5CSEBA5U23I7N - Cyclone V SE SoC FPGA 85K LE | Intel
部品番号: 5CSEBA5U23I7N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152 | $15,200.00 |
| 500 | $140.25 | $70,125.00 |
| 1,000 | $132.1 | $132,100.00 |
5CSEBA5U23I7N 概要
A System-on-Chip FPGA is a heterogeneous compute device that combines a general-purpose CPU subsystem (ARM Cortex-A9 with caches, MMU, and CoreSight debug) with a programmable logic fabric in a single silicon die. This architecture sits above discrete microcontrollers in the design hierarchy and below traditional ASIC + MPU combinations: SoC FPGA -> Cyclone V -> low-power FPGA family -> programmable logic -> semiconductor. The HPS typically handles OS, networking stacks, and control planes, while the FPGA fabric accelerates parallel dataplanes, custom peripherals, and high-bandwidth interfaces.
Key features of the 5CSEBA5U23I7N include 85K logic elements, dual ARM Cortex-A9 cores, integrated CoreSight debug, on-chip HPS peripherals (EMAC, USB, SD/MMC, NAND), 800 MHz maximum HPS clock, and a shared interconnect between HPS and FPGA fabric. The Cyclone V SE SoC family delivers up to 301K logic elements at the high end, but the 5CSEBA5U23I7N targets the 85K sweet spot for cost-optimized industrial designs.
Architecturally, the device uses TSMC's 28 nm low-power process, which reduces static power compared with the prior 40 nm Cyclone IV generation. The HPS-to-FPGA bridges (AXI-3 and Avalon) are tightly coupled over a multi-layer interconnect, allowing DMA engines to stream data between DDR controllers and custom accelerators with minimal CPU overhead.
Typical applications include industrial machine vision, motor drives and robotics, factory automation controllers, military/aerospace signal processing, and medical imaging pre-processing. The integrated ARM cores eliminate an external processor on the PCB, shrinking BOM cost and latency for system control loops.
When designing with this part, ensure the PCB footprint is UBGFA-672 (0.5 mm or 0.8 mm ball pitch per the package code - verify in the Cyclone V device handbook). Power sequencing must satisfy the HPS and FPGA rail bring-up order described in the Cyclone V SoC power management user guide; failure to sequence properly can prevent HPS boot.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: 5CSEBA5U23I7N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 5CSEBA5U23I7N （同一形状・フットプリント） — 相違点: Package, Logic Elements, Embedded Memory, Operating Temperature, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
5CSEBA5U23I7LN
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$325 / 個
データシートを見る →5CSEBA5U23I7
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$145.5 / 個
データシートを見る →5CSEBA5U23C8N
✅ ドロップイン✓ 在庫あり
$88.75 / 個
データシートを見る →5CSEBA5U23C7N
✅ ドロップイン✓ 在庫あり
$103.88 / 個
データシートを見る →5CSEBA4U23I7N
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →5CSEBA2U23I7N
✅ ドロップイン✓ 在庫あり
$124 / 個
データシートを見る →5CSEBA5U23I7N 最大定格＆電気的特性
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 85,000 |
| Process Technology | 28 nm |
| Core Voltage | 1.1 V |
| HPS CPU | Dual ARM Cortex-A9 MPCore |
| Debug | ARM CoreSight |
| Maximum HPS Clock | 800 MHz |
| パッケージ | 672-UBGA (23x23 mm) |
| 動作温度 | -40C to +100C (Industrial) |
| Hot Swap Support | Yes |
| 実装タイプ | Surface Mount (BGA) |
| MSLレベル | 3 |
| RoHS ステータス | Compliant |
| Lead Free | Yes |
| HPS Peripherals | EMAC, USB, SD/MMC, NAND, SPI, UART, I2C |
5CSEBA5U23I7N ピン構成
| ピン 1 | VCC — Core supply voltage |
| ピン 2 | GND — Ground reference |
| ピン 3 | HPS_VCC — Hard processor system supply |
| ピン 4 | IO_BANK_1 — FPGA I/O bank reference |
主な用途
5CSEBA5U23I7N の用途: 7 件s: Industrial Motor Control, Machine Vision Systems, Software Defined Radio, Factory Automation Controllers, Medical Imaging Pre-Processing, Military and Aerospace Signal Processing, Smart Energy and Grid Edge.
