A3PE600-1FG484 - ProASIC3E FPGA 600K Gates 484-BGA | Microchip
部品番号: A3PE600-1FG484 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $63.2 | $632.00 |
| 100 | $57.9 | $5,790.00 |
| 500 | $52.4 | $26,200.00 |
| 1,000 | $48.1 | $48,100.00 |
A3PE600-1FG484 概要
A flash-based FPGA stores its configuration in on-chip flash memory rather than SRAM, so it boots instantly at power-up without an external configuration PROM and is inherently single-chip. Within the programmable logic hierarchy, the A3PE600 belongs to the ProASIC3E family -> flash FPGA -> field-programmable gate array -> programmable logic device, built on a 130nm CMOS flash process.
Key features include reprogrammable flash fabric with a maximum operating frequency of about 231-272 MHz depending on speed grade, LiveSequence/instant-on capability, optional soft ARM Cortex-M1 support, low total cost of ownership through elimination of configuration devices, and abundant user I/O for system integration.
Technically, the ProASIC3E fabric uses a sea-of-gates architecture of versatile VersaNets and buffered routing, with embedded block RAM (4,608-bit blocks totaling 110,592 bits). The '-1' speed grade targets cost-optimized, moderate-frequency designs, while the FG484 footprint provides high I/O count for bus-width interfaces. 130nm flash cells retain configuration across power cycles, supporting secure, tamper-resistant designs without bitstream loading.
Typical applications include industrial automation controllers, communication line cards and bridge logic, medical instrument control, and aerospace/defense systems needing instant-on and high design security.
Design consideration: the part is RoHS non-compliant (lead-bearing balls), so it is restricted from new RoHS-mandated designs; use A3PE600-1FGG484 (green) instead.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: A3PE600-1FG484 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE600-1FG484 （同一形状・フットプリント） — 相違点: Package, Configuration Memory, System Gates, Operating Temperature, Family.
クイック比較ツール — 並列比較する代替部品を選択:
A3PE600-FG484
✅ ドロップイン✓ 在庫あり
$59 / 個
データシートを見る →A3PE600-FG484I
✅ ドロップイン✓ 在庫あり
$86.1 / 個
データシートを見る →A3PE600-FGG484
✅ ドロップイン✓ 在庫あり
$53.7 / 個
データシートを見る →A3PE600-FGG484I
✅ ドロップイン✓ 在庫あり
$44.03 / 個
データシートを見る →A3PE600-1FGG484
✅ ドロップイン✓ 在庫あり
$44.9 / 個
データシートを見る →A3PE600-1FG484I
✅ ドロップイン✓ 在庫あり
$48.6 / 個
データシートを見る →A3PE600L-FGG484M
✅ ドロップイン✓ 在庫あり
$79.9 / 個
データシートを見る →A3PE600-1FG484 最大定格＆電気的特性
| Family | ProASIC3E (flash FPGA) |
| System Gates | 600,000 |
| Logic Elements | 7,000 (approx. LE) |
| Total RAM Bits | 110,592 |
| User I/O | 270 |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Technology | 130 nm flash CMOS |
| Speed Grade | -1 (standard) |
| Maximum Frequency | 231 MHz to 272 MHz (family range) |
| 動作温度 | 0C to +85C (TJ) |
| パッケージ | 484-FBGA (23 x 23 mm, 1 mm pitch) |
| 実装タイプ | Surface Mount |
| Configuration | On-chip flash, instant-on, single chip |
| Soft CPU Support | ARM Cortex-M1 (soft core) |
| Packaging | Tray |
| RoHS ステータス | Non-compliant |
| Manufacturer Lead Time | 8 weeks |
A3PE600-1FG484 484-fbga (23 x 23 mm, 1 mm pitch) ピン配置ガイド
A3PE600-1FG484 (484-fbga (23 x 23 mm, 1 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE600-1FG484.
