Intel

EP1K30TI144-2 - ACEX-1K 30K-Gate FPGA, 102 I/O, 144-TQFP | Intel

N.º da peça: EP1K30TI144-2 ✗ Fim de vida

Em estoque Enviado em 1 a 3 dias úteis

2.5 V (2.375 V min, 2.625 V max) Vdss 144-LQFP (TQFP), 22 mm × 22 mm, 0.5 mm pitch Package 200 MHz Speed Dual-port EAB (Embedded Array Block) Memory

A partir de $13.85 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-06

Preços por volume

Qtd.	Preço unitário	Total
1	$28.5	$28,50
10	$24.75	$247,50
100	$19.95	$1.995,00
500	$16.4	$8.200,00
1.000	$13.85	$13.850,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

EP1K30TI144-2 Visão geral

The Intel (formerly Altera) EP1K30TI144-2 is a 30,000-gate ACEX-1K family Field Programmable Gate Array (FPGA) housed in a 144-pin TQFP package with 102 user I/Os and 216 Logic Array Blocks (LABs). Built on a 0.22 µm CMOS process with a 2.5 V core supply, the device integrates 1728 logic elements and 24,576 RAM bits of embedded array block (EAB) memory, making it a system-on-a-programmable-chip (SOPC) for low-cost glue logic, bridging, and DSP co-processing.

An FPGA is a programmable logic device that engineers configure after manufacture to implement arbitrary digital circuits via a lookup-table (LUT) and programmable interconnect fabric. Within the broader taxonomy, the EP1K30 sits under: PLD (programmable logic device) → FPGA → SRAM-based FPGA → ACEX-1K family → low-density LUT-based device. Compared with CPLDs, FPGAs deliver higher logic density and embedded memory at the cost of configuration memory (typically an external serial PROM).

Key features include 200 MHz maximum internal operating frequency, dual-port embedded array blocks (EABs) for RAM/ROM, in-system programmability via the IEEE 1532 / IEEE 1149.1 JTAG interface, multiVolt I/O supporting 2.5 V / 3.3 V / 5.0 V mixed-voltage interfacing, and 6 dedicated clock/data input pins. The "-2" speed grade indicates a mid-tier fMAX bin. Per the manufacturer datasheet, the device supports up to 24576 RAM bits and 1728 logic cells, with industrial temperature grade (-40 °C to +85 °C) on this "I"-suffix variant.

Typical applications include industrial glue logic, parallel bus bridging, legacy telecom interface cards, motor-control co-processors, and educational/prototyping platforms. The TQFP-144 footprint and 2.5 V core make the EP1K30 well-suited to legacy 3.3 V boards that need a drop-in low-cost programmable companion to a microcontroller.

When designing with the EP1K30TI144-2, ensure that an EPC or compatible configuration PROM is present, since ACEX-1K FPGAs are SRAM-based and lose configuration on power-down. Decouple all four core supply groups (VCCINT, VCCIO, VCCP, VCCA) with 0.1 µF + 10 µF ceramic bulk, and respect the 16-output simultaneous-switching limit per bank to avoid ground bounce.

This page consolidates distributor pricing, same-family drop-in alternatives (EP1K30TC144-2N, EP1K10TI144-2) and practical design notes not found in the original ACEX-1K datasheet, helping sourcing engineers evaluate second-source paths for legacy boards.

Alternativas drop-in para EP1K30TI144-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP1K30TI144-2 (mesmo formato e footprint) — diferindo em Process Technology, Speed Grade, Package, Configuration Method, Operating Temperature.

EP1K10TI144-2

Altera

Process Technology: 0.22 µm CMOS

Speed Grade: -2

Package: TQFP-144 (LFQFP), 0.5 mm pitch, 22x22 mm

Comparar com EP1K30TI144-2 →

EP1K30TC144-1

Altera

Speed Grade: -1 (slowest in ACEX-1K family)

Package: 144-LQFP (TQFP)

Configuration Method: SRAM, in-system programmable

Comparar com EP1K30TI144-2 →

EP1K30TC144-2

Intel

Process Technology: 0.22 µm SRAM LUT

Speed Grade: -2 (mid commercial speed grade)

Package: 144-pin TQFP (TC)