Industrial Motor Control
The 5CSEBA5U23I7N suits industrial motor drives because its dual ARM Cortex-A9 HPS executes real-time FOC control loops while the 85K-LE FPGA fabric generates PWM modulators, encoder interfaces, and Sigma-Delta modulators. With 800 MHz HPS clock and hardware AXI bridges, feedback latency from ADC sample to PWM update stays under 1 microsecond. The -40C to +100C industrial temperature range and hot-swap support meet factory-floor cabinet requirements. Typical implementation uses one Cortex-A9 core for EtherCAT or Profinet fieldbus and the second for the control loop; the FPGA fabric offloads PWM, dead-time insertion, and resolver excitation. Reference designs in the Cyclone V SoC embedded design suite ship full motor-control firmware and Quartus RTL.
おすすめ
Machine Vision Systems
The 5CSEBA5U23I7N is well matched to industrial machine vision because the FPGA fabric can ingest MIPI CSI-2 or parallel image-sensor streams at line rate while the dual Cortex-A9 HPS runs OpenCV-based inspection algorithms. The shared HPS-FPGA DDR interface allows zero-copy frame buffers for full-HD video at 60 fps without external memory contention. The 85K LEs accommodate hardware Sobel, thresholding, and connectivity pre-processing that offload the CPUs to track multiple objects per frame. The integrated EMAC and USB OTG simplify GigE Vision and USB3 Vision host connectivity, eliminating an external PHY controller.
おすすめ
Software Defined Radio
The 5CSEBA5U23I7N enables entry-level SDR designs by mapping DDC/DUC and channelizer FFTs into the 85K-LE FPGA fabric while the dual Cortex-A9 HPS runs GNU Radio or a custom signal-processing stack. The shared DDR3 controller (in the HPS) lets the FPGA fabric stream complex baseband samples directly to the processors for demodulation, with hardware DMA via the AXI bridges reducing CPU interrupt load. With on-chip transceivers absent in this SE variant, external ADC/DAC pairs interface over LVDS - the 85K LEs comfortably host a 16-tap polyphase filter bank for LTE channelization. Hot-swap capability simplifies insertion into modular SDR chassis.
おすすめ
Factory Automation Controllers
The 5CSEBA5U23I7N is an ideal PLC and PAC platform because the dual Cortex-A9 HPS runs a real-time Linux or VxWorks distribution with EtherCAT, Profinet, or Modbus TCP stacks while the FPGA fabric implements custom industrial I/O - high-speed counters, PWM, frequency measurement, and isolated digital interfaces. The integrated EMAC, USB, and SD/MMC peripherals reduce external component count on the carrier PCB. Industrial temperature grade -40C to +100C plus hot-swap support allow cabinet-free mounting and live rack replacement during production line changes.
おすすめ
Medical Imaging Pre-Processing
The 5CSEBA5U23I7N fits medical ultrasound and endoscopy pre-processing because the FPGA fabric can run beamforming, FFT, and I/Q demodulation pipelines with deterministic latency while the dual Cortex-A9 HPS handles patient interface, image reconstruction, and DICOM stack. The HPS-FPGA shared DDR allows raw RF samples to flow directly into preprocessing buffers without an external frame grabber. The 85K-LE budget supports 32-channel beamformers used in portable ultrasound carts; lower-channel systems can move to 5CSEBA4U23I7N for cost reduction. Industrial temperature and lifecycle longevity make the part viable for medical device certification paths.
おすすめ
Military and Aerospace Signal Processing
The 5CSEBA5U23I7N targets ruggedized signal processing in defense and avionics subsystems because the dual Cortex-A9 HPS runs secure boot, while the 85K-LE FPGA fabric handles encryption, packet processing, and radar or EW pre-processing. The industrial temperature range -40C to +100C and hot-swap support suit avionics bays and shipboard electronics. Although the SE variant lacks transceivers, external serializer/deserializer parts interface over LVDS through FPGA I/O. Long lifecycle commitments from the Cyclone V generation and Intel's continued silicon supply make this part suitable for multi-year defense programs.
