5CSEBA5U23I7LN - Cyclone V SE SoC FPGA, 85K LE, 925MHz | Intel
MPN: 5CSEBA5U23I7LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $397.5 | $3,975.00 |
| 100 | $372.25 | $37,225.00 |
| 500 | $348 | $174,000.00 |
| 1,000 | $325 | $325,000.00 |
5CSEBA5U23I7LN Overview
A System-on-Chip FPGA combines a hard processor subsystem (HPS) with programmable logic (PL) on a single silicon die. The HPS section (dual ARM Cortex-A9 MPCore with NEON, single/double-precision FPU, 32 KB I-cache and D-cache per core, 512 KB shared L2, CoreSight debug) executes an OS such as Linux or RTOS, while the PL section handles custom datapath, DSP, memory interface, and high-speed I/O. This heterogeneous architecture bridges traditional MCUs (software-defined, fixed peripherals) and standalone FPGAs (parallel, but software overhead) for low-BOM-cost designs.
Key features include: up to 85K logic elements, 4,450 Kbits embedded memory, 87 DSP blocks (18x18 multipliers), 288 configurable LVDS/SE I/Os (3.3V LVCMOS/LVTTL tolerant), 6 phase-locked loops, 12.5 Gbps total transceiver bandwidth (Cyclone V SE supports up to 6 transceivers up to 3.125 Gbps each), 1 Gb Ethernet MAC, USB 2.0 OTG, two CAN controllers, and dual DDR3/DDR3L/DDR2/LPDDR2 hard memory controllers in the HPS.
Architecturally, the 5CSEBA5U23I7LN exposes five 3.3V I/O banks plus dedicated clock, PLL, configuration, and JTAG pins on the 672-UBGA. The HPS exposes its own peripherals (EMAC, USB, SD/MMC, NAND/NOR flash controllers) through dedicated MIO/HSMC routing. Power sequencing requires a strict 0.9V core -> 1.1V/1.2V/1.5V/1.8V/2.5V/3.3V I/O -> 1.5V/1.8V/3.3V RGMII -> 1.5V DDR3 ramp order, all monitored by a Power Management Bus (PMBus) controller.
Typical applications: industrial motor control, machine vision, factory automation, multi-axis servo drives, portable medical imaging, broadcast video processing, and small-cell baseband. The integrated HPS eliminates the need for a companion processor, reducing board area, BOM cost, and latency between CPU and FPGA datapath.
When designing with this device, provision for the 1.0V core, 1.5V DDR3, and 3.3V I/O rails using low-noise LDO or DC-DC converters; budget the 8-layer PCB stack-up for 100 ohm differential routing on GTX transceivers; and verify Quartus Prime device support before software bring-up. The 'L' suffix denotes a lower-power HPS tier; the 'N' suffix denotes lead-free reflow.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the bare manufacturer datasheet.
Drop-in alternatives for 5CSEBA5U23I7LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 5CSEBA5U23I7LN (same form factor and footprint) — differing in Package, Logic Elements, Operating Temperature, Embedded Memory, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA5U23I7N
✅ Drop-In✓ In Stock
$132.1 / Unit
View Datasheet →5CSEBA5U23I7SN
✅ Drop-In✓ In Stock
$310 / Unit
View Datasheet →5CSEBA5U23I7
✅ Drop-In✓ In Stock
$145.5 / Unit
View Datasheet →5CSEBA4U23I7N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →5CSXFC5C6U23I7N
✅ Drop-In✓ In Stock
$210 / Unit
View Datasheet →5CSEBA2U23I7N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$124 / Unit
View Datasheet →5CSEBA5U23I7LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE |
| Device Variant | 5CSEA5 |
| Logic Elements | 85K |
| Embedded Memory | 4,450 Kbits |
| DSP Blocks (18x18 multipliers) | 87 |
| Maximum User I/O Pins | 288 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 925 MHz |
| Number of PLLs | 6 |
| Transceivers | Up to 6 (up to 3.125 Gbps each) |
| Package | 672-pin UBGAs (23x23 mm) |
| Operating Temperature | -40C to +100C (industrial, TJ) |
| Speed Grade | -7 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (N suffix = lead-free reflow) |
5CSEBA5U23I7LN 672-pin ubgas (23x23 mm) Pin Configuration Guide
Pin configuration for 5CSEBA5U23I7LN (672-pin ubgas (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA5U23I7LN.
Refer to the datasheet for full pin configuration.
