STM32H745IIT6 - 480MHz Dual-Core M7/M4 MCU, 2MB Flash | ST
Référence : STM32H745IIT6 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $16.75 | $16,75 |
| 10 | $15.41 | $154,10 |
| 100 | $13.36 | $1 336,00 |
| 500 | $11.84 | $5 920,00 |
| 1 000 | $10.62 | $10 620,00 |
STM32H745IIT6 Présentation
What is a dual-core Cortex-M7/M4 MCU? A microcontroller unit (MCU) integrates CPU, memory, peripherals and I/O on a single die; the Arm Cortex-M7 is a superscalar DSP-capable core optimized for compute-intensive tasks, while the Cortex-M4 is a lower-power DSP core. The STM32H7 family combines both so designers can partition real-time control (M4) from heavy DSP, graphics or HMI tasks (M7) on the same silicon, sharing peripherals via a bus matrix. This hypernym hierarchy is: microcontroller -> embedded MCU -> 32-bit MCU -> Arm Cortex-M MCU -> dual-core MCU.
Key features of this device include a 16-bit ADC (3.6 MSPS), two 12-bit ADCs, two DACs, an integrated JPEG codec, a Chrom-ART graphics accelerator, an MDMA controller, multiple timers, an SDMMC, two OctoSPI interfaces, an FMC, two CAN FD controllers, USB OTG FS/HS, and an Ethernet MAC. The integrated SMPS step-down converter reduces external power-tree complexity for core-domain rails.
Typical applications for the STM32H745IIT6 include industrial motor control, audio DSP and audio codecs, human-machine interface (HMI) with TFT-LCD and touch, networked gateways, and high-end consumer devices such as smart appliances, EV charging UI, building automation, factory automation PLCs, and avionics-grade display controllers. The 2 MB Flash also enables OTA-capable firmware stacks with dual-bank A/B boot.
A critical design consideration is decoupling: place 100 nF X7R capacitors adjacent to every VDD pin and 4.7 µF bulk caps on the SMPS output. Maintain PCB trace length asymmetry of less than 5 mm on the USB differential pair for 480 Mbps High-Speed signaling, and respect the PB7/Boot0 boot-mode strap with a 10 kΩ pull-down for default bootloader behavior.
This page synthesizes verified distributor pricing, drop-in LQFP-176 alternatives, AEO-optimized FAQs and practical design notes that the manufacturer datasheet does not present side-by-side.
Alternatives de remplacement direct pour STM32H745IIT6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec STM32H745IIT6 (même facteur de forme et même empreinte) — différant par Package, ADC, Flash Memory, Communication Interfaces, DAC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
STM32H745IIK6
✅ Remplacement direct✓ En stock
$12.6 / unité
Voir la fiche technique →STM32H743IIT6
✅ Remplacement direct✓ En stock
