5CGXBC9E7F35C8N - Cyclone V GX FPGA, 301K LE, 1152-BGA | Intel
部品番号: 5CGXBC9E7F35C8N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $640.74 | $640.74 |
| 10 | $615.5 | $6,155.00 |
| 25 | $595.2 | $14,880.00 |
| 50 | $575.8 | $28,790.00 |
| 100 | $555.1 | $55,510.00 |
5CGXBC9E7F35C8N 概要
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that can be reconfigured after manufacturing to implement custom digital circuits. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital integrated circuits -> semiconductors, offering parallel processing and flexible I/O that microcontrollers and ASICs cannot match at low-to-mid volumes.
Key features of the 5CGXBC9E7F35C8N include 9 full-duplex transceivers supporting CPRI, PCIe Gen1, and Gigabit Ethernet protocols, variable-precision DSP blocks for high-performance fixed- and floating-point arithmetic, and hard memory controllers supporting DDR3, DDR2, and LPDDR2 interfaces. The 'C8N' speed grade indicates an 8 ns commercial 0.85V core voltage; the 'N' suffix indicates lead-free / Pb-free termination.
The Cyclone V GX architecture combines an FPGA fabric with hardened PCIe Gen1/Gen2 and transceiver IP, providing lower power and lower BOM cost versus soft-IP implementations. The 1152-BGA package provides ample signal escape for high-pin-count designs while supporting industrial-grade thermal envelopes.
Typical applications include industrial machine vision and video processing, motor control and industrial automation, broadcast video and Pro-AV equipment, wireless backhaul and small-cell baseband, and PCIe Gen2 endpoint cards for industrial computing.
When designing with this FPGA, ensure the Quartus Prime toolchain version matches the silicon revision; pay attention to transceiver reference clock jitter and PCB-controlled-impedance routing for 3.125 Gbps SERDES channels.
This page synthesizes distributor pricing, drop-in alternatives from the Cyclone V family, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: 5CGXBC9E7F35C8N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 5CGXBC9E7F35C8N （同一形状・フットプリント） — 相違点: Package, Family, Logic Elements, Core Voltage, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
5CGXBC9E7F35C7N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
5CGXBC9E7F35C6N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
5CGXBC9E7F35I8N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
5CGXBC9E7F35A7N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
5CGXBC9E6F35C8N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
5CGXBC9E7F35C8N 最大定格＆電気的特性
| Family | Cyclone V GX |
| Logic Elements | 301,000 |
| Embedded Memory | 14,251,008 bits |
| Maximum User I/O | 560 |
| Transceivers | 9 full-duplex channels |
| Transceiver Data Rate | 3.125 Gbps |
| DSP Blocks | Variable-precision, hardware multiplier |
| Process Technology | 28 nm low-power |
| Core Voltage | 0.85 V (C8 speed grade) |
| Speed Grade | 8 (C8N) |
| パッケージ | 1152-ball FBGA (FineLine BGA) |
| Hard Memory Controller | DDR3, DDR2, LPDDR2 |
| Hard PCIe | PCIe Gen1/Gen2 x1/x2/x4 |
| 動作温度 | 0C to +85C (commercial) |
| Lead-Free / Pb-Free | Yes (N suffix) |
| RoHS ステータス | Compliant |
5CGXBC9E7F35C8N 1152-ball fbga (fineline bga) ピン配置ガイド
5CGXBC9E7F35C8N (1152-ball fbga (fineline bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 5CGXBC9E7F35C8N.
詳細は データシート をご参照ください。
主な用途
5CGXBC9E7F35C8N の用途: 6 件s: Industrial Machine Vision Systems, Broadcast Video Processing and Pro-AV, Industrial Motor Control and Drives, Wireless Backhaul and Small-Cell Baseband, PCIe Endpoint Add-In Cards, Medical Imaging and Diagnostics.
