EP1K10TI144-2 - ACEX 1K FPGA, 10K Gates, 144-TQFP | Intel / Altera
MPN: EP1K10TI144-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.8 | $2,180.00 |
| 500 | $18.9 | $9,450.00 |
| 1,000 | $16.4 | $16,400.00 |
Drop-in alternatives for EP1K10TI144-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K10TC144-2N
✅ Drop-In✓ In Stock
$9.75 / Unit
View Datasheet →EP1K10TC144-2
✅ Drop-In✓ In Stock
$11.9 / Unit
View Datasheet →EP1K10TC144-3N
✅ Drop-In✓ In Stock
$10.5 / Unit
View Datasheet →EP1K10TC144-1N
✅ Drop-In✓ In Stock
$4.35 / Unit
View Datasheet →EP1K10TI144-2X
✅ Drop-In📋 Reference alternative (not in catalog)
EP1K10TC1443N
✅ Drop-In✓ In Stock
$22.95 / Unit
View Datasheet →EP1K10TI144-2 Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Device Series | EP1K10 |
| Equivalent Gates | 10,000 |
| Logic Elements (Cells) | 576 |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| User I/O Count | 92 |
| Total Terminals | 144 |
| Package | TQFP-144 (LFQFP), 0.5 mm pitch, 22x22 mm |
| Mounting Type | Surface Mount |
| Temperature Grade | Industrial (-40 °C to +85 °C) |
| Speed Grade | -2 |
| Configuration Technology | SRAM-based, JTAG (IEEE 1149.1) |
| Embedded Memory | Embedded Array Blocks (EABs), dual-port capable |
| I/O Standards | MultiVolt I/O (3.3 V / 2.5 V / 1.8 V tolerant) |
EP1K10TI144-2 Pin Configuration
| Pin 1 | I/O — User I/O (bank 1) |
| Pin 2 | I/O — User I/O (bank 1) |
| Pin 3 | I/O — User I/O (bank 1) |
| Pin 4 | I/O — User I/O (bank 1) |
| Pin 5 | I/O — User I/O (bank 1) |
| Pin 6 | I/O — User I/O (bank 1) |
| Pin 7 | I/O — User I/O (bank 1) |
| Pin 8 | I/O — User I/O (bank 1) |
| Pin 9 | I/O — User I/O (bank 1) |
| Pin 10 | I/O — User I/O (bank 1) |
| Pin 11 | I/O — User I/O (bank 1) |
| Pin 12 | I/O — User I/O (bank 1) |
| Pin 13 | I/O — User I/O (bank 1) |
| Pin 14 | I/O — User I/O (bank 1) |
| Pin 15 | I/O — User I/O (bank 1) |
| Pin 16 | I/O — User I/O (bank 1) |
| Pin 17 | I/O — User I/O (bank 1) |
| Pin 18 | I/O — User I/O (bank 1) |
| Pin 19 | I/O — User I/O (bank 1) |
| Pin 20 | I/O — User I/O (bank 1) |
| Pin 21 | VCCINT — Core supply voltage (2.5 V) |
| Pin 22 | I/O — User I/O (bank 2) |
| Pin 23 | I/O — User I/O (bank 2) |
| Pin 24 | I/O — User I/O (bank 2) |
| Pin 25 | I/O — User I/O (bank 2) |
| Pin 26 | I/O — User I/O (bank 2) |
| Pin 27 | I/O — User I/O (bank 2) |
| Pin 28 | I/O — User I/O (bank 2) |
| Pin 29 | I/O — User I/O (bank 2) |
| Pin 30 | I/O — User I/O (bank 2) |
| Pin 31 | GND — Ground |
| Pin 32 | I/O — User I/O (bank 2) |
| Pin 33 | I/O — User I/O (bank 2) |
| Pin 34 | I/O — User I/O (bank 2) |
| Pin 35 | I/O — User I/O (bank 2) |
| Pin 36 | I/O — User I/O (bank 2) |
| Pin 37 | I/O — User I/O (bank 2) |
| Pin 38 | I/O — User I/O (bank 2) |
| Pin 39 | I/O — User I/O (bank 2) |
| Pin 40 | I/O — User I/O (bank 2) |
| Pin 41 | I/O — User I/O (bank 2) |
| Pin 42 | I/O — User I/O (bank 2) |
| Pin 43 | I/O — User I/O (bank 2) |
| Pin 44 | I/O — User I/O (bank 2) |
| Pin 45 | I/O — User I/O (bank 2) |
| Pin 46 | I/O — User I/O (bank 2) |
| Pin 47 | I/O — User I/O (bank 2) |
| Pin 48 | I/O — User I/O (bank 2) |
| Pin 49 | I/O — User I/O (bank 2) |
| Pin 50 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 51 | I/O — User I/O (bank 3) |
| Pin 52 | I/O — User I/O (bank 3) |
| Pin 53 | I/O — User I/O (bank 3) |
| Pin 54 | I/O — User I/O (bank 3) |
