5CSEBA5U23I7 - Cyclone V SE SoC FPGA 85K LE Dual A9 | Intel
MPN: 5CSEBA5U23I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $213.97 | $213.97 |
| 10 | $192.57 | $1,925.70 |
| 100 | $171.17 | $17,117.00 |
| 500 | $156.2 | $78,100.00 |
| 1,000 | $145.5 | $145,500.00 |
Drop-in alternatives for 5CSEBA5U23I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA4U23I7N
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Contact for price
View Datasheet →5CSEBA5U23C8N
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$88.75 / Unit
View Datasheet →5CSEBA2U23I7N
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$124 / Unit
View Datasheet →5CSEBA5U19I7N
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$119.85 / Unit
View Datasheet →5CSEBA5U23I7 Maximum Ratings & Electrical Characteristics
| Product Type | SoC FPGA (HPS + FPGA) |
| Family | Cyclone V SE |
| Logic Elements | 85,000 |
| Hard Processor Subsystem | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| DSP Blocks | 87 (variable-precision) |
| Embedded Memory | Approx. 4,450 Kbits (M10K + M9K) |
| User I/O Count | 145 |
| Package | 672-pin UBGA (U23, 23x23 mm) |
| Process Technology | 28 nm low-power |
| Memory Interfaces (HPS) | DDR2 / DDR3 / LPDDR2 with ECC |
| HPS Peripherals | Gigabit Ethernet, USB 2.0, UART, SPI, I2C, NAND |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
5CSEBA5U23I7 672-pin ubga (u23, 23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA5U23I7 (672-pin ubga (u23, 23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA5U23I7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA5U23I7 is suitable for 6 applications: Industrial Motor Control and Drives, Machine Vision and Factory Automation, Broadcast and Professional Audio/Video Processing, Energy and Smart-Grid Embedded Systems, Medical Imaging Front-Ends, Automotive Driver-Assistance Prototyping.
Industrial Motor Control and Drives
The 5CSEBA5U23I7's dual-core ARM Cortex-A9 HPS running at 800 MHz executes motion-control algorithms and fieldbus communication such as EtherCAT or PROFINET, while the 85K logic elements and 87 variable-precision DSP blocks implement deterministic current loops, PWM generation, and encoder decoding in hardware. Industrial temperature grade (-40C to +100C) allows deployment on factory floors without derating. The HPS-side DDR3 controller with ECC supports high-bandwidth data logging and predictive maintenance analytics. Compared with a discrete MCU+FPGA solution, this single-chip SoC reduces board area and inter-chip latency, critical when closing sub-microsecond control loops on three-phase inverter stages.
Recommended
Machine Vision and Factory Automation
The 5CSEBA5U23I7 receives image sensor streams through its LVDS-capable GPIO and runs preprocessing such as color conversion, thresholding, and convolution on the FPGA fabric, offloading the dual A9 cores from bit-level work. The 4,450 Kbits of embedded memory buffer line-scan and area-scan frames for inspection of moving parts. A Linux stack on the HPS manages the GigE Vision or USB3 Vision protocol, publishes results over TCP/IP, and renders an HMI on a connected touchscreen. Industrial temperature range ensures reliability in unattended factory cells. The SoC integration reduces the bill of materials compared with separate processor and FPGA boards in vision systems.
Recommended
Broadcast and Professional Audio/Video Processing
The 85K logic elements and 87 DSP blocks of the 5CSEBA5U23I7 implement real-time video pipelines such as scaling, deinterlacing, and color-space conversion for broadcast routers and pro-AV switchers. The dual ARM Cortex-A9 cores run a Linux-based control plane for IP management (AVB, Dante, NMOS), while the FPGA fabric handles uncompressed SDI over LVDS and HDMI bridge logic. Industrial temperature operation supports OB vans and broadcast equipment racks. DDR3 with ECC on the HPS side buffers compressed streams. Quartus Prime reference designs for SDI and HDMI simplify time-to-market for broadcast OEMs upgrading from legacy FPGAs.
Recommended
Energy and Smart-Grid Embedded Systems
The 5CSEBA5U23I7 is well suited to smart-grid infrastructure such as substation controllers, power-quality analyzers, and renewable-energy inverters where the dual ARM Cortex-A9 cores run IEC 61850 or DNP3 protocol stacks with security libraries. The FPGA fabric accelerates phasor measurement, harmonic analysis, and anti-aliasing filters for high-voltage sensors. Industrial temperature operation tolerates outdoor enclosures and switchgear cabinets. HPS DDR3 with ECC protects against soft errors in radiation-exposed substations. The integrated design replaces multi-board solutions, reducing points of failure in unattended grid assets.
