A3PE600-1FG484 - ProASIC3E FPGA 600K Gates 484-BGA | Microchip
MPN: A3PE600-1FG484 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $63.2 | $632.00 |
| 100 | $57.9 | $5,790.00 |
| 500 | $52.4 | $26,200.00 |
| 1,000 | $48.1 | $48,100.00 |
Drop-in alternatives for A3PE600-1FG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE600-FG484
✅ Drop-In✓ In Stock
$59 / Unit
View Datasheet →A3PE600-FG484I
✅ Drop-In✓ In Stock
$86.1 / Unit
View Datasheet →A3PE600-FGG484
✅ Drop-In✓ In Stock
$53.7 / Unit
View Datasheet →A3PE600-FGG484I
✅ Drop-In✓ In Stock
$44.03 / Unit
View Datasheet →A3PE600-1FGG484
✅ Drop-In✓ In Stock
$44.9 / Unit
View Datasheet →A3PE600-1FG484I
✅ Drop-In✓ In Stock
$48.6 / Unit
View Datasheet →A3PE600L-FGG484M
✅ Drop-In✓ In Stock
$79.9 / Unit
View Datasheet →A3PE600-1FG484 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E (flash FPGA) |
| System Gates | 600,000 |
| Logic Elements | 7,000 (approx. LE) |
| Total RAM Bits | 110,592 |
| User I/O | 270 |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Technology | 130 nm flash CMOS |
| Speed Grade | -1 (standard) |
| Maximum Frequency | 231 MHz to 272 MHz (family range) |
| Operating Temperature | 0C to +85C (TJ) |
| Package | 484-FBGA (23 x 23 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Configuration | On-chip flash, instant-on, single chip |
| Soft CPU Support | ARM Cortex-M1 (soft core) |
| Packaging | Tray |
| RoHS Status | Non-compliant |
| Manufacturer Lead Time | 8 weeks |
A3PE600-1FG484 484-fbga (23 x 23 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for A3PE600-1FG484 (484-fbga (23 x 23 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE600-1FG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE600-1FG484 is suitable for 6 applications: Industrial Automation Controllers, Communications Line Cards and Bridge Logic, Aerospace and Defense Secure Systems, Medical Instrument Control, Test and Measurement Equipment, IoT Gateways and Edge Processing.
Industrial Automation Controllers
The A3PE600-1FG484 fits industrial automation controllers that need deterministic, instantly-available logic at power-up. Its flash fabric is live within microseconds, eliminating the external configuration PROM and boot delay required by SRAM FPGAs, which matters when I/O must be serviced immediately after a power event. The 600K-gate capacity with 270 user I/Os and 110,592 RAM bits absorbs typical PLC glue logic, encoder interfaces, fieldbus bridges, and safety interlock functions on one chip. Operating from a 1.5V core (1.425V-1.575V) with commercial 0C to +85C junction rating, it suits enclosed cabinet environments; use the -I industrial grade variant where ambient conditions exceed that range.
Recommended
Communications Line Cards and Bridge Logic
In telecom and datacom line cards, the A3PE600-1FG484 provides bridge logic between backplane buses, PHY devices, and system ASICs. The 270 user I/Os in the 484-FBGA (23x23 mm, 1 mm pitch) support wide parallel buses and multiple I/O bank voltages, while the 231-272 MHz-class fabric performance of the ProASIC3E family handles moderate-speed pipeline and framing functions. The 110,592-bit block RAM buffers packet payloads, and the -1 speed grade balances cost against timing at typical line-card frequencies. Because configuration is flash-based, line cards resume operation instantly after hot-swap power events, and the single-chip solution reduces BOM count compared to SRAM FPGA plus boot-flash alternatives.
Recommended
Aerospace and Defense Secure Systems
Defense and avionics designers choose the A3PE600-1FG484 for its inherent design security and instant-on behavior. Flash-based configuration cannot be read back like an SRAM bitstream, and the device powers up functional with no external configuration memory that could be probed or corrupted. The 600K-gate fabric with soft ARM Cortex-M1 support allows a processor plus custom interface logic to coexist on one secure chip, while 270 I/Os integrate legacy MIL-STD bus bridges and sensor interfaces. The non-RoHS (lead-bearing) build is acceptable in many defense contexts where RoHS exemptions apply; verify program requirements before selecting this over the green FGG484 variant.
Recommended
Medical Instrument Control
Medical diagnostic instruments benefit from the A3PE600-1FG484's combination of reprogrammability, single-chip integration, and instant-on operation. The 600K-gate capacity implements sensor timing generators, acquisition sequencers, and motor control interfaces, while the 110,592-bit embedded RAM provides buffering for sample streams. Flash configuration means the instrument is ready the moment power is applied - important for patient-throughput in clinical settings - and field firmware updates are performed through JTAG without changing hardware. Operating from a quiet 1.5V core within 1.425V-1.575V and 0C to +85C, it integrates cleanly into benchtop analyzers, imaging subsystems, and laboratory automation where deterministic startup is required.