Industrial Machine Vision Systems
The 5CGXBC9E7F35C8N fits industrial machine vision because its 301K logic elements, 14 Mb embedded memory, and 9 transceivers handle multiple GigE Vision, Camera Link, or CoaXPress camera streams simultaneously. The variable-precision DSP blocks accelerate Bayer demosaicing, color-space conversion, and convolution filters without offloading to external processors. Its hardened PCIe Gen2 endpoint simplifies host-side frame capture over PCIe x4 to a CPU, while the 28 nm low-power process keeps board thermal design within factory-enclosure budgets. Compared to a Cyclone V E device, the GX variant's transceivers reduce external PHY BOM cost and design complexity for multi-camera aggregation setups.
おすすめ
Broadcast Video Processing and Pro-AV
For broadcast video routing, multiviewers, and Pro-AV signal processors, the 5CGXBC9E7F35C8N provides the SERDES bandwidth to ingest 3G-SDI or HDMI-over-SDI streams while performing real-time scaling and color correction in fabric. The 3.125 Gbps transceivers support SMPTE 424M and emerging 6G/12G UHD-SDI standards via external cable equalizers. The 560 user I/O enables direct connection to multiple parallel video buses, HDMI/TMDS interfaces, and LCD panels. With PCIe x4 Gen2, the FPGA can act as a video capture card or live mixer DSP engine in broadcast studio infrastructure.
おすすめ
Industrial Motor Control and Drives
The 5CGXBC9E7F35C8N is well matched to multi-axis industrial servo drives and variable-frequency drives (VFDs). Its variable-precision DSP blocks implement field-oriented control (FOC), space-vector PWM, and encoder decoding for up to 8 axes from a single device. Hardened PCIe and Ethernet interfaces enable EtherCAT, PROFINET, or EtherNet/IP master/slave communication. The 28 nm process node and 0.85 V core voltage keep power dissipation low even at full logic utilization, which is critical in sealed drive enclosures. The 560 I/O allows direct connection to multi-axis current-sensing ADCs and gate-driver PWM outputs.
おすすめ
Wireless Backhaul and Small-Cell Baseband
In small-cell base stations and wireless backhaul modems, the 5CGXBC9E7F35C8N handles CPRI and OBSAI fronthaul via its 9 transceivers at 3.125 Gbps, supporting up to 9 antenna-carrier sectors in a single FPGA. The 14 Mb embedded memory buffers baseband samples between PHY and modem DSP, and the variable-precision DSP blocks implement FFT/iFFT, channel estimation, and pre-coding for LTE/5G NR PHY layers. The hardened PCIe Gen2 enables direct host connectivity to a baseband SoC. Compared to ASIC implementations, the Cyclone V GX allows rapid protocol upgrades across LTE, 5G NR, and Wi-Fi 6E in a single platform.
おすすめ
PCIe Endpoint Add-In Cards
The 5CGXBC9E7F35C8N is ideal for industrial PCIe Gen2 x4 endpoint cards used in test equipment, data acquisition, and protocol analyzer products. Its hard PCIe Gen2 IP block delivers deterministic latency with minimal logic overhead, freeing the FPGA fabric for application-specific DSP, buffering, or protocol-conversion logic. The 560 I/O and 9 transceivers expose multiple high-speed serial interfaces to the host backplane, while the 14 Mb embedded memory supports high-bandwidth streaming DMA. Commercial-temperature pricing is competitive against full custom ASICs at low-volume production runs.
