MPX2050D vs MPX2100D 比較

詳細な並列比較: MPX2050D メーカー: STMicroelectronics および MPX2100D メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。

NXP Semiconductors
MPX2100D MPX2100D - 100kPa Differential Pressure Sensor | NXP/STMicro

MPX2100D - 100kPa Differential Pressure Sensor | NXP/STMicro

MPX2100D ✓ 生産中

仕様比較

パラメータ MPX2050D MPX2100D
ブランド STMicroelectronics NXP Semiconductors
カテゴリ Pressure Sensors Pressure Sensors
ライフサイクル状態 有効 有効
在庫状況 In Stock In Stock
単価(USD) $5.40 $17.80
Pressure Type Differential Differential
Operating Pressure Range 0 kPa to 50 kPa (0 PSI to 7.25 PSI) 0 kPa to 100 kPa (0 to 14.5 psi)
Maximum Overload Pressure [DATA_NEEDED: maximum overload pressure] —
出力タイプ Analog voltage (Wheatstone bridge, differential) Analog ratiometric Wheatstone bridge (millivolts)
Output Voltage Span 0 mV to 40 mV (at 10 V excitation, 50 kPa) —
Sensitivity (typical) 0.45 mV/kPa (at 10 V excitation) —
Excitation Voltage 10 V DC (typical), [DATA_NEEDED: max Vex] —
Linearity ±0.5% (typical, full scale) 0.1% to 0.3% typical [DATA_NEEDED: confirm]
Accuracy ±0.05% to ±0.2% (0°C to 85°C, Vex = 10 V) —
動作温度 -40°C to +125°C —
Storage Temperature [DATA_NEEDED: storage temperature range] —
Response Time 5 kHz (resonance-limited, [DATA_NEEDED: rise time in ms]) —
Bridge Resistance 1.0 kΩ to 4.5 kΩ (input/output, typical [DATA_NEEDED: exact value]) —
パッケージ 4-SIP Module (Unibody, ported) 4-SIP Unibody (UNIBODY4F), 2.54 mm pitch
Port Configuration Dual inlet (differential) —
実装タイプ Through-hole SIP Through-hole SIP module
RoHS ステータス Compliant (per ST product page) Compliant [DATA_NEEDED: confirm from NXP product page]
MSLレベル [DATA_NEEDED: MSL rating] —
Full-Scale Span (Typical) — 40 mV at 10 V excitation
Sensitivity (Nominal) — 0.4 mV/kPa
Supply Voltage (Recommended) — 10 V DC
Supply Voltage (Maximum) — 16 V DC
Pressure Port Configuration — Dual axial ports (differential)
Package Body Dimensions — 15.56 mm x 15.56 mm x 5.33 mm
動作温度範囲 — -40C to +125C [DATA_NEEDED: confirm exact range from datasheet]
On-Chip Temperature Compensation — Yes (factory laser-trimmed)
Technology — Silicon piezoresistive MEMS strain-gauge bridge
Diaphragm Material — Silicon [DATA_NEEDED: confirm]

データシート&リソース

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