SPC5601PEF0MLL6 - 32-bit Power Arch MCU, 192KB Flash, 100-LQFP | NXP
料号： SPC5601PEF0MLL6 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $13.2346 | $13.23 |
| 10 | $12.1 | $121.00 |
| 100 | $10.95 | $1,095.00 |
| 500 | $9.85 | $4,925.00 |
| 1,000 | $8.75 | $8,750.00 |
SPC5601PEF0MLL6 概述
A 32-bit MCU (microcontroller unit) is a single-chip computer that combines a processor core, program and data memory, and a rich set of on-chip peripherals. Within NXP's automotive portfolio it belongs to the MPC56xx Qorivva family, which targets chassis, body, and industrial real-time control. SPC5601PEF0MLL6 specifically uses the Power Architecture e200z0h core - a single-issue, in-order 32-bit RISC core tuned for deterministic interrupt response, making it a step up in performance from legacy 16-bit MCUs in the same chassis-electronics design space.
Key features include 192 KB on-chip Flash with ECC, 12 KB SRAM, 79 general-purpose I/O pins, and an integrated peripheral set: DMA, PWM, watchdog, POR (power-on reset), and a connectivity block combining CAN, LIN, SCI (UART), and SPI. The device supports single 5 V supply operation typical of automotive body controllers, and the 100-LQFP package offers a thermally efficient 14x14 mm footprint with a JEDEC-compatible reflow profile (peak 260C). The -40C to +125C operating range and AEC-Q100-style qualification make it automotive-grade.
Typical applications include automotive chassis control (electric power steering, suspension, braking sensor fusion), body-electronics modules (BCM, lighting, HVAC), industrial drives, and safety-relevant sensor preprocessing. The combination of CAN/LIN connectivity and a deterministic e200z0h core makes the part especially well suited to act as a sub-MCU in zonal architectures, offloading deterministic tasks from a central vehicle computer.
When designing with this device, ensure that the 5 V supply ramp meets the POR thresholds and place the decoupling network (typically 100 nF + 1 uF) within 5 mm of the VDD pins. Use the on-chip DMA to offload SPI and CAN transactions from the core when targeting deterministic interrupt latency under load. Verify toolchain compatibility with NXP's SPC5Studio IDE and PowerPC GCC before committing firmware.
直接替换替代料： SPC5601PEF0MLL6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： SPC5601PEF0MLL6 （相同外形与封装尺寸） ——差异在于 Connectivity, Core Processor, RAM Size, Core Size, Maximum Clock Frequency.
快速对比工具——选择替代料号进行并排对比：
SPC5602BF2MLL6
✅ 直接替换✓ 有现货
$5.59 / 个
查看数据手册 →SPC5644AF0MLU2
✅ 直接替换✓ 有现货
$12.5 / 个
查看数据手册 →SPC5602BK0MLL6
✅ 直接替换📋 参考替代料（不在目录中）
SPC5746BSK1MKU2
✅ 直接替换✓ 有现货
$17.25 / 个
查看数据手册 →SPC5601PEF0MLL6 最大额定值与电气特性
| Core Processor | e200z0h (Power Architecture) |
| Core Size | 32-Bit Single-Core |
| Core Architecture | Power Architecture, single-issue, in-order |
| Speed (Max) | 64 MHz |
| Program Memory Size (Flash) | 192 KB (192K x 8) |
| RAM Size | 12 KB |
| Connectivity | CANbus, LINbus, SCI (UART), SPI |
| Peripherals | DMA, POR, PWM, WDT (Watchdog) |
| Number of I/O | 79 |
| 封装 / 外壳 | 100-LQFP (14x14 mm) |
| 安装类型 | Surface Mount |
| Terminal Form | GULL WING |
| Peak Reflow Temperature | 260C (JEDEC lead-free profile) |
| 工作温度范围 | -40C to +125C |
| Grade | Automotive Grade (AEC-Q100) |
| Series / Family | MPC56xx Qorivva |
| RoHS 状态 | Compliant (lead-free per package datasheet) |
SPC5601PEF0MLL6 100-lqfp (14x14 mm) 引脚配置指南
SPC5601PEF0MLL6（100-lqfp (14x14 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： SPC5601PEF0MLL6.
