N25Q256A13E12A0F - 256Mb SPI NOR Flash, 108MHz | Micron
部品番号: N25Q256A13E12A0F ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
N25Q256A13E12A0F 概要
Serial NOR Flash is a nonvolatile memory category within the flash memory hierarchy (NOR Flash -> serial NOR Flash -> SPI Flash -> nonvolatile semiconductor memory). Unlike parallel NOR or NAND Flash, serial NOR devices communicate over a compact SPI bus (with single, dual, and quad I/O modes in this Multiple I/O family), which dramatically reduces pin count, PCB area, and routing complexity. This makes SPI NOR Flash the de facto standard for code storage (XIP, execute-in-place) next to microcontrollers, FPGAs, and networking processors.
Key differentiating features of the N25Q256A13E12A0F include its 256Mb density, 108 MHz SPI clock rate (enabling quad I/O transfers for high read throughput), 4KB sector erase granularity for efficient in-field firmware updates, and an industrial-to-automotive-adjacent -40C to +125C operating range. The 24-ball T-PBGA (6x8) footprint keeps the memory close to the host processor for signal integrity at high clock rates.
Technically, the device is part of the Micron N25Q Multiple I/O Serial Flash family, which adds dual-output/dual-I/O and quad-output/quad-I/O SPI commands on top of standard single-I/O SPI. The 4KB sector organization (as stated in the 3V, 256Mb Multiple I/O Serial Flash datasheet) allows fine-grained erase before program, which is important for parameter storage blocks that coexist with a large boot image. SLC architecture provides higher endurance and wider temperature margin than multi-level cell alternatives.
Typical applications include FPGA configuration storage, BIOS/UEFI boot code in embedded x86 platforms, firmware storage in industrial drives and networking line cards, and automotive infotainment clusters needing reliable code execution over temperature.
Design consideration: for execute-in-place at 108 MHz, keep SPI traces short and matched; for maximum throughput in code-shadowing scenarios, prefer quad I/O commands so effective read bandwidth approaches four times the single-I/O SPI rate.
This page synthesizes distributor availability data, cross-reference findings, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: N25Q256A13E12A0F — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: N25Q256A13E12A0F （同一形状・フットプリント） — 相違点: Package, Interface, Memory Type, Packaging, Supply Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
N25Q064A13E12A0F
✅ ドロップイン✓ 在庫あり
$2.85 / 個
データシートを見る →N25Q128A13E12A0F
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2.52 / 個
データシートを見る →N25Q128A13ESEA0F
✅ ドロップイン✓ 在庫あり
$1.65 / 個
データシートを見る →N25Q064A13ESEA0F
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →N25Q032A13EF4A0F
✅ ドロップイン✓ 在庫あり
$1.25 / 個
データシートを見る →N25Q256A13E12A0F 最大定格＆電気的特性
| メモリタイプ | NOR Flash, Serial SPI |
| Density | 256 Mbit (32 MB) |
| メモリ構成 | 64M x 4 (Mouser listing); 32M x 8 per FindIC listing - see validation note |
| 電源電圧 | 2.7 V to 3.6 V |
| Max SPI Clock Frequency | 108 MHz |
| I/O Modes | Single, Dual, Quad I/O (Multiple I/O Serial Flash) |
| Technology | SLC (Single-Level Cell) |
| Sector Erase Size | 4 KB |
| パッケージ | 24-ball T-PBGA (6x8 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +125C |
| Access Time | 8 ns (per FindIC listing) |
| RoHS ステータス | Compliant |
| Packaging | Tape & Reel (TR suffix) |
N25Q256A13E12A0F 24-ball t-pbga (6x8 mm) ピン配置ガイド
N25Q256A13E12A0F (24-ball t-pbga (6x8 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: N25Q256A13E12A0F.
詳細は データシート をご参照ください。
主な用途
N25Q256A13E12A0F の用途: 6 件s: FPGA Configuration Storage, BIOS/UEFI Boot Firmware Storage, Industrial Networking Line Cards, Automotive-Adjacent Infotainment and Clusters, Embedded Drive and SSD Controller Firmware, IoT Gateways and Smart Industrial Sensors.
FPGA Configuration Storage
The N25Q256A13E12A0F stores FPGA bitstreams for high-density devices, where its 256Mb capacity accommodates multiple configuration images plus partial-reconfiguration partitions. Quad I/O mode at the 108 MHz maximum clock compresses configuration time versus single-I/O SPI, reducing the visible power-on latency of the system. In the circuit, the Flash connects directly to the FPGA's dedicated configuration SPI master through short, length-matched traces; the 24-ball T-PBGA (6x8 mm) footprint allows placement within a few millimeters of the FPGA ball field. Its 4KB sector erase supports fine-grained update of a golden-image region without erasing the active bitstream, improving field-update reliability.
おすすめ
BIOS/UEFI Boot Firmware Storage
Embedded x86 and ARM server platforms use serial NOR Flash for BIOS/UEFI code, and the N25Q256A13E12A0F's 32MB capacity fits modern firmware images that include UEFI drivers, option ROMs, and recovery partitions. The 2.7V-3.6V supply integrates directly with the platform's 3.3V rail, and quad I/O at up to 108 MHz speeds POST-time code shadowing into DRAM. SLC technology provides the high endurance needed for frequent BIOS settings rewrites in the 4KB sectors reserved for NVRAM variables. The -40C to +125C rating covers uncontrolled server-room and edge-computing thermal environments where commercial-grade parts would be marginal.
