10AX090U4F45I3LG - Arria 10 GX FPGA 900K LE | Intel
部品番号: 10AX090U4F45I3LG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $8782.45 | $8,782.45 |
| 5 | $8550 | $42,750.00 |
| 10 | $8320 | $83,200.00 |
| 25 | $7990 | $199,750.00 |
| 100 | $7450 | $745,000.00 |
10AX090U4F45I3LG 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and embedded hardened IP such as block RAM, DSP slices, high-speed transceivers, and external memory controllers. Modern FPGAs sit at the top of the programmable-logic hierarchy (FPGA -> programmable logic -> digital IC -> semiconductor) and are used as glue logic, accelerators, and full SoC replacements where ASIC NRE cost is unjustified. The Arria 10 GX family specifically targets 10 Gbps backplane, 25 Gbps backplane-ready, video processing, and DSP-intensive applications with hard PCIe Gen3 and 100G Ethernet IP.
Key features of the 10AX090U4F45I3LG include 480 user I/O pins, 20 nm TSMC process, industrial temperature grade (-40C to +100C), industrial speed grade, and 28 Gbps-capable transceivers (per Arria 10 GX family capability). The -I3 speed/power bin denotes a mid-power balance suitable for fan-cooled line cards and modular embedded systems. The 1932-ball FCBGA (F45 package code) uses a 45 mm body with fine-pitch BGA balls to deliver the 480 user I/O bandwidth while providing mechanical rigidity for high-layer-count PCB stackups.
The architecture pairs a programmable logic fabric with hard memory controllers, hard PCIe Gen3 x8 IP, hard 10/25/100G Ethernet MACs, and hardened floating-point DSP blocks. This heterogeneous integration removes soft-IP area overhead and lets the FPGA sustain multi-gigasample DSP throughput while keeping core voltage at 0.9 V for power-efficient operation in dense line-card designs. The Arria 10 family is widely deployed in 4K/8K video broadcast, medical imaging, and defense signal-processing platforms.
Typical applications include 4K/8K video broadcast and processing, 100G Ethernet line cards, software-defined radio (SDR) baseband, radar signal processing, ASIC prototyping, and high-performance DSP co-processing. The 20 nm process node gives a good power/performance trade-off for thermally constrained chassis compared with 28 nm predecessors.
When designing with this FPGA, plan PCB stackup with the BGA escape pattern, allocate sufficient decoupling, and verify Quartus Prime software version compatibility for the -I3 device variant. Thermal management is critical at 0.9 V core due to static plus dynamic power; a heat spreader or heatsink with adequate airflow is recommended for sustained operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping procurement and engineering teams make informed sourcing and design decisions.
ドロップイン代替品: 10AX090U4F45I3LG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AX090U4F45I3LG （同一形状・フットプリント） — 相違点: Package, Speed Grade, Process Technology, Transceivers, DSP Blocks.
クイック比較ツール — 並列比較する代替部品を選択:
10AX090U4F45E3LG
✅ ドロップイン✓ 在庫あり
$7147.8719 / 個
データシートを見る →10AX090U3F45I2LG
✅ ドロップイン✓ 在庫あり
$9750 / 個
データシートを見る →10AX090U2F45I2LG
✅ ドロップイン✓ 在庫あり
$7957.34 / 個
データシートを見る →10AX090S4F45I3LG
✅ ドロップイン✓ 在庫あり
$6050 / 個
データシートを見る →10AX090N4F45I3LG
✅ ドロップイン✓ 在庫あり
$5202.97 / 個
データシートを見る →10AX090U4F45I3LG 最大定格＆電気的特性
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (Bits) | 59,234,304 |
| User I/O Pins | 480 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| パッケージ | 1932-ball FCBGA (F45) |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | -3 (mid-power) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Transceivers | Up to 28 Gbps (Arria 10 GX family capability) |
| Hard IP | PCIe Gen3 x8, 10/25/100G Ethernet MAC, DDR3/DDR4 controllers |
| DSP Blocks | Hardened floating-point DSP fabric |
| Configuration | SRAM-based, supports via Quartus Prime |
10AX090U4F45I3LG 1932-ball fcbga (f45) ピン配置ガイド
10AX090U4F45I3LG (1932-ball fcbga (f45) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AX090U4F45I3LG.
詳細は データシート をご参照ください。
主な用途
10AX090U4F45I3LG の用途: 6 件s: 4K/8K Video Broadcast Processing, 100G Ethernet Line Card, Software-Defined Radio (SDR) Baseband, Radar Signal Processing, ASIC Prototyping, High-Performance DSP Co-Processing.
4K/8K Video Broadcast Processing
The 10AX090U4F45I3LG's 900,000 logic elements and hard DSP fabric deliver the parallel arithmetic throughput needed for 4K/8K video pipelines, including chroma upsampling, color-space conversion, HDR tone mapping, and wavelet compression. The -3 speed grade sustains 300 MHz DSP operation, while the 1932-ball FCBGA exposes the high-pin-count parallel video bus and multiple DisplayPort/SDI links. Hard PCIe Gen3 x8 IP enables direct attachment to host CPUs for ingest cards. Compared with software-only pipelines on x86, the FPGA approach offloads per-pixel operations for deterministic low-latency broadcast output.