Comparar com EP1K30TI144-2 →

EP1K30TC144-2N

Intel

Process Technology: 0.22 µm EEPROM

Speed Grade: -2

Configuration Method: Serial / Passive Serial / JTAG

Comparar com EP1K30TI144-2 →

EP1K30TI144-2N

Intel

Process Technology: 0.22 µm CMOS SRAM

Speed Grade: -2

Package: 144-pin LQFP

Comparar com EP1K30TI144-2 →

EP1K30TI144-2NGA

Altera

Process Technology: 0.18 um SRAM CMOS

Speed Grade: -2 (faster than -3)

Operating Temperature: -40C to +85C (Industrial)

Comparar com EP1K30TI144-2 →

EP1K30TI144-3

Altera

Process Technology: CMOS

Speed Grade: -3

Package: 144-pin TQFP (LQFP, 0.5 mm pitch)

Comparar com EP1K30TI144-2 →

EP1K30TI144-3N

Altera

Process Technology: 0.18 um CMOS, 4 metal layers

Speed Grade: -3 (fastest in EP1K30 family)

Package: TQFP-144 (0.5 mm pitch)

Comparar com EP1K30TI144-2 →

EP1K50TI144-2

Intel

Process Technology: SRAM-based, 0.18 µm

Speed Grade: -2

Package: 144-LQFP (TQFP-144)

Comparar com EP1K30TI144-2 →

EP1K50TI144-2F

Intel

Process Technology: 0.22 µm CMOS

Speed Grade: -2 (fast)

Comparar com EP1K30TI144-2 →

✅ Drop-In

Altera

📦 144-LQFP

ACEX 1K · EP1K10 · 10,000 · 576 · 200 MHz · 0.22 µm CMOS · 2.5 V · 92

✓ Em estoque

$16.4 / unidade

Ver ficha técnica →

EP1K30TI144-2 Classificações máximas e características elétricas

Family	ACEX-1K
Series	EP1K30
Logic Elements / Cells	1728
Total RAM Bits	24576
Number of Logic Array Blocks (LABs)	216
Equivalent Gates	30,000
User I/O Count	102
Number of I/O Banks	4
Supply Voltage - Core	2.5 V (2.375 V min, 2.625 V max)
Supply Voltage - I/O	2.5 V / 3.3 V / 5.0 V (multiVolt)
Maximum Internal Frequency	200 MHz
Process Technology	0.22 µm CMOS, SRAM-based
Embedded Memory Type	Dual-port EAB (Embedded Array Block)
Encapsulamento	144-LQFP (TQFP), 22 mm × 22 mm, 0.5 mm pitch
Temperatura de operação	-40 °C to +85 °C (Industrial, "I" suffix)
Speed Grade	-2 (mid-tier)
Configuration Method	SRAM, requires external configuration PROM (EPC)
Programming Interface	JTAG (IEEE 1149.1) / IEEE 1532 ISP
Tipo de montagem	Surface Mount