おすすめ
Industrial Networking Line Cards
Switch, router, and industrial Ethernet line cards store firmware, MAC/PHY configuration, and logs in serial NOR Flash; the N25Q256A13E12A0F fits this role with 256Mb of SLC storage and a 108 MHz quad-I/O interface for fast boot of management processors. The -40C to +125C operating range satisfies industrial temperature requirements for factory-floor and outdoor telecom cabinets. The 4KB sector erase architecture lets networking firmware maintain a small parameter/log region alongside the main code image without wholesale image erasure, extending useful life. The 24-ball T-PBGA reflow-solderable package withstands industrial assembly and vibration profiles.
おすすめ
Automotive-Adjacent Infotainment and Clusters
Digital instrument clusters and infotainment head units require nonvolatile code storage that survives automotive thermal profiles; the N25Q256A13E12A0F's -40C to +125C rating addresses these environments for infotainment-adjacent (non-safety-critical) storage. Its 256Mb SLC capacity holds graphics boot code, fonts, and calibration tables, while quad SPI at 108 MHz supports quick logo-to-display boot times that clusters demand. Designers should confirm the specific qualification level required by their OEM; where AEC-Q100 certification is contractual, the corresponding Micron automotive-qualified variant must be selected instead of this industrial-grade part.
おすすめ
Embedded Drive and SSD Controller Firmware
Storage controllers in embedded SSDs and industrial drives keep boot firmware and firmware-update images in external serial NOR Flash. The N25Q256A13E12A0F provides 256Mb, enough for dual-bank firmware schemes enabling safe over-the-air controller updates with rollback. SLC endurance in 4KB sectors supports frequent logging of drive health and wear data. The 2.7V-3.6V supply matches standard 3.3V drive rails, and the small 24-ball T-PBGA (6x8 mm) package fits on dense controller boards where board area is at a premium. Quad I/O shortens controller startup, reducing perceived drive latency at system power-on.
おすすめ
IoT Gateways and Smart Industrial Sensors
IoT gateways aggregate sensor data and require reliable local code and certificate storage; the N25Q256A13E12A0F's 32MB SLC array holds the gateway OS bootloader, TLS certificates, and update staging images. The 108 MHz quad-I/O interface accelerates secure-boot verification, and the 4KB sector granularity enables fine-grained management of small certificate and configuration objects without erasing the main image. The -40C to +125C range supports unheated enclosures in smart-factory and outdoor deployments. Its reflow-compatible 24-ball T-PBGA package suits standard automated assembly lines used in volume IoT hardware production.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: N25Q256A13E12A0F — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | N25Q064A13E12A0F | N25Q128A13E12A0F | N25Q128A13ESEA0F | N25Q064A13ESEA0F | N25Q032A13EF4A0F |
|---|---|---|---|---|---|---|
| Package | 24-ball T-PBGA (6x8 mm) | 24-ball T-PBGA (6x8 mm) - same footprint | 24-ball T-PBGA (6x8 mm) - same footprint | N25Q family T-PBGA - verify suffix | N25Q family T-PBGA - verify suffix | N25Q family - verify EF4 package suffix |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 256 Mbit (32 MB) | 64 Mbit (8 MB) | 128 Mbit (16 MB) | 128 Mbit (16 MB) | 64 Mbit (8 MB) | 32 Mbit (4 MB) |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Density Match for 32MB Images | Yes (native) | No - 8 MB only | No - 16 MB only | No - 16 MB only | No - 8 MB only | No - 4 MB only |
主な差別化要因
- 4x the capacity of the same-footprint 64Mb option （vs N25Q064A13E12A0F)
- Extended -40C to +125C operation （vs N25Q064A13E12A0F)
- SLC reliability with 4KB sector granularity （vs N25Q128A13E12A0F)
設計ノート
At the 108 MHz maximum SPI clock, treat the quad-I/O bus (SCK, CS#, DQ0-DQ3) as a moderately fast digital interface: keep traces under ~50 mm where possible, maintain ground reference continuity, and series-terminate the clock if ringing is observed. The 24-ball T-PBGA's short internal bond wires help, but via stubs and connectorized SPI routing can degrade eyes at full speed. If long traces are unavoidable, verify timing margin at 54 MHz as a fallback and confirm the host controller supports the reduced clock without driver changes.
Decouple VCC with at least 100 nF ceramic directly at the ball-side via pair plus a 4.7 uF bulk capacitor per device. Program and erase operations draw current bursts well above the read current; shared 3.3V rails with sensitive analog circuitry may see droop during 4KB sector erase. Confirm exact ICC program/erase figures in the Micron datasheet (not stated in the retrieved listing data) before finalizing rail budgeting, and sequence power so VCC is stable before the first chip-select assertion to avoid undefined command states.
Above 16MB, the full 32MB array requires 4-byte addressing; many legacy SPI host controllers default to 3-byte addressing and silently wrap addresses at 16MB, corrupting images in the upper half. Verify your controller or bootloader enables 4-byte address mode (or uses the appropriate extended-address register commands) before committing the design. Also match the exact temperature-grade suffix when ordering substitutes: variants with different suffix codes may be rated only to +85C even though the footprint is identical.
コンプライアンス情報
RoHS compliance stated on Ampheo distributor listing ('24-ball T-PBGA, RoHS'). REACH, lead-free, halogen-free, and conflict-minerals declarations were not present in the verified data; request certificates from Micron.
