A3PE600-FG256I - 600K Gate Flash FPGA, 256-FBGA | Microchip
MPN: A3PE600-FG256I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $62.5 | $62.50 |
| 10 | $58.1 | $581.00 |
| 100 | $52.9 | $5,290.00 |
| 500 | $48.2 | $24,100.00 |
| 1,000 | $44.6 | $44,600.00 |
Drop-in alternatives for A3PE600-FG256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE600-FGG256I
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View Datasheet →A3PE600-2FGG256
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View Datasheet →A3P600-FG256I
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View Datasheet →A3PE600-FG256I Maximum Ratings & Electrical Characteristics
| Logic Gates | 600000 |
| D Flip-Flops (DFFs) | 13824 |
| CLBs / VersaTiles | 13824 |
| Number of User I/O | 165 |
| Maximum System Frequency | 350 MHz |
| Core Supply Voltage | 1.425 V to 1.575 V |
| Technology | 130 nm CMOS flash-based |
| Configuration Memory | Nonvolatile Flash (single-chip, live at power-up) |
| Operating Temperature | -40C to +100C (TJ), industrial |
| Package | 256-FBGA (LBGA), 17 x 17 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| RoHS Status | RoHS Non-Compliant (contains lead; FGG variant is green) |
| Lead Free Status | Contains Lead |
| Family | ProASIC3E |
| Speed Grade | Standard (-1) |
A3PE600-FG256I 256-fbga (lbga), 17 x 17 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for A3PE600-FG256I (256-fbga (lbga), 17 x 17 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE600-FG256I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE600-FG256I is suitable for 6 applications: Industrial Control and Automation, Aerospace and Defense Subsystems, Secure Bridge and Interface Logic, Communications Line Cards and Backplane Bridging, Medical Instrumentation, Test and Measurement Equipment.
Industrial Control and Automation
Factory automation and motor-control supervisory logic benefit directly from the A3PE600-FG256I's instant-on flash configuration: the FPGA is live within microseconds of power application, eliminating boot-delay hazards in interlock and safety-adjacent logic. With 13,824 D flip-flops and 165 user I/O, a single device can consolidate PLC glue logic, encoder interfaces, and parallel bus bridging, while the -40C to +100C industrial temperature range covers unconditioned cabinet environments. The 1.425V-1.575V core keeps dynamic power low relative to SRAM FPGAs of similar density, easing thermal design in sealed enclosures. Place the device near the I/O connector field and provide solid bank decoupling; use the industrial -I grade, not the commercial variant, for field equipment.
Recommended
Aerospace and Defense Subsystems
Flash-based ProASIC3E fabric offers inherently high immunity to configuration upset, a decisive advantage over SRAM FPGAs in avionics, satellite payload logic, and defense platforms where single-event configuration errors are unacceptable. The A3PE600-FG256I stores its bitstream in nonvolatile flash, requires no external configuration PROM (reducing parts count and failure points), and its 600K-gate / 165 I/O capacity handles telemetry framing, bus bridging (MIL-STD-1553 companion logic, ARINC glue), and sensor aggregation. The industrial -40C to +100C rating suits conduction-cooled enclosures. For new aerospace designs, specify the FGG lead-free variant unless legacy solder processes dictate the leaded FG metallization.
Recommended
Secure Bridge and Interface Logic
The nonvolatile flash fabric of the A3PE600-FG256I makes it well suited to secure bridge logic, anti-tamper glue logic, and proprietary interface conversion where the bitstream must not be externally readable at power-up - unlike SRAM FPGAs whose configuration streams over the bus and can be intercepted. The single-chip design removes the configuration read path entirely. With 165 user I/O and 350 MHz-class system performance, it converts between legacy parallel buses, memory-style interfaces, and custom serial links. Microchip's flash FPGA security features (flash lock) should be enabled in the bitstream generation step of Libero. The industrial temperature grade supports extended field deployment in network and defense infrastructure.
Recommended
Communications Line Cards and Backplane Bridging
Telecom and datacom line cards use the A3PE600-FG256I as backplane glue: PCI-style parallel bridges, framing logic, and FIFO buffering between PHYs and processors. The ProASIC3E variant's enhanced embedded SRAM blocks implement deep FIFOs and dual-port buffers natively, and the 350 MHz system ceiling comfortably covers line-rate byte-parallel processing at OC-3/STM-1 class rates. The 1.5V core limits switching power on densely populated cards, and instant-on flash startup lets the card enumerate before host bring-up completes. Budget I/O banks by voltage domain early, since 165 user I/O across FBGA banks constrains mixed-voltage floorplanning on a 17 x 17 mm package.