詳細は データシート をご参照ください。
主な用途
A3PE600-1FG484 の用途: 6 件s: Industrial Automation Controllers, Communications Line Cards and Bridge Logic, Aerospace and Defense Secure Systems, Medical Instrument Control, Test and Measurement Equipment, IoT Gateways and Edge Processing.
Industrial Automation Controllers
The A3PE600-1FG484 fits industrial automation controllers that need deterministic, instantly-available logic at power-up. Its flash fabric is live within microseconds, eliminating the external configuration PROM and boot delay required by SRAM FPGAs, which matters when I/O must be serviced immediately after a power event. The 600K-gate capacity with 270 user I/Os and 110,592 RAM bits absorbs typical PLC glue logic, encoder interfaces, fieldbus bridges, and safety interlock functions on one chip. Operating from a 1.5V core (1.425V-1.575V) with commercial 0C to +85C junction rating, it suits enclosed cabinet environments; use the -I industrial grade variant where ambient conditions exceed that range.
おすすめ
Communications Line Cards and Bridge Logic
In telecom and datacom line cards, the A3PE600-1FG484 provides bridge logic between backplane buses, PHY devices, and system ASICs. The 270 user I/Os in the 484-FBGA (23x23 mm, 1 mm pitch) support wide parallel buses and multiple I/O bank voltages, while the 231-272 MHz-class fabric performance of the ProASIC3E family handles moderate-speed pipeline and framing functions. The 110,592-bit block RAM buffers packet payloads, and the -1 speed grade balances cost against timing at typical line-card frequencies. Because configuration is flash-based, line cards resume operation instantly after hot-swap power events, and the single-chip solution reduces BOM count compared to SRAM FPGA plus boot-flash alternatives.
おすすめ
Aerospace and Defense Secure Systems
Defense and avionics designers choose the A3PE600-1FG484 for its inherent design security and instant-on behavior. Flash-based configuration cannot be read back like an SRAM bitstream, and the device powers up functional with no external configuration memory that could be probed or corrupted. The 600K-gate fabric with soft ARM Cortex-M1 support allows a processor plus custom interface logic to coexist on one secure chip, while 270 I/Os integrate legacy MIL-STD bus bridges and sensor interfaces. The non-RoHS (lead-bearing) build is acceptable in many defense contexts where RoHS exemptions apply; verify program requirements before selecting this over the green FGG484 variant.
おすすめ
Medical Instrument Control
Medical diagnostic instruments benefit from the A3PE600-1FG484's combination of reprogrammability, single-chip integration, and instant-on operation. The 600K-gate capacity implements sensor timing generators, acquisition sequencers, and motor control interfaces, while the 110,592-bit embedded RAM provides buffering for sample streams. Flash configuration means the instrument is ready the moment power is applied - important for patient-throughput in clinical settings - and field firmware updates are performed through JTAG without changing hardware. Operating from a quiet 1.5V core within 1.425V-1.575V and 0C to +85C, it integrates cleanly into benchtop analyzers, imaging subsystems, and laboratory automation where deterministic startup is required.
おすすめ
Test and Measurement Equipment
Bench instruments and automated test equipment use the A3PE600-1FG484 as a reprogrammable timing, trigger, and interface engine. The -1 speed grade fabric (family performance 231-272 MHz) generates measurement sequencers and clock-domain bridges, while 270 I/Os connect front-end ADCs, DACs, and display interfaces across multiple I/O banks. The 110,592-bit block RAM captures waveform segments, and flash configuration means the instrument boots to a ready state immediately - a visible user-experience advantage over SRAM FPGA designs. Since the fabric is fully reprogrammable in-system, one hardware platform serves multiple instrument SKUs, lowering total cost of ownership across product variants.
