10AS032H4F34E3SG - Arria 10 SX SoC FPGA 320K LE | Intel (Altera)
MPN: 10AS032H4F34E3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4095 | $40,950.00 |
| 100 | $3820 | $382,000.00 |
| 250 | $3650 | $912,500.00 |
| 500 | $3490 | $1,745,000.00 |
Drop-in alternatives for 10AS032H4F34E3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS032H4F34E3LG
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View Datasheet →10AS032H4F34E3SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Process Technology | 20 nm |
| Core Supply Voltage | 0.9 V |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | 1.5 GHz |
| Package | 1152-ball FC-FBGA, 35x35 mm |
| Package Code | F34 |
| Mounting Type | Surface Mount (BGA) |
| Terminal Form | Ball |
| Terminal Count | 1152 |
| Operating Temperature Grade | E2 (Extended) |
| RoHS Status | Compliant (per Altera product page) |
| Lead-Free | Yes |
| Recommended FPGA Toolchain | Intel Quartus Prime |
10AS032H4F34E3SG f34 Pin Configuration Guide
Complete pinout information for 10AS032H4F34E3SG (f34 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H4F34E3SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H4F34E3SG is suitable for 6 applications: Wireless Baseband Processing, Radar and Electronic Warfare Signal Processing, Broadcast Video Infrastructure, Industrial Motor Control and Robotics, Medical Imaging and Diagnostics, Test and Measurement Instrumentation.
Wireless Baseband Processing
The 10AS032H4F34E3SG fits wireless baseband designs needing moderate logic density plus an embedded CPU for MAC-layer scheduling. Its 320K logic elements, hardened dual-core ARM Cortex-A9 MPCore, and 1.5 GHz HPS clock let engineers implement LTE PHY, custom FFT pipelines, and L1 protocol stacks on a single die. Hard floating-point DSP blocks accelerate channel estimation while the HPS handles Layer 2/3 and OS tasks. E3 transceiver grade supports backhaul links to 25 Gbps.
Recommended
Radar and Electronic Warfare Signal Processing
Arria 10 SX 320K LE is well suited to mid-range phased-array radar and electronic-warfare front-end processing where hardened ARM cores handle track management while the FPGA fabric runs pulse-Doppler FFTs. The 20 nm process delivers high DSP throughput per watt, and E3 transceiver grade lets designers aggregate multiple ADC lanes. Embedded CoreSight simplifies real-time debug of multi-channel DSP pipelines.
Recommended
Broadcast Video Infrastructure
Broadcast video routers, format converters, and 4K/UHD processing engines map well to the 10AS032H4F34E3SG. The 320K logic budget supports multi-stream SDI/HDMI bridging, HDR metadata insertion, and on-the-fly color-space conversion. The hard ARM subsystem runs control software and IP-based video stacks. E3 transceiver grade enables SMPTE ST 2022/2110 IP video at 25 Gbps.
Recommended
Industrial Motor Control and Robotics
The 10AS032H4F34E3SG delivers deterministic real-time motor control by combining FPGA fabric for high-rate current-loop PWM with the ARM Cortex-A9 MPCore for motion planning, EtherCAT/Ethernet/IP stacks, and safety logic. Its 320K logic budget supports multi-axis servo drives, while the HPS runs Linux or RTOS. Industrial temp grades are available via speed-grade variants.