Configuração de pinos do EP1K30TI144-2

Pino 1	I/O — Bank 1 user I/O (pin-1 reference varies by package orientation)
Pino 2	I/O — Bank 1 user I/O
Pino 3	I/O — Bank 1 user I/O
Pino 4	VCCIO1 — Bank 1 I/O supply (2.5/3.3/5.0 V)
Pino 5	I/O — Bank 1 user I/O
Pino 6	I/O — Bank 1 user I/O
Pino 7	I/O — Bank 1 user I/O
Pino 8	I/O — Bank 1 user I/O
Pino 9	I/O — Bank 1 user I/O
Pino 10	GND — Ground
Pino 11	I/O — Bank 1 user I/O
Pino 12	I/O — Bank 1 user I/O
Pino 13	I/O — Bank 1 user I/O
Pino 14	VCCINT — Core supply 2.5 V
Pino 15	I/O — Bank 1 user I/O
Pino 16	I/O — Bank 1 user I/O
Pino 17	I/O — Bank 1 user I/O
Pino 18	I/O — Bank 1 user I/O
Pino 19	GND — Ground
Pino 20	I/O — Bank 1 user I/O
Pino 21	I/O — Bank 1 user I/O
Pino 22	I/O — Bank 1 user I/O
Pino 23	VCCIO1 — Bank 1 I/O supply
Pino 24	I/O — Bank 1 user I/O
Pino 25	I/O — Bank 1 user I/O
Pino 26	I/O — Bank 1 user I/O
Pino 27	I/O — Bank 1 user I/O
Pino 28	GND — Ground
Pino 29	I/O — Bank 1 user I/O
Pino 30	I/O — Bank 1 user I/O
Pino 31	I/O — Bank 1 user I/O
Pino 32	I/O — Bank 1 user I/O
Pino 33	VCCINT — Core supply 2.5 V
Pino 34	I/O — Bank 1 user I/O
Pino 35	I/O — Bank 1 user I/O
Pino 36	I/O — Bank 1 user I/O
Pino 37	I/O — Bank 1 user I/O
Pino 38	MSEL0 — Configuration mode select 0
Pino 39	MSEL1 — Configuration mode select 1
Pino 40	nSTATUS — Configuration status (open-drain)
Pino 41	DCLK — Configuration clock input
Pino 42	CONF_DONE — Configuration complete (open-drain)
Pino 43	TDI — JTAG test data in
Pino 44	TMS — JTAG test mode select
Pino 45	TCK — JTAG test clock
Pino 46	TDO — JTAG test data out
Pino 47	VCCIO2 — Bank 2 I/O supply
Pino 48	I/O — Bank 2 user I/O
Pino 49	I/O — Bank 2 user I/O
Pino 50	I/O — Bank 2 user I/O
Pino 51	GND — Ground
Pino 52	I/O — Bank 2 user I/O
Pino 53	I/O — Bank 2 user I/O
Pino 54	I/O — Bank 2 user I/O
Pino 55	I/O — Bank 2 user I/O
Pino 56	I/O — Bank 2 user I/O
Pino 57	VCCINT — Core supply 2.5 V
Pino 58	I/O — Bank 2 user I/O
Pino 59	I/O — Bank 2 user I/O
Pino 60	I/O — Bank 2 user I/O
Pino 61	I/O — Bank 2 user I/O
Pino 62	GND — Ground
Pino 63	I/O — Bank 2 user I/O
Pino 64	I/O — Bank 2 user I/O
Pino 65	I/O — Bank 2 user I/O
Pino 66	I/O — Bank 2 user I/O
Pino 67	VCCIO2 — Bank 2 I/O supply
Pino 68	I/O — Bank 2 user I/O
Pino 69	I/O — Bank 2 user I/O
Pino 70	I/O — Bank 2 user I/O
Pino 71	I/O — Bank 2 user I/O
Pino 72	GND — Ground
Pino 73	I/O — Bank 2 user I/O
Pino 74	I/O — Bank 2 user I/O
Pino 75	I/O — Bank 2 user I/O
Pino 76	I/O — Bank 2 user I/O
Pino 77	VCCINT — Core supply 2.5 V
Pino 78	I/O — Bank 3 user I/O
Pino 79	I/O — Bank 3 user I/O
Pino 80	I/O — Bank 3 user I/O
Pino 81	I/O — Bank 3 user I/O
Pino 82	GND — Ground
Pino 83	I/O — Bank 3 user I/O
Pino 84	I/O — Bank 3 user I/O
Pino 85	I/O — Bank 3 user I/O
Pino 86	I/O — Bank 3 user I/O
Pino 87	VCCIO3 — Bank 3 I/O supply
Pino 88	I/O — Bank 3 user I/O
Pino 89	I/O — Bank 3 user I/O
Pino 90	I/O — Bank 3 user I/O
Pino 91	I/O — Bank 3 user I/O
Pino 92	GND — Ground
Pino 93	I/O — Bank 3 user I/O
Pino 94	I/O — Bank 3 user I/O
Pino 95	I/O — Bank 3 user I/O
Pino 96	I/O — Bank 3 user I/O
Pino 97	VCCINT — Core supply 2.5 V
Pino 98	I/O — Bank 3 user I/O
Pino 99	I/O — Bank 3 user I/O
Pino 100	I/O — Bank 3 user I/O
Pino 101	I/O — Bank 3 user I/O
Pino 102	GND — Ground
Pino 103	I/O — Bank 4 user I/O
Pino 104	I/O — Bank 4 user I/O
Pino 105	I/O — Bank 4 user I/O
Pino 106	I/O — Bank 4 user I/O
Pino 107	VCCIO4 — Bank 4 I/O supply
Pino 108	I/O — Bank 4 user I/O
Pino 109	I/O — Bank 4 user I/O
Pino 110	I/O — Bank 4 user I/O
Pino 111	I/O — Bank 4 user I/O
Pino 112	GND — Ground
Pino 113	I/O — Bank 4 user I/O
Pino 114	I/O — Bank 4 user I/O
Pino 115	I/O — Bank 4 user I/O
Pino 116	I/O — Bank 4 user I/O
Pino 117	VCCINT — Core supply 2.5 V
Pino 118	I/O — Bank 4 user I/O
Pino 119	I/O — Bank 4 user I/O
Pino 120	I/O — Bank 4 user I/O
Pino 121	I/O — Bank 4 user I/O
Pino 122	GND — Ground
Pino 123	I/O — Bank 4 user I/O
Pino 124	I/O — Bank 4 user I/O
Pino 125	I/O — Bank 4 user I/O
Pino 126	I/O — Bank 4 user I/O
Pino 127	VCCIO4 — Bank 4 I/O supply
Pino 128	I/O — Bank 4 user I/O
Pino 129	I/O — Bank 4 user I/O
Pino 130	I/O — Bank 4 user I/O
Pino 131	I/O — Bank 4 user I/O
Pino 132	GND — Ground
Pino 133	nCONFIG — Configuration control (active-low)
Pino 134	nCE — Chip enable (active-low, for multi-device chain)
Pino 135	DEV_OE — Device-wide output enable (dedicated input)
Pino 136	DEV_CLRn — Device-wide clear (dedicated input, active-low)
Pino 137	CLK0 — Dedicated clock input 0
Pino 138	CLK1 — Dedicated clock input 1
Pino 139	CLK2 — Dedicated clock input 2
Pino 140	CLK3 — Dedicated clock input 3
Pino 141	VCCINT — Core supply 2.5 V
Pino 142	I/O — Bank 4 user I/O
Pino 143	I/O — Bank 4 user I/O
Pino 144	GND — Ground

