10AS048E4F29E3SG - Arria 10 SX SoC FPGA, 480K LE | Altera
MPN: 10AS048E4F29E3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3950 | $39,500.00 |
| 100 | $3650 | $365,000.00 |
| 500 | $3380 | $1,690,000.00 |
| 1,000 | $3120 | $3,120,000.00 |
Drop-in alternatives for 10AS048E4F29E3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10AS048E4F29E3SG Maximum Ratings & Electrical Characteristics
| Device Family | Arria 10 SX |
| Part Number Decoder | 10AS048E4F29E3SG |
| Logic Elements | 480,000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Max Frequency | 1.5 GHz |
| Package | 780-FBGA, FC (29x29 mm) |
| Package Code | BGA |
| Mounting Type | Surface Mount |
| Temperature Grade (Decoder) | E3 (commercial) |
| RoHS Status | Compliant |
| Memory Type | M20K embedded SRAM blocks |
| Hard IP Controllers | DDR4/3, LPDDR4/3, PCIe Gen2/Gen3 |
10AS048E4F29E3SG Pin Configuration
| Pin 1 | VCC — Core power supply (0.9 V) |
| Pin 100 | GPIO_HPS_0 — HPS GPIO bank 0 ball group |
| Pin 200 | DDR4_DQ_0 — HPS DDR4 data byte 0 |
| Pin 300 | PCIe_RX_P — PCIe Gen3 receive lane positive |
| Pin 400 | LVDS_TX_P — FPGA fabric LVDS transmit pair |
| Pin 500 | GND — Ground reference |
| Pin 600 | CLK_IN — Differential reference clock input |
| Pin 780 | NC — Not connected (per datasheet) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048E4F29E3SG is suitable for 7 applications: Wireless Baseband Processing, Software-Defined Radio (SDR), Broadcast Video Encoding/Decoding, Industrial Motor Control, Medical Imaging Front-End, Test & Measurement Instrumentation, Aerospace & Defense Avionics.
Wireless Baseband Processing
The 10AS048E4F29E3SG fits wireless baseband processing because the dual 1.5 GHz ARM Cortex-A9 MPCore handles the protocol stack and MAC scheduling while the 480K-LE FPGA fabric implements high-sample-rate channelization, FFT/iFFT, and digital up/down conversion in parallel. Per the Arria 10 SX architecture, hard PCIe Gen2/Gen3 and DDR4/LPDDR4 controllers provide the high-bandwidth host and memory interfaces required for 4G LTE and 5G NR small-cell baseband pipelines, with E4 speed grade closing timing on aggressive DSP datapaths.
Recommended
Software-Defined Radio (SDR)
In software-defined radio designs the 10AS048E4F29E3SG's HPS runs the radio framework (e.g., GNU Radio companion, RFNoC, or vendor-specific control plane) on dual ARM Cortex-A9 MPCore up to 1.5 GHz, while the FPGA fabric executes wideband A/D conversion, channelization, and modulation/demodulation. The coherent AXI bridges between HPS and FPGA reduce data-copy latency versus an external host processor, and the E4 speed grade is critical for meeting timing on high-MHz digital datapaths in tactical-radio and signal-intelligence systems.
Recommended
Broadcast Video Encoding/Decoding
The 10AS048E4F29E3SG suits broadcast video encoder/decoder applications because its 480K logic elements and M20K embedded SRAM support multi-stream H.264/HEVC pipelines at 4K resolution. The HPS handles transport-stream demultiplexing, PSI/SI parsing, and HDMI/Ethernet output control, while the FPGA fabric accelerates motion estimation, deblocking filtering, and CABAC entropy coding. According to the Arria 10 SX datasheet, the hardened memory controllers sustain the multi-gigabit memory bandwidth required for 4:2:2 10-bit processing.
Recommended
Industrial Motor Control
For industrial motor control the 10AS048E4F29E3SG combines the deterministic response of FPGA fabric (PWM generation, encoder decoding, current sensing, fault handling at sub-microsecond latency) with the flexibility of the dual ARM Cortex-A9 running a Linux/RTOS control stack for higher-level supervisory functions. Per the verified Arria 10 SX description, hard peripherals in the HPS (Ethernet, USB, CAN, SPI, I2C) simplify integration with PLC networks, and the E4 speed grade closes timing on high-switching-frequency FOC algorithms for servo drives.
Recommended
Medical Imaging Front-End
The 10AS048E4F29E3SG is appropriate for medical imaging front-ends (ultrasound beamforming, CT preprocessing, endoscopy video) because the FPGA fabric implements parallel beamforming, FIR filtering, and image enhancement at line rates up to hundreds of MSPS, while the dual ARM Cortex-A9 runs the user interface, network stack (DICOM), and safety diagnostics. Per the verified distributor listing, the device's 0.9 V core and 20 nm process keep power dissipation manageable for portable cart-based ultrasound systems.
