10AX090U4F45E3LG - 900K Logic Elements Arria 10 FPGA | Intel
MPN: 10AX090U4F45E3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7147.8719 | $7,147.87 |
| 10 | $7147.8719 | $71,478.72 |
| 100 | $7147.8719 | $714,787.19 |
| 500 | $7147.8719 | $3,573,935.95 |
| 1,000 | $7147.8719 | $7,147,871.90 |
10AX090U4F45E3LG Overview
An FPGA is a semiconductor device containing configurable logic blocks, programmable interconnects, embedded memories, and I/O resources that can be configured after manufacturing. In the system hierarchy, an FPGA sits between a general-purpose processor and fixed-function application-specific integrated circuits: it provides more parallel processing capability and hardware-timer predictability than software execution, while offering more design flexibility than a custom ASIC. The Arria 10 GX family is designed for bandwidth-intensive and compute-oriented digital systems.
The key verified resource figures are 900,000 logic elements, 480 I/O, and 59,234,304 memory bits. A 1932-ball FCBGA package provides the interconnect and thermal/mechanical interface required by this high-pin-count device. The part is listed by distributors as an FPGA IC with ball-grid-array terminals and a square BGA package designation. These characteristics make the device suitable for designs that need substantial configurable logic and many external interfaces.
The configurable architecture allows designers to implement parallel pipelines, packet-processing engines, control logic, and interface bridging without waiting for a custom mask set. Embedded memory can support buffering, lookup tables, FIFOs, and local data storage close to the logic. The device should be evaluated with the complete manufacturer device documentation because the verified search data does not expose operating voltage, transceiver count, transceiver speed, DSP count, temperature grade, package dimensions, or speed grade details.
Typical applications include communications and networking equipment, industrial automation, high-performance test and measurement, video and image processing, and accelerator or protocol-processing systems. Its 480 I/O count is particularly relevant when a design must connect to many memory devices, converters, backplanes, or high-speed interfaces. The 900,000-logic-element capacity supports partitioning complex functions across parallel hardware blocks.
PCB design must use the exact 1932-ball land pattern, manufacturer pin map, and recommended stack-up from the Altera/Intel device documentation. Power integrity, simultaneous-switching-noise control, decoupling, thermal analysis, and high-speed routing are critical. Designers should also confirm configuration memory, clocking, transceiver support, and software-tool compatibility before release.
This product data synthesizes the exact distributor and manufacturer search values, while clearly identifying unavailable electrical and mechanical details with data-needed markers. It also avoids treating generic cross-reference search pages as proof of a pin-compatible replacement.
Drop-in alternatives for 10AX090U4F45E3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10AX090U4F45E3LG (same form factor and footprint) — differing in Package, Process Technology, Transceivers, Family, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090S4F45E3LG
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4582.63 / Unit
View Datasheet →10AX090U4F45E3SG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
10AX090N4F45I3LG
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5202.97 / Unit
View Datasheet →10AX090R4F40I3LG
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5690 / Unit
View Datasheet →10AX090U3F45E2LG
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6900 / Unit
View Datasheet →10AX090U4F45E3LG Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera |
| Current Brand | Intel |
| Product Type | Field Programmable Gate Array (FPGA) |
| Family | Arria 10 GX |
| Logic Elements | 900000 |
| User I/O | 480 |
| Embedded Memory | 59234304 bit |
| Package | 1932-BBGA, FCBGA |
| Terminal Count | 1932 |
| Terminal Form | Ball |
| Package Code | BGA |
| Package Shape | Square |
10AX090U4F45E3LG square Pin Configuration Guide
Pin configuration for 10AX090U4F45E3LG (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090U4F45E3LG.
Refer to the datasheet for full pin configuration.
Typical Applications
10AX090U4F45E3LG is suitable for 6 applications: Communications Networking Equipment, Industrial Automation Controllers, Test and Measurement Systems, Video and Image Processing, High-Performance Protocol Bridge, Hardware Accelerator Platform.
Communications Networking Equipment
10AX090U4F45E3LG fits communications equipment that needs high logic density and 480 user I/O for parallel packet handling, protocol conversion, traffic management, and interface aggregation. Its verified 900,000 logic elements support large datapaths and control structures, while the 59,234,304-bit embedded memory can hold queues, lookup tables, packet buffers, and timing state. The 1932-ball FCBGA is suitable for a complex system board, but the design must use the exact manufacturer ball map and verify the device's transceiver count and maximum data rate before selecting external connectors or high-speed PHYs. Power integrity and thermal analysis are especially important because the supplied data does not provide power, voltage, or thermal limits.
Recommended
Industrial Automation Controllers
10AX090U4F45E3LG can serve as the programmable processing and control fabric in an industrial automation controller. The verified 900,000 logic elements allow deterministic parallel control, machine-state handling, sensor fusion, and communication-protocol termination, while 480 user I/O support numerous field interfaces and local devices. Embedded memory of 59,234,304 bits can support FIFOs, waveform tables, command buffers, and diagnostic data. The BGA package offers a compact system integration point, but it increases PCB escape, assembly, and rework complexity. The supplied data does not provide industrial temperature, voltage, or reliability qualification values, so the target should not be used for a safety or harsh-environment design until the manufacturer documentation confirms those requirements.