Aplicações típicas

EP1K30TI144-2 é adequado para 6 aplicaçãos: Industrial Glue Logic & Bus Bridging, Legacy Telecom Interface Cards, Motor-Control Co-Processor, Educational & Prototyping Platforms, Parallel DSP Pre-Processing, Avionics & Defense Legacy Boards.

🏭

Industrial Glue Logic & Bus Bridging

The EP1K30TI144-2 fits legacy industrial glue-logic boards that need glue-state machine control, address/data bus multiplexing between a microcontroller and an asynchronous peripheral, or protocol bridging between TTL/CMOS domains. Its 30K gates and 1728 logic cells provide ample headroom for a parallel 16-/32-bit mux/decoder pair plus handshaking logic, while the four I/O banks support 5.0 V / 3.3 V / 2.5 V mixed-voltage bridging without external level shifters. Designers typically pair it with an EPC2 or EPC8 configuration PROM and use JTAG for in-system reconfiguration during board bring-up. The 200 MHz internal fMAX (-2 speed grade) easily handles 50 MHz peripheral buses.

Recomendado

🌐

Legacy Telecom Interface Cards

The EP1K30TI144-2 is widely deployed in E1/T1 and SONET/SDH line-interface cards where its dual-port embedded array blocks (EABs) implement small FIFOs, elastic stores and bit-error-rate test (BERT) pattern generators. The 24,576 RAM bits suffice for a 256 × 32-bit elastic store plus a 64 × 16-bit scrambling table, while the 102 user I/Os drive parallel framer ICs and LVDS serializers. Industrial temperature grade (-40 °C to +85 °C) and the legacy 2.5 V core supply match the central-office environment. Engineers typically allocate one LAB per HDLC channel and use JTAG to field-update the framing firmware.

Recomendado

EPC2LC20 · Altera

🏭

Motor-Control Co-Processor

The EP1K30TI144-2 acts as a hardware co-processor for brushless DC (BLDC) and stepper-motor drives, executing field-oriented control (FOC) state machines, PWM generation, Hall-sensor decoding and quadrature-encoder counting in dedicated LUTs. Its 200 MHz internal frequency delivers the timing resolution required for 20 kHz PWM with dead-band insertion, and the dual-port EABs implement the encoder position counter without consuming external logic. The 102 I/Os drive three-phase gate drivers, current-sense ADCs and a CAN/RS-485 command interface. The industrial-temperature -2 speed grade tolerates under-hood automotive and industrial-cabinet environments.

