10AS048E4F29I3SG - Arria 10 SX 480K LE SoC FPGA | Intel
MPN: 10AS048E4F29I3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1380 | $13,800.00 |
| 100 | $1295 | $129,500.00 |
| 500 | $1220 | $610,000.00 |
| 1,000 | $1150 | $1,150,000.00 |
Drop-in alternatives for 10AS048E4F29I3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS048E4F29I3LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2980 / Unit
View Datasheet →10AS048E4F29E3SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3120 / Unit
View Datasheet →10AS048E3F29I2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1480 / Unit
View Datasheet →10AS048E4F29I3SG
✅ Drop-In✓ In Stock
$1150 / Unit
View Datasheet →10AS048E4F29I3SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| HPS Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Process Technology | 20 nm TSMC |
| Package | 780-ball FC-FBGA, F29 (29x29 mm) |
| Operating Temperature | Industrial -40C to +100C junction |
| Core Voltage | 0.9 V |
| Transceivers Maximum Data Rate | 17.4 Gbps |
| Memory Interface | DDR3 / DDR4 with ECC via hard memory controller |
| Mounting Type | Surface Mount (FC-FBGA flip-chip) |
| RoHS Status | Compliant |
| Speed Grade | 3 |
| Device Grade Suffix | -I3SG (Industrial, Speed 3, Lead-free) |
10AS048E4F29I3SG 780-ball fc-fbga, f29 (29x29 mm) Pin Configuration Guide
Complete pinout information for 10AS048E4F29I3SG (780-ball fc-fbga, f29 (29x29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048E4F29I3SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048E4F29I3SG is suitable for 6 applications: Wireless Baseband Processing, Military Radar and Electronic Warfare, Medical Imaging Accelerator (CT / Ultrasound / MRI), Broadcast Video Processing and Encoding, Industrial Machine Vision and Quality Inspection, Test and Measurement Instrumentation.
Wireless Baseband Processing
The 10AS048E4F29I3SG's dual-core ARM Cortex-A9 HPS handles the LTE/5G NR control plane (RRC, MAC scheduling, Layer-2) while the 480K LE FPGA fabric accelerates the datapath including FFT/iFFT, channel estimation, and LDPC/turbo decoding. The 17.4 Gbps transceivers enable CPRI/OBSAI fronthaul to remote radio heads, supporting both LTE and emerging 5G NR numerologies. Its 1.5 GHz HPS clock handles Layer-2 latency budgets (sub-1 ms) for real-time scheduling, while 480K LE provides sufficient DSP blocks for sub-6 GHz massive-MIMO precoding. The industrial temperature grade suits outdoor base-station deployments where ambient air exceeds +70C during peak sun load.
Recommended
Military Radar and Electronic Warfare
Radar pulse-Doppler processing and EW channelization demand both deterministic latency and software control - exactly the workload split Arria 10 SX targets. The 480K LE fabric runs FIR/FFT pulse compression at the ADC sample rate, while the dual Cortex-A9 cores manage threat-library updates, beam-steering tables, and Mode-S/IFF protocols. The 17.4 Gbps transceivers accept direct ADC samples at 1-3 GSPS without external SERDES, simplifying the RF front-end. Industrial -40C to +100C operation supports avionics and ground-vehicle platforms with wide thermal swings. The 780-ball FC-FBGA package's flip-chip solder balls also improve thermal conductivity to the PCB for high-power jammer modes.
Recommended
Medical Imaging Accelerator (CT / Ultrasound / MRI)
The 10AS048E4F29I3SG accelerates back-projection, beamforming, and image-reconstruction pipelines in CT, ultrasound, and MRI systems where deterministic hardware latency is critical. The 480K LE fabric runs parallel back-projection threads at 50-100x real-time speedup over CPU-only baselines, while the dual Cortex-A9 cores run the OS, image-display stack, and DICOM transfer. The Arria 10 SX's hard memory controller with DDR4 ECC protects patient-data integrity, and the industrial temperature grade handles the elevated ambient inside scanner cabinets. The HPS-fabric coherent interconnect (AXI) lets the OS hand reconstructed frames to display without external round-trips.
Recommended
Broadcast Video Processing and Encoding
The 10AS048E4F29I3SG handles multi-stream broadcast contribution feeds including HEVC/H.264 encode, HDR tone-mapping, and 4K/8K up/down-conversion. Its 480K LE fabric runs parallel encoding pipelines (4 streams of 4K60 HEVC in parallel) while the dual Cortex-A9 cores manage IP routing, PTP/SMPTE-2059 timing, and stream multiplexing. The 17.4 Gbps transceivers accept 12G-SDI (SMPTE-2082) feeds natively without external re-clockers. Industrial temperature grade supports outdoor broadcast truck and remote production (REMI) environments. The HPS runs the control UI and telemetry for broadcast-automation integration.
Recommended
Industrial Machine Vision and Quality Inspection
Factory automation lines require deterministic, low-latency image processing for defect detection, OCR, and pick-and-place robotics. The 10AS048E4F29I3SG's FPGA fabric runs Sobel/Harris/CNN inference at the camera frame rate, while the dual Cortex-A9 HPS handles PLC/EtherCAT master, HMI, and vision-server communication. Industrial -40C to +100C operation handles cabinet temperatures near motors and welders without active cooling. The 17.4 Gbps transceivers accept CoaXPress 2.0 (CXP-12) feeds at 12.5 Gbps from high-speed linescan cameras. The SoC architecture reduces the need for a separate industrial PC, simplifying cabinet bill-of-materials.
