10AX090N2F45I1SG - Arria 10 GX FPGA 900K LE, 1932-FCBGA | Intel
部品番号: 10AX090N2F45I1SG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $8245 | $8,245.00 |
| 10 | $7900 | $79,000.00 |
| 100 | $7350 | $735,000.00 |
| 500 | $6890 | $3,445,000.00 |
| 1,000 | $6450 | $6,450,000.00 |
10AX090N2F45I1SG 概要
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, DSP slices, and BRAM. FPGAs belong to the broader category of programmable logic devices, which sit within the integrated circuit (IC) taxonomy: programmable logic -> digital IC -> semiconductor. Unlike ASICs, FPGAs are reprogrammable in the field, enabling rapid prototyping, hardware iteration, and long lifecycle support across communications, industrial, and defense markets.
Key features of the 10AX090N2F45I1SG include 3,456 DSP blocks for fixed- and floating-point signal processing, 24 transceivers supporting data rates up to 17.4 Gbps for protocols such as PCIe Gen3 x8, 10GbE, and CPRI, dual-core ARM Cortex-A9 MPCore hard processor subsystem options, and hard memory controllers for DDR3/DDR4. The device operates from a 0.85V-0.95V core supply (nominal 0.9V) with industrial temperature grading (-40C to +100C).
The Arria 10 architecture combines a 20nm low-power process with adaptive logic modules (ALMs), 20Kbit MLABs, and 20Kbit M20K BRAM blocks, plus variable-precision DSP blocks. Hard PCIe Gen3 and Gen2 IP blocks eliminate soft-IP overhead, while hardened floating-point multipliers accelerate DSP workloads by 4x versus previous generations.
Typical applications include 4K/UHD video processing and broadcast, wireless baseband and radio head design, radar and electronic warfare signal processing, industrial machine vision, and high-performance computing accelerators. The wide transceiver bandwidth also suits 100G OTN and 400G line-card prototyping.
When designing with this device, allocate adequate PCB layers (typically 12+ layers) and high-performance VRM for the 0.9V core rail - transient currents can exceed 60A at full utilization. Plan JTAG and configuration pin assignments early; the F45 FCBGA requires careful escape routing and high-quality BGA assembly.
This page synthesizes distributor pricing, Arria 10 family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: 10AX090N2F45I1SG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AX090N2F45I1SG （同一形状・フットプリント） — 相違点: Package, DSP Blocks, Speed Grade, Process Technology, Core Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
10AX090N2F45E2SG
✅ ドロップイン✓ 在庫あり
$4943.22 / 個
データシートを見る →10AX090N2F45E1SG
✅ ドロップイン✓ 在庫あり
$10250 / 個
データシートを見る →10AX090N2F45E2LG
✅ ドロップイン✓ 在庫あり
$6095.25 / 個
データシートを見る →10AX090N2F40I2SG
✅ ドロップイン✓ 在庫あり
$6185 / 個
データシートを見る →10AX090N2F40I1SG
✅ ドロップイン✓ 在庫あり
$2985 / 個
データシートを見る →10AX066N2F40E1SG
✅ ドロップイン✓ 在庫あり
$3350 / 個
データシートを見る →10AX090N2F45I1SG 最大定格＆電気的特性
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 59,234,304 bits |
| DSP Blocks | 3,456 |
| Maximum User I/Os | 768 |
| Transceivers | 24 channels, up to 17.4 Gbps |
| Transceiver Protocols | PCIe Gen3 x8, 10GbE, CPRI, JESD204B, SATA 3.0 |
| Hard Memory Controllers | DDR3/DDR4 with ECC |
| Process Technology | TSMC 20nm |
| Core Voltage | 0.9 V (nominal) |
| 動作温度 | -40C to +100C (Industrial) |
| パッケージ | 1932-ball FCBGA (F45) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Configuration Scheme | JTAG, Active Serial, Passive Serial |
10AX090N2F45I1SG 1932-ball fcbga (f45) ピン配置ガイド
10AX090N2F45I1SG (1932-ball fcbga (f45) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AX090N2F45I1SG.
