance in the same package footprint. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
A3PE600-1FGG484I - ProASIC3E 600K-Gate Flash FPGA | Microchip
The Microchip (Microsemi) A3PE600-1FGG484I is a 600,000-system-gate ProASIC3E flash-based FPGA with up to 272 MHz system performance, 270 user I/Os, and 110592 bits of embedded dual-port SRAM, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package operating over the industrial temperature range denoted by the I suffix. It is fabricated on a 130-nm, 7-layer-metal (6 copper) flash-based CMOS process and runs from a 1.5V core supply. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external SRAM configuration device. Within the programmable logic hierarchy, the FPGA sits above CPLDs and below ASSPs/ASICs in integration, and the ProASIC3E family occupies the nonvolatile, single-chip segment of that hierarchy, meaning the device is live-at-power-up (Level 0 support) with no external boot PROM required. Key differentiating features include true single-chip operation, reprogrammability without a configuration flash, optional soft ARM support per the family datasheet, up to 504 kbits of true dual-port SRAM across the family, and low total cost of ownership due to the elimination of the configuration device. The ProASIC3E fabric delivers system performance in the 231-272 MHz class depending on speed grade. Technically, the A3PE600 is built from VersaTiles, Microchip's fine-grain flash-based logic element, with embedded memory blocks distributed across the fabric. The 1.5V core and 130-nm process yield a balance of static power and logic density suited to glue logic consolidation, bus bridging, and control-plane functions. Typical applications include industrial automation control, communications line-card bridging, medical instrumentation control logic, and aerospace/defense systems that benefit from nonvolatile, single-chip, secure configuration. Design consideration: the 484-FBGA requires attention to power-plane segmentation for 1.5V core versus I/O banks, and BGA rework constraints make speed-grade and temperature-grade selection important before layout. This page synthesizes distributor pricing, verified drop-in alternatives within the ProASIC3E family, and practical design notes not found in the manufacturer datasheet.
A3PE600-1PQG208 - ProASIC3E FPGA 600K Gates | Microsemi
The Microsemi (Microchip) A3PE600-1PQG208 is a ProASIC3E family Field Programmable Gate Array (FPGA) offering 600,000 system gates, 147 user programmable I/O pins, and 110,592 bits of total embedded RAM, housed in a 208-pin BFQFP (PQFP, 28x28 mm) surface-mount package operating from a 1.5V core supply. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that the designer configures after manufacturing. Within the programmable logic hierarchy, it sits between fixed-function ASICs and software-programmed microcontrollers, offering hardware parallelism with post-production reconfigurability. The ProASIC3E family extends the base ProASIC3 architecture with embedded flash configuration and enhanced memory resources, making it a single-chip, non-volatile solution that requires no external configuration PROM. Key features of the A3PE600-1PQG208 include 600K gates of flash-based fabric, 272 MHz system-level performance on 130 nm flash technology, a tight 1.425V to 1.575V core supply window, and 147 usable I/Os for wide-bus interfacing. Its single-chip, live-at-power-up behavior eliminates the boot delay and configuration-stream vulnerability of SRAM FPGAs, improving system security and reliability. Technically, ProASIC3E uses a proven flash switch architecture with VersaTiles as the fundamental logic element, delivering deterministic, ASIC-like timing behavior. The -1 speed grade defines the timing bin, and the 28x28 mm PQFP package provides robust leads suitable for industrial environments and board-level rework. Typical applications include industrial automation control, communications bridging and protocol conversion, medical instrumentation glue logic, and aerospace/defense systems where non-volatile, secure, rad-tolerant-by-technology FPGAs are preferred. Design consideration: ensure the 1.5V core rail stays within 1.425V-1.575V under worst-case load transients, and follow Microchip power-decoupling guidance with multiple bulk and 0.1uF ceramic capacitors around the 208-pin package. This page synthesizes verified distributor data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-1PQG208I - 600K-Gate ProASIC3E Flash FPGA | Microsemi
The Microsemi (Microchip) A3PE600-1PQG208I is a 600,000-gate ProASIC3E flash-based FPGA with 110,592 bits of embedded RAM, 147 user I/O pins, and 130nm flash technology, housed in a 208-pin PQFP (BFQFP, 28x28 mm) industrial package rated for -40C to +100C junction temperature. It operates from a 1.425V to 1.575V core supply at a 1.5V nominal level. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration device. Within the programmable logic hierarchy, the ProASIC3E sits in the mid-density segment of Microsemi/Microchip's FPGA portfolio, positioning it above the low-density ProASIC3 (A3P) parts and below the ProASIC3L and Fusion families. Because configuration data is non-volatile, the device powers up instantly without a bootloader FPGA or external flash, a key differentiator versus SRAM FPGAs from Xilinx and Intel/Altera. Key features include single-chip, secure, non-volatile operation; reprogrammability for in-field upgrades; low total cost of ownership by eliminating the external configuration IC; and system performance up to 272 MHz in the -1 speed grade. The ProASIC3E architecture adds embedded memory (110,592 bits) suitable for FIFOs and small buffers, and abundant user I/O (147 pins in this package) with flexible I/O standards. Architecturally, the device uses a sea-of-vanilla-gates fabric built on 130nm flash process technology, with Versatile routing and clock-conditioning resources. The ProASIC3E family is positioned by Microsemi as a cost-effective ASIC replacement for consumer, networking/communications, computing, and avionics markets, per the official ProASIC3E datasheet. Typical applications include industrial control and automation, communications line cards, avionics and secure systems (benefiting from flash security), and ASIC prototyping or low-volume ASIC replacement. Design consideration: power the 1.5V core from a regulator meeting the 1.425V-1.575V window, and verify I/O bank voltage assignments early, since the 208-PQFP has a fixed pinout that constrains banking. This page adds value beyond the datasheet by synthesizing distributor sourcing data, same-package drop-in alternatives, and comparison tables in one place.