MPX2050D vs MPX2100D 비교

다음의 상세 나란히 비교: MPX2050D 제조: STMicroelectronics 및 MPX2100D 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MPX2100D MPX2100D - 100kPa Differential Pressure Sensor | NXP/STMicro

MPX2100D - 100kPa Differential Pressure Sensor | NXP/STMicro

MPX2100D ✓ 활성

사양 비교

파라미터 MPX2050D MPX2100D
브랜드 STMicroelectronics NXP Semiconductors
카테고리 Pressure Sensors Pressure Sensors
수명 주기 상태 활성 활성
재고 상태 In Stock In Stock
단가 (USD) $5.40 $17.80
Pressure Type Differential Differential
Operating Pressure Range 0 kPa to 50 kPa (0 PSI to 7.25 PSI) 0 kPa to 100 kPa (0 to 14.5 psi)
Maximum Overload Pressure [DATA_NEEDED: maximum overload pressure] —
출력 유형 Analog voltage (Wheatstone bridge, differential) Analog ratiometric Wheatstone bridge (millivolts)
Output Voltage Span 0 mV to 40 mV (at 10 V excitation, 50 kPa) —
Sensitivity (typical) 0.45 mV/kPa (at 10 V excitation) —
Excitation Voltage 10 V DC (typical), [DATA_NEEDED: max Vex] —
Linearity ±0.5% (typical, full scale) 0.1% to 0.3% typical [DATA_NEEDED: confirm]
Accuracy ±0.05% to ±0.2% (0°C to 85°C, Vex = 10 V) —
동작 온도 -40°C to +125°C —
Storage Temperature [DATA_NEEDED: storage temperature range] —
Response Time 5 kHz (resonance-limited, [DATA_NEEDED: rise time in ms]) —
Bridge Resistance 1.0 kΩ to 4.5 kΩ (input/output, typical [DATA_NEEDED: exact value]) —
패키지 4-SIP Module (Unibody, ported) 4-SIP Unibody (UNIBODY4F), 2.54 mm pitch
Port Configuration Dual inlet (differential) —
실장 유형 Through-hole SIP Through-hole SIP module
RoHS 상태 Compliant (per ST product page) Compliant [DATA_NEEDED: confirm from NXP product page]
MSL 레벨 [DATA_NEEDED: MSL rating] —
Full-Scale Span (Typical) — 40 mV at 10 V excitation
Sensitivity (Nominal) — 0.4 mV/kPa
Supply Voltage (Recommended) — 10 V DC
Supply Voltage (Maximum) — 16 V DC
Pressure Port Configuration — Dual axial ports (differential)
Package Body Dimensions — 15.56 mm x 15.56 mm x 5.33 mm
동작 온도 범위 — -40C to +125C [DATA_NEEDED: confirm exact range from datasheet]
On-Chip Temperature Compensation — Yes (factory laser-trimmed)
Technology — Silicon piezoresistive MEMS strain-gauge bridge
Diaphragm Material — Silicon [DATA_NEEDED: confirm]

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