詳細は データシート をご参照ください。
主な用途
10AX090N2F45I1SG の用途: 6 件s: 4K/UHD Video Processing and Broadcast, Wireless Baseband and Radio Head Design, Radar and Electronic Warfare Signal Processing, Industrial Machine Vision and Inspection, High-Performance Computing Accelerators, Medical Imaging and Diagnostics.
4K/UHD Video Processing and Broadcast
The 10AX090N2F45I1SG's 900,000 logic elements, 3,456 DSP blocks, and 59 Mbits embedded memory make it ideal for 4K/UHD video processing pipelines including HEVC/H.265 encoding, broadcast format conversion, and multi-stream transcoding. Its 17.4 Gbps transceivers handle uncompressed 4K@60fps streams over 12G-SDI or SMPTE 2022-5/6 IP, while DDR4 interfaces provide frame buffering for real-time processing. Compared to smaller Arria 10 variants, the 900K LE device supports multiple parallel codecs without resource exhaustion, reducing system cost by eliminating external processor chips.
おすすめ
Wireless Baseband and Radio Head Design
In 4G LTE Advanced and 5G NR baseband units (BBU) and remote radio heads (RRH), the 10AX090N2F45I1SG's hardened CPRI and JESD204B transceivers at 17.4 Gbps support up to 24 antenna streams with native fronthaul connectivity. The 3,456 DSP blocks accelerate FFT/iFFT, channel estimation, and crest-factor reduction (CFR) operations. Industrial temperature grading (-40C to +100C) suits outdoor RRH deployment. The 900K LE density enables complete PHY-layer implementation plus MAC framer, eliminating separate DSP processors in compact radio designs.
おすすめ
Radar and Electronic Warfare Signal Processing
The 10AX090N2F45I1SG delivers defense-grade signal processing capability with 3,456 DSP blocks performing pulse-Doppler radar FFTs, digital beamforming, and electronic countermeasures in real time. Its 17.4 Gbps transceivers ingest multi-channel ADC data from RF front-ends via JESD204B, while the 59 Mbit embedded memory provides windowing buffers and CFAR detection tables. Industrial temperature grading ensures operation in harsh military environments. Compared to DSP processors, the FPGA achieves 10-50x faster FFT throughput per watt, critical for size, weight, and power (SWaP)-constrained platforms.
おすすめ
Industrial Machine Vision and Inspection
For high-speed machine vision systems inspecting semiconductors, pharmaceuticals, and automotive parts, the 10AX090N2F45I1SG delivers parallel pixel processing across its 900K LEs. The 17.4 Gbps transceivers accept CoaXPress or 10 GigE Vision streams from multiple line-scan cameras, while 3,456 DSP blocks run Sobel filtering, blob analysis, and AI inference at line rates exceeding 100 kHz. DDR4 controllers buffer multi-megapixel frames. Industrial temperature grading supports factory floor environments, and the 768 user I/Os handle parallel sensor arrays and motor-control feedback.
おすすめ
High-Performance Computing Accelerators
The 10AX090N2F45I1SG serves as a PCIe Gen3 x8 hardware accelerator in HPC clusters, where its 900K LEs and 3,456 DSP blocks offload compute-intensive kernels such as genomic alignment, financial Monte Carlo simulation, and cryptography from host CPUs. The 17.4 Gbps transceivers enable 100 GbE network connectivity for distributed computing, while DDR4 controllers provide high-bandwidth memory access. Compared to GPU accelerators, the FPGA achieves 5-10x better performance-per-watt for streaming workloads with deterministic latency.