Recommended
Test and Measurement Equipment
Bench instruments and automated test equipment use the A3PE600-1FG484 as a reprogrammable timing, trigger, and interface engine. The -1 speed grade fabric (family performance 231-272 MHz) generates measurement sequencers and clock-domain bridges, while 270 I/Os connect front-end ADCs, DACs, and display interfaces across multiple I/O banks. The 110,592-bit block RAM captures waveform segments, and flash configuration means the instrument boots to a ready state immediately - a visible user-experience advantage over SRAM FPGA designs. Since the fabric is fully reprogrammable in-system, one hardware platform serves multiple instrument SKUs, lowering total cost of ownership across product variants.
Recommended
IoT Gateways and Edge Processing
Edge gateways use the A3PE600-1FG484 as a protocol translation and sensor-aggregation device. Instant-on flash configuration keeps the gateway's I/O fabric alive through brownouts and power cycling, and the soft ARM Cortex-M1 core can run lightweight processing alongside deterministic interface logic in one chip. The 270 user I/Os accommodate multiple sensor buses, and the 484-FBGA's 23x23 mm footprint suits compact gateway hardware. For battery-backed or thermally constrained deployments, the low-power A3PE600L-FGG484M drop-in variant reduces static current on the same footprint, letting one PCB design serve both standard and low-power product tiers without redesign.
Recommended
Recommended Products Summary
Engineering reference data for A3PE600-1FG484 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE600-FG484 | A3PE600-FGG484 | A3PE600-1FGG484 | A3PE600L-FGG484M |
|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm) | 484-FBGA - same | 484-FBGA - same (green) | 484-FBGA - same (green) | 484-FBGA - same (green) |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| User I/O | 270 | 270 | 270 | 270 | 270 |
| Total RAM Bits | 110,592 | 110,592 | 110,592 | 110,592 | 110,592 |
| Speed Grade | -1 | standard (slower than -1) | standard | -1 | [DATA_NEEDED] |
| RoHS Status | Non-compliant | Non-compliant | Compliant (green) | Compliant (green) | Compliant (green) |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V (reduced static power) |
Key Differentiators
- Lowest-risk drop-in RoHS upgrade (vs A3PE600-FGG484)
- Same speed grade with industrial temperature (vs A3PE600-1FG484I)
- Lower static power option on same footprint (vs A3PE600L-FGG484M)
- Timing headroom trade-off vs slower baseline grade (vs A3PE600-FG484)
Design Notes
Design a dedicated 1.5V core rail held within 1.425V-1.575V under all load transients. Estimate core current from Libero power-analysis of your actual design rather than worst-case family tables; flash ProASIC3E devices draw low static current, but dynamic current scales with clock frequency and toggle rate. Sequence I/O bank supplies per the datasheet power-up requirements, and include bulk plus 0.1uF decoupling at each VCC/VCCI ball group. An estimated budget example: a 100 MHz design with moderate toggle rates typically lands well below the absolute maximum, but confirm with Microchip's power estimator before finalizing the regulator.
The 484-FBGA (23x23 mm, 1 mm pitch, 2.23 mm height) requires a controlled-impedance, at least 4-layer stackup for clean power delivery. Fan out with via-in-pad or dog-bone escapes; 1 mm pitch allows 0.5 mm trace/space routing on standard processes. Dedicate solid planes for core VCC and GND, and partition I/O banks so that each bank's VCCI rail is decoupled locally. Follow the Microchip ProASIC3E user's guide package routing guidelines and export the official ball map from Libero rather than relying on third-party pinout listings, since ball assignments include dedicated VPP/JTAG balls that must not be repurposed.
The A3PE600-1FG484 is RoHS non-compliant (lead-bearing balls) - it cannot be used in products covered by RoHS directives; select A3PE600-1FGG484 instead. Second, the -1 speed grade has less timing margin than -2 parts: run static timing analysis in Libero and avoid constraining fabric above roughly the 231 MHz class family limits for -1 grade. Third, unlike SRAM FPGAs there is no external bitstream, but VPP programming-supply requirements still apply during reprogramming - do not hard-wire VPP pins per SRAM-FPGA habits; consult the manufacturer datasheet for correct connections.
The 484-FBGA dissipates heat primarily through the ball array into the PCB. Estimated: a mid-utilization design on the 1.5V core typically dissipates well under 1 W, which a standard 4-layer board with solid planes handles without a heatsink given the device's 23x23 mm footprint. For high-utilization, high-frequency designs, verify junction temperature stays within the 0C to +85C (TJ) range using Microchip's thermal data, and consider thermal vias under the package. If ambient temperatures exceed commercial limits, drop in the pin-compatible A3PE600-1FG484I industrial variant instead of adding cooling.
Compliance Information
RoHS non-compliant (lead-bearing FBGA balls) per Microchip USA product data. For RoHS-mandated designs use the green A3PE600-1FGG484 variant. Not an automotive-qualified part.