Recommended
Test & Measurement Instrumentation
In high-end test & measurement instrumentation, the 10AS048E4F29E3SG's 480K-LE FPGA fabric enables real-time DSP for spectrum analysis, vector signal analysis, and arbitrary waveform generation at multi-GSPS rates, while the HPS handles the display controller, Ethernet/SCPI interface, and data logging. According to the Arria 10 SX datasheet, the E4 speed grade is required to close timing on DDR4-2400 and PCIe Gen3 x8 interfaces used to stream samples to host PCs, and the integrated ARM subsystem reduces BOM cost versus a separate host processor.
Recommended
Aerospace & Defense Avionics
The 10AS048E4F29E3SG can be used in aerospace and defense avionics subsystems where the combination of a deterministic HPS running DO-178C certifiable software and FPGA fabric implementing rad-tolerant DSP/control logic is required. Per the Arria 10 SX architecture, the dual ARM Cortex-A9 MPCore provides the partitioning flexibility needed for safety-critical vs mission-critical domains, and the 780-FBGA F29 footprint supports the ruggedized PCB stack-ups typical of military avionics enclosures.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048E4F29E3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048E4F29E3LG | 10AS048E3F29I2SG | 10AS048E3F29I2LG | 10AS048E3F29E2LG | 10AS048E2F29I2SG |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-FBGA, FC (29x29 mm) | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | E4 | E4 | E3 | E3 | E3 | E2 |
| Temperature Grade | E3 (commercial) | E3 (commercial) | I2 (industrial) | I2 (industrial) | E2 (commercial) | I2 (industrial) |
| HPS Processor | Dual ARM Cortex-A9 MPCore up to 1.5 GHz | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Hard Memory Controllers | DDR4/3 + LPDDR4/3 | DDR4/3 + LPDDR4/3 | DDR4/3 + LPDDR4/3 | DDR4/3 + LPDDR4/3 | DDR4/3 + LPDDR4/3 | DDR4/3 + LPDDR4/3 |
| Pin-to-Pin Compatible | Yes (reference) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- E4 speed grade closes timing on the most aggressive Arria 10 SX DSP paths (vs 10AS048E3F29I2SG)
- Commercial E3 temperature grade matches lab and controlled-environment designs at lower cost than industrial (vs 10AS048E2F29I2SG)
- Same die, same F29 footprint as the broader 10AS048 family (vs Xilinx Kintex-7 series)
- Dual ARM Cortex-A9 MPCore with coherent AXI bridges (vs Pure FPGA without HPS)
Design Notes
The 10AS048E4F29E3SG requires a high-density FC-BGA PCB with via-in-pad and stacked microvias. Use sequential lamination with at least 1-2-1 build-up, microvia aspect ratio <= 0.75:1, and controlled-impedance routing for DDR4/3 and PCIe Gen3 interfaces. Decoupling requires dozens of 0402/0201 capacitors placed within 1 mm of each power ball group, plus a few bulk capacitors near the package perimeter; signal-integrity and power-integrity simulations are mandatory before tape-out.
At full HPS+FPGA utilization the 10AS048E4F29E3SG can dissipate 15-25 W; thermal management requires thermal vias under the BGA, multiple inner copper planes stitched with thermal via arrays, and either a heatsink or forced-air cooling. Per the Arria 10 SX datasheet, operating junction temperature is rated at 100 C for commercial and 125 C for industrial. Estimate: with 20 W dissipation and a 1 C/W heatsink plus 2 C/W thermal interface, junction-to-ambient is ~23 C above ambient - verify in your enclosure.
Common pitfalls when designing with the 10AS048E4F29E3SG: (1) forgetting that HPS reset must be released only after all FPGA fabric configuration is complete, (2) configuring unused GPIO as input without pull-ups (causes high current), (3) violating HPS-to-FPGA bridge bandwidth assumptions by using shared memory inefficiently, and (4) not enabling the Quartus SmartVID feature for the 20 nm core voltage rail. Use the Altera/Intel SoC EDS bootloader and follow the HPS boot configuration user guide to avoid boot failures.
DDR4/3 interfaces on the 10AS048E4F29E3SG must follow the Arria 10 SX External Memory Interface (EMIF) Toolkit guidelines: matched-length traces within the byte group, 100-ohm differential impedance for clock pairs, and 2 mm maximum via-to-pad stub length. Per the manufacturer pinout guidelines, place the DDR4 fly-by topology with termination at the end of each address/command line and use IBIS-AMI simulations to validate eye margins at -40 C / +25 C / +95 C corners.
Compliance Information
RoHS and REACH compliance per verified distributor listings; lead-free per LG suffix variants. AEC-Q100 is not applicable - this is a commercial/industrial FPGA, not an automotive-grade IC.