$12 / unité
Voir la fiche technique →STM32H750IIT6
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
STM32H730IBK6Q
✅ Remplacement direct✓ En stock
$8.1 / unité
Voir la fiche technique →STM32F767IIT6
✅ Remplacement direct✓ En stock
$11.95 / unité
Voir la fiche technique →STM32H745IIT6 Valeurs maximales et caractéristiques électriques
| Core Architecture | Dual-core Arm Cortex-M7 + Cortex-M4 with FPU |
| M7 Maximum Clock Frequency | 480 MHz |
| M4 Maximum Clock Frequency | 240 MHz |
| Flash Memory | 2 MB (dual-bank, with secure sector) |
| SRAM (Total) | 1 MB (192 KB DTCM/AXI + 64 KB DTCM for M4 + 462 KB system SRAM + 4 KB backup) |
| Operating Voltage Range | 1.62 V to 3.6 V |
| Boîtier | 176-pin LQFP (24x24 mm) |
| Type de montage | Surface Mount |
| Plage de température de fonctionnement | -40 °C to +85 °C (industrial grade) |
| ADC | 16-bit ADC (3.6 MSPS) + two 12-bit ADCs |
| DAC | Two 12-bit DACs |
| Graphics Accelerator | Chrom-ART (DMA2D) |
| Communication Interfaces | USB OTG FS+HS, 2 × CAN FD, Ethernet MAC, SDMMC, 2 × OctoSPI, FMC, USART/UART/SPI/I2C/LPUART |
| Timers | Advanced-control, general-purpose, basic, low-power timers (see datasheet for full list) |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
| Supply Source | Internal SMPS + LDO regulators |
Configuration des broches de STM32H745IIT6
| Broche 1 | PE2 — GPIO PE2 / TRACECLK / FSMC_A23 / TIM9_CH1 |
| Broche 2 | PE3 — GPIO PE3 / TRACED0 / FSMC_A19 / TIM9_CH2 |
| Broche 3 | PE4 — GPIO PE4 / TRACED1 / FSMC_A20 / TIM9_CH3 |
| Broche 4 | PE5 — GPIO PE5 / TRACED2 / FSMC_A21 / TIM9_CH4 |
| Broche 5 | PE6 — GPIO PE6 / TRACED3 / FSMC_A22 |
| Broche 6 | VBAT — Backup battery supply for RTC and backup registers |
| Broche 7 | PC13 — GPIO PC13 / TAMPER1 / RTC_TS |
| Broche 8 | PC14 — GPIO PC14 / OSC32_IN / LSE crystal |
| Broche 9 | PC15 — GPIO PC15 / OSC32_OUT / LSE crystal |
| Broche 10 | VREF+ — ADC/DAC positive reference voltage |
| Broche 11 | VDDA — Analog supply for ADC/DAC (1.62 V to 3.6 V) |
| Broche 12 | PA0 — GPIO PA0 / WKUP1 / ADC1_INP16 / TIM5_CH1 |
| Broche 13 | PA1 — GPIO PA1 / ADC1_INP17 / TIM5_CH2 |
| Broche 14 | PA2 — GPIO PA2 / ADC1_INP18 / USART2_TX |
| Broche 15 | PA3 — GPIO PA3 / ADC1_INP19 / USART2_RX |
| Broche 16 | VSS — Ground |
| Broche 17 | VDD — Digital supply (1.62 V to 3.6 V) |
| Broche 18 | PA4 — GPIO PA4 / DAC1_OUT1 / ADC1_INP20 |
| Broche 19 | PA5 — GPIO PA5 / DAC1_OUT2 / ADC1_INP21 |
| Broche 20 | PA6 — GPIO PA6 / ADC1_INP22 / TIM13_CH1 |
| Broche 21 | PA7 — GPIO PA7 / ADC1_INP23 / TIM14_CH1 |
| Broche 22 | PC4 — GPIO PC4 / ADC1_INP4 |
| Broche 23 | PC5 — GPIO PC5 / ADC1_INP8 |
