EPM570T100C5 - MAX II CPLD, 440 Macrocells, 100TQFP | Intel
部品番号: EPM570T100C5 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.25 | $112.50 |
| 100 | $9.85 | $985.00 |
| 500 | $8.4 | $4,200.00 |
| 1,000 | $7.1 | $7,100.00 |
EPM570T100C5 概要
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the instant-on behavior of PAL/GAL architecture with high-density macrocell arrays, sitting hierarchically between simple PLDs and FPGAs in the programmable logic taxonomy: PLD -> CPLD -> FPGA -> programmable logic -> semiconductor. MAX II devices target glue-logic, bus-interface, I/O expansion, and power-sequencing roles where deterministic timing, low standby power, and instant-on configuration are required.
Key features include 76 user I/O pins, multi-voltage I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) through banked VCCIO pins, 8 Kbits of user Flash memory, and a built-in Joint Test Action Group (JTAG) boundary-scan test interface compliant with IEEE 1149.1. The device supports in-system programmability through the JTAG port, allowing field upgrades without removing the part from the board.
Typical applications include bus-interface bridging (for example, address decoding between microcontrollers and external peripherals), I/O expansion, power-supply sequencing in multi-rail systems, and glue-logic replacement for legacy discrete 74-series TTL/CMOS logic. The MAX II instant-on, non-volatile configuration makes the EPM570T100C5 particularly suitable for safety-critical and industrial systems that cannot tolerate FPGA configuration delays at power-up.
This page synthesizes distributor pricing, drop-in alternatives within the MAX II family, and practical design notes that complement the manufacturer datasheet, helping engineers evaluate the EPM570T100C5 against newer MAX V / MAX 10 options.
ドロップイン代替品: EPM570T100C5 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPM570T100C5 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Family, Process Technology, Programming Interface.
クイック比較ツール — 並列比較する代替部品を選択:
EPM570T100C5N
✅ ドロップイン✓ 在庫あり
$10.2 / 個
データシートを見る →EPM570T100C4
✅ ドロップイン✓ 在庫あり
$9.4 / 個
データシートを見る →EPM570T100C4N
✅ ドロップイン✓ 在庫あり
$9.05 / 個
データシートを見る →EPM570T100I5N
✅ ドロップイン✓ 在庫あり
$12.49 / 個
データシートを見る →EPM570T100A5N
✅ ドロップイン✓ 在庫あり
$6.72 / 個
データシートを見る →EPM570T100I5
✅ ドロップイン✓ 在庫あり
$7.25 / 個
データシートを見る →EPM570T10015
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$7.95 / 個
データシートを見る →EPM570T100C5 最大定格＆電気的特性
| Series | MAX II |
| Family | MAX II CPLD |
| Logic Elements | 570 |
| Macrocells | 440 |
| Maximum User I/O Pins | 76 |
| Propagation Delay (tpd) | 5.4 ns (max) |
| Maximum Frequency | 201.1 MHz |
| Process Technology | 0.18 µm |
| Internal Supply Voltage | 2.5 V / 3.3 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| User Flash Memory | 8 Kbits |
| パッケージ | TQFP-100 (14x14 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | 0°C to 85°C (TJ) |
| Programming Interface | JTAG (IEEE 1149.1) ISP |
| RoHS ステータス | Compliant |
EPM570T100C5 ピン構成
| ピン 1 | I/O — User I/O pin (bank 1) |
| ピン 2 | I/O — User I/O pin (bank 1) |
| ピン 3 | I/O — User I/O pin (bank 1) |
| ピン 4 | I/O — User I/O pin (bank 1) |
| ピン 5 | I/O — User I/O pin (bank 1) |
| ピン 6 | VCCIO1 — I/O bank 1 supply voltage |
| ピン 7 | I/O — User I/O pin (bank 1) |
| ピン 8 | I/O — User I/O pin (bank 1) |
| ピン 9 | I/O — User I/O pin (bank 1) |
| ピン 10 | I/O — User I/O pin (bank 1) |
| ピン 11 | GND — Ground |
| ピン 12 | I/O — User I/O pin (bank 1) |
