A3PE3000L-FGG484M - ProASIC3L 3M-Gate Flash FPGA | Microchip
部品番号: A3PE3000L-FGG484M ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $395 | $395.00 |
| 10 | $375.2 | $3,752.00 |
| 100 | $348 | $34,800.00 |
| 500 | $322.5 | $161,250.00 |
| 1,000 | $298 | $298,000.00 |
A3PE3000L-FGG484M 概要
A flash-based FPGA is a field-programmable gate array that stores its configuration in non-volatile on-chip flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, it sits as an FPGA -> programmable logic device -> semiconductor. Unlike SRAM FPGAs, ProASIC3L devices are single-chip, instant-on, and inherently more secure because the bitstream is stored internally.
Key features of the ProASIC3L family include 1.2V to 1.5V core voltage operation, Flash*Freeze technology that dramatically cuts static power while retaining state, and per the Microchip datasheet roughly 40% lower dynamic power and 50% lower static power than the equivalent ProASIC3 device. The non-volatile flash fabric eliminates configuration PROMs, reduces bill-of-material cost, and improves supply-chain security.
The A3PE3000L fabric provides versatile logic elements, embedded SRAM, and supports soft-core processors and common IP cores. The 23 x 23 mm, 1.0 mm pitch FGG484 package with 2.23 mm height suits high-I/O-count designs where board area and solderable inspection matter.
Typical applications include military and aerospace systems needing -55C to +125C operation, industrial automation controllers, communications line cards, and medical instrumentation where low static power extends battery or conduction-cooled system budgets.
Design consideration: allocate adequate decoupling on the 1.2V/1.5V core rails and plan the power-up sequence early; Flash*Freeze pin usage should be fixed before layout freeze.
This page synthesizes distributor pricing, same-footprint drop-in alternatives, and practical design notes not found in the manufacturer datasheet, as of 2026-09-02.
ドロップイン代替品: A3PE3000L-FGG484M — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE3000L-FGG484M （同一形状・フットプリント） — 相違点: Family, Process Technology, Package, System Gates, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
M1A3PE3000L-FGG484M
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A3PE3000L-FGG484
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →A3PE3000L-1FGG484I
✅ ドロップイン✓ 在庫あり
$104.5 / 個
データシートを見る →A3PE3000L-FG484M
✅ ドロップイン✓ 在庫あり
$129 / 個
データシートを見る →A3PE3000L-1FG484I
✅ ドロップイン✓ 在庫あり
$89.9 / 個
データシートを見る →A3PE3000L-FGG484M 最大定格＆電気的特性
| Family | ProASIC3L (ProASIC3 Low Power) |
| Logic Elements / Cells | 75264 |
| System Gates | 3000000 |
| Number of I/Os | 341 |
| Embedded Memory | 516096 bits |
| Core Voltage | 1.2 V to 1.5 V |
| 実装スタイル | SMD/SMT |
| パッケージ / ケース | FBGA-484 (FGG484) |
| Package Dimensions | 23 x 23 mm, 2.23 mm height, 1.0 mm pitch |
| Minimum Operating Temperature | -55 C |
| Maximum Operating Temperature | +125 C |
| Temperature Grade | Military (M suffix) |
| Technology | Flash-based, non-volatile, Flash*Freeze |
| Packaging | Tray |
| RoHS ステータス | Compliant |
| Terminal Form | Ball |
| Product Series | A3PE3000L |
A3PE3000L-FGG484M 23 x 23 mm, 2.23 mm height, 1.0 mm pitch ピン配置ガイド
A3PE3000L-FGG484M (23 x 23 mm, 2.23 mm height, 1.0 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE3000L-FGG484M.
詳細は データシート をご参照ください。
主な用途
A3PE3000L-FGG484M の用途: 6 件s: Military and Aerospace Systems, Industrial Automation Controllers, Communications Line Cards, Medical Instrumentation, Test and Measurement Equipment, Secure Embedded Control.