おすすめ
IoT Gateways and Edge Processing
Edge gateways use the A3PE600-1FG484 as a protocol translation and sensor-aggregation device. Instant-on flash configuration keeps the gateway's I/O fabric alive through brownouts and power cycling, and the soft ARM Cortex-M1 core can run lightweight processing alongside deterministic interface logic in one chip. The 270 user I/Os accommodate multiple sensor buses, and the 484-FBGA's 23x23 mm footprint suits compact gateway hardware. For battery-backed or thermally constrained deployments, the low-power A3PE600L-FGG484M drop-in variant reduces static current on the same footprint, letting one PCB design serve both standard and low-power product tiers without redesign.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3PE600-1FG484 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3PE600-FG484 | A3PE600-FGG484 | A3PE600-1FGG484 | A3PE600L-FGG484M |
|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm) | 484-FBGA - same | 484-FBGA - same (green) | 484-FBGA - same (green) | 484-FBGA - same (green) |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| User I/O | 270 | 270 | 270 | 270 | 270 |
| Total RAM Bits | 110,592 | 110,592 | 110,592 | 110,592 | 110,592 |
| RoHS Status | Non-compliant | Non-compliant | Compliant (green) | Compliant (green) | Compliant (green) |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V (reduced static power) |
主な差別化要因
- Lowest-risk drop-in RoHS upgrade （vs A3PE600-FGG484)
- Same speed grade with industrial temperature （vs A3PE600-1FG484I)
- Lower static power option on same footprint （vs A3PE600L-FGG484M)
- Timing headroom trade-off vs slower baseline grade （vs A3PE600-FG484)
設計ノート
Design a dedicated 1.5V core rail held within 1.425V-1.575V under all load transients. Estimate core current from Libero power-analysis of your actual design rather than worst-case family tables; flash ProASIC3E devices draw low static current, but dynamic current scales with clock frequency and toggle rate. Sequence I/O bank supplies per the datasheet power-up requirements, and include bulk plus 0.1uF decoupling at each VCC/VCCI ball group. An estimated budget example: a 100 MHz design with moderate toggle rates typically lands well below the absolute maximum, but confirm with Microchip's power estimator before finalizing the regulator.
The 484-FBGA (23x23 mm, 1 mm pitch, 2.23 mm height) requires a controlled-impedance, at least 4-layer stackup for clean power delivery. Fan out with via-in-pad or dog-bone escapes; 1 mm pitch allows 0.5 mm trace/space routing on standard processes. Dedicate solid planes for core VCC and GND, and partition I/O banks so that each bank's VCCI rail is decoupled locally. Follow the Microchip ProASIC3E user's guide package routing guidelines and export the official ball map from Libero rather than relying on third-party pinout listings, since ball assignments include dedicated VPP/JTAG balls that must not be repurposed.
The A3PE600-1FG484 is RoHS non-compliant (lead-bearing balls) - it cannot be used in products covered by RoHS directives; select A3PE600-1FGG484 instead. Second, the -1 speed grade has less timing margin than -2 parts: run static timing analysis in Libero and avoid constraining fabric above roughly the 231 MHz class family limits for -1 grade. Third, unlike SRAM FPGAs there is no external bitstream, but VPP programming-supply requirements still apply during reprogramming - do not hard-wire VPP pins per SRAM-FPGA habits; consult the manufacturer datasheet for correct connections.
The 484-FBGA dissipates heat primarily through the ball array into the PCB. Estimated: a mid-utilization design on the 1.5V core typically dissipates well under 1 W, which a standard 4-layer board with solid planes handles without a heatsink given the device's 23x23 mm footprint. For high-utilization, high-frequency designs, verify junction temperature stays within the 0C to +85C (TJ) range using Microchip's thermal data, and consider thermal vias under the package. If ambient temperatures exceed commercial limits, drop in the pin-compatible A3PE600-1FG484I industrial variant instead of adding cooling.
コンプライアンス情報
RoHS non-compliant (lead-bearing FBGA balls) per Microchip USA product data. For RoHS-mandated designs use the green A3PE600-1FGG484 variant. Not an automotive-qualified part.
