10AX090N2F45E2SG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel
部品番号: 10AX090N2F45E2SG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6182.78 | $6,182.78 |
| 10 | $5870.64 | $58,706.40 |
| 100 | $5561.5 | $556,150.00 |
| 500 | $5252.36 | $2,626,180.00 |
| 1,000 | $4943.22 | $4,943,220.00 |
10AX090N2F45E2SG 概要
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, DSP slices, and memory controllers. FPGAs sit within the broader semiconductor hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike ASICs, FPGAs are reprogrammable in-system, allowing engineers to iterate hardware functionality without retooling a fab, which makes them essential for prototyping, low-volume production, and designs requiring late-stage hardware changes.
Key features of the 10AX090N2F45E2SG include 12.05 Gbps transceivers, dual ARM Cortex-A9 MPCore hard processor subsystem availability on the SoC variant, integrated PCI Express hard IP, and 24 floating-point DSP blocks (variable precision DSP). The device supports DDR4 external memory interfaces up to 1,200 MHz with hardened PHY, hardened floating-point arithmetic engines, and partial reconfiguration capability. Configuration is via JTAG, passive serial, fast passive parallel, or Avalon-ST interfaces.
From an architectural perspective, the Arria 10 family uses a heterogeneous fabric that combines logic, DSP, memory, and transceiver tiles with a global routing network. The 20nm process delivers higher core performance and lower power than the prior 28nm Stratix V generation. The 768 user I/O count and 768 maximum LVDS pairs enable rich connectivity for video, telecom, and high-speed serial aggregation systems.
Typical applications for the 10AX090N2F45E2SG include 4K video processing and broadcast equipment, 100G/400G optical transport networking, radar and electronic warfare signal processing, medical imaging systems such as CT and MRI back-end processing, 4G/5G baseband prototyping, and high-performance computing acceleration. The integrated transceivers and PCI Express Gen3 hard IP also make the part well-suited for data center network interface cards and protocol bridging.
When designing with the 10AX090N2F45E2SG, pay close attention to power sequencing: the 0.95 V core rail must ramp before the 1.8 V I/O and transceiver rails to avoid latch-up. Use Intel's PowerPlay Early Power Estimator (EPE) before tape-out to size the regulator tree, and route the global clock networks with controlled impedance to minimize jitter. A minimum of 8 PCB layers with continuous power planes is recommended.
This page synthesizes distributor pricing, parametric positioning versus other Arria 10 density points, and practical design notes that go beyond the manufacturer datasheet. The 10AX090N2F45E2SG is positioned in the upper-middle of the Arria 10 logic-density stack, offering a balanced trade-off between capacity, transceiver count, and power consumption.
ドロップイン代替品: 10AX090N2F45E2SG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AX090N2F45E2SG （同一形状・フットプリント） — 相違点: Package, Speed Grade, DSP Blocks, Process Technology, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
10AX090N2F45E2LG
✅ ドロップイン✓ 在庫あり
$6095.25 / 個
データシートを見る →10AX090N2F45E1SG
✅ ドロップイン✓ 在庫あり
$10250 / 個
データシートを見る →10AX090N2F45E2SG 最大定格＆電気的特性
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 23,104 Kbits |
| User I/O Count | 768 |
| DSP Blocks | 24 (variable precision, hardened FP) |
| Transceivers | Up to 12.05 Gbps |
| パッケージ | 1932-ball FCBGA (F45) |
| Process Technology | TSMC 20nm |
| PCI Express Hard IP | Yes (Gen3 capable) |
| External Memory Support | DDR4 up to 1,200 MHz, DDR3, QDR IV, RLDRAM III |
| Hard Processor System | Dual ARM Cortex-A9 MPCore (on SoC variants) |
| Configuration Modes | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Avalon-ST |
| Operating Temperature Grade | E2 (extended) |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount (BGA) |
10AX090N2F45E2SG 1932-ball fcbga (f45) ピン配置ガイド
10AX090N2F45E2SG (1932-ball fcbga (f45) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AX090N2F45E2SG.
詳細は データシート をご参照ください。
主な用途
10AX090N2F45E2SG の用途: 6 件s: 4K Video Processing & Broadcast Equipment, 100G/400G Optical Transport Networking, Radar & Electronic Warfare Signal Processing, Medical Imaging Systems (CT/MRI Back-End), 4G/5G Baseband Prototyping & PHY Layer, High-Performance Computing Acceleration.
4K Video Processing & Broadcast Equipment
The 10AX090N2F45E2SG fits 4K video processing and broadcast equipment because its 900,000 logic elements provide headroom for multi-stream 12G-SDI processing, color-space conversion, and HDR pipeline logic. The integrated transceivers natively support 12G-SDI (11.88 Gbps) and 6G-SDI data rates without external PHYs, reducing BOM cost on broadcast routers and video switchers. The 768 user I/O count accommodates parallel camera interface aggregation, while the 23,104 Kbit embedded memory buffers line buffers for frame-rate conversion. Estimated: at 300 MHz fabric speed, the device sustains simultaneous processing of two 4K60 streams.
おすすめ
100G/400G Optical Transport Networking
The 10AX090N2F45E2SG is well-matched to 100G optical transport networking because its transceiver channels operate up to 12.05 Gbps, allowing aggregation to 100G via 10x10G or 4x25G CAUI-2/-4 architectures. The 900K-LE fabric absorbs OTN framer, FEC (RS(255,239) and RS(255,239) with KP4), and 100GbE MAC functions without external co-processors. The hardened PCI Express Gen3 hard IP and 10GbE MAC simplify PHY-layer integration, while DDR4 support at 1,200 MHz provides line-rate buffering. Estimated: full 100G OTU4 processing consumes ~70% of the 900K LE fabric.
