10AS048E4F29I3SG - Arria 10 SX 480K LE SoC FPGA | Intel
部品番号: 10AS048E4F29I3SG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1380 | $13,800.00 |
| 100 | $1295 | $129,500.00 |
| 500 | $1220 | $610,000.00 |
| 1,000 | $1150 | $1,150,000.00 |
10AS048E4F29I3SG 概要
An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that combines programmable logic (FPGA fabric) with one or more hard processor cores (CPU subsystem) on a single die. SoC FPGAs sit within the broader hierarchy: programmable logic -> FPGA -> SoC FPGA -> embedded processor -> semiconductor. The dual Cortex-A9 MPCore HPS provides operating-system-capable processing, while the FPGA fabric accelerates custom dataplanes, signal processing, and high-speed I/O. Compared with a discrete CPU + FPGA two-chip solution, the SoC FPGA reduces board area, inter-chip latency, and BOM cost while increasing bandwidth between HPS and fabric.
Key features of the 10AS048E4F29I3SG include 480K logic elements, dedicated DSP blocks, 20 nm TSMC low-power process technology, embedded transceivers up to 17.4 Gbps, up to 1.5 GHz fabric performance, and a hard memory controller subsystem supporting DDR3/DDR4 with ECC. The integrated HPS includes a dual-core ARM Cortex-A9 MPCore running up to 1.5 GHz with NEON media engine, single/double-precision FPU, L1 cache per core, and 512 KB shared L2 cache. The part operates across the industrial temperature range (-40C to +100C junction) and is housed in a 780-pin FC-FBGA package with flip-chip solder balls.
Typical applications include wireless baseband processing, military radar and electronic warfare, medical imaging accelerators, broadcast video processing, industrial machine vision, and high-performance test and measurement. The dual Cortex-A9 cores handle control planes and operating system workloads (typically Linux), while the FPGA fabric accelerates DSP-intensive dataplanes (FFT, channelization, beamforming). The 17.4 Gbps transceivers enable connection to high-speed ADCs/DACs, CPRI/OBSAI fronthaul, JESD204B/C converters, and backplane SERDES.
When designing with this part, ensure the PCB has matched-length routing for the high-speed transceivers and that the power distribution network (PDN) meets the peak current requirements during HPS + fabric concurrent operation. Quartus Prime software is required for synthesis, place-and-route, and HPS firmware configuration. The device's -I3SG suffix denotes industrial temperature grade, speed grade 3, and lead-free / RoHS compliant assembly. Compared with pure FPGA alternatives, the integrated HPS reduces the need for an external processor and simplifies multi-board designs.
ドロップイン代替品: 10AS048E4F29I3SG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AS048E4F29I3SG （同一形状・フットプリント） — 相違点: Package, Mounting Type, Operating Temperature, Speed Grade, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
10AS048E4F29I3LG
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2980 / 個
データシートを見る →10AS048E4F29E3SG
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3120 / 個
データシートを見る →10AS048E3F29I2SG
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1480 / 個
データシートを見る →10AS048E4F29I3SG
✅ ドロップイン✓ 在庫あり
$1150 / 個
データシートを見る →10AS048E4F29I3SG 最大定格＆電気的特性
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| HPS Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Process Technology | 20 nm TSMC |
| パッケージ | 780-ball FC-FBGA, F29 (29x29 mm) |
| 動作温度 | Industrial -40C to +100C junction |
| Core Voltage | 0.9 V |
| Transceivers Maximum Data Rate | 17.4 Gbps |
| Memory Interface | DDR3 / DDR4 with ECC via hard memory controller |
| 実装タイプ | Surface Mount (FC-FBGA flip-chip) |
| RoHS ステータス | Compliant |
| Speed Grade | 3 |
| Device Grade Suffix | -I3SG (Industrial, Speed 3, Lead-free) |
10AS048E4F29I3SG 780-ball fc-fbga, f29 (29x29 mm) ピン配置ガイド
10AS048E4F29I3SG (780-ball fc-fbga, f29 (29x29 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AS048E4F29I3SG.
詳細は データシート をご参照ください。
主な用途
10AS048E4F29I3SG の用途: 6 件s: Wireless Baseband Processing, Military Radar and Electronic Warfare, Medical Imaging Accelerator (CT / Ultrasound / MRI), Broadcast Video Processing and Encoding, Industrial Machine Vision and Quality Inspection, Test and Measurement Instrumentation.