Recommended
Test and Measurement Systems
10AX090U4F45E3LG is appropriate for test and measurement systems that require substantial parallel logic, local buffering, and many external connections. The 900,000-logic-element resource can implement acquisition sequencing, digital filters, trigger engines, protocol analyzers, and instrument control in hardware, reducing dependence on software scheduling. Its 480 I/O support multiple converters, memories, front-panel devices, and measurement buses, while the 59,234,304-bit memory provides local data buffering. For signal-integrity-sensitive designs, the 1932-ball FCBGA requires controlled impedance routing, a verified stack-up, and careful power distribution. The supplied web data does not specify DSP resources, transceiver speed, timing limits, or power consumption, so those details must be resolved from the official device documentation.
Recommended
Video and Image Processing
10AX090U4F45E3LG supports video and image-processing systems that need parallel pixel pipelines, frame buffers, and multiple camera or display interfaces. The verified 900,000 logic elements can be allocated to image preprocessing, format conversion, feature extraction, encoding, and display timing, while 480 user I/O provide a practical interface budget for sensors, memory, and bridge devices. The 59,234,304-bit embedded memory is useful for line buffers, lookup tables, and small frame-local storage, although the exact memory architecture and bandwidth must be confirmed from the datasheet. The 1932-ball FCBGA enables high connection density but demands careful escape routing and thermal design. The supplied data does not include DSP count, video interface standards, clock limits, or package dimensions.
Recommended
High-Performance Protocol Bridge
10AX090U4F45E3LG can be used as a protocol bridge where data must be adapted between multiple buses, packet formats, or real-time interfaces. Its 900,000 logic elements provide capacity for protocol parsing, arbitration, queue management, and simultaneous ingress/egress processing, while 480 I/O support numerous PHY, memory, and control connections. The verified 59,234,304-bit embedded memory can hold conversion tables, descriptors, and short bursts of traffic. Because the supplied data does not specify transceiver count, data rate, I/O standards, or supported protocols, system architects must verify those features directly in the manufacturer documentation. The 1932-ball FCBGA also requires a detailed signal-integrity and power-integrity plan before routing is released.
Recommended
Hardware Accelerator Platform
10AX090U4F45E3LG is a potential hardware accelerator for workloads that benefit from parallel execution and predictable hardware timing. The 900,000 logic elements support custom arithmetic pipelines, state machines, data transformations, and interface controllers, while 480 user I/O provide connections to host processors, memories, sensors, and accelerator networks. The verified 59,234,304-bit embedded memory can hold coefficients, descriptors, and intermediate data near the computation logic. The device should be selected only after clock, power, DSP, memory-bandwidth, and thermal requirements are known, because the supplied search data does not provide those specifications. A 1932-ball FCBGA implementation also requires manufacturer-approved land pattern, stack-up, decoupling, and thermal design.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090U4F45E3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090S4F45E3LG | 10AX090U4F45E3SG | 10AX090N4F45I3LG | 10AX090R4F40I3LG | 10AX090U3F45E2LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA | 1932-ball FCBGA | 1932-ball FCBGA | 1932-ball FCBGA | 1932-ball FCBGA | 1932-ball FCBGA |
| Family | Arria 10 GX | Arria 10 family | Arria 10 GX | Arria 10 family | Arria 10 family | Arria 10 family |
Key Differentiators
- The target is explicitly identified as an Arria 10 GX FPGA with 900,000 logic elements. (vs 10AX090S4F45E3LG)
- The target provides 480 verified user I/O. (vs 10AX090N4F45I3LG)
- The target has a verified 59,234,304-bit embedded-memory figure. (vs 10AX090U3F45E2LG)
- The target is tied to the official Arria 10 GX ordering record. (vs 10AX090R4F40I3LG)
Design Notes
Use the official 1932-ball FCBGA land pattern, pin map, escape recommendation, and stack-up for 10AX090U4F45E3LG. The verified data confirms 1,932 ball terminals, BGA package coding, and a square package, but does not provide package dimensions or ball names. Do not infer the land pattern from the package description. Confirm ball numbering, via construction, layer count, impedance targets, and keepout zones with the manufacturer package documentation before PCB release.
Power integrity must be designed from verified electrical limits, not from estimated capacity. The supplied data does not state core voltage, I/O voltage, current, power consumption, or power-up sequencing for 10AX090U4F45E3LG. Obtain the complete electrical specification and reference-design guidance, then calculate regulator current, transient response, decoupling, and startup sequencing using the intended FPGA configuration and I/O utilization. Label any preliminary power estimate as an estimate until confirmed.
Treat the 1932-ball FCBGA as a high-density thermal design. The verified search data does not provide junction temperature, thermal resistance, allowed ambient range, or power dissipation, so no final heatsink or airflow decision can be made from the supplied values. After obtaining the device power model and package thermal data, estimate junction temperature from the actual design power and selected board solution, then validate with the manufacturer thermal guidelines and measured or simulated results.
The 480 user I/O resource makes signal-integrity planning essential. The supplied record does not specify supported I/O standards, transceiver count, maximum data rate, differential-pair rules, or timing limits. Assign each external interface to a verified I/O bank, confirm voltage compatibility, and route high-speed signals with controlled impedance, continuous reference planes, suitable return paths, and manufacturer-recommended spacing. Validate the complete interface configuration in the FPGA design tool before fabrication.
Do not substitute a similar Arria 10 ordering code solely because the package class appears to match. The supplied evidence confirms 1932-ball FCBGA for the target but does not verify that the listed alternatives have identical ball maps, logic resources, memory, speed grades, temperature grades, or power requirements. A suffix change can affect qualification or operating characteristics even when the package description is similar. Validate every alternative against the official ordering guide, pin map, electrical limits, and design-tool device support before approving a replacement.
Compliance Information
The verified data identifies the manufacturer product page as a trade-compliance and material-attribute source, but the supplied search excerpts do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status.