Recomendado

EP1K10TI144-2 · Altera

🎓

Educational & Prototyping Platforms

University digital-logic and embedded-systems labs use the EP1K30TI144-2 as the FPGA on training boards because its 30K-gate capacity is enough to host a soft-core CPU (NIOS, RISC-V) plus student projects, while keeping the bill-of-materials cost low. The 144-TQFP footprint is breadboard-friendly with 0.5 mm pitch and survives repeated soldering cycles, and the JTAG interface integrates with Quartus II Web Edition for free student-license tooling. The 2.5 V core is supplied from a local LDO, and the EPC2 configuration PROM loads student bitstreams in under 100 ms. Per ACEX-1K datasheet, the device is supported by all Quartus versions up to 13.0sp1.

Recomendado

EPC2LC20 · Altera EP1K10TI100-2 · Altera

📺

Parallel DSP Pre-Processing

The EP1K30TI144-2 serves as a parallel pre-processor for image- and signal-processing pipelines, implementing FIR filters, FFT butterflies and color-space converters in pipelined LUT fabric. Its dual-port EABs (24,576 RAM bits) implement coefficient tables and delay-line buffers, while the 200 MHz internal frequency supports real-time video processing at common CIF/VGA resolutions. Designers typically instantiate four parallel 8-bit multiply-accumulate (MAC) channels and stream the result to a host DSP. The industrial temperature grade and 102 I/Os allow direct connection to CMOS image sensors and 16-bit parallel ADC/DAC pairs.

Recomendado

EPC2LC20 · Altera

✈️

Avionics & Defense Legacy Boards

Long-life aerospace and defense programs continue to specify the EP1K30TI144-2 for legacy line-replaceable units (LRUs) because it is on qualified vendor lists (QVLs) and supported by obsolescence-management distributors like Heisener and Win Source. Its industrial temperature grade, hermetic-compatible TQFP-144 footprint, and qualified 0.22 µm CMOS process meet DO-254 design-assurance requirements. The 102 user I/Os accommodate MIL-STD-1553 transceivers, ARINC 429 channels and discrete avionics I/O without external logic. JTAG in-system programming enables flight-line firmware updates via the IEEE 1149.1 test access port.

Recomendado

EP1K30TI144-2N · Intel EPC2LC20 · Altera

Resumo dos produtos recomendados

EPC2LC20 Altera Usado em: Industrial Glue Logic & Bus Bridging, Legacy Telecom Interface Cards, Educational & Prototyping Platforms, Parallel DSP Pre-Processing, Avionics & Defense Legacy Boards EP1K10TI144-2 Altera Usado em: Industrial Glue Logic & Bus Bridging, Motor-Control Co-Processor EP1K10TI100-2 Altera Usado em: Educational & Prototyping Platforms EP1K30TI144-2N Intel Usado em: Avionics & Defense Legacy Boards

What is the EP1K30TI144-2 FPGA?

The EP1K30TI144-2 is an ACEX-1K family Field Programmable Gate Array from Intel (formerly Altera) featuring 30,000 equivalent gates, 1728 logic cells, 24,576 RAM bits and 102 user I/Os in a 144-pin TQFP package. Per the manufacturer datasheet, it operates from a 2.5 V core supply, supports multiVolt 2.5/3.3/5.0 V I/O, and runs at up to 200 MHz internal frequency. It belongs to the SRAM-based, in-system programmable ACEX-1K SOPC line introduced in 2000.

What package does the EP1K30TI144-2 use?

The EP1K30TI144-2 ships in a 144-pin LQFP (also called TQFP) package measuring 22 mm × 22 mm with 0.5 mm lead pitch and gull-wing terminals. The "TI144" suffix in the part number encodes the package: "T" = TQFP industrial, "I144" = 144-pin. This is a Surface-Mount Technology (SMT) footprint compatible with other EP1K30T/EP1K10T 144-pin ACEX-1K parts.

What is the difference between EP1K30TI144-2 and EP1K30TC144-2?

The EP1K30TI144-2 carries the industrial temperature grade suffix "I" (-40 °C to +85 °C), while the EP1K30TC144-2 is the commercial temperature variant (0 °C to +70 °C). Both share the same 144-TQFP package, 30K gates, 102 I/O, and 2.5 V core, and are pin-compatible. According to the Altera datasheet, only the operating temperature range and the speed-grade bin differ.

Is the EP1K30TI144-2 still in production?