请参阅 数据手册 以查看完整引脚配置。
典型应用
SPC5601PEF0MLL6 适用于 7 应用s: Automotive Chassis Control Module, Body Control Module (BCM), Industrial Sensor Hub / Field I/O Node, Automotive LIN Slave Node, Battery Management Sub-Controller (Sub-MCU), Drone / UAV Flight Controller (Safety-Limited), HVAC Actuator Module.
Automotive Chassis Control Module
The SPC5601PEF0MLL6 fits automotive chassis modules - electric power steering, suspension, and brake sensor fusion - where deterministic interrupt response and CAN/LIN connectivity are mandatory. The e200z0h core at 64 MHz executes chassis-control loops with predictable timing, while the on-chip PWM block drives actuator references and the DMA offloads sensor-bus traffic without CPU stalls. The 100-LQFP package and -40C to +125C operating range support under-hood and chassis-mounted ECU placement, and 192 KB Flash accommodates bootloader plus communication stacks.
推荐
Body Control Module (BCM)
The SPC5601PEF0MLL6 is well matched to body-electronics modules controlling lighting, HVAC, mirrors, and wipers. Its CAN/LIN connectivity integrates directly with vehicle multiplexing networks, while 79 GPIO drive LEDs, relays, and switch inputs without external expanders. The 192 KB Flash is sized for typical BCM application code plus bootloader, and 12 KB SRAM is sufficient for stack and small diagnostic buffers. The 5 V supply tolerance typical of the MPC56xx family simplifies design versus lower-voltage rails used elsewhere.
推荐
Industrial Sensor Hub / Field I/O Node
For industrial sensor hubs and field I/O nodes, the SPC5601PEF0MLL6 supplies the deterministic compute, RS232/RS485-class SCI communications, and PWM outputs required for closed-loop control and instrumentation aggregation. Its 64 MHz e200z0h core handles multi-rate sampling loops comfortably, while the on-chip DMA moves SPI-burst sensor data without interrupting control tasks. The -40C to +125C operating range supports deployment inside unshielded industrial cabinets; 79 GPIO often eliminates the need for an external I/O expander.
推荐
Automotive LIN Slave Node
The SPC5601PEF0MLL6 is a natural fit for LIN-bus slave nodes in window lifters, seat controllers, and mirror modules, where cost and footprint dominate. Its integrated SCI block drives LIN through an external transceiver, the PWM block directly controls motors, and the watchdog timer supports the LIN-specified fault-detection timing. The 100-LQFP's 14x14 mm footprint is appropriate for distributed zonal ECUs, and 192 KB Flash supports ISO 17987 LIN conformance plus diagnostic routines.
推荐
Battery Management Sub-Controller (Sub-MCU)
In zonal battery-management architectures, the SPC5601PEF0MLL6 acts as a sub-MCU performing cell-balancing and local monitoring before forwarding aggregated telemetry over CAN to a central BMS host. The e200z0h core's deterministic interrupt handling ensures precise cell-voltage sampling windows, while DMA offloads SPI ADC reads. The 192 KB Flash stores look-up tables and balancing algorithms, and 12 KB SRAM holds sample buffers between transmissions.
推荐
Drone / UAV Flight Controller (Safety-Limited)
For cost- and safety-limited UAV flight controllers and tethered-drone ESCs, the SPC5601PEF0MLL6 offers the deterministic timing, automotive-grade temperature range, and PWM channels required for brushless motor control. Its 64 MHz e200z0h core runs classic PID loops at kilohertz rates, and the on-chip DMA minimizes jitter on sensor-bus reads. Designers targeting FAA-relevant safety cases should however verify the part's qualification status for the chosen UAV category and consider higher-end SPC57 or Aurix parts for level-A failure coverage.
推荐
HVAC Actuator Module
The SPC5601PEF0MLL6 serves as a tightly integrated HVAC actuator controller, driving blower motors and damper servos via PWM while reading temperature and pressure inputs via SPI/ADC. Its 79 GPIO support multiple airflow sensors and mode-position feedback switches without external multiplexers. AEC-Q100 automotive qualification and the -40C to +125C operating range cover cabin and underhood HVAC placements, and 192 KB Flash accommodates both legacy and modern CAN-based HVAC command sets.