おすすめ
Medical Imaging and Diagnostics
In CT scanners, MRI reconstruction, and ultrasound beamforming, the 10AX090N2F45I1SG's 17.4 Gbps transceivers accept raw RF data from multi-channel ADC arrays, while 3,456 DSP blocks perform filtered back-projection (FBP) and iterative reconstruction in real time. The 59 Mbit embedded memory holds projection data and sinograms, reducing external memory accesses by 40%. Industrial temperature grading supports cart-mounted diagnostic equipment. The FPGA's deterministic latency enables precise synchronization of imaging subsystems, critical for diagnostic accuracy.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AX090N2F45I1SG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AX090N2F45E2SG | 10AX090N2F45E1SG | 10AX090N2F45E2LG | 10AX090N2F40I2SG | 10AX090N2F40I1SG | 10AX066N2F40E1SG |
|---|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F40) - similar | 1932-ball FCBGA (F40) - similar | 1932-ball FCBGA (F40) - similar |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 660,000 |
| Transceiver Speed | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 43,597,056 bits |
| DSP Blocks | 3,456 | 3,456 | 3,456 | 3,456 | 3,456 | 3,456 | 2,438 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +100C (Extended Commercial) | 0C to +100C (Extended Commercial) | 0C to +100C (Extended Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +100C (Extended Commercial) |
| Speed Grade | 1 (fastest) | 2 | 1 | 2 | 2 | 1 | 1 |
| Unit Price (qty 1, USD) | $8,245.00 | $7,890.00 | $8,100.00 | $7,950.00 | $7,400.00 | $7,650.00 | $5,890.00 |
主な差別化要因
- Highest transceiver speed in 900K LE Arria 10 family （vs 10AX090N2F40I1SG)
- Industrial temperature grading for harsh environments （vs 10AX090N2F45E1SG)
- Same high-density fabric across F45 speed-grade variants （vs 10AX066N2F40E1SG)
設計ノート
The 1932-ball FCBGA package at 1 mm ball pitch demands a minimum 12-layer PCB stackup with high-speed layers referenced to solid ground planes. Escape routing must use microvias (laser-drilled, 0.1 mm pad) on the top two layers, with through-vias from layer 3 downward. Estimate: total BGA breakout requires approximately 4-6 routing layers just for signal escape, plus dedicated ground and power layers.
The 0.9V core rail can demand transient currents exceeding 60A at full FPGA utilization. Use a multi-phase synchronous buck regulator with at least 4 phases and low-ESR ceramic output capacitors (e.g., 22x 22uF X5R 0805). Place input capacitors within 5 mm of the VCCT pins. Add bulk tantalum or polymer capacitors (470uF) near the regulator. Decoupling: one 0.1uF + one 1nF per power pin pair. Estimated: 8-layer PCB with 2oz copper on power layers is required to handle peak current without excessive voltage droop.
At maximum utilization with 100% toggle rate, junction power can exceed 25W. The FCBGA package has theta_JA of approximately 8 C/W with 100 LFM airflow, requiring a heatsink with thermal resistance below 1 C/W. Estimate: with junction temp limit of 100C (industrial grade) and ambient 70C, allowable rise is 30C, demanding thermal solution theta_JA below 1.2 C/W. Use thermal interface material (TIM) with conductivity above 3 W/mK and ensure heatsink mounting pressure of 30-50 psi.
17.4 Gbps transceivers require strict impedance control: 100 ohm differential microstrip or stripline with tolerance +/-10%. Via stubs must be back-drilled to minimize reflections at >10 Gbps. Reference Intel AN 613 reference design for channel budget and pre-emphasis/equalization settings. Place AC coupling capacitors (100nF X7R 0201) within 200 mil of TX/RX pins for optimal signal integrity.
Common pitfalls: (1) configuring JTAG pins as user I/O, bricking the device - always reserve JTAG pins or use external configuration controller; (2) insufficient cooling causing thermal throttling below 100C junction; (3) improper MSL handling - the FCBGA package is MSL3 with 168-hour floor life; (5) failing to enable soft-error detection in safety-critical applications. Always generate the design with Intel Quartus Prime and verify pin assignments against the F45 pinout file.
コンプライアンス情報
RoHS and lead-free compliance per Intel/Altera product page. Industrial temperature grade (-40C to +100C). AEC-Q100 not applicable for FPGA logic devices.