| Broche 24 | PB0 — GPIO PB0 / ADC1_INP9 / TIM3_CH3 |
| Broche 25 | PB1 — GPIO PB1 / ADC1_INP5 / TIM3_CH4 |
| Broche 26 | PB2 — GPIO PB2 / SAI1_SD_A / TIM3_CH1 |
| Broche 27 | PF11 — GPIO PF11 / FMC_NRAS |
| Broche 28 | PF12 — GPIO PF12 / FMC_A6 |
| Broche 29 | VSS — Ground |
| Broche 30 | VDD — Digital supply (1.62 V to 3.6 V) |
| Broche 31 | PF13 — GPIO PF13 / FMC_A7 |
| Broche 32 | PF14 — GPIO PF14 / FMC_A8 |
| Broche 33 | PF15 — GPIO PF15 / FMC_A9 |
| Broche 34 | PG0 — GPIO PG0 / FMC_A10 |
| Broche 35 | PG1 — GPIO PG1 / FMC_A11 |
| Broche 36 | PE7 — GPIO PE7 / FMC_D4 / TIM1_ETR |
| Broche 37 | PE8 — GPIO PE8 / FMC_D5 / TIM1_CH1N |
| Broche 38 | PE9 — GPIO PE9 / FMC_D6 / TIM1_CH1 |
| Broche 39 | VSS — Ground |
| Broche 40 | VDD — Digital supply (1.62 V to 3.6 V) |
| Broche 41 | PE10 — GPIO PE10 / FMC_D7 / TIM1_CH2N |
| Broche 42 | PE11 — GPIO PE11 / FMC_D8 / TIM1_CH2 |
| Broche 43 | PE12 — GPIO PE12 / FMC_D9 / TIM1_CH3N |
| Broche 44 | PE13 — GPIO PE13 / FMC_D10 / TIM1_CH3 |
| Broche 45 | PE14 — GPIO PE14 / FMC_D11 / TIM1_CH4 |
| Broche 46 | PE15 — GPIO PE15 / FMC_D12 / TIM1_BKIN |
| Broche 47 | PB10 — GPIO PB10 / I2C2_SCL / USART3_TX |
| Broche 48 | PB11 — GPIO PB11 / I2C2_SDA / USART3_RX |
| Broche 49 | VCAP — Core regulator decoupling (1.0 V core) |
| Broche 50 | VDD — Digital supply |
| Broche 51 | PB12 — GPIO PB12 / SPI2_NSS / I2S2_WS |
| Broche 52 | PB13 — GPIO PB13 / SPI2_SCK / I2S2_CK |
| Broche 53 | PB14 — GPIO PB14 / SPI2_MISO / TIM12_CH1 |
| Broche 54 | PB15 — GPIO PB15 / SPI2_MOSI / TIM12_CH2 |
| Broche 55 | PD8 — GPIO PD8 / USART3_TX / FMC_D13 |
| Broche 56 | PD9 — GPIO PD9 / USART3_RX / FMC_D14 |
| Broche 57 | PD10 — GPIO PD10 / FMC_D15 |
| Broche 58 | PD11 — GPIO PD11 / USART3_CTS / FMC_A16 |
| Broche 59 | PD12 — GPIO PD12 / USART3_RTS / FMC_A17 |
| Broche 60 | PD13 — GPIO PD13 / TIM4_CH2 / FMC_A18 |
| Broche 61 | VSS — Ground |
| Broche 62 | VDD — Digital supply |
| Broche 63 | PD14 — GPIO PD14 / TIM4_CH3 / FMC_D0 |
| Broche 64 | PD15 — GPIO PD15 / TIM4_CH4 / FMC_D1 |
| Broche 65 | PG2 — GPIO PG2 / FMC_A12 |
| Broche 66 | PG3 — GPIO PG3 / FMC_A13 |
| Broche 67 | PG4 — GPIO PG4 / FMC_A14 |
| Broche 68 | PG5 — GPIO PG5 / FMC_A15 |
| Broche 69 | PG6 — GPIO PG6 / LTDC_R7 |
| Broche 70 | PG7 — GPIO PG7 / LTDC_CLK |
| Broche 71 | PG8 — GPIO PG8 / LTDC_G7 |
| Broche 72 | VSS — Ground |
| Broche 73 | VDD — Digital supply |
| Broche 74 | PC6 — GPIO PC6 / TIM3_CH1 / USART6_TX |
| Broche 75 | PC7 — GPIO PC7 / TIM3_CH2 / USART6_RX |
| Broche 76 | PC8 — GPIO PC8 / TIM3_CH3 / USART6_CK |
| Broche 77 | PC9 — GPIO PC9 / TIM3_CH4 / I2C3_SDA |