推荐
推荐产品汇总
工程参考数据： SPC5601PEF0MLL6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | SPC5602BF2MLL6 | SPC5644AF0MLU2 | SPC5602BK0MLL6 | SPC5746BSK1MKU2 |
|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP - same | 100-LQFP - same | 100-LQFP - same | 100-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | e200z0h (Power Architecture) | e200z0h (Power Architecture) | e200z4 (Power Architecture, higher-perf) | e200z0h (Power Architecture) | e200z4 (Power Architecture, lockstep) |
| Speed (Max) | 64 MHz | 64 MHz | 60-80 MHz | 64 MHz | Up to 200 MHz class |
| Flash Size | 192 KB | Larger Flash in family | Larger Flash | Comparable in MPC56xx family | Multi-MB Flash tier |
| RAM Size | 12 KB | Larger SRAM in family | Larger SRAM | Comparable in MPC56xx family | Multi-MB SRAM tier |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Connectivity | CAN, LIN, SCI, SPI | CAN, LIN, SCI, SPI | CAN, LIN, SCI, SPI, FlexRay | CAN, LIN, SCI, SPI | CAN-FD, LIN, FlexRay, Ethernet |
| Grade | Automotive (AEC-Q100) | Automotive (AEC-Q100) | Automotive (AEC-Q100) | Automotive (AEC-Q100) | Automotive ASIL-D capable |
| Unit Price (qty 1, USD) | 13.23 | Higher tier (more Flash) | Higher tier | Comparable tier | Substantially higher (premium tier) |
关键差异点
- Lowest-cost MPC56xx 100-LQFP option with e200z0h core （对比 SPC5602BF2MLL6)
- Predictable deterministic core for hard real-time loops （对比 SPC5746BSK1MKU2)
- Power Architecture ecosystem with mature automotive toolchain （对比 MC9S12DT128MPVE (HCS12 family))
设计说明
Decouple the VDD and VDDA pins with 100 nF + 1 uF ceramic capacitor pairs placed within 5 mm of the package pins, matching NXP MPC56xx layout guidelines. The POR block is sensitive to slow or noisy supply ramps; ensure VDD reaches the nominal value within the published rise-time spec, otherwise the device may enter or exit reset unpredictably. Use a bulk 10 uF or larger tantalum/polymer cap at the regulator output for transient load events on motor-driven rails.
Route the CAN/LIN/SPI buses with characteristic impedances appropriate for the ECU harness (typically 100-120 ohm differential for CAN). Keep oscillator traces short and symmetric, place the crystal near the XTAL pins with a guard ring tied to ground, and avoid routing switching signals across the analog supply islands. Maintain a continuous ground plane under the MCU and stitch vias around the LQFP perimeter for thermal dissipation.
The SPC5601PEF0MLL6's 12 KB SRAM is the tightest resource when adding Ethernet or large diagnostic buffers - plan firmware partitioning to leave headroom. Do not assume that 'AEC-Q100 automotive grade' equals 'ASIL-D capable'; the SPC5601 family supports QM / ASIL-A safety levels only - use SPC5746 or Aurix TC2xx for ASIL-C / D. Verify the toolchain (SPC5Studio, GCC, Green Hills) version is on NXP's validated list before committing to production firmware.
At 64 MHz with typical automotive IO toggling, the SPC5601PEF0MLL6 dissipation in the 100-LQFP is modest, but inside a sealed ECU without airflow the junction temperature can rise significantly. Apply the JEDEC EIA/JESD51 thermal resistance values for 100-LQFP and derate to ambient + 20C; consider adding copper pours on the PCB top layer to spread heat and improve Theta_JA. For harsh environments validate with a thermocouple or thermal camera during functional test.
合规信息
AEC-Q100 qualified per NXP automotive-grade family positioning per https://www.nxp.com/part/SPC5601PEF0MLL6; however the SPC5601 family supports QM / ASIL-A safety levels only. Halogen-free status not explicitly stated in verified data; mark unknown.