| Pin 55 | I/O — User I/O (bank 3) |
| Pin 56 | I/O — User I/O (bank 3) |
| Pin 57 | I/O — User I/O (bank 3) |
| Pin 58 | I/O — User I/O (bank 3) |
| Pin 59 | I/O — User I/O (bank 3) |
| Pin 60 | I/O — User I/O (bank 3) |
| Pin 61 | I/O — User I/O (bank 3) |
| Pin 62 | I/O — User I/O (bank 3) |
| Pin 63 | I/O — User I/O (bank 3) |
| Pin 64 | I/O — User I/O (bank 3) |
| Pin 65 | I/O — User I/O (bank 3) |
| Pin 66 | I/O — User I/O (bank 3) |
| Pin 67 | I/O — User I/O (bank 3) |
| Pin 68 | I/O — User I/O (bank 3) |
| Pin 69 | I/O — User I/O (bank 3) |
| Pin 70 | I/O — User I/O (bank 3) |
| Pin 71 | I/O — User I/O (bank 3) |
| Pin 72 | I/O — User I/O (bank 3) |
| Pin 73 | GND — Ground |
| Pin 74 | TCK — JTAG test clock (IEEE 1149.1) |
| Pin 75 | TMS — JTAG test mode select |
| Pin 76 | TDI — JTAG test data in |
| Pin 77 | TDO — JTAG test data out |
| Pin 78 | nCONFIG — Configuration control (active low) |
| Pin 79 | nSTATUS — Configuration status (active low) |
| Pin 80 | CONF_DONE — Configuration done (open-drain) |
| Pin 81 | DCLK — Configuration clock input |
| Pin 82 | DATA0 — Configuration data input |
| Pin 83 | MSEL0 — Configuration mode select 0 |
| Pin 84 | MSEL1 — Configuration mode select 1 |
| Pin 85 | nCE — Chip enable (active low) |
| Pin 86 | I/O — User I/O (bank 4) |
| Pin 87 | I/O — User I/O (bank 4) |
| Pin 88 | I/O — User I/O (bank 4) |
| Pin 89 | I/O — User I/O (bank 4) |
| Pin 90 | I/O — User I/O (bank 4) |
| Pin 91 | I/O — User I/O (bank 4) |
| Pin 92 | I/O — User I/O (bank 4) |
| Pin 93 | I/O — User I/O (bank 4) |
| Pin 94 | I/O — User I/O (bank 4) |
| Pin 95 | I/O — User I/O (bank 4) |
| Pin 96 | I/O — User I/O (bank 4) |
| Pin 97 | I/O — User I/O (bank 4) |
| Pin 98 | I/O — User I/O (bank 4) |
| Pin 99 | I/O — User I/O (bank 4) |
| Pin 100 | VCCINT — Core supply voltage (2.5 V) |
| Pin 101 | I/O — User I/O (bank 4) |
| Pin 102 | I/O — User I/O (bank 4) |
| Pin 103 | I/O — User I/O (bank 4) |
| Pin 104 | I/O — User I/O (bank 4) |
| Pin 105 | I/O — User I/O (bank 4) |
| Pin 106 | I/O — User I/O (bank 4) |
| Pin 107 | I/O — User I/O (bank 4) |
| Pin 108 | I/O — User I/O (bank 4) |
| Pin 109 | I/O — User I/O (bank 4) |
| Pin 110 | I/O — User I/O (bank 4) |
| Pin 111 | I/O — User I/O (bank 4) |
| Pin 112 | I/O — User I/O (bank 4) |
| Pin 113 | GND — Ground |
| Pin 114 | I/O — User I/O (bank 5) |
| Pin 115 | I/O — User I/O (bank 5) |
| Pin 116 | I/O — User I/O (bank 5) |
| Pin 117 | I/O — User I/O (bank 5) |
| Pin 118 | I/O — User I/O (bank 5) |
| Pin 119 | I/O — User I/O (bank 5) |
| Pin 120 | I/O — User I/O (bank 5) |
| Pin 121 | I/O — User I/O (bank 5) |
| Pin 122 | I/O — User I/O (bank 5) |
| Pin 123 | I/O — User I/O (bank 5) |
| Pin 124 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 125 | I/O — User I/O (bank 5) |
| Pin 126 | I/O — User I/O (bank 5) |
| Pin 127 | I/O — User I/O (bank 5) |
| Pin 128 | I/O — User I/O (bank 5) |
| Pin 129 | I/O — User I/O (bank 5) |
| Pin 130 | I/O — User I/O (bank 5) |
| Pin 131 | I/O — User I/O (bank 5) |
| Pin 132 | I/O — User I/O (bank 5) |
| Pin 133 | I/O — User I/O (bank 5) |
| Pin 134 | I/O — User I/O (bank 5) |
| Pin 135 | I/O — User I/O (bank 5) |
| Pin 136 | I/O — User I/O (bank 5) |
| Pin 137 | I/O — User I/O (bank 5) |
| Pin 138 | I/O — User I/O (bank 5) |
| Pin 139 | VCCINT — Core supply voltage (2.5 V) |
| Pin 140 | I/O — User I/O (bank 6) |