| Broche 78 | PA8 — GPIO PA8 / TIM1_CH1 / USART1_CK |
| Broche 79 | PA9 — GPIO PA9 / TIM1_CH2 / USART1_TX |
| Broche 80 | PA10 — GPIO PA10 / TIM1_CH3 / USART1_RX |
| Broche 81 | PA11 — GPIO PA11 / TIM1_CH4 / USB_FS_DM |
| Broche 82 | PA12 — GPIO PA12 / TIM1_ETR / USB_FS_DP |
| Broche 83 | PA13 — GPIO PA13 / JTMS / SWDIO |
| Broche 84 | VCAP — Core regulator decoupling |
| Broche 85 | VSS — Ground |
| Broche 86 | VDD — Digital supply |
| Broche 87 | PA14 — GPIO PA14 / JTCK / SWCLK |
| Broche 88 | PA15 — GPIO PA15 / JTDI / SPI3_NSS |
| Broche 89 | PC10 — GPIO PC10 / UART4_TX / SPI3_SCK |
| Broche 90 | PC11 — GPIO PC11 / UART4_RX / SPI3_MISO |
| Broche 91 | PC12 — GPIO PC12 / UART5_TX / SPI3_MOSI |
| Broche 92 | PD0 — GPIO PD0 / CAN1_RX / FMC_D2 |
| Broche 93 | PD1 — GPIO PD1 / CAN1_TX / FMC_D3 |
| Broche 94 | PD2 — GPIO PD2 / UART5_RX / SDMMC0_CMD |
| Broche 95 | PD3 — GPIO PD3 / USART2_CTS / FMC_CLK |
| Broche 96 | PD4 — GPIO PD4 / USART2_RTS / FMC_NOE |
| Broche 97 | PD5 — GPIO PD5 / UART4_RX / FMC_NWE |
| Broche 98 | VSS — Ground |
| Broche 99 | VDD — Digital supply |
| Broche 100 | PD6 — GPIO PD6 / UART4_TX / FMC_NWAIT |
| Broche 101 | PD7 — GPIO PD7 / USART2_CK / FMC_NE1 |
| Broche 102 | PG9 — GPIO PG9 / USART6_RX / OCTOSPIM_P2_NCS |
| Broche 103 | PG10 — GPIO PG10 / LTDC_G3 / OCTOSPIM_P2_IO0 |
| Broche 104 | PG11 — GPIO PG11 / LTDC_G4 / OCTOSPIM_P2_IO1 |
| Broche 105 | PG12 — GPIO PG12 / LTDC_B5 / OCTOSPIM_P2_IO2 |
| Broche 106 | PG13 — GPIO PG13 / LTDC_B6 / OCTOSPIM_P2_IO3 |
| Broche 107 | PG14 — GPIO PG14 / LTDC_B7 / OCTOSPIM_P2_CLK |
| Broche 108 | VSS — Ground |
| Broche 109 | VDD — Digital supply |
| Broche 110 | PG15 — GPIO PG15 / USART6_CTS / FMC_NCAS |
| Broche 111 | PB3 — GPIO PB3 / JTDO / SPI3_SCK |
| Broche 112 | PB4 — GPIO PB4 / NJTRST / SPI3_MISO |
| Broche 113 | PB5 — GPIO PB5 / I2C1_SMBA / SPI3_MOSI |
| Broche 114 | PB6 — GPIO PB6 / I2C1_SCL / USART1_TX |
| Broche 115 | PB7 — GPIO PB7 / I2C1_SDA / USART1_RX |
| Broche 116 | BOOT0 — Boot mode pin (10 kΩ pull-down for default bootloader) |
| Broche 117 | PB8 — GPIO PB8 / TIM4_CH3 / I2C1_SCL |
| Broche 118 | PB9 — GPIO PB9 / TIM4_CH4 / I2C1_SDA |
| Broche 119 | PE0 — GPIO PE0 / TIM4_ETR / LPTIM1_ETR |
| Broche 120 | PE1 — GPIO PE1 / UART8_TX / FMC_NBL1 |
| Broche 121 | VSS — Ground |
| Broche 122 | VDD — Digital supply |
| Broche 123 | PF0 — GPIO PF0 / FMC_A0 / I2C1_SDA |
| Broche 124 | PF1 — GPIO PF1 / FMC_A1 / I2C1_SCL |
| Broche 125 | PF2 — GPIO PF2 / FMC_A2 / I2C2_SMBA |
| Broche 126 | PF3 — GPIO PF3 / FMC_A3 / I2C2_SDA |
| Broche 127 | PF4 — GPIO PF4 / FMC_A4 / I2C2_SCL |
| Broche 128 | PF5 — GPIO PF5 / FMC_A5 / I2C2_SCL |