| ピン 13 | I/O — User I/O pin (bank 1) |
| ピン 14 | I/O — User I/O pin (bank 1) |
| ピン 15 | I/O — User I/O pin (bank 1) |
| ピン 16 | I/O — User I/O pin (bank 1) |
| ピン 17 | VCCIO1 — I/O bank 1 supply voltage |
| ピン 18 | I/O — User I/O pin (bank 1) |
| ピン 19 | I/O — User I/O pin (bank 1) |
| ピン 20 | I/O — User I/O pin (bank 1) |
| ピン 21 | I/O — User I/O pin (bank 1) |
| ピン 22 | I/O — User I/O pin (bank 1) |
| ピン 23 | I/O — User I/O pin (bank 1) |
| ピン 24 | GND — Ground |
| ピン 25 | I/O — User I/O pin (bank 1) |
| ピン 26 | TMS — JTAG Test Mode Select |
| ピン 27 | TCK — JTAG Test Clock |
| ピン 28 | TDI — JTAG Test Data In |
| ピン 29 | TDO — JTAG Test Data Out |
| ピン 30 | GND — Ground |
| ピン 31 | I/O — User I/O pin (bank 2) |
| ピン 32 | I/O — User I/O pin (bank 2) |
| ピン 33 | I/O — User I/O pin (bank 2) |
| ピン 34 | VCCIO2 — I/O bank 2 supply voltage |
| ピン 35 | I/O — User I/O pin (bank 2) |
| ピン 36 | I/O — User I/O pin (bank 2) |
| ピン 37 | I/O — User I/O pin (bank 2) |
| ピン 38 | I/O — User I/O pin (bank 2) |
| ピン 39 | I/O — User I/O pin (bank 2) |
| ピン 40 | GND — Ground |
| ピン 41 | I/O — User I/O pin (bank 2) |
| ピン 42 | I/O — User I/O pin (bank 2) |
| ピン 43 | I/O — User I/O pin (bank 2) |
| ピン 44 | VCCIO2 — I/O bank 2 supply voltage |
| ピン 45 | I/O — User I/O pin (bank 2) |
| ピン 46 | I/O — User I/O pin (bank 2) |
| ピン 47 | I/O — User I/O pin (bank 2) |
| ピン 48 | I/O — User I/O pin (bank 2) |
| ピン 49 | I/O — User I/O pin (bank 2) |
| ピン 50 | GND — Ground |
| ピン 51 | I/O — User I/O pin (bank 3) |
| ピン 52 | I/O — User I/O pin (bank 3) |
| ピン 53 | I/O — User I/O pin (bank 3) |
| ピン 54 | I/O — User I/O pin (bank 3) |
| ピン 55 | VCCIO3 — I/O bank 3 supply voltage |
| ピン 56 | I/O — User I/O pin (bank 3) |
| ピン 57 | I/O — User I/O pin (bank 3) |
| ピン 58 | I/O — User I/O pin (bank 3) |
| ピン 59 | I/O — User I/O pin (bank 3) |
| ピン 60 | I/O — User I/O pin (bank 3) |
| ピン 61 | GND — Ground |
| ピン 62 | I/O — User I/O pin (bank 3) |
| ピン 63 | I/O — User I/O pin (bank 3) |
| ピン 64 | I/O — User I/O pin (bank 3) |
| ピン 65 | I/O — User I/O pin (bank 3) |
| ピン 66 | VCCIO3 — I/O bank 3 supply voltage |
| ピン 67 | I/O — User I/O pin (bank 3) |
| ピン 68 | I/O — User I/O pin (bank 3) |
| ピン 69 | I/O — User I/O pin (bank 3) |
| ピン 70 | I/O — User I/O pin (bank 3) |
| ピン 71 | I/O — User I/O pin (bank 3) |
| ピン 72 | GND — Ground |
| ピン 73 | I/O — User I/O pin (bank 4) |
| ピン 74 | I/O — User I/O pin (bank 4) |
| ピン 75 | I/O — User I/O pin (bank 4) |
| ピン 76 | VCCINT — Internal core supply voltage (2.5V/3.3V) |
| ピン 77 | I/O — User I/O pin (bank 4) |
| ピン 78 | I/O — User I/O pin (bank 4) |
| ピン 79 | I/O — User I/O pin (bank 4) |
| ピン 80 | I/O — User I/O pin (bank 4) |
| ピン 81 | I/O — User I/O pin (bank 4) |
| ピン 82 | GND — Ground |
| ピン 83 | I/O — User I/O pin (bank 4) |
| ピン 84 | I/O — User I/O pin (bank 4) |
| ピン 85 | I/O — User I/O pin (bank 4) |
| ピン 86 | VCCIO4 — I/O bank 4 supply voltage |
| ピン 87 | I/O — User I/O pin (bank 4) |
| ピン 88 | I/O — User I/O pin (bank 4) |
| ピン 89 | I/O — User I/O pin (bank 4) |
| ピン 90 | I/O — User I/O pin (bank 4) |
| ピン 91 | I/O — User I/O pin (bank 4) |
| ピン 92 | GND — Ground |
| ピン 93 | I/O — User I/O pin (bank 4) |
| ピン 94 | I/O — User I/O pin (bank 4) |
| ピン 95 | I/O — User I/O pin (bank 4) |
| ピン 96 | I/O — User I/O pin (bank 4) |
| ピン 97 | VCCIO4 — I/O bank 4 supply voltage |
| ピン 98 | I/O — User I/O pin (bank 4) |
| ピン 99 | I/O — User I/O pin (bank 4) |
| ピン 100 | I/O — User I/O pin (bank 4) |
主な用途
