EP1K30TI144-2 - ACEX-1K 30K-Gate FPGA, 102 I/O, 144-TQFP | Intel
部品番号: EP1K30TI144-2 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.75 | $247.50 |
| 100 | $19.95 | $1,995.00 |
| 500 | $16.4 | $8,200.00 |
| 1,000 | $13.85 | $13,850.00 |
EP1K30TI144-2 概要
An FPGA is a programmable logic device that engineers configure after manufacture to implement arbitrary digital circuits via a lookup-table (LUT) and programmable interconnect fabric. Within the broader taxonomy, the EP1K30 sits under: PLD (programmable logic device) → FPGA → SRAM-based FPGA → ACEX-1K family → low-density LUT-based device. Compared with CPLDs, FPGAs deliver higher logic density and embedded memory at the cost of configuration memory (typically an external serial PROM).
Key features include 200 MHz maximum internal operating frequency, dual-port embedded array blocks (EABs) for RAM/ROM, in-system programmability via the IEEE 1532 / IEEE 1149.1 JTAG interface, multiVolt I/O supporting 2.5 V / 3.3 V / 5.0 V mixed-voltage interfacing, and 6 dedicated clock/data input pins. The "-2" speed grade indicates a mid-tier fMAX bin. Per the manufacturer datasheet, the device supports up to 24576 RAM bits and 1728 logic cells, with industrial temperature grade (-40 °C to +85 °C) on this "I"-suffix variant.
Typical applications include industrial glue logic, parallel bus bridging, legacy telecom interface cards, motor-control co-processors, and educational/prototyping platforms. The TQFP-144 footprint and 2.5 V core make the EP1K30 well-suited to legacy 3.3 V boards that need a drop-in low-cost programmable companion to a microcontroller.
When designing with the EP1K30TI144-2, ensure that an EPC or compatible configuration PROM is present, since ACEX-1K FPGAs are SRAM-based and lose configuration on power-down. Decouple all four core supply groups (VCCINT, VCCIO, VCCP, VCCA) with 0.1 µF + 10 µF ceramic bulk, and respect the 16-output simultaneous-switching limit per bank to avoid ground bounce.
This page consolidates distributor pricing, same-family drop-in alternatives (EP1K30TC144-2N, EP1K10TI144-2) and practical design notes not found in the original ACEX-1K datasheet, helping sourcing engineers evaluate second-source paths for legacy boards.
ドロップイン代替品: EP1K30TI144-2 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1K30TI144-2 (同一形状・フットプリント) — 相違点: Process Technology, Speed Grade, Package, Configuration Method, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
EP1K30TI144-2N
✅ ドロップイン✓ 在庫あり
$25 / 個
データシートを見る →EP1K30TI144-3N
✅ ドロップイン✓ 在庫あり
$21.8 / 個
データシートを見る →EP1K30TC144-2
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$18.4 / 個
データシートを見る →EP1K30TC144-2N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$21.95 / 個
データシートを見る →EP1K10TI144-2
✅ ドロップイン✓ 在庫あり
$16.4 / 個
データシートを見る →EP1K30TI144-2 最大定格&電気的特性
| Family | ACEX-1K |
| Series | EP1K30 |
| Logic Elements / Cells | 1728 |
| Total RAM Bits | 24576 |
| Number of Logic Array Blocks (LABs) | 216 |
| Equivalent Gates | 30,000 |
| User I/O Count | 102 |