| Broche 129 | VSS — Ground |
| Broche 130 | VDD — Digital supply |
| Broche 131 | PF6 — GPIO PF6 / TIM10_CH1 / FMC_NIORD |
| Broche 132 | PF7 — GPIO PF7 / TIM11_CH1 / FMC_NREG |
| Broche 133 | PF8 — GPIO PF8 / TIM13_CH1 / FMC_NIOWR |
| Broche 134 | PF9 — GPIO PF9 / TIM14_CH1 / FMC_CD |
| Broche 135 | PF10 — GPIO PF10 / OCTOSPIM_P2_NCS |
| Broche 136 | OSC_IN — HSE crystal oscillator input |
| Broche 137 | OSC_OUT — HSE crystal oscillator output |
| Broche 138 | VSS — Ground |
| Broche 139 | VDD — Digital supply |
| Broche 140 | NRST — Reset input (active low) |
| Broche 141 | PC0 — GPIO PC0 / ADC1_INP10 / OTG_FS_DP |
| Broche 142 | PC1 — GPIO PC1 / ADC1_INP11 / OTG_FS_DM |
| Broche 143 | PC2 — GPIO PC2 / ADC1_INP12 / OTG_FS_DP |
| Broche 144 | PC3 — GPIO PC3 / ADC1_INP13 / OTG_FS_DM |
| Broche 145 | VREF- — ADC/DAC negative reference (ground) |
| Broche 146 | VDDA — Analog supply for ADC/DAC |
| Broche 147 | VSS — Ground |
| Broche 148 | VDD — Digital supply |
| Broche 149 | PA0 — (duplicate pin block reserved - see datasheet) |
| Broche 150 | VREF+ — (duplicate pin block reserved) |
| Broche 151 | PH0 — GPIO PH0 / OSC_IN (LSE crystal) |
| Broche 152 | PH1 — GPIO PH1 / OSC_OUT (LSE crystal) |
| Broche 153 | VSS — Ground |
| Broche 154 | VDD — Digital supply |
| Broche 155 | PA0 — (alternate analog input block) |
| Broche 156 | PA1 — (alternate analog input block) |
| Broche 157 | PA2 — (alternate analog input block) |
| Broche 158 | PA3 — (alternate analog input block) |
| Broche 159 | VSS — Ground |
| Broche 160 | VDD — Digital supply |
| Broche 161 | PA4 — (alternate analog input block) |
| Broche 162 | PA5 — (alternate analog input block) |
| Broche 163 | PA6 — (alternate analog input block) |
| Broche 164 | PA7 — (alternate analog input block) |
| Broche 165 | PC4 — (alternate analog input block) |
| Broche 166 | PC5 — (alternate analog input block) |
| Broche 167 | PB0 — (alternate analog input block) |
| Broche 168 | PB1 — (alternate analog input block) |
| Broche 169 | PB2 — (alternate analog input block) |
| Broche 170 | VSS — Ground |
| Broche 171 | VDD — Digital supply |
| Broche 172 | PF11 — (alternate block) |
| Broche 173 | PF12 — (alternate block) |
| Broche 174 | PF13 — (alternate block) |
| Broche 175 | PF14 — (alternate block) |
| Broche 176 | PF15 — (alternate block) |
Applications typiques
STM32H745IIT6 convient pour 6 applications: Industrial Motor Control and Servo Drives, Audio DSP and Networked Audio Devices, Human-Machine Interface with TFT-LCD and Touch, Industrial IoT Edge Gateways, EV Charging Stations and Smart Energy UI, Building Automation and HVAC Controllers.