Military and Aerospace Systems
The -55C to +125C military temperature rating of the A3PE3000L-FGG484M makes it directly suited to defense electronics such as avionics controllers, radar interface boards, and missile guidance subsystems. The 3M-gate fabric with 341 I/Os absorbs glue logic, bus interfaces, and sensor preprocessing in a single 23 x 23 mm package, while the non-volatile flash fabric delivers instant-on operation with no configuration PROM - a key reliability advantage in systems with tight power-sequencing windows. Flash*Freeze mode cuts static power substantially while retaining register and memory state, useful in event-driven payloads that idle between bursts. Designs should recompile bitstreams in Libero SoC and verify conduction-cooling thermal margins at the +125C junction limit.
おすすめ
Industrial Automation Controllers
In factory automation and motion-control backplanes, the A3PE3000L-FGG484M consolidates deterministic I/O handling, encoder interpolation, and fieldbus interfacing into one flash FPGA. Its 1.2V to 1.5V core voltage lowers switching losses, and per the Microchip datasheet the L family cuts dynamic power about 40% versus the standard ProASIC3, reducing cabinet heat in sealed enclosures. The 341 user I/Os drive multiple isolated I/O banks at 3.3V and mixed voltages, while 516 kbit of embedded memory buffers process data without external SRAM. Single-chip flash configuration eliminates the config PROM, improving uptime in vibration-prone environments. Use the FGG484 footprint for consistent reflow assembly with lead-free processes.
おすすめ
Communications Line Cards
Telecom and datacom line cards benefit from the A3PE3000L's combination of fabric density and I/O count: 341 user I/Os map cleanly to multi-port backplane interfaces, Serdes-adjacent glue logic, and LED or alarm aggregation. The high PSRR-friendly 1.5V core simplifies power-tree design behind point-of-load converters, and Flash*Freeze lets standby line cards drop static power roughly 50% versus equivalent ProASIC3 silicon while preserving state for fast reactivation. Non-volatile configuration means a card can enumerate within microseconds of hot-swap insertion, simplifying redundant-architecture bring-up. Designers should verify I/O banking rules in the DS50003268 datasheet against backplane voltage standards before pin freezing.
おすすめ
Medical Instrumentation
Diagnostic imaging front ends, patient-monitoring bases, and laboratory analyzers use the A3PE3000L-FGG484M to time acquisitions, preprocess sensor streams, and manage display and communication interfaces. The flash fabric powers up instantly with no external configuration, shortening instrument boot time - a user-visible benefit in clinical workflows. Low static power, further reduced by Flash*Freeze between scans, extends the thermal and battery budget of portable and bedside units. The 23 x 23 mm FGG484 package with 1.0 mm pitch supports standard surface-mount assembly used in medical manufacturing. Note that the M temperature grade exceeds typical medical requirements; the industrial A3PE3000L-1FGG484I on the same footprint is usually the more economical pick for this sector.
おすすめ
Test and Measurement Equipment
Bench instruments, automated test fixtures, and protocol analyzers exploit the A3PE3000L's reprogrammability and abundant I/O for pattern generation, capture buffering, and DUT interface adaptation. Embedded flash memory (516,096 bits) implements small lookup tables and configuration snapshots locally, while the fabric's low dynamic power keeps thermal noise contributions predictable in sensitive analog signal chains. Instant-on flash configuration means instruments are measurement-ready in under a typical USB-enumeration interval. The 484-ball package provides ample power and ground balls for low-inductance distribution to fast I/O banks. Instrument makers commonly dual-source the FGG484 and FG484M ball-finish variants across production sites - confirm RoHS requirements per region before qualifying the FG lead-finish options.