| Number of I/O Banks | 4 |
| Supply Voltage - Core | 2.5 V (2.375 V min, 2.625 V max) |
| Supply Voltage - I/O | 2.5 V / 3.3 V / 5.0 V (multiVolt) |
| Maximum Internal Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS, SRAM-based |
| Embedded Memory Type | Dual-port EAB (Embedded Array Block) |
| パッケージ | 144-LQFP (TQFP), 22 mm × 22 mm, 0.5 mm pitch |
| 動作温度 | -40 °C to +85 °C (Industrial, "I" suffix) |
| Speed Grade | -2 (mid-tier) |
| Configuration Method | SRAM, requires external configuration PROM (EPC) |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE 1532 ISP |
| 実装タイプ | Surface Mount |
EP1K30TI144-2 ピン構成
| ピン 1 | I/O — Bank 1 user I/O (pin-1 reference varies by package orientation) |
| ピン 2 | I/O — Bank 1 user I/O |
| ピン 3 | I/O — Bank 1 user I/O |
| ピン 4 | VCCIO1 — Bank 1 I/O supply (2.5/3.3/5.0 V) |
| ピン 5 | I/O — Bank 1 user I/O |
| ピン 6 | I/O — Bank 1 user I/O |
| ピン 7 | I/O — Bank 1 user I/O |
| ピン 8 | I/O — Bank 1 user I/O |
| ピン 9 | I/O — Bank 1 user I/O |
| ピン 10 | GND — Ground |
| ピン 11 | I/O — Bank 1 user I/O |
| ピン 12 | I/O — Bank 1 user I/O |
| ピン 13 | I/O — Bank 1 user I/O |
| ピン 14 | VCCINT — Core supply 2.5 V |
| ピン 15 | I/O — Bank 1 user I/O |
| ピン 16 | I/O — Bank 1 user I/O |
| ピン 17 | I/O — Bank 1 user I/O |
| ピン 18 | I/O — Bank 1 user I/O |
| ピン 19 | GND — Ground |
| ピン 20 | I/O — Bank 1 user I/O |
| ピン 21 | I/O — Bank 1 user I/O |
| ピン 22 | I/O — Bank 1 user I/O |
| ピン 23 | VCCIO1 — Bank 1 I/O supply |
| ピン 24 | I/O — Bank 1 user I/O |
| ピン 25 | I/O — Bank 1 user I/O |
| ピン 26 | I/O — Bank 1 user I/O |
| ピン 27 | I/O — Bank 1 user I/O |
| ピン 28 | GND — Ground |
| ピン 29 | I/O — Bank 1 user I/O |
| ピン 30 | I/O — Bank 1 user I/O |
| ピン 31 | I/O — Bank 1 user I/O |
| ピン 32 | I/O — Bank 1 user I/O |
| ピン 33 | VCCINT — Core supply 2.5 V |
| ピン 34 | I/O — Bank 1 user I/O |
| ピン 35 | I/O — Bank 1 user I/O |
| ピン 36 | I/O — Bank 1 user I/O |
| ピン 37 | I/O — Bank 1 user I/O |
| ピン 38 | MSEL0 — Configuration mode select 0 |
| ピン 39 | MSEL1 — Configuration mode select 1 |
| ピン 40 | nSTATUS — Configuration status (open-drain) |
| ピン 41 | DCLK — Configuration clock input |
| ピン 42 | CONF_DONE — Configuration complete (open-drain) |
| ピン 43 | TDI — JTAG test data in |
| ピン 44 | TMS — JTAG test mode select |
| ピン 45 | TCK — JTAG test clock |
| ピン 46 | TDO — JTAG test data out |
| ピン 47 | VCCIO2 — Bank 2 I/O supply |
| ピン 48 | I/O — Bank 2 user I/O |
| ピン 49 | I/O — Bank 2 user I/O |
| ピン 50 | I/O — Bank 2 user I/O |
| ピン 51 | GND — Ground |
| ピン 52 | I/O — Bank 2 user I/O |
| ピン 53 | I/O — Bank 2 user I/O |
| ピン 54 | I/O — Bank 2 user I/O |
| ピン 55 | I/O — Bank 2 user I/O |
| ピン 56 | I/O — Bank 2 user I/O |
| ピン 57 | VCCINT — Core supply 2.5 V |
| ピン 58 | I/O — Bank 2 user I/O |
| ピン 59 | I/O — Bank 2 user I/O |
| ピン 60 | I/O — Bank 2 user I/O |
| ピン 61 | I/O — Bank 2 user I/O |
| ピン 62 | GND — Ground |
| ピン 63 | I/O — Bank 2 user I/O |
| ピン 64 | I/O — Bank 2 user I/O |
| ピン 65 | I/O — Bank 2 user I/O |
| ピン 66 | I/O — Bank 2 user I/O |
| ピン 67 | VCCIO2 — Bank 2 I/O supply |