Typical Applications
5CSEBA5U23I7LN is suitable for 8 applications: Industrial Motor Control and Servo Drives, Machine Vision and Industrial Cameras, Factory Automation and PLC Controllers, Portable Medical Imaging and Diagnostics, Broadcast Video Processing and Conversion, Small-Cell Baseband Processing, Software-Defined Radio (SDR) Platforms, Automotive Driver Assistance (ADAS) Prototyping.
Industrial Motor Control and Servo Drives
The 5CSEBA5U23I7LN is well-suited for multi-axis industrial servo drives and BLDC/PMSM motor control. Its dual ARM Cortex-A9 HPS at 925 MHz runs a Linux/RTOS control loop and EtherCAT master (via HPS Ethernet MAC), while the 87 DSP blocks execute field-oriented control (FOC), SVPWM, and current-loop math at sub-microsecond latency. The 85K logic elements and 288 user I/Os absorb encoder interfaces (EnDat, BISS, SSI), GPIO for gate-driver control, and high-speed PWM generators. Industrial -40C to +100C junction temperature supports cabinet and machine-mount deployments without derating.
Recommended
Machine Vision and Industrial Cameras
For machine-vision pipelines, the 5CSEBA5U23I7LN integrates image acquisition (MIPI CSI-2 via soft controllers, parallel CMOS sensor via FPGA I/O) and processing on a single chip. The HPS runs OpenCV/halcon pre-processing and communicates over GigE Vision, while the FPGA fabric executes Bayer demosaic, white-balance, and feature-extraction at line rate. The 4,450 Kbits of embedded memory buffer full-HD lines, and 87 DSP blocks accelerate Sobel/Canny edge detection. PoE+ power and the small 23x23 mm UBGAs footprint suit compact industrial IP67 housings.
Recommended
Factory Automation and PLC Controllers
As an integrated PLC controller, the 5CSEBA5U23I7LN combines IEC 61131-3 soft-PLC execution on the dual Cortex-A9 HPS with FPGA-accelerated I/O scanning, high-speed counters, and PWM/SERCOS interfaces. The HPS Ethernet MAC supports PROFINET, EtherNet/IP, or Modbus TCP stacks, while the FPGA fabric handles the deterministic sub-100-microsecond I/O update. Industrial temperature range and the RoHS-compliant UBGAs package suit DIN-rail mounted control cabinets in factory automation systems.
Recommended
Portable Medical Imaging and Diagnostics
In portable ultrasound, endoscopy, or patient-monitoring equipment, the 5CSEBA5U23I7LN delivers 85K logic elements for beamforming and DSP pipelines (B-mode, color Doppler) plus the ARM Cortex-A9 HPS for user interface, image storage, and DICOM networking. Its low-power HPS tier and small 23x23 mm UBGAs footprint suit battery-powered handheld form factors. The 87 DSP blocks accelerate FFT and FIR filtering, while industrial temperature range supports continuous-operation medical equipment deployments.
Recommended
Broadcast Video Processing and Conversion
The 5CSEBA5U23I7LN handles broadcast video format conversion (SDI/HDMI/DisplayPort to/from IP) at up to 1080p60. The HPS runs a Linux-based video-over-IP stack (SMPTE 2022, NDI), while the FPGA fabric performs scaling, color-space conversion, and audio embedding. Its 288 user I/Os accept multiple video input streams, and 4,450 Kbits of embedded memory buffer frame rate conversion. The 925 MHz HPS tier ensures smooth transcoding and stream multiplexing in studio and outside-broadcast deployments.
Recommended
Small-Cell Baseband Processing
For 4G LTE small-cell and 5G sub-6 GHz base stations, the 5CSEBA5U23I7LN integrates the L1/L2 baseband on the FPGA fabric (CPRI/JESD204B fronthaul, FFT/iFFT, channel coding) and the L3 stack on the HPS. Six transceivers support CPRI up to 3.125 Gbps or JESD204B Class 2 to RFICs, while the 288 user I/Os handle timing and sync interfaces. The 925 MHz HPS runs the eNodeB stack with minimal latency, and industrial temperature rating fits outdoor small-cell enclosures.
Recommended
Software-Defined Radio (SDR) Platforms
The 5CSEBA5U23I7LN serves as the heart of mid-tier SDR platforms for spectrum monitoring, public-safety radio, and tactical communications. The FPGA fabric implements DDC/DUC, channelization, and digital filtering, while the dual ARM Cortex-A9 HPS runs GNU Radio, signal classification, and network interfaces. Six 3.125 Gbps transceivers interface directly to ADC/DAC daughter cards (FMC connector), and industrial temperature rating supports harsh field deployments.