おすすめ
Radar & Electronic Warfare Signal Processing
The 10AX090N2F45E2SG suits radar and electronic warfare signal processing because its 24 hardened floating-point DSP blocks deliver up to 1.5 TFLOPs of single-precision throughput, sufficient for pulse compression, MTI filtering, and DOA estimation. The 900K-LE fabric hosts the beamforming and direction-finding control logic, while the 23,104 Kbit embedded memory stages FFT samples at radar PRF rates. Transceivers support direct ADC interface at up to 12.05 Gbps for digital receivers, eliminating external deserializer ASICs. Estimated: at 300 MHz, a 4096-point FFT completes in approximately 13.6 microseconds.
おすすめ
Medical Imaging Systems (CT/MRI Back-End)
The 10AX090N2F45E2SG fits medical imaging back-end processing because its 900K logic elements execute filtered back-projection and iterative reconstruction algorithms for CT image pipelines, while the 24 hardened floating-point DSP blocks accelerate sinogram-to-image transforms. The DDR4 interface up to 1,200 MHz streams raw detector data at sustained line rates, and the embedded memory tiles (M20K blocks) buffer reconstructed slice data. Transceivers aggregate multi-channel ADC inputs directly, while the PCI Express Gen3 link interfaces to the host workstation. Reliability is critical; the E2 temperature grade supports hospital equipment thermal envelopes.
おすすめ
4G/5G Baseband Prototyping & PHY Layer
The 10AX090N2F45E2SG is suitable for 4G/5G baseband prototyping because its 12.05 Gbps transceivers interface directly with CPRI and OBSAI fronthaul links, while the 900K LE fabric hosts soft PHY LTE Turbo and 5G LDPC encoders/decoders with measured throughput headroom. The hardened DSP blocks execute the complex matrix operations of MIMO detection, and the DDR4 interface sustains multi-carrier sample buffers. Researchers use the partial reconfiguration feature to swap reference algorithms rapidly. Estimated: full 4x4 MIMO 20 MHz LTE PHY consumes ~40% of the 900K LE fabric.
おすすめ
High-Performance Computing Acceleration
The 10AX090N2F45E2SG serves high-performance computing acceleration because the PCI Express Gen3 x8 hard IP delivers up to 8 GB/s host bandwidth, and the 900K-LE fabric hosts custom OpenCL/C kernels for offloading compute-intensive functions such as financial Monte Carlo simulation, genomics alignment, or database query acceleration. The 24 hardened floating-point DSP blocks and the 23,104 Kbit embedded memory provide high on-chip compute density, while transceivers aggregate multiple accelerator cards into HPC fabrics via serial protocols. The DDR4 interface supports large working-set datasets without host round-trip.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AX090N2F45E2SG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AX090N2F45E2LG | 10AX090N2F45E1SG | 10AX090N2F40I2SG |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F40) - different ballout |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (Kbits) | 23,104 | 23,104 | 23,104 | 23,104 |
| Temperature Grade | E2 (extended) | E2 (extended) | E1 (extended, slightly narrower range) | I2 (industrial) |
| Transceiver Max Rate | 12.05 Gbps | 12.05 Gbps | 12.05 Gbps | 12.05 Gbps |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant |
主な差別化要因
- High 900K LE density with 768 user I/O （vs 10AX066N2F40E1SG)
- Largest F45 1932-ball FCBGA with full transceiver complement （vs 10AX090N2F40I2SG)
- Drop-in compatible with E1 and E2 temperature variants （vs 10AX090N2F45E1SG)
設計ノート
Estimated: Use Intel's PowerPlay Early Power Estimator (EPE) before schematic capture. A 900K-LE Arria 10 design at 300 MHz logic utilization typically draws 12-18W on the 0.95V core rail, plus 2-4W on 1.8V I/O and 4-6W on transceiver rails. Sequence the core rail first; the I/O and transceiver rails must follow. Decouple each rail with 10uF bulk plus 0.1uF/0.01uF high-frequency ceramics placed within 5mm of the package balls.
The 1932-ball FCBGA package dissipates 20-25W typical in mid-utilization designs. Estimate: with theta_JA of approximately 9 C/W (still-air, JEDEC 4-layer test board), junction-to-ambient delta T is ~200C at 22W. A heatsink with thermal interface material and 200-400 LFM airflow is mandatory. Mount the BGA on a PCB with continuous internal ground planes and stitched thermal vias under the package to spread heat to inner layers.
Use a minimum 8-layer PCB with controlled-impedance routing for transceivers (100 ohm differential for transceivers, 50 ohm single-ended for clocks, 85/100 ohm differential for DDR4). Maintain BGA breakout within the first 8mm using microvia-in-pad or HDI stackup with 0.4mm pitch escape. Route transceivers with length matching within 0.127 mm (5 mil) for the TX and RX pairs of the same channel. Provide reference plane continuity under all high-speed traces.
Do not assume 'E2' parts work at the same temperature range as 'I2' or 'E1' - check Intel's specific thermal tables. Do not skip the SmartVID configuration; without it the device may request an unsupported voltage. Do not use passive serial configuration with the wrong EPCQ device density. For configuration, ensure MSEL[2:0] pins are pulled correctly via 4.7kΩ to match the desired configuration scheme (AS x1, AS x4, JTAG, FPP, PS).
コンプライアンス情報
RoHS compliant per Intel Altera product page. Not AEC-Q100 qualified - FPGAs in this density class are typically not AEC-Q100; for automotive-grade FPGA options consider lower-density Cyclone families or Spartan-7 class devices. Lead-free solder balls standard on E2/LG variants.