Recommended
Medical Imaging and Diagnostics
Mid-tier medical imaging systems (ultrasound beamformers, endoscopy video processors, CT reconstruction pipelines) fit the 10AS032H4F34E3SG's 320K-LE budget. Hard DSP blocks accelerate beamforming and tomographic reconstruction while the ARM subsystem handles UI, DICOM networking, and safety-class control. Quartus Prime supports IEC 62304/62366 design workflows common in medical development.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and ATE platforms leverage the 10AS032H4F34E3SG's mix of FPGA fabric for real-time DSP and ARM cores for instrument UI, storage, and remote control. E3-grade transceivers aggregate multi-GHz ADC lanes to host CPUs over PCIe or 10/25 GbE. Quartus Prime DSP Builder accelerates filter and FFT design for these instruments.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H4F34E3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H4F34E3LG | 10AS032H3F35I2SG | 10AS032H3F35E2SG | 10AS032H3F34I2SG |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel - same brand | Intel - same brand | Intel - same brand | Intel - same brand |
| Package | 1152-ball FC-FBGA (F34, 35x35 mm) | 1152-ball FC-FBGA (F34, 35x35 mm) - same | 1152-ball FC-FBGA (F35, 35x35 mm) - different ball map | 1152-ball FC-FBGA (F35, 35x35 mm) - different ball map | 1152-ball FC-FBGA (F34, 35x35 mm) - same |
| Logic Elements | 320,000 | 320,000 - same | 320,000 - same | 320,000 - same | 320,000 - same |
| Speed Grade | H4 | H4 - same | H3 (-10-15% Fmax) | H3 (-10-15% Fmax) | H3 (-10-15% Fmax) |
| Transceiver Grade | E3 | E3 - same | I2 (lower-grade transceiver) | E2 | I2 |
| Operating Temperature | Extended (E2) | Extended (E2) - same | Industrial (I2) | Extended (E2) | Industrial (I2) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Same | Same | Same | Same |
| Maximum Core Frequency | 1.5 GHz | 1.5 GHz - same | 1.5 GHz (HPS independent of FPGA speed grade) | 1.5 GHz | 1.5 GHz |
Key Differentiators
- Highest available speed grade in 320K Arria 10 SX F34 family (vs 10AS032H3F34E2SG)
- Higher transceiver grade (E3) than E2 or I2 variants (vs 10AS032H3F34I2SG)
- Tray packaging suitable for low-volume and lab use (vs 10AS032H4F34E3LG)
Design Notes
Estimated: at 0.9 V core with the 20 nm Arria 10 SX process, a typical 320K-LE utilization design draws 8-15 W static power plus dynamic power proportional to toggle rate. The 35x35 mm F34 FC-FBGA requires a multi-layer PCB with a thermal via array under the central ground balls and at least 4 inner solid ground planes. Designers should run Quartus Prime Power Estimator before layout finalization to size the heatsink and airflow. Junction temperature must stay below 100 C for the E2 grade.
The 1152-ball F34 FC-FBGA needs 1.0 mm pitch BGA escape with microvia-in-pad stackups and 0.8 mm drill via-on-pad microvias for breakout. Maintain matched length on HPS DDR3/4 lanes to within +/-25 ps; group byte lanes together. Keep high-speed transceiver differential pairs length-matched to within 0.05 mm and reference continuous ground planes for the full length. Decoupling: place 0.1 uF and 0.01 uF ceramics within 2 mm of each power ball cluster.
A common pitfall is treating F34 and F35 packages as interchangeable - they share the 35x35 mm body but have different ball assignments. The 10AS032H4F34E3SG (F34) cannot be swapped with an F35 device without a PCB redesign. Another pitfall is ignoring the HPS pin-muxing constraints: EMAC, USB, SDIO, and NAND balls are fixed and conflict if multiple peripherals are enabled. Use Quartus Prime HPS Pin Multiplexer tool early in pin planning.
Recommended: route HPS traces on inner layers adjacent to a solid reference plane; place the boot configuration flash (QSPI or SD card) within 100 mm of the HPS boot pins to meet signal-integrity requirements. Reserve the top layer above the FPGA for high-speed serializer/deserializer (SerDes) channels; do not route slow control signals across SerDes lanes. Place the JTAG header within 75 mm of the FPGA TCK pin for reliable boundary-scan.
Compliance Information
RoHS and REACH compliance confirmed on the Altera/Intel product page trade-compliance section. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC. Conflict-minerals declaration available on the Intel supply-chain portal.