Recommended
Medical Imaging Front-Ends
The 5CSEBA5U23I7 supports portable ultrasound, endoscopy, and point-of-care imaging devices by combining the 85K logic elements for beamforming and front-end DSP with the dual Cortex-A9 cores for image reconstruction and DICOM networking. The industrial temperature range suits operating-room carts and ambulances. DDR3 with ECC on the HPS preserves image-data integrity against radiation from imaging sources. Low-power 28nm process reduces thermal load in handheld probes. Linux on the HPS accelerates compliance with FDA pre-market submission requirements through a stable software base.
Recommended
Automotive Driver-Assistance Prototyping
The 5CSEBA5U23I7 enables prototyping of advanced driver-assistance systems (ADAS) such as surround-view, lane-departure warning, and sensor-fusion ECUs by running AUTOSAR or Linux on the dual A9 cores while the FPGA fabric processes camera and radar data streams. Industrial temperature operation covers cabin installations even though the part is not AEC-Q100 qualified. The 672-pin UBGA package provides enough I/O for multi-camera MIPI-CSI bridging. Designers can use the Cyclone V SoC development kit to validate algorithms before migrating to AEC-Q100-qualified Cyclone V or Arria V SoCs in production.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA5U23I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA4U23I7N | 5CSEBA5U23C8N | 5CSEBA2U23I7N | 5CSEBA5U19I7N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-pin UBGA (U23, 23x23 mm) | 672-pin UBGA (U23, 23x23 mm) - same | 672-pin UBGA (U23, 23x23 mm) - same | 672-pin UBGA (U23, 23x23 mm) - same | 484-pin UBGA (U19, 19x19 mm) - smaller |
| Logic Elements | 85,000 | ~40,000 | 85,000 | ~25,000 | 85,000 |
| HPS Cores | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz |
| DSP Blocks | 87 | ~66 | 87 | ~38 | 87 |
| Embedded Memory | Approx. 4,450 Kbits | ~2,700 Kbits | Approx. 4,450 Kbits | ~1,400 Kbits | Approx. 4,450 Kbits |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| User I/O | 145 | 145 | 145 | 145 | ~75 |
Key Differentiators
- Pin-compatible density scaling within the SE family (vs 5CSEBA4U23I7N)
- Industrial temperature grade with same die (vs 5CSEBA5U23C8N)
- Maximum logic density in the 672-pin U23 package (vs 5CSEBA2U23I7N)
Design Notes
The Cyclone V SE SoC requires multiple independent power rails: a 1.1V core supply for the HPS, a 1.1V core supply for the FPGA fabric, separate PLL analog supplies, and various I/O bank voltages (1.2V, 1.5V, 1.8V, 2.5V, 3.3V). Power-on sequencing is mandatory per the Cyclone V handbook: the FPGA fabric core must reach 1.1V before HPS core power is applied. Use a dedicated power manager such as the Intel EN6347 or a discrete MOSFET sequencing circuit. Estimated: sequencing from five rails typically requires 50-100 ms for the FPGA fabric to come up, after which HPS is released and the preloader/U-boot initializes SDRAM. Failure to sequence correctly can latch-up or damage the part.
The 672-pin UBGA at 23x23 mm uses a fine BGA pitch that requires microvia PCB technology (laser-drilled stacked vias) and HDI stack-up. According to Intel Cyclone V hardware design guidelines, every BGA ball should have a via-in-pad or dog-bone escape to inner layers, with the top layer reserved primarily for routing away from the device. Maintain a continuous ground plane directly beneath the BGA and use stitching vias every 2-3 mm around the periphery to suppress EMI. DDR3 trace length matching is critical for the HPS controller - target within 25 mils of the lengths provided in the Cyclone V pin-out file for the byte lanes.
A common pitfall when designing with the 5CSEBA5U23I7 is configuring HPS pin multiplexing in software while leaving the FPGA-fabric pins conflicting in the Pin Planner - Quartus Prime's pin-planner validation step catches this before compile, but skipping it leads to non-functional HPS peripherals on the bench. Another common error is using the wrong Quartus Prime device support file for the specific speed grade; the -I7 speed grade is industrial-temperature and requires the matching 'speed grade' selection during compilation. Estimated: approximately 30% of first-time Cyclone V SoC boards require an additional revision for HPS pin-mux or speed-grade mismatches. Always run 'quartus_pgm --verify' on the final SOF/JIC before declaring bring-up complete.
Compliance Information
RoHS compliant per Intel/Altera product page. Industrial temperature grade (-40C to +100C) but not AEC-Q100 qualified - not directly automotive qualified for under-hood use. Cross-brand automotive AEC-Q100 SoC FPGAs (e.g., Xilinx Zynq-7000 automotive variants) are not pin-compatible.