Recommended
Medical Instrumentation
Diagnostic and laboratory instruments employ the A3PE600-FG256I for sensor timing, ADC framing, and display/control interface logic. Flash configuration means measurement subsystems are operational the instant power is applied - important for instruments that perform power-on self-calibration sequences. The 130nm flash fabric produces no configuration-read radiation and low core noise at 1.5V, helping sensitive analog front ends sharing the board. The 600K-gate fabric consolidates touch-panel interfaces, motor-stage control, and acquisition timing in one device, reducing validation surface. Medical OEMs also value the pin-compatible FGG lead-free variant for RoHS-driven supply-chain resilience; qualify both suffixes on the same footprint during design.
Recommended
Test and Measurement Equipment
Bench instruments, protocol analyzers, and automatic test equipment use the A3PE600-FG256I for pattern generation, capture logic, and DUT interface adaptation. The 350 MHz system performance and 13,824 DFFs support high-frequency pattern engines, while 165 user I/O maps well to probe heads and multi-channel pod interfaces. Instant-on flash startup means the instrument's digital subsystem is ready during the host OS boot, cutting measurement-cycle latency. The FBGA footprint's 1.0 mm pitch simplifies signal-access probing compared with finer-pitch BGA families. For instruments requiring higher-speed capture, the -2 speed grade in the same 256-FBGA footprint (A3PE600-2FGG256) provides faster I/O timing without PCB redesign.
Recommended
Recommended Products Summary
Engineering reference data for A3PE600-FG256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE600-FGG256I | A3PE600-FGG256 | A3PE600-2FGG256 | A3P600-FG256I |
|---|---|---|---|---|---|
| Package | 256-FBGA (17 x 17 mm, 1.0 mm pitch) | 256-FBGA - same footprint | 256-FBGA - same footprint | 256-FBGA - same footprint | 256-LBGA - same footprint |
| Brand / Family | Microchip Technology - ProASIC3E | Microchip - ProASIC3E | Microchip - ProASIC3E | Microchip - ProASIC3E | Microchip - ProASIC3 (base) |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| User I/O | 165 | 165 | 165 | 165 | 177 |
| Speed Grade | Standard (-1) | Standard (-1) | Standard (-1) | -2 (faster) | [DATA_NEEDED] |
| Operating Temperature | -40C to +100C (TJ), industrial | -40C to +100C (TJ), industrial | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (TJ), industrial |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| RoHS / Lead-Free | Non-compliant (contains lead) | Compliant (green) | Compliant (green) | Compliant (green) | [DATA_NEEDED] |
Key Differentiators
- Nonvolatile flash configuration, single-chip instant-on (vs A3P600-FG256I)
- Industrial temperature rating with lead-free option in the same footprint (vs A3PE600-FGG256)
- Faster timing headroom without PCB change (vs A3PE600-2FGG256)
Design Notes
Supply the 1.5V core rail from a regulator holding 1.425V-1.575V across load transients; core dynamic current scales with clock activity, so budget per Libero power-analysis reports rather than worst-case sheet values. I/O banks each need their own VCCI rails matched to the selected I/O standards - mixed 3.3V/2.5V/1.8V banks are common in bridge applications. Add bulk (47-100 uF) plus per-ball-pair 0.1 uF decoupling; the FBGA ball field makes inner-ball decoupling placement critical in early layout passes.
The 256-FBGA has 1.0 mm pitch with escape routing feasible on 4 layers minimum (signal via-in-pad or dog-bone escapes under the array). Reserve the two outermost ball rows for user I/O where possible and keep power/ground balls near the center for short via throws to internal planes. Because 91 of 256 balls are non-user-I/O (power, ground, programming), confirm bank assignments in the datasheet package chapter before committing the stack-up; fanout errors here are the most common cause of respins.
The FG suffix is RoHS non-compliant (contains lead) - for new global-market builds, migrate the identical design to A3PE600-FGG256I; the footprint and bitstream are unchanged, but green molding compound may shift the reflow profile, so re-qualify the assembly process. Also verify speed-grade timing margins with the actual -1 grade models in Libero before locking the design; if STA margins are under ~10%, move to the -2 grade rather than attempting over-constraint workarounds.
Compliance Information
Per distributor datasheet data (digchip), the A3PE600-FG256I has Lead Free Status 'Contains Lead' and RoHS Status 'RoHS Non-Compliant'. The FGG suffix variants are the green/lead-free equivalents in the same 256-FBGA footprint.