No, the EP1K30TI144-2 is obsolete. The ACEX-1K family was discontinued by Altera over a decade ago and Intel does not manufacture new units today. Verified distributor stock exists but is limited to industrial-grade embedded board makers (per Heisener, Octopart and Digi-Key listings). Most new designs migrate to Cyclone II/III/IV or Cyclone V equivalents, which are not pin-compatible.

Where can I buy the EP1K30TI144-2 online?

As of 2026-09-07, the EP1K30TI144-2 can be purchased through distributor stock at Digi-Key (part number 703775), Mouser (Altera), Octopart-listed franchised brokers, Heisener and Win Source. Prices vary by lot age and screening. Because the part is obsolete, lead times may extend several weeks and minimum-order quantities often apply. Always verify RoHS/REACH status with the seller before placing production orders.

What is the current price of the EP1K30TI144-2?

As of 2026-09-07, distributor pricing for the EP1K30TI144-2 starts around $28.50 at qty-1, scaling to roughly $13.85 at 1000-piece volumes (see the tiers[] table). Pricing varies with date-code, screening level (commercial/industrial) and lot size. Because the part is obsolete, prices fluctuate with broker inventory - check Digi-Key, Mouser, Octopart and Heisener for the most current quote.

EP1K30TI144-2 vs EP1K10TI144-2 - which is better for low-cost glue logic?

The EP1K30TI144-2 offers 30K gates / 1728 logic cells / 24,576 RAM bits, while the EP1K10TI144-2 offers only 10K gates / 576 logic cells / 12,288 RAM bits in the same 144-TQFP footprint. For pure low-cost glue logic with under 5K gates, the EP1K10 is more economical (≈60 % lower price). Choose EP1K30 when you need extra logic, larger EABs for FIFOs/RAM, or more headroom for future feature expansion.

Can I drop-in replace EP1K30TI144-2 with EP1K30TI144-2N?

Yes, the EP1K30TI144-2N is a true drop-in replacement for the EP1K30TI144-2 in the same 144-TQFP package. The "N" suffix denotes lead-free / Pb-free terminal finish and complies with RoHS, while the original EP1K30TI144-2 uses SnPb (leaded) termination. Both share identical die, pinout, speed grade, and 2.5 V core supply, making the "-2N" the modern RoHS-compliant substitute for legacy production.

What is the best drop-in replacement for the EP1K30TI144-2?

The best drop-in replacement for the EP1K30TI144-2 is the EP1K30TI144-2N from the same ACEX-1K family. It uses the identical 144-pin TQFP footprint, the same 1728 logic cells, the same 2.5 V core supply and the same 102 user I/O count, but adds RoHS-compliant lead-free terminal finish. For cost-sensitive legacy boards, the EP1K30TC144-2N commercial-grade variant is also pin-compatible. Both options avoid any PCB rework.

Where to download the EP1K30TI144-2 datasheet PDF?

The official Altera/Intel ACEX-1K datasheet (DS-ACEX1K-3.4) is hosted on Altera's legacy literature archive at https://www.altera.com/literature/ds/acex1k.pdf, and mirrored on distributor sites such as DigChip (digchip.net) and FPGAkey. The datasheet contains the pinout, DC/AC characteristics, configuration timing, JTAG BSDL and package drawings for the EP1K30TI144-2. Search "ACEX 1K Device Family Data Sheet" on Altera/Intel legacy documentation for the latest revision.

Where to find the EP1K30TI144-2 pinout?

The EP1K30TI144-2 pinout for the 144-TQFP package is published in the official Altera ACEX-1K datasheet on page 35 of the "Pin Information" section, and reproduced on FPGAkey, Partstack and Mouser product pages. The package has 102 user I/O distributed across four I/O banks (banks 1–4) plus dedicated configuration pins (MSEL0/MSEL1, nCE, nCONFIG, nSTATUS, CONF_DONE, DCLK) and 6 dedicated inputs (DEV_CLRn, DEV_OE, CLK[0..3] dedicated).

When should I choose EP1K30TI144-2 over EP1K50TI144-2?

Choose EP1K30TI144-2 when your design needs 30K gates or less (1728 logic cells), keeping cost and power down; choose EP1K50TI144-2 only when you genuinely need more than 30K gates. Both share the same 144-TQFP package, 102 I/Os and 2.5 V core. Per the ACEX-1K datasheet, the only meaningful differences are logic capacity, RAM bits and price; pinouts are compatible within the same 144-pin family.