Industrial Motor Control and Servo Drives
The STM32H745IIT6 is well suited for industrial motor control because its 240 MHz Cortex-M4 core can run a deterministic FOC or field-oriented control loop while the 480 MHz Cortex-M7 handles communication stacks, predictive maintenance analytics, and HMI. Two 12-bit ADCs sample phase currents at 5.3 MSPS each with simultaneous triggering, and the 16-bit ADC delivers 3.6 MSPS for DC-bus and resolver feedback. HRTIM enables sub-100 ns PWM resolution for high-speed IGBT/SiC inverters. Compared to the STM32F767IIT6, the H745 doubles control-loop headroom and adds dual-bank Flash for fail-safe firmware updates on the factory floor.
Recommandé
Audio DSP and Networked Audio Devices
The STM32H745IIT6 supports audio DSP applications by pairing an M7 running the audio CODEC at 480 MHz with an M4 handling Ethernet AVB or AES67 networking. The SAI interfaces accommodate up to four stereo I2S channels, and the SPDIF-Rx handles consumer digital audio. Designers can leverage the integrated hardware AES-256 crypto accelerator for streaming encryption, while the 1 MB SRAM accommodates 480 ms of 48 kHz / 24-bit multi-channel buffers. Compared to the STM32F469BIT6, the H745 offers 4× DSP throughput for the same speaker count and adds USB HS for fast firmware update.
Recommandé
Human-Machine Interface with TFT-LCD and Touch
The STM32H745IIT6 drives TFT-LCD HMI applications because the Cortex-M7 runs the LVGL or TouchGFX graphics stack while the Cortex-M4 manages sensor polling and CAN-FD communication. The Chrom-ART (DMA2D) accelerator offloads rectangle fill, blending and pixel-format conversion, and the LTDC controller supports up to 1024x768 displays in 24-bit parallel mode. Two OctoSPI interfaces enable fast PSRAM frame buffers up to 256 Mbit. Compared to the STM32H743IIT6, the H745 lets the M4 handle capacitive-touch acquisition in parallel with M7 graphics rendering, eliminating display jitter.
Recommandé
Industrial IoT Edge Gateways
The STM32H745IIT6 is ideal for industrial edge gateways because the M7 core runs Linux-equivalent RTOS + TLS stacks via the Ethernet MAC and USB HS, while the M4 manages real-time Modbus/IO-Link acquisition at deterministic intervals. Two CAN FD controllers enable simultaneous fieldbus bridging, and the SDMMC supports SD-card data logging. The 2 MB dual-bank Flash allows fail-safe OTA updates with rollback safety. Compared to the STM32H730IBK6Q, the H745 doubles Flash and adds the M4 deterministic core for hard-real-time IO-Link jobs.
Recommandé
EV Charging Stations and Smart Energy UI
The STM32H745IIT6 fits EV charging station controllers because the M7 core can drive a 7-inch TFT HMI for charge-status display while the M4 core executes the IEC 61851 state machine, ISO 15118 PLC stack, and OCPP backhaul. Two CAN FD controllers manage the vehicle CAN bus and the daisy-chained bus of charging posts, while the Ethernet MAC handles OCPP 1.6/2.0.1 JSON communication. The integrated SMPS reduces BOM cost by eliminating an external buck regulator. Compared to the STM32F469BIT6, the H745 doubles M7 clock and adds the M4 for true parallel control + HMI.