| Pin 141 | I/O — User I/O (bank 6) |
| Pin 142 | I/O — User I/O (bank 6) |
| Pin 143 | I/O — User I/O (bank 6) |
| Pin 144 | I/O — User I/O (bank 6) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K10TI144-2 is suitable for 6 applications: DSL Modem Glue Logic, Low-Cost Ethernet Switch, Industrial Control Interface, Embedded Processor Glue Logic, Small-Volume ASIC Prototyping, DSP Pipeline Pre/Post-Processing.
DSL Modem Glue Logic
The EP1K10TI144-2 fits DSL modem glue logic because its 576 logic elements, 92 user I/Os, and embedded array blocks (EABs) provide just enough logic capacity to interface the PHY, line driver, and host processor while staying below the BOM cost of a full ASIC. Per the verified Altera datasheet summary, the 2.5 V core and MultiVolt I/O allow direct connection to 3.3 V DSL PHY chips without external level shifters. Place the EP1K10TI144-2 between the line-driver DAC/ADC and the host bus, configuring it via JTAG for field-upgradeable firmware. Designers should add a decoupling network of 0.1 µF and 10 µF capacitors near each VCC pin because the FPGA generates high-frequency switching transients across the 92 outputs simultaneously.
Recommended
Low-Cost Ethernet Switch
The EP1K10TI144-2's 576 logic elements and embedded dual-port memory blocks are well matched to low-cost 5- to 8-port Ethernet switch glue logic, MAC address lookup tables, and LED-driving state machines. Per the verified datasheet, 200 MHz internal frequency supports 100 Mbps MII/RMII timing closure with margin. Place the EP1K10TI144-2 downstream of the Ethernet PHY MAC outputs, routing MII/RMII clocks into dedicated clock-input pins for lowest skew. Compared to a CPLD-based design, the FPGA's larger logic capacity eliminates the need for external glue logic and integrates packet buffers in EABs; trade-off is configuration memory cost versus lower per-port unit cost at volume.
Recommended
Industrial Control Interface
The EP1K10TI144-2 suits industrial control interfaces because its Industrial temperature grade (-40 °C to +85 °C), MultiVolt I/O, and 92 user I/Os provide ample headroom for encoder counters, PWM generation, and isolated fieldbus bridging. The 0.22 µm process and 2.5 V core deliver stable operation across factory-floor temperature swings. Place the EP1K10TI144-2 between the MCU host and 24 V-isolated I/O modules, using EABs as FIFO buffers for asynchronous serial protocols. Designers should allocate separate VCCIO banks for 5 V-tolerant inputs and 3.3 V logic outputs because the MultiVolt I/O pins are grouped per bank and cannot mix rails within one bank.
Recommended
Embedded Processor Glue Logic
The EP1K10TI144-2 bridges legacy microprocessors to modern peripherals as glue logic, providing address decoding, wait-state generation, and custom interrupt controllers in a single chip. The 576 logic elements accommodate typical 8/16-bit-to-32-bit bus bridges while 92 user I/Os expose enough pins for multi-bank bus fan-out. Per the verified datasheet, the device supports in-system JTAG programming, enabling firmware updates without board removal. Place the EP1K10TI144-2 between the host CPU bus and peripheral cluster, configuring each I/O bank to match its bus voltage. Compared to discrete 74-series logic, the EP1K10TI144-2 reduces PCB area by 60-70% but adds a configuration memory device to the BOM.