おすすめ
Medical Imaging and Diagnostics
In medical imaging modalities such as ultrasound, endoscopy, and X-ray detectors, the 5CGXBC9E7F35C8N provides the parallel processing density to manage multi-channel analog front-end digitization and beamforming in real time. Its variable-precision DSP blocks accelerate finite-impulse-response (FIR) filters, image reconstruction, and Doppler processing at ultrasound frame rates. The transceivers aggregate data from probe-head ADCs over LVDS or serial LVDS at low latency, while the hard memory controller drives DDR3 buffers for raw frame storage. Industrial-grade variants (5CGXBC9E7F35I8N) extend operating range to -40C for portable imaging carts.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 5CGXBC9E7F35C8N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 5CGXBC9E7F35C7N | 5CGXBC9E7F35C6N | 5CGXBC9E7F35I8N | 5CGXBC9E7F35A7N | 5CGXBC9E6F35C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (F35) | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same |
| Logic Elements | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits |
| Speed Grade | C8 (8 ns) | C7 (7 ns) - faster | C6 (6 ns) - faster | I8 industrial, 8 ns | A7 automotive, 7 ns | C8, 6G transceiver |
| Transceivers | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 2.5 Gbps (6G) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | -40C to +125C (automotive) | 0C to +85C |
| Hard PCIe Gen2 IP | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) |
主な差別化要因
- Highest-density Cyclone V GX with 301K LE （vs 5CGXBC9D7F27C8N)
- Hardened PCIe Gen2 IP block included （vs 5CEFA9F27C7N)
- 9 integrated 3.125 Gbps transceivers （vs 5CEFA9F23I7N)
設計ノート
The 5CGXBC9E7F35C8N requires multiple power rails: 0.85 V core (VCC), 1.1 V auxiliary (VCCAUX), 1.5 V/1.8 V/2.5 V/3.0 V I/O banks (VCCIO), and 1.1 V transceiver analog (VCCT_GXB). Use the Intel Cyclone V PowerPlay Early Power Estimator (EPE) spreadsheet before schematic capture to size regulator current capacity. Recommended power sequencing: VCC first, then VCCAUX, then VCCIO, with monotonic ramp-up to prevent latch-up. Decouple each rail with a 100 nF X7R plus 10 uF bulk ceramic near each power pin pair; add 47 uF bulk tantalum at each voltage regulator output.
The 1152-FBGA package requires an 8-layer PCB minimum with stacked micro-via (laser-drilled) or stacked micro-via + buried-via stack-up to escape the 35 mm x 35 mm BGA. Reference the Cyclone V F35 package PCB layout guidelines for via-pad antipad dimensions. Match 100-ohm differential impedance on all 9 GXB transceiver channels and 90-ohm single-ended for LVDS I/O. Maintain at least 4 mm of continuous reference ground plane under the BGA; route high-speed SERDES over solid GND plane, never split planes. Use 0201 or 0402 decoupling on the BGA bottom side for shortest return-current loops.
Estimated: For the 9 full-duplex 3.125 Gbps transceivers, route each TX/RX pair as length-matched differential pairs within 0.13 mm (5 mil) of target length. Place the transceiver reference clock source (LVDS or LVPECL) within 25 mm of the CLK pins, with matched-length traces to within 0.05 mm. Use Intel's Cyclone V transceiver toolkit to simulate channel loss with your chosen PCB stack-up before tape-out; aim for less than 8 dB insertion loss at 1.5 GHz for reliable 3.125 Gbps link-up across all temperature corners.
Do not confuse Cyclone V GX (this part) with Cyclone V E (no transceivers) or Cyclone V GT (6G/10G transceivers) at order entry. Although they share the same F35 package outline for some densities, the ball-out and pin functions differ at many pins. Confirm the F35 ordering code in the Intel ordering information file (OIF) before PCB fabrication. The 'N' suffix denotes lead-free finish; 'N' is mandatory for RoHS compliance. Do not mix JTAG chain ID assignments when using multiple FPGAs in a scan chain - configure MSEL pins for the desired JTAG mode.
コンプライアンス情報
RoHS and REACH compliance per Intel product declaration. Lead-free finish confirmed by N suffix in part number. AEC-Q100 qualification requires the A-suffix automotive variant; the 5CGXBC9E7F35C8N is commercial grade. Conflict minerals reporting compliant per Intel policy.