Recommended
Automotive Driver Assistance (ADAS) Prototyping
Although not AEC-Q100 qualified, the 5CSEBA5U23I7LN is widely used in ADAS pre-production prototyping for sensor fusion (camera + radar + lidar). The 87 DSP blocks accelerate point-cloud processing and convolutional neural network inference (with FPGA IP), while the 925 MHz HPS hosts ROS2 and sensor-fusion middleware. The 288 user I/Os aggregate multiple automotive Ethernet and CAN-FD streams. For production-grade automotive, evaluate the AEC-Q100 variants from competing families.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA5U23I7LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA5U23I7N | 5CSEBA5U23I7SN | 5CSEBA5U23I7 | 5CSXFC5C6U23I7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGAs (23x23 mm) | 672-UBGAs (23x23 mm) | 672-UBGAs (23x23 mm) | 672-UBGAs (23x23 mm) | 672-UBGAs (23x23 mm) |
| Logic Elements | 85K | 85K | 85K | 85K | 110K |
| HPS Maximum Frequency | 925 MHz | 800 MHz | 800 MHz | 925 MHz | 925 MHz |
| Embedded Memory | 4,450 Kbits | 4,450 Kbits | 4,450 Kbits | 4,450 Kbits | 5,570 Kbits |
| DSP Blocks (18x18) | 87 | 87 | 87 | 87 | 112 |
| Transceivers | Up to 6 (3.125 Gbps) | Up to 6 (3.125 Gbps) | Up to 6 (3.125 Gbps) | Up to 6 (3.125 Gbps) | Up to 6 (3.125 Gbps) - SX tier |
| Speed Grade | -7 | -7 | -7 | -7 | -7 |
| Temperature Range | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
Key Differentiators
- 925 MHz HPS bin (vs 800 MHz on I7N variant) (vs 5CSEBA5U23I7N)
- Same 672-UBGAs 23x23 mm footprint across Cyclone V SE family (vs 5CSEBA4U23I7N)
- Lower power than Cyclone V SX alternatives (vs 5CSXFC5C6U23I7N)
Design Notes
Estimated: at typical industrial motor-control utilization (~60% LE, ~50% DSP, HPS active), the 5CSEBA5U23I7LN consumes 2-5 W. Use Intel PowerPlay Early Power Estimator with your resource profile for design-specific accuracy. The device requires a 0.9V core rail (VCC), 1.1V/1.2V/1.5V/1.8V/2.5V/3.3V I/O rails (VCCIO), and 1.5V DDR3 rail (VCC_DDR). Sequence the 0.9V core first, then VCCIO, then VCC_DDR, using a PMBus-compliant controller such as the LTC2977. Decoupling: 0.1 uF X7R per power pin plus 47 uF bulk caps on each rail. Severity: critical.
Use an 8-layer PCB stack-up with dedicated GND and PWR planes. The 672-UBGAs at 23x23 mm has 1.0 mm pitch; route all signals on inner layers with microvia-in-pad for high-density breakouts. Maintain 100 ohm differential impedance for the 6 transceivers (3.125 Gbps). Route DDR3 to the HPS section with matched lengths (+/- 25 mil) on address/command and +/- 10 mil on data/byte lanes. Severity: critical.
Do not confuse the L-suffix (925 MHz HPS bin) with the standard I7N variant (800 MHz) - the silicon is the same but binned for higher HPS clock. The N suffix denotes lead-free reflow (mandatory for RoHS). Use Quartus Prime v18.1 or later for full Cyclone V SE support; older versions do not recognize the 5CSEBA5U23 part number. Severity: critical.
Estimated: the 672-UBGAs package has a theta_JA of approximately 12 C/W with proper thermal via array under the central balls. At 5 W dissipation, junction temperature rise is approximately 60 C above ambient; at +85 C ambient, junction reaches +145 C, which is 45 C above the +100 C industrial limit. Use thermal vias (0.3 mm drill, 1.0 mm pitch) under the package and a 4-layer PCB with 1 oz copper on outer layers to keep theta_JA at 12 C/W. Severity: recommended.
Place decoupling capacitors within 100 mil of each power pin. Route all HPS DDR3 traces on the same layer with no vias or layer changes. Keep high-speed transceiver traces on dedicated inner layers with continuous reference planes. Use length-matching within +/- 5 mil for the 6 transceiver differential pairs (TX and RX). Severity: recommended.
Compliance Information
RoHS compliant per Altera/Intel product page (N suffix = lead-free reflow). Not AEC-Q100 qualified; for automotive applications use AEC-Q100 qualified alternatives from other families. Halogen-free per JEDEC JS709B.