Wireless Baseband Processing
The 10AS048E4F29I3SG's dual-core ARM Cortex-A9 HPS handles the LTE/5G NR control plane (RRC, MAC scheduling, Layer-2) while the 480K LE FPGA fabric accelerates the datapath including FFT/iFFT, channel estimation, and LDPC/turbo decoding. The 17.4 Gbps transceivers enable CPRI/OBSAI fronthaul to remote radio heads, supporting both LTE and emerging 5G NR numerologies. Its 1.5 GHz HPS clock handles Layer-2 latency budgets (sub-1 ms) for real-time scheduling, while 480K LE provides sufficient DSP blocks for sub-6 GHz massive-MIMO precoding. The industrial temperature grade suits outdoor base-station deployments where ambient air exceeds +70C during peak sun load.
おすすめ
Military Radar and Electronic Warfare
Radar pulse-Doppler processing and EW channelization demand both deterministic latency and software control - exactly the workload split Arria 10 SX targets. The 480K LE fabric runs FIR/FFT pulse compression at the ADC sample rate, while the dual Cortex-A9 cores manage threat-library updates, beam-steering tables, and Mode-S/IFF protocols. The 17.4 Gbps transceivers accept direct ADC samples at 1-3 GSPS without external SERDES, simplifying the RF front-end. Industrial -40C to +100C operation supports avionics and ground-vehicle platforms with wide thermal swings. The 780-ball FC-FBGA package's flip-chip solder balls also improve thermal conductivity to the PCB for high-power jammer modes.
おすすめ
Medical Imaging Accelerator (CT / Ultrasound / MRI)
The 10AS048E4F29I3SG accelerates back-projection, beamforming, and image-reconstruction pipelines in CT, ultrasound, and MRI systems where deterministic hardware latency is critical. The 480K LE fabric runs parallel back-projection threads at 50-100x real-time speedup over CPU-only baselines, while the dual Cortex-A9 cores run the OS, image-display stack, and DICOM transfer. The Arria 10 SX's hard memory controller with DDR4 ECC protects patient-data integrity, and the industrial temperature grade handles the elevated ambient inside scanner cabinets. The HPS-fabric coherent interconnect (AXI) lets the OS hand reconstructed frames to display without external round-trips.
おすすめ
Broadcast Video Processing and Encoding
The 10AS048E4F29I3SG handles multi-stream broadcast contribution feeds including HEVC/H.264 encode, HDR tone-mapping, and 4K/8K up/down-conversion. Its 480K LE fabric runs parallel encoding pipelines (4 streams of 4K60 HEVC in parallel) while the dual Cortex-A9 cores manage IP routing, PTP/SMPTE-2059 timing, and stream multiplexing. The 17.4 Gbps transceivers accept 12G-SDI (SMPTE-2082) feeds natively without external re-clockers. Industrial temperature grade supports outdoor broadcast truck and remote production (REMI) environments. The HPS runs the control UI and telemetry for broadcast-automation integration.
おすすめ
Industrial Machine Vision and Quality Inspection
Factory automation lines require deterministic, low-latency image processing for defect detection, OCR, and pick-and-place robotics. The 10AS048E4F29I3SG's FPGA fabric runs Sobel/Harris/CNN inference at the camera frame rate, while the dual Cortex-A9 HPS handles PLC/EtherCAT master, HMI, and vision-server communication. Industrial -40C to +100C operation handles cabinet temperatures near motors and welders without active cooling. The 17.4 Gbps transceivers accept CoaXPress 2.0 (CXP-12) feeds at 12.5 Gbps from high-speed linescan cameras. The SoC architecture reduces the need for a separate industrial PC, simplifying cabinet bill-of-materials.