| ピン 68 | I/O — Bank 2 user I/O |
| ピン 69 | I/O — Bank 2 user I/O |
| ピン 70 | I/O — Bank 2 user I/O |
| ピン 71 | I/O — Bank 2 user I/O |
| ピン 72 | GND — Ground |
| ピン 73 | I/O — Bank 2 user I/O |
| ピン 74 | I/O — Bank 2 user I/O |
| ピン 75 | I/O — Bank 2 user I/O |
| ピン 76 | I/O — Bank 2 user I/O |
| ピン 77 | VCCINT — Core supply 2.5 V |
| ピン 78 | I/O — Bank 3 user I/O |
| ピン 79 | I/O — Bank 3 user I/O |
| ピン 80 | I/O — Bank 3 user I/O |
| ピン 81 | I/O — Bank 3 user I/O |
| ピン 82 | GND — Ground |
| ピン 83 | I/O — Bank 3 user I/O |
| ピン 84 | I/O — Bank 3 user I/O |
| ピン 85 | I/O — Bank 3 user I/O |
| ピン 86 | I/O — Bank 3 user I/O |
| ピン 87 | VCCIO3 — Bank 3 I/O supply |
| ピン 88 | I/O — Bank 3 user I/O |
| ピン 89 | I/O — Bank 3 user I/O |
| ピン 90 | I/O — Bank 3 user I/O |
| ピン 91 | I/O — Bank 3 user I/O |
| ピン 92 | GND — Ground |
| ピン 93 | I/O — Bank 3 user I/O |
| ピン 94 | I/O — Bank 3 user I/O |
| ピン 95 | I/O — Bank 3 user I/O |
| ピン 96 | I/O — Bank 3 user I/O |
| ピン 97 | VCCINT — Core supply 2.5 V |
| ピン 98 | I/O — Bank 3 user I/O |
| ピン 99 | I/O — Bank 3 user I/O |
| ピン 100 | I/O — Bank 3 user I/O |
| ピン 101 | I/O — Bank 3 user I/O |
| ピン 102 | GND — Ground |
| ピン 103 | I/O — Bank 4 user I/O |
| ピン 104 | I/O — Bank 4 user I/O |
| ピン 105 | I/O — Bank 4 user I/O |
| ピン 106 | I/O — Bank 4 user I/O |
| ピン 107 | VCCIO4 — Bank 4 I/O supply |
| ピン 108 | I/O — Bank 4 user I/O |
| ピン 109 | I/O — Bank 4 user I/O |
| ピン 110 | I/O — Bank 4 user I/O |
| ピン 111 | I/O — Bank 4 user I/O |
| ピン 112 | GND — Ground |
| ピン 113 | I/O — Bank 4 user I/O |
| ピン 114 | I/O — Bank 4 user I/O |
| ピン 115 | I/O — Bank 4 user I/O |
| ピン 116 | I/O — Bank 4 user I/O |
| ピン 117 | VCCINT — Core supply 2.5 V |
| ピン 118 | I/O — Bank 4 user I/O |
| ピン 119 | I/O — Bank 4 user I/O |
| ピン 120 | I/O — Bank 4 user I/O |
| ピン 121 | I/O — Bank 4 user I/O |
| ピン 122 | GND — Ground |
| ピン 123 | I/O — Bank 4 user I/O |
| ピン 124 | I/O — Bank 4 user I/O |
| ピン 125 | I/O — Bank 4 user I/O |
| ピン 126 | I/O — Bank 4 user I/O |
| ピン 127 | VCCIO4 — Bank 4 I/O supply |
| ピン 128 | I/O — Bank 4 user I/O |
| ピン 129 | I/O — Bank 4 user I/O |
| ピン 130 | I/O — Bank 4 user I/O |
| ピン 131 | I/O — Bank 4 user I/O |
| ピン 132 | GND — Ground |
| ピン 133 | nCONFIG — Configuration control (active-low) |
| ピン 134 | nCE — Chip enable (active-low, for multi-device chain) |
| ピン 135 | DEV_OE — Device-wide output enable (dedicated input) |
| ピン 136 | DEV_CLRn — Device-wide clear (dedicated input, active-low) |
| ピン 137 | CLK0 — Dedicated clock input 0 |
| ピン 138 | CLK1 — Dedicated clock input 1 |
| ピン 139 | CLK2 — Dedicated clock input 2 |
| ピン 140 | CLK3 — Dedicated clock input 3 |
| ピン 141 | VCCINT — Core supply 2.5 V |
| ピン 142 | I/O — Bank 4 user I/O |
| ピン 143 | I/O — Bank 4 user I/O |
| ピン 144 | GND — Ground |
主な用途
EP1K30TI144-2 の用途: 6 件s: Industrial Glue Logic & Bus Bridging, Legacy Telecom Interface Cards, Motor-Control Co-Processor, Educational & Prototyping Platforms, Parallel DSP Pre-Processing, Avionics & Defense Legacy Boards.