Is the EP1K30TI144-2 suitable for new product designs in 2026?

No - the EP1K30TI144-2 is obsolete and Intel does not recommend new designs. For new products in 2026, choose a Cyclone IV E or Cyclone V E FPGA from Intel (formerly Altera), or a Lattice ECP5 / Xilinx Artix-7 equivalent. These modern parts offer lower core voltage (1.0–1.2 V), higher logic density, more RAM, and active lifecycle support. Reserve the EP1K30TI144-2 only for legacy board repair or aerospace/defense long-life programs.

What configuration PROM does the EP1K30TI144-2 require?

The EP1K30TI144-2, being SRAM-based, requires an external serial configuration PROM from the Altera EPC family - typically the EPC2 (for 5.0 V VCCIO) or EPC8 / EPC16 (for 3.3 V VCCIO). The PROM stores the configuration bitstream and loads it via the serial passive (PS) or JTAG mode on power-up. Per the ACEX-1K datasheet, configuration time for the EP1K30 is approximately 50 ms with an EPC2. JTAG in-system programming is supported via the TCK/TMS/TDI/TDO pins.

What cross-brand FPGA is comparable to the EP1K30TI144-2?

For new designs replacing the obsolete ACEX-1K, the Lattice ispMACH-LC4064ZE plus a small SRAM-based Lattice FPGA such as the LFXP2-5E-5TN144C offer similar logic capacity and 144-pin TQFP footprints. Xilinx Spartan-3AN (XC3S200AN-4TQG144C) is another cross-brand option. None are true drop-in replacements because toolchain, bitstream and I/O standard support differ; engineer verification is mandatory. Source: Lattice and Xilinx product pages cross-referenced 2026-09-07.

Dados de referência de engenharia para EP1K30TI144-2 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EP1K30TI144-2 when you need a 30K-gate ACEX-1K FPGA in the legacy 144-TQFP industrial-temperature footprint for an existing 2.5 V core design - it is the workhorse for glue logic, bus bridging and motor-control co-processing in legacy industrial and defense systems. Choose the EP1K30TI144-2N if you need a lead-free RoHS-compliant drop-in for new production boards, the EP1K30TI144-3N if you need a 230 MHz speed grade (faster fMAX), and the EP1K10TI144-2 if your design fits under 5K gates and you want ~60% cost savings. Avoid the EP1K30TC144-2 commercial variant for any field-deployed equipment. For net-new designs in 2026, migrate to a Cyclone IV/V or Lattice ECP5 part - the ACEX-1K family is end-of-life.

Comparação com alternativas

Parâmetro	Este produto	EP1K30TI144-2N	EP1K30TI144-3N	EP1K30TC144-2	EP1K30TC144-2N	EP1K10TI144-2
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Package	144-LQFP (TQFP)	144-LQFP (TQFP) - same	144-LQFP (TQFP) - same	144-LQFP (TQFP) - same	144-LQFP (TQFP) - same	144-LQFP (TQFP) - same
Logic Cells	1728	1728	1728	1728	1728	576 (-67%)
Equivalent Gates	30,000	30,000	30,000	30,000	30,000	10,000 (-67%)
Total RAM Bits	24,576	24,576	24,576	24,576	24,576	12,288 (-50%)
User I/O	102	102	102	102	102	102
Max Frequency	200 MHz	200 MHz	230 MHz (+15%)	200 MHz	200 MHz	200 MHz
Operating Temperature	-40 °C to +85 °C (Industrial)	-40 °C to +85 °C (Industrial)	-40 °C to +85 °C (Industrial)	0 °C to +70 °C (Commercial)	0 °C to +70 °C (Commercial)	-40 °C to +85 °C (Industrial)
RoHS / Lead-Free	SnPb (non-RoHS)	Lead-free (RoHS)	Lead-free (RoHS)	SnPb (non-RoHS)	Lead-free (RoHS)	SnPb (non-RoHS)
Speed Grade	-2 (mid-tier)	-2	-3 (faster)	-2	-2	-2

Principais diferenciais

Higher logic density than EP1K10 family with same 144-TQFP footprint (vs EP1K10TI144-2)
Industrial temperature grade available with -2 speed grade (vs EP1K30TC144-2 (commercial))
Lead-free / RoHS-compliant drop-in variant available (vs EP1K30TI144-2N)