おすすめ
Smart Energy and Grid Edge
The 5CSEBA5U23I7N fits grid-edge intelligent electronic devices because the dual Cortex-A9 HPS runs secure communication stacks (DLMS/COSEM, IEC 61850) while the FPGA fabric executes high-speed sampling for power-quality monitoring and protective relays. The 85K LEs accommodate multi-channel 16-bit sigma-delta decimation chains. Hot-swap support simplifies live maintenance of grid-edge cabinets, and the industrial temperature range meets outdoor substation requirements. Integrated EMAC and USB streamline connection to distribution automation networks.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 5CSEBA5U23I7N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 5CSEBA5U23I7LN | 5CSEBA5U23I7 | 5CSEBA5U23C8N | 5CSEBA5U23C7N | 5CSEBA4U23I7N | 5CSEBA2U23I7N |
|---|---|---|---|---|---|---|---|
| Package | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 85,000 | 85,000 | 85,000 | 85,000 | 85,000 | 40,000 | 25,000 |
| HPS Cores | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | -7 | -8 | -7 | -8 | -7 | -7 | -7 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Hot Swap Support | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
主な差別化要因
- Highest logic element count within the 5CSEBA5 UBGFA-672 family （vs 5CSEBA2U23I7N)
- Industrial temperature grade with hot-swap support （vs 5CSEBA5U23C7N)
- Faster speed grade than -8 alternatives （vs 5CSEBA5U23C8N)
- Same-package upgrade path to higher logic capacity （vs 5CSEBA4U23I7N)
設計ノート
The 672-ball UBGFA package requires a multi-layer PCB with laser-drilled microvias for the inner-row balls. Use Intel's provided UBGFA-672 symbol and footprint directly from the Quartus installation - never derive the footprint from a generic BGA library, as the ball pitch and ball-matrix dimensions vary between Cyclone V packages. Estimated: the UBGFA-672 (23x23 mm) at the package code used here is typically 0.5 mm pitch; verify in the device handbook pin-information file before finalizing the carrier PCB stackup.
Cyclone V SoC devices require multiple sequenced rails: VCC (1.1 V core), VCCPD, VCCIO banks, HPS_VCC, and DDRx_VTT. The HPS and FPGA rails must satisfy the bring-up order described in the Cyclone V SoC power management user guide - failure to sequence correctly can prevent the Cortex-A9 cores from booting. Reference Intel's power-tree reference designs for the typical sequencing controller (e.g., LTC or TI PMIC) recommended for each Cyclone V speed grade.
At -7 speed grade and full FPGA+HPS utilization, the 5CSEBA5U23I7N can dissipate 3-5 W depending on toggle rate and I/O loading. Industrial enclosures should mount the device with a thermal pad or heat spreader to the chassis wall; the UBGFA-672 package does not have an integrated heat spreader lid, so cooling depends entirely on PCB copper and external heat-sinking. Estimated: a 4-layer PCB with continuous inner ground plane typically yields theta-JA of approximately 15-20 C/W for UBGFA-672; verify with the package thermal model file in the Cyclone V device handbook.
Do not bypass the configuration-mode jumper for the MSEL pins - incorrect MSEL settings prevent the FPGA fabric from loading from the chosen boot source (e.g., SD card, QSPI flash, JTAG). Always check the Cyclone V configuration user guide for the resistor pull values on MSEL[3:0]. A common mistake is leaving the HPS boot source defined in the preloader image inconsistent with the FPGA configuration mode - this causes the HPS to boot Linux before the fabric is ready, hanging the application.
Route the HPS-to-FPGA AXI bridges on inner striplines with matched length within each byte lane. The HPS DDR3 controller has stringent skew requirements - route byte lanes with <50 mil skew and maintain a clean reference plane. Place the HPS reset and JTAG pins on a dedicated header or test point cluster to simplify debug, since recovering a misconfigured boot sequence typically requires JTAG access.
コンプライアンス情報
RoHS compliant per distributor listings. Not AEC-Q100 qualified - this is an FPGA, not an automotive-grade IC; AEC-Q100 is not applicable to programmable logic. Halogen-free status not stated in available data; consult Intel RoHS declaration letter for confirmation.