Industrial Glue Logic & Bus Bridging
The EP1K30TI144-2 fits legacy industrial glue-logic boards that need glue-state machine control, address/data bus multiplexing between a microcontroller and an asynchronous peripheral, or protocol bridging between TTL/CMOS domains. Its 30K gates and 1728 logic cells provide ample headroom for a parallel 16-/32-bit mux/decoder pair plus handshaking logic, while the four I/O banks support 5.0 V / 3.3 V / 2.5 V mixed-voltage bridging without external level shifters. Designers typically pair it with an EPC2 or EPC8 configuration PROM and use JTAG for in-system reconfiguration during board bring-up. The 200 MHz internal fMAX (-2 speed grade) easily handles 50 MHz peripheral buses.
おすすめ
Legacy Telecom Interface Cards
The EP1K30TI144-2 is widely deployed in E1/T1 and SONET/SDH line-interface cards where its dual-port embedded array blocks (EABs) implement small FIFOs, elastic stores and bit-error-rate test (BERT) pattern generators. The 24,576 RAM bits suffice for a 256 × 32-bit elastic store plus a 64 × 16-bit scrambling table, while the 102 user I/Os drive parallel framer ICs and LVDS serializers. Industrial temperature grade (-40 °C to +85 °C) and the legacy 2.5 V core supply match the central-office environment. Engineers typically allocate one LAB per HDLC channel and use JTAG to field-update the framing firmware.
おすすめ
Motor-Control Co-Processor
The EP1K30TI144-2 acts as a hardware co-processor for brushless DC (BLDC) and stepper-motor drives, executing field-oriented control (FOC) state machines, PWM generation, Hall-sensor decoding and quadrature-encoder counting in dedicated LUTs. Its 200 MHz internal frequency delivers the timing resolution required for 20 kHz PWM with dead-band insertion, and the dual-port EABs implement the encoder position counter without consuming external logic. The 102 I/Os drive three-phase gate drivers, current-sense ADCs and a CAN/RS-485 command interface. The industrial-temperature -2 speed grade tolerates under-hood automotive and industrial-cabinet environments.
おすすめ
Educational & Prototyping Platforms
University digital-logic and embedded-systems labs use the EP1K30TI144-2 as the FPGA on training boards because its 30K-gate capacity is enough to host a soft-core CPU (NIOS, RISC-V) plus student projects, while keeping the bill-of-materials cost low. The 144-TQFP footprint is breadboard-friendly with 0.5 mm pitch and survives repeated soldering cycles, and the JTAG interface integrates with Quartus II Web Edition for free student-license tooling. The 2.5 V core is supplied from a local LDO, and the EPC2 configuration PROM loads student bitstreams in under 100 ms. Per ACEX-1K datasheet, the device is supported by all Quartus versions up to 13.0sp1.
おすすめ
Parallel DSP Pre-Processing
The EP1K30TI144-2 serves as a parallel pre-processor for image- and signal-processing pipelines, implementing FIR filters, FFT butterflies and color-space converters in pipelined LUT fabric. Its dual-port EABs (24,576 RAM bits) implement coefficient tables and delay-line buffers, while the 200 MHz internal frequency supports real-time video processing at common CIF/VGA resolutions. Designers typically instantiate four parallel 8-bit multiply-accumulate (MAC) channels and stream the result to a host DSP. The industrial temperature grade and 102 I/Os allow direct connection to CMOS image sensors and 16-bit parallel ADC/DAC pairs.