おすすめ
Test and Measurement Instrumentation
Benchtop instruments such as oscilloscopes, spectrum analyzers, and protocol analyzers benefit from the 10AS048E4F29I3SG's hybrid CPU + FPGA architecture. The FPGA fabric digitizes and pre-processes high-speed ADC samples at 50-100 GSPS through external TI / Analog Devices front-end ADCs, while the dual Cortex-A9 cores run the UI, measurements, and remote-API interfaces. The 17.4 Gbps transceivers feed external DACs for arbitrary waveform generation. Industrial temperature grade suits benchtop fan-cooled enclosures. The HPS boots from QSPI NOR flash for fast instrument startup, while the FPGA fabric is configured on each measurement mode change.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AS048E4F29I3SG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AS048E4F29I3LG | 10AS048E4F29E3SG | 10AS048E3F29I2SG |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 780-FBGA, FC (29x29) | 780-FBGA, FC (29x29) - same | 780-FBGA, FC (29x29) - same | 780-FBGA, FC (29x29) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 |
| HPS Cores | Dual Cortex-A9 MPCore | Dual Cortex-A9 MPCore | Dual Cortex-A9 MPCore | Dual Cortex-A9 MPCore |
| Speed Grade | 3 | 3 | 3 | 2 (slower Fmax, ~-15%) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +100C) | Industrial (-40C to +100C) |
| Transceiver Max Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| Process | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC |
| RoHS | Compliant (G suffix) | Compliant | Compliant | Compliant |
| Unit Price (qty-1, USD, as of 2026-09-05) | $1,450 | ~$1,450 | ~$1,250 (commercial, lower cost) | ~$1,250 (speed grade 2, lower cost) |
主な差別化要因
- Speed grade 3 enables higher Fmax and 1.5 GHz HPS operation （vs 10AS048E3F29I2SG)
- Industrial temperature grade (-40C to +100C) supports outdoor / military deployments （vs 10AS048E4F29E3SG)
- SoC FPGA architecture eliminates the need for an external processor （vs Discreet FPGA + CPU two-chip solution)
設計ノート
The 10AS048E4F29I3SG at full HPS + fabric utilization can dissipate 15-20 W. Estimated: at +85C ambient with 1.5 GHz HPS core and ~70% fabric utilization, junction temperature approaches +95C. The 780-ball F29 FC-FBGA's flip-chip solder balls provide a low-thermal-resistance path to the PCB top-side copper pour. Design the PCB with at least 8 thermal via arrays directly under the BGA, each via filled-and-capped. A bottom-side heat spreader is recommended for sealed enclosures without forced airflow.
The 17.4 Gbps transceivers demand controlled-impedance stripline routing with reference planes on adjacent layers, length matching within 0.127 mm tolerance across differential pairs, and AC-coupling capacitors placed near the TX pin. Recommended stackup: 14-layer with stripline for transceivers, microstrip for control-plane signals. The HPS requires separate analog power rails (VCC_AUX, VCC_PLL_HPS) with ferrite-bead isolation from the digital rail. The DDR4 interface needs 100-ohm differential matched routing for DQS pairs and a fly-by VTT topology.
Three common mistakes to avoid: (1) Quartus Prime version mismatches cause bitstream incompatibility - always pin the Quartus version that generated the .sof file; (2) The HPS boot source (QSPI NOR, SD card, NAND) must be configured via BSEL pins and pulled correctly at power-up; (3) The Transceiver reference clock must be clean - use a dedicated jitter-cleaner PLL (e.g., Texas Instruments LMK04832) rather than routing an FPGA-derived clock back through a transceiver. The ARM Cortex-A9 cores will not boot cleanly with a noisy clock and the SoC will hang in u-boot.
The 780-ball FC-FBGA's breakout fanout on inner-layer 0.4 mm pitch requires laser-drilled microvias (4-6 mil via pad) and HDI stackup. Estimated via-stub length must be below 0.25 mm to maintain 17.4 Gbps transceiver signal integrity. For DDR4 interfaces at 2133 MT/s, fly-by topology with VTT termination at the end-of-line is mandatory; T-topology will fail timing closure. Use IBIS-AMI simulation (Siemens HyperLynx or Ansys SIwave) to validate the breakout before committing to PCB fabrication.
Place decoupling capacitors directly beneath the BGA on the bottom side, with vias connecting to the top-side power planes through a 6-12 via cluster per cap. Bulk capacitors (22 uF tantalum or 47 uF ceramic) should be placed within 25 mm of the device. The HPS analog supply (VCC_AUX) requires an isolated ground island with a single-point bridge to the digital ground plane near the BGA's central GND balls. Keep high-speed transceiver channels on the same side of the package as the SMA connectors to avoid via-crossings that break reference-plane continuity.
コンプライアンス情報
RoHS and lead-free compliance indicated by 'G' suffix per Altera ordering part number guide. AEC-Q100 not applicable (FPGA family). Conflict-minerals compliance per Altera/Intel corporate responsibility report. Halogen-free status not explicitly stated in verified data.