おすすめ
100G Ethernet Line Card
The 10AX090U4F45I3LG integrates hard 100G Ethernet MAC and hardened PCS IP, enabling a single-chip 100G line card for switch/router platforms. The 28 Gbps-capable transceivers (per Arria 10 GX family) drive CFP/CFP2/QSFP28 optics directly, while the 480 user I/O feed multiple front-panel ports and backplane lanes. The -3 speed grade closes 156.25 MHz timing for 100G Ethernet PCS and OTN framing, and the 59 Mbit of block RAM supports deep packet buffering. Pair with external DDR4 for line-rate table lookup and traffic management.
おすすめ
Software-Defined Radio (SDR) Baseband
The 10AX090U4F45I3LG's hardened floating-point DSP blocks and high-speed transceivers make it a natural fit for SDR baseband, where it performs channelization, FFT-based spectrum analysis, and modem signal processing on wideband IF samples. The 20 nm process keeps core power manageable at 0.9 V despite the 900K LE count, while the industrial temperature rating supports outdoor/ruggedized radio enclosures. The 480 user I/O provide abundant LVDS pairs for ADC/DAC interfacing at GSPS rates.
おすすめ
Radar Signal Processing
Phased-array radar systems rely on FPGAs like the 10AX090U4F45I3LG for pulse compression, beamforming, and Doppler processing in real time. The Arria 10 GX hardened floating-point DSP blocks execute complex FFTs and matrix operations at hundreds of MHz, while the 59 Mbit block RAM stages range-Doppler maps. The 1932-ball FCBGA provides mechanical rigidity for vibration-prone environments, and the -I3 industrial temp grade handles the -40C to +100C junction range required in airborne radar pods.
おすすめ
ASIC Prototyping
The 10AX090U4F45I3LG is widely used as an ASIC prototyping vehicle because its 900K LE and hard memory controllers can map large ASIC RTL partitions with high fidelity. Multiple FPGAs can be tiled with high-speed transceivers bridging partitions, achieving multi-hundred-MHz ASIC-equivalent emulation. The 1932-ball FCBGA exposes enough GPIO to replicate most ASIC package pinouts, and Quartus Prime Pro supports industry-standard prototyping flows (HAPS, Protium).
おすすめ
High-Performance DSP Co-Processing
The 10AX090U4F45I3LG's hardened floating-point DSP fabric acts as a coprocessor to host CPUs or GPUs, offloading compute kernels like FIR filters, FFTs, convolutions, and matrix multiplies. The hard PCIe Gen3 x8 IP provides 8 GB/s host coupling, while the 59 Mbit block RAM and external DDR4 controller stage large datasets. Industrial temp (-40C to +100C) and -3 speed grade suit medical imaging accelerators and high-frequency trading platforms where deterministic low-latency DSP matters.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AX090U4F45I3LG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AX090U4F45E3LG | 10AX090U3F45I2LG | 10AX090U2F45I2LG | 10AX090S4F45I3LG | 10AX090N4F45I3LG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 SoC | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | -3 (mid-power) | -3 | -2 | -2 | -3 | -3 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial | Industrial | Industrial | Industrial |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits |
| User I/O Pins | 480 | 480 | 480 | 480 | 480 | 480 |
主な差別化要因
- Mid-power -3 speed grade in industrial temp （vs 10AX090U3F45I2LG)
- Pure FPGA fabric without embedded HPS （vs 10AX090S4F45I3LG)
- Industrial temperature rating for harsh environments （vs 10AX090U4F45E3LG)
設計ノート
Estimated: at typical utilization (60-70% LE, 50% DSP, 25 Gbps transceivers active), the 10AX090U4F45I3LG dissipates 15-25 W from a 0.9 V core plus I/O. The 1932-ball FCBGA package requires a heatsink or heat-spreader lid plus 200-400 LFM airflow to keep junction below 100C in industrial temp. Apply thermal interface material (TIM) with conductivity >= 3 W/mK between the lid and heatsink.
The 1932-ball FCBGA at F45 pitch demands an HDI PCB stackup (any-layer microvia, laser-drilled vias) for breakout routing. Plan at least a 12-layer stackup with paired ground planes adjacent to signal layers to maintain signal integrity on 25 Gbps transceiver channels. Decouple with 0402/0201 ceramic caps (0.1 uF, 1 uF, 10 uF) placed as close as possible to each power pin per the Arria 10 pin connection guidelines.
Route 25/28 Gbps transceiver channels with controlled impedance (100 ohm differential) and keep stubs under 150 mil. Match pair lengths within 5 mil for 25 Gbps and 2 mil for 28 Gbps. Use AC-coupled capacitors (100 nF) at transmitter outputs per Arria 10 GX transceiver user guide. Provide a clean reference ground plane under transceiver channels; avoid crossing power plane splits.
Do not assume all Arria 10 GX OPNs are feature-equivalent: the U, S, and N suffixes denote unlocked GX, SoC with HPS, and feature-restricted variants respectively. Pin-compatibility is preserved in the F45 package, but Quartus device support files and fitter results differ. Always compile your design against the exact OPN in the Quartus device selection to avoid fitter errors and unused-pin warnings.
コンプライアンス情報
RoHS/REACH compliance per Intel/Altera product page; AEC-Q100 is automotive-grade qualification and not applicable to high-density FPGAs in this class. Industrial temperature grade -I3 supports -40C to +100C junction operation.