Microchip Technology
A3PE3000L-FG896M - 3M-Gate Low-Power Flash FPGA | Microchip
部品番号: A3PE3000L-FG896M ✓ 生産中
在庫あり
1〜3営業日以内に発送
1.2 V / 1.5 V Vdss
896-ball FBGA (FG896) Package
On-chip flash (nonvolatile, single-chip) Memory
お問い合わせ
価格については
MOQ: 1 |
価格更新日: 2026-09-02
ボリューム価格
| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1 | $1.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
ℹ️ すべての価格はUSDです
A3PE3000L-FG896M 概要
The Microchip (formerly Microsemi/Actel) A3PE3000L-FG896M is a 3-million-gate ProASIC3L low-power flash FPGA with 75,264 logic cells and 620 user I/O, fabricated on a 130nm CMOS flash process and housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package operating from a 1.2V/1.5V core supply.
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that do not require an external configuration PROM, power up instantly, and are inherently more secure because the bitstream is not stored externally. Within the power management hierarchy of programmable logic, the ProASIC3L family sits as Microchip's low-power variant of the ProASIC3/ProASIC3E families, adding Flash*Freeze technology.
Key differentiating features include Flash*Freeze technology, which allows the device to enter an ultra-low-power sleep mode while retaining state and waking in microseconds; 1.2V to 1.5V core operation for reduced dynamic and static power; single-chip reprogrammable flash configuration; Schmitt-trigger option on single-ended inputs; and weak pull-up/pull-down support on I/O.
Technically, the device uses a sea-of-gates flash architecture with versatile logic elements, embedded block RAM, and supports IEEE 1149.1 (JTAG) boundary scan testing. The pin-compatible package strategy across the ProASIC3L family (except PQ208) allows design migration between density grades without PCB rework.
Typical applications include military and aerospace systems, industrial automation, portable instrumentation, and low-power embedded control where nonvolatile single-chip configuration and minimal standby power are essential.
Design consideration: the M temperature grade suffix indicates a military-grade screening level; verify supply sequencing and use Microchip Libero SoC design tools for implementation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that do not require an external configuration PROM, power up instantly, and are inherently more secure because the bitstream is not stored externally. Within the power management hierarchy of programmable logic, the ProASIC3L family sits as Microchip's low-power variant of the ProASIC3/ProASIC3E families, adding Flash*Freeze technology.
Key differentiating features include Flash*Freeze technology, which allows the device to enter an ultra-low-power sleep mode while retaining state and waking in microseconds; 1.2V to 1.5V core operation for reduced dynamic and static power; single-chip reprogrammable flash configuration; Schmitt-trigger option on single-ended inputs; and weak pull-up/pull-down support on I/O.
Technically, the device uses a sea-of-gates flash architecture with versatile logic elements, embedded block RAM, and supports IEEE 1149.1 (JTAG) boundary scan testing. The pin-compatible package strategy across the ProASIC3L family (except PQ208) allows design migration between density grades without PCB rework.
Typical applications include military and aerospace systems, industrial automation, portable instrumentation, and low-power embedded control where nonvolatile single-chip configuration and minimal standby power are essential.
Design consideration: the M temperature grade suffix indicates a military-grade screening level; verify supply sequencing and use Microchip Libero SoC design tools for implementation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: A3PE3000L-FG896M — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE3000L-FG896M （同一形状・フットプリント） — 相違点: Family, Package, Configuration Memory, Process Technology, RoHS Status.
Microchip Technology
Family: ProASIC3E
Package: 896-BGA / 896-FBGA (31x31 mm, 1.0 mm ball pitch)
Configuration Memory: On-chip Flash (non-volatile, single chip)
比較対象 A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3E
Package: 896-BGA (FBGA)
Configuration Memory: Flash (non-volatile, reprogrammable)
比較対象 A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3L (Flash FPGA)
Package: 896-ball FBGA
Process Technology: 130 nm Flash
比較対象 A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3L
Package: 896-ball FBGA
Configuration Memory: Nonvolatile flash (single-chip, Instant On)
比較対象 A3PE3000L-FG896M →
クイック比較ツール — 並列比較する代替部品を選択:
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストA3PE3000L-FG896M 最大定格＆電気的特性
| Family | ProASIC3L (ProASIC3EL) |
| Equivalent Gates | 3,000,000 |
| Logic Cells | 75,264 |
| User I/O | 620 |
| Process Technology | 130 nm CMOS flash |
| Core Voltage | 1.2 V / 1.5 V |
| パッケージ | 896-ball FBGA (FG896) |
| 実装タイプ | Surface Mount |
| Configuration Memory | On-chip flash (nonvolatile, single-chip) |
| Low-Power Technology | Flash*Freeze |
| JTAG Boundary Scan | IEEE 1149.1 |
| Input Type Option | Schmitt trigger on single-ended inputs |
| Pull Resistors | Weak pull-up / pull-down |
| Temperature Grade | M (military screening per suffix) |
A3PE3000L-FG896M 896-ball fbga (fg896) ピン配置ガイド
A3PE3000L-FG896M (896-ball fbga (fg896) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE3000L-FG896M.
詳細は データシート をご参照ください。
主な用途
A3PE3000L-FG896M の用途: 3 件s: 組込みシステム, IoTデバイス, 産業制御.
組込みシステム
A3PE3000L-FG896Mを使用した組込みアプリケーションのコア処理。
IoTデバイス
A3PE3000L-FG896Mを搭載したスマートコネクテッドデバイス。
産業制御
A3PE3000L-FG896Mを使用した自動化および制御システム。
この製品に関するFAQはありません。
エンジニアリング参考データ: A3PE3000L-FG896M — 比較、設計ガイダンス、コンプライアンス情報。
コンプライアンス情報
RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
鉛フリー
Unknown
ハロゲンフリー
Unknown
紛争鉱物
Unknown
Compliance data not present in the provided web data.
データ検証日: 2026-09-02
— データはXAIPARTの部品エンジニアリングチームによって検証・管理されています
関連部品&用語
Microchip Technology
Actel Corporation
Microsemi Corporation
A3PE3000L-FG896M
ProASIC3L
flash FPGA
field-programmable gate array
Flash*Freeze technology
896-ball FBGA
IEEE 1149.1 JTAG
130nm CMOS
SRAM FPGA
low-power FPGA
military FPGA
boundary scan
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