SPC5601PEF0MLL6 - 32-bit Power Arch MCU, 192KB Flash, 100-LQFP | NXP
部品番号: SPC5601PEF0MLL6 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $13.2346 | $13.23 |
| 10 | $12.1 | $121.00 |
| 100 | $10.95 | $1,095.00 |
| 500 | $9.85 | $4,925.00 |
| 1,000 | $8.75 | $8,750.00 |
SPC5601PEF0MLL6 概要
A 32-bit MCU (microcontroller unit) is a single-chip computer that combines a processor core, program and data memory, and a rich set of on-chip peripherals. Within NXP's automotive portfolio it belongs to the MPC56xx Qorivva family, which targets chassis, body, and industrial real-time control. SPC5601PEF0MLL6 specifically uses the Power Architecture e200z0h core - a single-issue, in-order 32-bit RISC core tuned for deterministic interrupt response, making it a step up in performance from legacy 16-bit MCUs in the same chassis-electronics design space.
Key features include 192 KB on-chip Flash with ECC, 12 KB SRAM, 79 general-purpose I/O pins, and an integrated peripheral set: DMA, PWM, watchdog, POR (power-on reset), and a connectivity block combining CAN, LIN, SCI (UART), and SPI. The device supports single 5 V supply operation typical of automotive body controllers, and the 100-LQFP package offers a thermally efficient 14x14 mm footprint with a JEDEC-compatible reflow profile (peak 260C). The -40C to +125C operating range and AEC-Q100-style qualification make it automotive-grade.
Typical applications include automotive chassis control (electric power steering, suspension, braking sensor fusion), body-electronics modules (BCM, lighting, HVAC), industrial drives, and safety-relevant sensor preprocessing. The combination of CAN/LIN connectivity and a deterministic e200z0h core makes the part especially well suited to act as a sub-MCU in zonal architectures, offloading deterministic tasks from a central vehicle computer.
When designing with this device, ensure that the 5 V supply ramp meets the POR thresholds and place the decoupling network (typically 100 nF + 1 uF) within 5 mm of the VDD pins. Use the on-chip DMA to offload SPI and CAN transactions from the core when targeting deterministic interrupt latency under load. Verify toolchain compatibility with NXP's SPC5Studio IDE and PowerPC GCC before committing firmware.
ドロップイン代替品: SPC5601PEF0MLL6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: SPC5601PEF0MLL6 （同一形状・フットプリント） — 相違点: Connectivity, Core Processor, RAM Size, Core Size, Maximum Clock Frequency.
クイック比較ツール — 並列比較する代替部品を選択:
SPC5602BF2MLL6
✅ ドロップイン✓ 在庫あり
$5.59 / 個
データシートを見る →SPC5644AF0MLU2
✅ ドロップイン✓ 在庫あり
$12.5 / 個
データシートを見る →SPC5602BK0MLL6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SPC5746BSK1MKU2
✅ ドロップイン✓ 在庫あり
$17.25 / 個
データシートを見る →SPC5601PEF0MLL6 最大定格＆電気的特性
| Core Processor | e200z0h (Power Architecture) |
| Core Size | 32-Bit Single-Core |
| Core Architecture | Power Architecture, single-issue, in-order |
| Speed (Max) | 64 MHz |
| Program Memory Size (Flash) | 192 KB (192K x 8) |
| RAM Size | 12 KB |
| Connectivity | CANbus, LINbus, SCI (UART), SPI |
| Peripherals | DMA, POR, PWM, WDT (Watchdog) |
| Number of I/O | 79 |
| パッケージ / ケース | 100-LQFP (14x14 mm) |
| 実装タイプ | Surface Mount |
| Terminal Form | GULL WING |
| Peak Reflow Temperature | 260C (JEDEC lead-free profile) |
| 動作温度範囲 | -40C to +125C |
| Grade | Automotive Grade (AEC-Q100) |
| Series / Family | MPC56xx Qorivva |
| RoHS ステータス | Compliant (lead-free per package datasheet) |
SPC5601PEF0MLL6 100-lqfp (14x14 mm) ピン配置ガイド
SPC5601PEF0MLL6 (100-lqfp (14x14 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: SPC5601PEF0MLL6.