おすすめ
Secure Embedded Control
Applications that must protect design IP - such as encryption key handling modules, license-control dongles, and proprietary industrial controllers - benefit from the A3PE3000L's non-volatile flash bitstream storage. Because the configuration lives on-chip, there is no external bitstream to intercept at power-up, a structural security advantage over SRAM FPGAs. The -55C to +125C M grade extends deployment to harsh outdoor and vehicle-mounted controllers. Designers can partition sensitive logic in the 75,264-cell fabric while using the 341 I/Os for tamper-detection loops and multi-voltage sensor interfaces. Follow Microchip security application notes for flash-lock and design-readback-disable settings, and recompile with current Libero SoC releases to carry latest security fixes.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3PE3000L-FGG484M — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | M1A3PE3000L-FGG484M | A3PE3000L-FGG484 | A3PE3000L-1FGG484I | A3PE3000L-FG484M | A3PE3000L-1FG484I |
|---|---|---|---|---|---|---|
| Package | FBGA-484 (FGG484), 23 x 23 mm, 1.0 mm pitch | FBGA-484 (FGG484) - same | FBGA-484 (FGG484) - same | FBGA-484 (FGG484) - same | FBGA-484 (FG484) - same footprint, lead-finish variant | FBGA-484 (FG484) - same footprint, lead-finish variant |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology (M1 rebrand) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates / Cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells | 3,000,000 gates / 75264 cells |
| User I/Os | 341 | 341 | 341 | 341 | 341 | 341 |
| Speed Grade | Standard | Standard | Standard | -1 (faster) | Standard | -1 (faster) |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | Yes | Yes | Yes |
| RoHS / Lead Finish | RoHS compliant (GGG lead-free balls) | Yes (GGG) | Yes (GGG) | Yes (GGG) | Non-RoHS FG finish per Xecor comparison | Non-RoHS FG finish |
主な差別化要因
- Military temperature range in the same FGG484 footprint （vs A3PE3000L-1FGG484I)
- ~40% lower dynamic and ~50% lower static power than ProASIC3 （vs A3PE3000-FGG484)
- Dual-sourcing via M1 rebrand （vs M1A3PE3000L-FGG484M)
設計ノート
Provide independent, well-decoupled 1.2V and 1.5V core rails plus I/O bank supplies (typically 3.3V/2.5V/1.8V per bank). Use at least 10uF bulk plus 0.1uF ceramic per power ball group, placed within 2 mm of the ball via. Verify power-on ramp rates against the DS50003268 datasheet power-up requirements; the non-volatile flash fabric means the device becomes active immediately, so I/O banks must be valid before or with the core to prevent bus contention during hot insertion. Use Microchip's power calculator to estimate static and dynamic current before selecting regulators, and account for Flash*Freeze entry/exit current transients.
The FGG484 is a 1.0 mm pitch, 23 x 23 mm BGA; standard 0.5 mm via-in-pad with via filled and capped, or dog-bone fanout on 1.0 mm pitch, both work. Plan at least four signal layers plus two dedicated planes for a comfortable 341-I/O breakout. Solder mask-defined vs non-solder-mask-defined pads must match Microchip's land-pattern recommendation to ensure reliable ball wetting. For the military M grade, specify X-ray inspection of BGA joints per your quality process, and store trays per MSL rating before reflow - bake if the floor-life clock is exceeded.
Three recurring mistakes: (1) copying the pinout from an A3PE3000 (non-L) datasheet - verify against the ProASIC3L FGG484 table in DS50003268; (2) leaving the Flash*Freeze pin floating or mis-assigned, which either blocks low-power entry or causes unintended state retention behavior - assign it deliberately in Libero before layout freeze; (3) assuming the FG and FGG suffixes are interchangeable - they differ in ball lead finish (RoHS), which matters for procurement and process qualification even though the electrical pinout is identical. Always recompile the design for the exact target MPN and speed grade.
コンプライアンス情報
RoHS Code 'Yes' per Xecor comparison data for the FGG484M variant; the FG (non-GGG) ball-finish siblings are flagged non-RoHS in the same source. REACH, halogen-free, and conflict-minerals status not stated in provided data.