Recommended
Test and Measurement Instrumentation
Benchtop instruments such as oscilloscopes, spectrum analyzers, and protocol analyzers benefit from the 10AS048E4F29I3SG's hybrid CPU + FPGA architecture. The FPGA fabric digitizes and pre-processes high-speed ADC samples at 50-100 GSPS through external TI / Analog Devices front-end ADCs, while the dual Cortex-A9 cores run the UI, measurements, and remote-API interfaces. The 17.4 Gbps transceivers feed external DACs for arbitrary waveform generation. Industrial temperature grade suits benchtop fan-cooled enclosures. The HPS boots from QSPI NOR flash for fast instrument startup, while the FPGA fabric is configured on each measurement mode change.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048E4F29I3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048E4F29I3LG | 10AS048E4F29E3SG | 10AS048E3F29I2SG |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 780-FBGA, FC (29x29) | 780-FBGA, FC (29x29) - same | 780-FBGA, FC (29x29) - same | 780-FBGA, FC (29x29) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 |
| HPS Cores | Dual Cortex-A9 MPCore | Dual Cortex-A9 MPCore | Dual Cortex-A9 MPCore | Dual Cortex-A9 MPCore |
| Speed Grade | 3 | 3 | 3 | 2 (slower Fmax, ~-15%) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +100C) | Industrial (-40C to +100C) |
| Transceiver Max Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| Process | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC | 20 nm TSMC |
| RoHS | Compliant (G suffix) | Compliant | Compliant | Compliant |
| Unit Price (qty-1, USD, as of 2026-09-05) | $1,450 | ~$1,450 | ~$1,250 (commercial, lower cost) | ~$1,250 (speed grade 2, lower cost) |
Key Differentiators
- Speed grade 3 enables higher Fmax and 1.5 GHz HPS operation (vs 10AS048E3F29I2SG)
- Industrial temperature grade (-40C to +100C) supports outdoor / military deployments (vs 10AS048E4F29E3SG)
- SoC FPGA architecture eliminates the need for an external processor (vs Discreet FPGA + CPU two-chip solution)
Design Notes
The 10AS048E4F29I3SG at full HPS + fabric utilization can dissipate 15-20 W. Estimated: at +85C ambient with 1.5 GHz HPS core and ~70% fabric utilization, junction temperature approaches +95C. The 780-ball F29 FC-FBGA's flip-chip solder balls provide a low-thermal-resistance path to the PCB top-side copper pour. Design the PCB with at least 8 thermal via arrays directly under the BGA, each via filled-and-capped. A bottom-side heat spreader is recommended for sealed enclosures without forced airflow.
The 17.4 Gbps transceivers demand controlled-impedance stripline routing with reference planes on adjacent layers, length matching within 0.127 mm tolerance across differential pairs, and AC-coupling capacitors placed near the TX pin. Recommended stackup: 14-layer with stripline for transceivers, microstrip for control-plane signals. The HPS requires separate analog power rails (VCC_AUX, VCC_PLL_HPS) with ferrite-bead isolation from the digital rail. The DDR4 interface needs 100-ohm differential matched routing for DQS pairs and a fly-by VTT topology.
Three common mistakes to avoid: (1) Quartus Prime version mismatches cause bitstream incompatibility - always pin the Quartus version that generated the .sof file; (2) The HPS boot source (QSPI NOR, SD card, NAND) must be configured via BSEL pins and pulled correctly at power-up; (3) The Transceiver reference clock must be clean - use a dedicated jitter-cleaner PLL (e.g., Texas Instruments LMK04832) rather than routing an FPGA-derived clock back through a transceiver. The ARM Cortex-A9 cores will not boot cleanly with a noisy clock and the SoC will hang in u-boot.
The 780-ball FC-FBGA's breakout fanout on inner-layer 0.4 mm pitch requires laser-drilled microvias (4-6 mil via pad) and HDI stackup. Estimated via-stub length must be below 0.25 mm to maintain 17.4 Gbps transceiver signal integrity. For DDR4 interfaces at 2133 MT/s, fly-by topology with VTT termination at the end-of-line is mandatory; T-topology will fail timing closure. Use IBIS-AMI simulation (Siemens HyperLynx or Ansys SIwave) to validate the breakout before committing to PCB fabrication.
Place decoupling capacitors directly beneath the BGA on the bottom side, with vias connecting to the top-side power planes through a 6-12 via cluster per cap. Bulk capacitors (22 uF tantalum or 47 uF ceramic) should be placed within 25 mm of the device. The HPS analog supply (VCC_AUX) requires an isolated ground island with a single-point bridge to the digital ground plane near the BGA's central GND balls. Keep high-speed transceiver channels on the same side of the package as the SMA connectors to avoid via-crossings that break reference-plane continuity.
Compliance Information
RoHS and lead-free compliance indicated by 'G' suffix per Altera ordering part number guide. AEC-Q100 not applicable (FPGA family). Conflict-minerals compliance per Altera/Intel corporate responsibility report. Halogen-free status not explicitly stated in verified data.