詳細は データシート をご参照ください。
主な用途
SPC5601PEF0MLL6 の用途: 7 件s: Automotive Chassis Control Module, Body Control Module (BCM), Industrial Sensor Hub / Field I/O Node, Automotive LIN Slave Node, Battery Management Sub-Controller (Sub-MCU), Drone / UAV Flight Controller (Safety-Limited), HVAC Actuator Module.
Automotive Chassis Control Module
The SPC5601PEF0MLL6 fits automotive chassis modules - electric power steering, suspension, and brake sensor fusion - where deterministic interrupt response and CAN/LIN connectivity are mandatory. The e200z0h core at 64 MHz executes chassis-control loops with predictable timing, while the on-chip PWM block drives actuator references and the DMA offloads sensor-bus traffic without CPU stalls. The 100-LQFP package and -40C to +125C operating range support under-hood and chassis-mounted ECU placement, and 192 KB Flash accommodates bootloader plus communication stacks.
おすすめ
Body Control Module (BCM)
The SPC5601PEF0MLL6 is well matched to body-electronics modules controlling lighting, HVAC, mirrors, and wipers. Its CAN/LIN connectivity integrates directly with vehicle multiplexing networks, while 79 GPIO drive LEDs, relays, and switch inputs without external expanders. The 192 KB Flash is sized for typical BCM application code plus bootloader, and 12 KB SRAM is sufficient for stack and small diagnostic buffers. The 5 V supply tolerance typical of the MPC56xx family simplifies design versus lower-voltage rails used elsewhere.
おすすめ
Industrial Sensor Hub / Field I/O Node
For industrial sensor hubs and field I/O nodes, the SPC5601PEF0MLL6 supplies the deterministic compute, RS232/RS485-class SCI communications, and PWM outputs required for closed-loop control and instrumentation aggregation. Its 64 MHz e200z0h core handles multi-rate sampling loops comfortably, while the on-chip DMA moves SPI-burst sensor data without interrupting control tasks. The -40C to +125C operating range supports deployment inside unshielded industrial cabinets; 79 GPIO often eliminates the need for an external I/O expander.
おすすめ
Automotive LIN Slave Node
The SPC5601PEF0MLL6 is a natural fit for LIN-bus slave nodes in window lifters, seat controllers, and mirror modules, where cost and footprint dominate. Its integrated SCI block drives LIN through an external transceiver, the PWM block directly controls motors, and the watchdog timer supports the LIN-specified fault-detection timing. The 100-LQFP's 14x14 mm footprint is appropriate for distributed zonal ECUs, and 192 KB Flash supports ISO 17987 LIN conformance plus diagnostic routines.
おすすめ
Battery Management Sub-Controller (Sub-MCU)
In zonal battery-management architectures, the SPC5601PEF0MLL6 acts as a sub-MCU performing cell-balancing and local monitoring before forwarding aggregated telemetry over CAN to a central BMS host. The e200z0h core's deterministic interrupt handling ensures precise cell-voltage sampling windows, while DMA offloads SPI ADC reads. The 192 KB Flash stores look-up tables and balancing algorithms, and 12 KB SRAM holds sample buffers between transmissions.
おすすめ
Drone / UAV Flight Controller (Safety-Limited)
For cost- and safety-limited UAV flight controllers and tethered-drone ESCs, the SPC5601PEF0MLL6 offers the deterministic timing, automotive-grade temperature range, and PWM channels required for brushless motor control. Its 64 MHz e200z0h core runs classic PID loops at kilohertz rates, and the on-chip DMA minimizes jitter on sensor-bus reads. Designers targeting FAA-relevant safety cases should however verify the part's qualification status for the chosen UAV category and consider higher-end SPC57 or Aurix parts for level-A failure coverage.