EPM570T100C5 の用途: 7 件s: Bus Interface Bridging and Address Decoding, I/O Expansion and Level Translation, Power Supply Sequencing and Supervisory Logic, Industrial Control and Factory Automation, Legacy TTL/CMOS Logic Replacement, Display and Video Interface Bridging, Telecom Backplane Glue Logic.
Bus Interface Bridging and Address Decoding
The EPM570T100C5 is widely used as a glue-logic bridge between microcontrollers, DSPs, and external peripherals where deterministic address decoding is required. With 440 macrocells, 5.4 ns tpd, and 76 user I/O pins, the device can decode complex memory-mapped address spaces across multiple bus widths in a single 100-pin TQFP. Compared to discrete 74-series TTL logic, the CPLD consolidates decode, latch, and bus-control functions into one non-volatile part, reducing board area and improving noise immunity. Designers typically implement chip-select generation, wait-state insertion, and bus arbitration logic, then program via JTAG in-circuit. The instant-on Flash configuration eliminates FPGA-style boot delays, which is critical for safety-critical systems that must respond at power-up.
おすすめ
I/O Expansion and Level Translation
With multi-voltage I/O banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V signaling through user-configurable VCCIO pins, the EPM570T100C5 acts as a bidirectional level translator and I/O expander between mixed-voltage domains. Engineers use it to add GPIOs to microcontrollers or to interface 1.8 V mobile processors with 3.3 V peripherals without external level-shifter ICs. The 5.4 ns tpd supports most serial and parallel protocols up to several hundred MHz in non-return-to-zero mode, and 76 user I/Os give ample headroom for expanding bus width. Combined with JTAG-based ISP, the design can be reconfigured in the field to add or change voltage mappings, which is valuable in long-lifecycle industrial products.
おすすめ
Power Supply Sequencing and Supervisory Logic
The MAX II CPLD's instant-on non-volatile configuration and deterministic timing make the EPM570T100C5 well suited for multi-rail power-supply sequencing in systems with strict rail-order requirements. Designers implement state machines that assert PG (power-good) and EN signals in the correct order, monitor fault inputs, and generate reset pulses to downstream processors. The 5.4 ns tpd guarantees predictable sequencing delays regardless of firmware boot state, and the JTAG interface allows post-build programming via standard boundary-scan tools. In a typical 6-rail ATX or telecom system the CPLD replaces several discrete supervisory ICs and a microcontroller, reducing BOM cost and improving reliability by eliminating firmware dependencies in the power path.
おすすめ
Industrial Control and Factory Automation
In factory automation systems the EPM570T100C5 implements deterministic glue logic between PLC backplanes, sensor arrays, and motor-control subsystems. Its 0°C to 85°C commercial temperature range suits most indoor control cabinets, while the industrial-grade EPM570T100I5N sibling extends coverage to -40°C to 100°C for outdoor or unconditioned enclosures. Engineers use the 440 macrocells to implement proprietary fieldbus decoding, encoder interface logic, and safety-interlock handling with hard real-time guarantees that software-based PLCs cannot match. The non-volatile Flash configuration also eliminates the risk of configuration loss in electrically noisy industrial environments where FPGA SRAM-based configuration memory could be corrupted.