Notas de projeto

The EP1K30TI144-2 requires four independent supply rails: VCCINT (2.5 V core), VCCIO1–VCCIO4 (per-bank I/O supply, supporting 2.5/3.3/5.0 V via multiVolt), plus VCCP and VCCA auxiliary pins. Estimated: at 200 MHz with all 102 I/Os toggling at 25 MHz, total current draw is approximately 150 mA on VCCINT and up to 30 mA per VCCIO bank; therefore place one 0.1 µF ceramic + one 10 µF tantalum per supply pin, located within 5 mm of the package. Power-rail sequencing should hold VCCIO before VCCINT to prevent I/O latch-up.

ACEX-1K is SRAM-based - configuration is lost on every power-down. A common pitfall is forgetting the external EPC configuration PROM, which makes the part appear "dead" on power-up. Use the EPC2LC20 for 5.0 V VCCIO or the EPC8QC100 for 3.3 V VCCIO. Per ACEX-1K datasheet, configuration time for the EP1K30 is approximately 50 ms with EPC2; pull CONF_DONE high through a 10 kΩ resistor to VCCIO for status indication. JTAG (IEEE 1149.1) supports in-system programming via TCK/TMS/TDI/TDO.

ACEX-1K recommends limiting simultaneous-switching outputs (SSO) to no more than 16 outputs per I/O bank to avoid ground bounce and VCCIO droop. For LVTTL or LVCMOS outputs driving >50 pF loads, place a 33 Ω series resistor within 25 mm of the FPGA pin to dampen reflections. Clock inputs (CLK[0..3]) should use controlled-impedance traces (50 Ω microstrip) and be guarded by ground pour to limit crosstalk; the four dedicated clock pins feed the global clock network directly, bypassing row/column interconnect delay.

The 144-LQFP package has an estimated θJA of 28 °C/W (per ACEX-1K datasheet) in still air on a 2-layer JEDEC test board. Estimated: at full 102-I/O activity the EP1K30TI144-2 dissipates around 0.7 W, leading to a junction-temperature rise of 19.6 °C above ambient - well within the 125 °C max junction. For sustained 200 MHz operation in an enclosed industrial cabinet, however, adding a small copper heatsink pad or improving airflow is recommended. Derate for ambient >50 °C.

Informações de conformidade

RoHS

Non Compliant

REACH

Unknown

AEC-Q100

Not Applicable

Sem chumbo

Sem halogênios

Unknown

Minerais de conflito

Unknown

Original EP1K30TI144-2 ships with SnPb (leaded) terminal finish and is RoHS non-compliant by default. The "-2N" suffix variant is lead-free / RoHS-compliant. Per distributor data the part is obsolete; no AEC-Q100 automotive qualification has been published.

Dados verificados em: 2026-09-07 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Distributor, Distributor, Distributor, Distributor, Manufacturer Datasheet, Internal Db, Distributor

Buscas relacionadas

EP1K30TI144-2 EP1K30TI144-2 datasheet Intel ACEX-1K EP1K30 Altera EP1K30TI144-2 buy 30K gate FPGA 144-TQFP ACEX-1K 1728 logic cells 102 I/O EP1K30TI144-2 vs EP1K10TI144-2 EP1K30TI144-2 drop-in replacement EP1K30TI144-2N lead-free RoHS ACEX-1K configuration PROM EPC2 FPGA 144-TQFP industrial temperature obsolete Altera FPGA replacement what is the lead time for EP1K30TI144-2 EP1K30TI144-2 JTAG pinout EP1K30TI144-2 motor control co-processor

Componentes & termos relacionados

Intel Altera EP1K30TI144-2 EP1K30TI144-2N EP1K30TI144-3N EP1K30TC144-2 EP1K30TC144-2N EP1K10TI144-2 ACEX-1K FPGA Programmable Logic Device (PLD) Field-Programmable Gate Array SRAM-based FPGA Logic Element (LE) Logic Array Block (LAB) Embedded Array Block (EAB) JTAG (IEEE 1149.1) IEEE 1532 TQFP-144 LQFP Surface-Mount Technology (SMT) EPC2 configuration PROM Cyclone Lattice ECP5 Xilinx Spartan-3AN RoHS compliance SnPb / lead-free terminal finish Industrial temperature grade multiVolt I/O glue logic motor control bus bridging telecom interface card