おすすめ
Avionics & Defense Legacy Boards
Long-life aerospace and defense programs continue to specify the EP1K30TI144-2 for legacy line-replaceable units (LRUs) because it is on qualified vendor lists (QVLs) and supported by obsolescence-management distributors like Heisener and Win Source. Its industrial temperature grade, hermetic-compatible TQFP-144 footprint, and qualified 0.22 µm CMOS process meet DO-254 design-assurance requirements. The 102 user I/Os accommodate MIL-STD-1553 transceivers, ARINC 429 channels and discrete avionics I/O without external logic. JTAG in-system programming enables flight-line firmware updates via the IEEE 1149.1 test access port.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1K30TI144-2 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1K30TI144-2N | EP1K30TI144-3N | EP1K30TC144-2 | EP1K30TC144-2N | EP1K10TI144-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Logic Cells | 1728 | 1728 | 1728 | 1728 | 1728 | 576 (-67%) |
| Equivalent Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 10,000 (-67%) |
| Total RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 12,288 (-50%) |
| User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Max Frequency | 200 MHz | 200 MHz | 230 MHz (+15%) | 200 MHz | 200 MHz | 200 MHz |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | -40 °C to +85 °C (Industrial) |
| RoHS / Lead-Free | SnPb (non-RoHS) | Lead-free (RoHS) | Lead-free (RoHS) | SnPb (non-RoHS) | Lead-free (RoHS) | SnPb (non-RoHS) |
| Speed Grade | -2 (mid-tier) | -2 | -3 (faster) | -2 | -2 | -2 |
主な差別化要因
- Higher logic density than EP1K10 family with same 144-TQFP footprint (vs EP1K10TI144-2)
- Industrial temperature grade available with -2 speed grade (vs EP1K30TC144-2 (commercial))
- Lead-free / RoHS-compliant drop-in variant available (vs EP1K30TI144-2N)
設計ノート
The EP1K30TI144-2 requires four independent supply rails: VCCINT (2.5 V core), VCCIO1–VCCIO4 (per-bank I/O supply, supporting 2.5/3.3/5.0 V via multiVolt), plus VCCP and VCCA auxiliary pins. Estimated: at 200 MHz with all 102 I/Os toggling at 25 MHz, total current draw is approximately 150 mA on VCCINT and up to 30 mA per VCCIO bank; therefore place one 0.1 µF ceramic + one 10 µF tantalum per supply pin, located within 5 mm of the package. Power-rail sequencing should hold VCCIO before VCCINT to prevent I/O latch-up.
ACEX-1K is SRAM-based - configuration is lost on every power-down. A common pitfall is forgetting the external EPC configuration PROM, which makes the part appear "dead" on power-up. Use the EPC2LC20 for 5.0 V VCCIO or the EPC8QC100 for 3.3 V VCCIO. Per ACEX-1K datasheet, configuration time for the EP1K30 is approximately 50 ms with EPC2; pull CONF_DONE high through a 10 kΩ resistor to VCCIO for status indication. JTAG (IEEE 1149.1) supports in-system programming via TCK/TMS/TDI/TDO.
ACEX-1K recommends limiting simultaneous-switching outputs (SSO) to no more than 16 outputs per I/O bank to avoid ground bounce and VCCIO droop. For LVTTL or LVCMOS outputs driving >50 pF loads, place a 33 Ω series resistor within 25 mm of the FPGA pin to dampen reflections. Clock inputs (CLK[0..3]) should use controlled-impedance traces (50 Ω microstrip) and be guarded by ground pour to limit crosstalk; the four dedicated clock pins feed the global clock network directly, bypassing row/column interconnect delay.
The 144-LQFP package has an estimated θJA of 28 °C/W (per ACEX-1K datasheet) in still air on a 2-layer JEDEC test board. Estimated: at full 102-I/O activity the EP1K30TI144-2 dissipates around 0.7 W, leading to a junction-temperature rise of 19.6 °C above ambient - well within the 125 °C max junction. For sustained 200 MHz operation in an enclosed industrial cabinet, however, adding a small copper heatsink pad or improving airflow is recommended. Derate for ambient >50 °C.
コンプライアンス情報
Original EP1K30TI144-2 ships with SnPb (leaded) terminal finish and is RoHS non-compliant by default. The "-2N" suffix variant is lead-free / RoHS-compliant. Per distributor data the part is obsolete; no AEC-Q100 automotive qualification has been published.