Recommandé
Building Automation and HVAC Controllers
The STM32H745IIT6 is well matched to building-automation controllers where the M4 core executes BACnet/Modbus real-time scheduling at 240 MHz while the M7 drives the LVGL UI and TLS-secured remote-management stack. The Ethernet MAC supports PoE-powered wall-mounted designs, and the SDMMC accommodates firmware-update SD cards for field technicians. The 2 MB dual-bank Flash eliminates external bootloaders. Compared to the STM32F767IIT6, the H745's dual-core architecture isolates real-time building-control loops and prevents UI loading spikes from disturbing HVAC timing.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour STM32H745IIT6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | STM32H745IIK6 | STM32H743IIT6 | STM32H750IIT6 | STM32H730IBK6Q | STM32F767IIT6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 176-LQFP (24x24 mm) | 176-LQFP (24x24 mm) / UFBGA-176 | 176-LQFP (24x24 mm) - same | 176-LQFP (24x24 mm) - same | UFBGA-176 - footprint variant | 176-LQFP (24x24 mm) - same |
| Core Architecture | Dual-core M7 480 MHz + M4 240 MHz | Dual-core M7 480 MHz + M4 240 MHz - identical | Single-core M7 480 MHz | Single-core M7 480 MHz | Single-core M7 550 MHz | Single-core M7 216 MHz |
| Flash Memory | 2 MB | 2 MB - identical | 2 MB - identical | 128 KB (-94%) | 1 MB (-50%) | 2 MB - identical |
| Total SRAM | 1 MB | 1 MB - identical | 1 MB - identical | 1 MB - identical | 564 KB (-44%) | 512 KB (-49%) |
| Maximum Core Frequency | 480 MHz (M7) | 480 MHz (M7) | 480 MHz (M7) | 480 MHz (M7) | 550 MHz (M7) - higher | 216 MHz (M7) - lower |
| Ethernet MAC | Yes | Yes - identical | Yes - identical | Yes - identical | Yes - identical | Yes - identical |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C - identical | -40 °C to +85 °C - identical | -40 °C to +85 °C - identical | -40 °C to +85 °C - identical | -40 °C to +85 °C - identical |
Principaux différenciateurs
- True dual-core architecture (vs STM32H743IIT6)
- Massive SRAM for buffering (vs STM32H730IBK6Q)
- Massive Flash for OTA (vs STM32H750IIT6)
Notes de conception
Use the integrated SMPS (VDD_SMPS pins) to generate the 1.0 V core rail. Place a 4.7 µF X5R 6.3 V ceramic on VDD_SMPSFB and a 100 nF X7R 0603 close to every VDD pin. Estimated: at 480 MHz M7 + 240 MHz M4 active, total current is approximately 300 mA from VDD; verify on bench with a 4-wire VDD measurement before locking the BOM.
Maintain USB HS 90 Ω differential impedance on DP/DN, with length matching within 2 mm. Keep the 25 MHz HSE crystal traces shorter than 10 mm with a continuous ground guard. Decoupling: 100 nF per VDD pin, 4.7 µF per VDD group, plus 1 µF on VDDA. Place ESR-safe ferrite beads on USB VBUS if powering from a 5 V LDO.
Estimated: at 480 MHz M7 active with 100% utilization, the STM32H745IIT6 176-LQFP dissipates approximately 0.8-1.2 W. The LQFP package has θJA ≈ 38 °C/W. Add a 2-cm² copper pour on top of LQFP to keep junction rise below 50 °C above ambient at 25 °C room. For continuous 100% M7+M4 utilization, attach a small heatsink (15 K/W) or use the UFBGA-176 alternative variant.
Do not leave BOOT0 floating: tie it through 10 kΩ to VSS to enter flash-boot. If the BOOT0 strap is wrong, the device enters System memory bootloader and fails to run user code. Also note the dual-core split requires the M4 ROM bootloader stub or a complete M4 firmware image in M4RAM before booting M4. Verify with STM32CubeIDE multi-core debug or STM32CubeMX Clock Config tool.
Informations de conformité
RoHS and REACH compliant per STMicroelectronics material declaration. Industrial temperature grade (-40 to +85 °C) - not AEC-Q100 qualified for automotive.