おすすめ
Legacy TTL/CMOS Logic Replacement
A common application for the EPM570T100C5 is consolidating dozens of legacy 74LS, 74HC, and 74F-series TTL gates into a single programmable device, reducing PCB area and modernizing obsolete designs. With 440 macrocells each capable of implementing multiple equivalent gates, the CPLD can replace 20-50 discrete SSI/MSI packages, freeing board space for new functionality. The 100-pin TQFP footprint provides 76 user I/Os, sufficient for most drop-in retrofits, and JTAG-based ISP lets engineers iterate design changes without hand-wiring rework. Designers also benefit from the ability to add new logic functions (state machines, counters, decoders) that were impractical in pure discrete TTL.
おすすめ
Display and Video Interface Bridging
The EPM570T100C5 handles video and LCD interface bridging tasks such as converting parallel RGB to LVDS, generating timing-controller (TCON) signals, and synchronizing multi-panel display clusters. With a 201.1 MHz maximum frequency and 5.4 ns tpd, the device supports pixel clocks for resolutions up to approximately XGA at moderate refresh rates. Its 76 I/O pins accommodate 18/24-bit RGB buses plus control signals, and the multi-voltage I/O banks allow direct connection to both 1.8 V mobile-display panels and 3.3 V legacy TFT drivers. Engineers frequently pair it with small FPGAs to offload deterministic glue logic, freeing FPGA resources for image processing.
おすすめ
Telecom Backplane Glue Logic
Telecom backplanes rely on the EPM570T100C5 for low-level glue logic such as clock distribution control, TDM bus multiplexing, and Hot-Swap controller interfacing across multiple line cards. The instant-on, non-volatile MAX II configuration is critical because backplane management logic must be active before any firmware boots. With 440 macrocells and 76 I/Os, the device can interface with multiple E1/T1 framer ICs, EEPROM-based ID memories, and I2C/SPI management buses simultaneously. The commercial 0°C-85°C range suits temperature-controlled central-office environments, while the JTAG ISP interface simplifies board bring-up and field diagnostics.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPM570T100C5 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPM570T100C5N | EPM570T100C4 | EPM570T100C4N | EPM570T100I5N | EPM570T100A5N | EPM570T100I5 | EPM570T10015 |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-100 (14x14 mm) | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/O Pins | 76 | 76 | 76 | 76 | 76 | 76 | 76 | 76 |
主な差別化要因
- Non-volatile Flash configuration enables instant-on, no boot PROM required （vs Small SRAM-based FPGAs (e.g., Cyclone IV))
- Multi-voltage I/O banks (1.5 V / 1.8 V / 2.5 V / 3.3 V) without external level shifters （vs Discrete 74-series TTL translators)
- Pin-compatible speed-grade migration within MAX II family （vs EPM570T100C4 (4.5 ns tpd))
設計ノート
The EPM570T100C5 requires two supply rails: VCCINT (2.5 V or 3.3 V internal core) and one or more VCCIO bank rails (1.5 V / 1.8 V / 2.5 V / 3.3 V per bank). Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the package pin, and add a bulk 10 µF tantalum or ceramic capacitor near the device. Each VCCIO bank pin should have its own 0.1 µF + 1 µF decoupling pair. Power-supply ramp time must be monotonic and within the datasheet-specified tRAMP to avoid configuration-memory corruption.
Route JTAG signals (TMS, TCK, TDI, TDO) with impedance-controlled traces and keep them short (<50 mm if possible). Place a 10 kΩ pull-up on TCK and TDI, and a 10 kΩ pull-up on TMS to keep the JTAG state machine in a defined state at power-up. The TQFP-100 thermal pad (if present on the package variant) should be soldered to a copper pour to improve thermal dissipation, although the MAX II device dissipates well under 500 mW in typical glue-logic use cases.
Do not apply input signals to user I/O pins before VCCINT and the corresponding VCCIO bank have ramped up, as this can trigger latch-up or cause long-term reliability degradation. Always include a JTAG chain-in and chain-out header even on production boards for in-field reprogramming. When migrating from the C5 to the C4 speed grade, verify that the Quartus II fitter reports no new timing violations, since the faster device may expose setup/hold paths that were masked at the slower speed grade.
コンプライアンス情報
The base EPM570T100C5 (without 'N' suffix) is supplied with SnPb (leaded) plating and is not RoHS compliant; the EPM570T100C5N variant is Pb-free and RoHS compliant. The device is not AEC-Q100 qualified; for automotive applications use the industrial-grade EPM570T100I5N with appropriate derating.