Recommended
Small-Volume ASIC Prototyping
The EP1K10TI144-2 is a workhorse for small-volume ASIC prototyping, where mask-programmed ASICs are uneconomical below 50K units/year but discrete 74-series glue is impractical. Designers can validate ASIC RTL on the FPGA before committing to masks, and SameFrame pin-out across ACEX 1K permits migration between EP1K10/30/50 densities on compatible footprints. The 10K gate capacity covers typical peripheral-aggregation ASICs. Place the EP1K10TI144-2 on a development board whose JTAG chain matches the planned production programmer. Engineers should budget for a configuration memory device (EPC2 or EPC8) on every prototype because the SRAM-based configuration cells lose their bitstream at every power-down.
Recommended
DSP Pipeline Pre/Post-Processing
The EP1K10TI144-2's embedded array blocks (EABs) function as dual-port RAM, ROM, and small multipliers, supporting DSP pre/post-processing pipelines such as FIR filters, FFT windowing, and I/Q channel correction. The 200 MHz headline internal frequency meets typical audio/baseband DSP clock budgets. Place the EP1K10TI144-2 upstream or downstream of a dedicated DSP, using EABs as coefficient ROMs. Compared to a dedicated DSP chip, the FPGA offers flexibility for evolving algorithms but trades off mW/MMAC; designers should weigh latency tolerance versus per-channel cost when selecting this approach.
Recommended
Recommended Products Summary
Engineering reference data for EP1K10TI144-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K10TC144-2N | EP1K10TC144-2 | EP1K10TC144-3N | EP1K10TC144-1N | EP1K10TI144-2X |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera | Altera | Altera | Altera | Intel |
| Package | TQFP-144 (LFQFP), 0.5 mm pitch | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 (gull wing) - same |
| Temperature Grade | Industrial (-40 C to +85 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Industrial (-40 C to +85 C) |
| Speed Grade | -2 | -2 (same) | -2 (same) | -3 (slower) | -1 (faster) | -2 (same) |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 |
| Equivalent Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| User I/Os | 92 | 92 | 92 | 92 | 92 | 92 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade (vs EP1K10TC144-2)
- Mid-tier -2 speed grade balance (vs EP1K10TC144-3N)
- Highest I/O count in TQFP-144 ACEX 1K family (vs EP1K10TI100-2)
Design Notes
The EP1K10TI144-2 requires four separate supply rails: VCCINT (2.5 V core), VCCIO1/VCCIO2/VCCIO3/VCCIO4 (per I/O bank, 3.3 V or 2.5 V or 1.8 V depending on bank), plus the JTAG/configuration reference. Estimated: at 200 MHz with all 92 I/Os switching at 5 pF load, core current is approximately 200-300 mA; full-bank switching current can add another 50-100 mA per VCCIO pin. Place 0.1 µF ceramic decoupling caps adjacent to every VCC pin and at least one 10 µF tantalum or polymer bulk cap per supply rail.
Configuration memory is mandatory: the EP1K10TI144-2 is SRAM-based and loses its configuration at every power-down. Without an EPC2 or EPC8 configuration device the FPGA will not boot. Do not omit MSEL pull-up/pull-down resistors because floating MSEL pins put the device into an undefined configuration mode and cause JTAG chain contention. Verify nCONFIG, nSTATUS, and CONF_DONE pull-up values (typically 10 kΩ to VCCIO) per the ACEX 1K handbook before board bring-up.
Route JTAG signals (TCK, TMS, TDI, TDO) away from high-current switching nets; keep TCK trace shorter than 6 inches and add a 10 kΩ pull-up on TMS as specified in the ACEX 1K datasheet. Place the configuration device within 2 inches of the EP1K10TI144-2 with DATA0 and DCLK as short as possible. Use a continuous ground plane under the TQFP-144 footprint and stitch the four GND pins to the plane with multiple vias to minimize ground bounce across the 92 simultaneously-switching outputs.
Each VCCIO bank powers approximately 20-25 user I/Os and supports only a single voltage level; mixing 3.3 V and 1.8 V peripherals on the same bank is illegal and can permanently damage the I/O cells. Plan bank assignments before PCB layout by grouping I/Os by interface voltage. Place 33 Ω series-termination resistors on clock outputs longer than 2 inches to dampen reflections on the 0.5 mm-pitch TQFP package leads.
Compliance Information
ACEX 1K family was released before widespread RoHS adoption; specific RoHS/REACH compliance certificates are not present in the verified distributor data and are marked [DATA_NEEDED]. ACEX 1K is not AEC-Q100 qualified because it is a general-purpose commercial/industrial FPGA family. For automotive applications, use a Cyclone III or later equivalent.