おすすめ
HVAC Actuator Module
The SPC5601PEF0MLL6 serves as a tightly integrated HVAC actuator controller, driving blower motors and damper servos via PWM while reading temperature and pressure inputs via SPI/ADC. Its 79 GPIO support multiple airflow sensors and mode-position feedback switches without external multiplexers. AEC-Q100 automotive qualification and the -40C to +125C operating range cover cabin and underhood HVAC placements, and 192 KB Flash accommodates both legacy and modern CAN-based HVAC command sets.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: SPC5601PEF0MLL6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | SPC5602BF2MLL6 | SPC5644AF0MLU2 | SPC5602BK0MLL6 | SPC5746BSK1MKU2 |
|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP - same | 100-LQFP - same | 100-LQFP - same | 100-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | e200z0h (Power Architecture) | e200z0h (Power Architecture) | e200z4 (Power Architecture, higher-perf) | e200z0h (Power Architecture) | e200z4 (Power Architecture, lockstep) |
| Speed (Max) | 64 MHz | 64 MHz | 60-80 MHz | 64 MHz | Up to 200 MHz class |
| Flash Size | 192 KB | Larger Flash in family | Larger Flash | Comparable in MPC56xx family | Multi-MB Flash tier |
| RAM Size | 12 KB | Larger SRAM in family | Larger SRAM | Comparable in MPC56xx family | Multi-MB SRAM tier |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Connectivity | CAN, LIN, SCI, SPI | CAN, LIN, SCI, SPI | CAN, LIN, SCI, SPI, FlexRay | CAN, LIN, SCI, SPI | CAN-FD, LIN, FlexRay, Ethernet |
| Grade | Automotive (AEC-Q100) | Automotive (AEC-Q100) | Automotive (AEC-Q100) | Automotive (AEC-Q100) | Automotive ASIL-D capable |
| Unit Price (qty 1, USD) | 13.23 | Higher tier (more Flash) | Higher tier | Comparable tier | Substantially higher (premium tier) |
主な差別化要因
- Lowest-cost MPC56xx 100-LQFP option with e200z0h core （vs SPC5602BF2MLL6)
- Predictable deterministic core for hard real-time loops （vs SPC5746BSK1MKU2)
- Power Architecture ecosystem with mature automotive toolchain （vs MC9S12DT128MPVE (HCS12 family))
設計ノート
Decouple the VDD and VDDA pins with 100 nF + 1 uF ceramic capacitor pairs placed within 5 mm of the package pins, matching NXP MPC56xx layout guidelines. The POR block is sensitive to slow or noisy supply ramps; ensure VDD reaches the nominal value within the published rise-time spec, otherwise the device may enter or exit reset unpredictably. Use a bulk 10 uF or larger tantalum/polymer cap at the regulator output for transient load events on motor-driven rails.
Route the CAN/LIN/SPI buses with characteristic impedances appropriate for the ECU harness (typically 100-120 ohm differential for CAN). Keep oscillator traces short and symmetric, place the crystal near the XTAL pins with a guard ring tied to ground, and avoid routing switching signals across the analog supply islands. Maintain a continuous ground plane under the MCU and stitch vias around the LQFP perimeter for thermal dissipation.
The SPC5601PEF0MLL6's 12 KB SRAM is the tightest resource when adding Ethernet or large diagnostic buffers - plan firmware partitioning to leave headroom. Do not assume that 'AEC-Q100 automotive grade' equals 'ASIL-D capable'; the SPC5601 family supports QM / ASIL-A safety levels only - use SPC5746 or Aurix TC2xx for ASIL-C / D. Verify the toolchain (SPC5Studio, GCC, Green Hills) version is on NXP's validated list before committing to production firmware.
At 64 MHz with typical automotive IO toggling, the SPC5601PEF0MLL6 dissipation in the 100-LQFP is modest, but inside a sealed ECU without airflow the junction temperature can rise significantly. Apply the JEDEC EIA/JESD51 thermal resistance values for 100-LQFP and derate to ambient + 20C; consider adding copper pours on the PCB top layer to spread heat and improve Theta_JA. For harsh environments validate with a thermocouple or thermal camera during functional test.
コンプライアンス情報
AEC-Q100 qualified per NXP automotive-grade family positioning per https://www.nxp.com/part/SPC5601PEF0MLL6; however the SPC5601 family supports QM / ASIL-A safety levels only. Halogen-free status not explicitly stated in verified data; mark unknown.