TLE8457DSJXUMA1 - LIN Transceiver + 3.3V LDO | Infineon
部品番号: TLE8457DSJXUMA1 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0.83 | $0.83 |
| 10 | $0.76 | $7.60 |
| 100 | $0.64 | $64.00 |
| 500 | $0.55 | $275.00 |
| 1,000 | $0.48 | $480.00 |
| 2,500 | $0.42 | $1,050.00 |
TLE8457DSJXUMA1 概要
A LIN (Local Interconnect Network) transceiver is a physical-layer interface IC that bridges a low-speed microcontroller UART to a single-wire automotive bus. The LIN bus is standardized in ISO 17987 and widely used for body-electronics sub-networks (door modules, mirror adjusters, seat controllers, HVAC flaps) where CAN is too expensive. The integrated LDO allows a TLE8457DSJ slave node to be powered directly from the 12 V automotive battery without a separate voltage regulator, simplifying PCB design.
Key features of the TLE8457DSJXUMA1 include an ultra-low standby current of 20 µA (suitable for permanent-battery-attach nodes), battery input voltage range of 5.5 V to 28 V with transient tolerance per ISO 7637, integrated VCC undervoltage reset with fixed 3.3 V output, integrated current limit, thermal shutdown, and bus-pin ESD protection up to ±8 kV (HBM). The device operates across the automotive -40 °C to +150 °C junction temperature range and is qualified to AEC-Q100 grade 1, making it suitable for under-hood and body-control modules.
The TLE8457DSJ uses a bi-directional bus driver architecture compliant with LIN 2.2A and SAE J2602, with internal slope control to meet EMC requirements per IEC 61967 and SAE J1752. The integrated LDO is a p-channel MOSFET LDO architecture for low quiescent current, with internal compensation and soft-start. The part is offered as 'DSJ' (PG-DSO-8) only — the XUMA1 suffix denotes a 2,500-piece reel per IEC 60286-3.
Typical applications include LIN slave nodes in door modules, seat-control modules, HVAC damper actuators, interior lighting, rain/light sensors, and other LIN sub-nodes in automotive body-electronics networks. The integrated 3.3 V/70 mA supply removes the need for an external regulator at each LIN slave, reducing BOM count and PCB area.
When designing with the TLE8457DSJXUMA1, ensure the LIN bus pull-up is correctly selected (the device provides the slave-side pull-up internally only in some modes — see the datasheet). Place the VBAT decoupling capacitor (typically 100 nF ceramic + bulk) close to the VBAT pin to meet ISO 7637-2 transient immunity.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the TLE8457DSJXUMA1 not found in the manufacturer datasheet alone.
ドロップイン代替品: TLE8457DSJXUMA1 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
TLE8457CSJXUMA1
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
TLE8457DSJXUMA2
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
TJA1027T/20
✅ ドロップイン📋 参考代替品（カタログ未掲載）
NCV7428D10R2G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TLE7259-3GE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
TLE8457DSJXUMA1 仕様
| 機能 | LIN Transceiver with integrated 3.3V LDO |
| Protocol | LIN 2.2A, SAE J2602 |
| Number of Drivers/Receivers | 1/1 |
| データレート | 20 kbps (LIN max) |
| Integrated LDO Output Voltage | 3.3 V |
| Integrated LDO Output Current | 70 mA |
| Battery Supply Voltage (VBAT) | 5.5 V to 28 V |
| Standby Current | 20 µA (ultra-low) |
| 動作温度範囲 | -40 °C to +150 °C (junction) |
| パッケージ | PG-DSO-8 (TSON-8) |
| 実装タイプ | Surface Mount |
| AEC-Q100 Qualification | Grade 1 (qualified) |
| ESD Protection (HBM, LIN pin) | ±8 kV |
| RoHS ステータス | Compliant |
TLE8457DSJXUMA1 ピン構成
| ピン 1 | VBAT — Battery supply input, 5.5 V to 28 V |
| ピン 2 | GND — Ground |
| ピン 3 | LIN — LIN bus line (single-wire) |
| ピン 4 | WAKE — Wake-up input from bus activity |
| ピン 5 | EN — Enable input for normal/sleep mode |
| ピン 6 | VCC — 3.3 V LDO output to MCU |
| ピン 7 | TXD — Transmit data from MCU |
| ピン 8 | RXD — Received data to MCU |
主な用途
TLE8457DSJXUMA1 の用途: 7 件s: Automotive Door Module LIN Slave, HVAC Damper and Blower LIN Actuator, Seat Control and Seat Heater LIN Slave, Interior Lighting LIN Slave (RGB Ambience), Rain/Light Sensor LIN Slave, Steering-Wheel Switch LIN Cluster, Battery-Management Sensor LIN Slave.
Automotive Door Module LIN Slave
The TLE8457DSJXUMA1 is ideal for door-module slave ECUs that control window lifters, mirror adjusters, and door-lock actuators over a LIN sub-network. Its integrated 3.3 V/70 mA LDO supplies a small microcontroller (e.g., NXP S912XEQ512J2MAA from the Site MPN list) directly from the 12 V battery, removing the need for an external regulator and reducing BOM count. The 20 µA standby current keeps the door module within typical OEM quiescent-current budgets when parked. LIN 2.2A compliance plus ±8 kV HBM ESD on the LIN pin allow direct connection to the harsh vehicle wiring harness without external protection components.
おすすめ
HVAC Damper and Blower LIN Actuator
In automotive HVAC modules, multiple small motor-driven damper flaps and blower-speed controllers are typically networked on a LIN bus. The TLE8457DSJXUMA1's small PG-DSO-8 footprint and integrated LDO make it well suited to these space-constrained actuator PCBs that have no room for a discrete regulator. Its 5.5 V to 28 V VBAT range tolerates cranking and load-dump transients, and the integrated VCC undervoltage reset prevents MCU brown-outs during engine start. The LIN 2.2A/SAE J2602 compliance ensures interoperability with the master ECU from any Tier-1 supplier.
おすすめ
Seat Control and Seat Heater LIN Slave
Power-seat modules and seat-heater nodes are increasingly migrated from CAN to LIN because the data rate is adequate for switch and motor feedback. The TLE8457DSJXUMA1 fits these applications because its integrated 3.3 V rail can power a small MCU plus a Hall-sensor interface, eliminating an external LDO and saving PCB area inside the seat-frame-mounted module. The -40 °C to +150 °C junction temperature range covers both cabin and under-seat environments, and AEC-Q100 Grade 1 qualification meets OEM automotive PPAP requirements.
おすすめ
Interior Lighting LIN Slave (RGB Ambience)
Modern vehicle interior RGB-ambient lighting uses LIN-addressed LED-driver slaves to drive string-current-controlled LEDs. The TLE8457DSJXUMA1 serves as the LIN physical interface for these nodes: the integrated 3.3 V LDO can supply a small LED-controller IC such as an LP8860, while the LIN pin provides robust EMC and ESD performance to the in-cabin wiring harness. The 20 µA standby current is critical because interior lighting modules are typically permanently battery-attached, contributing to the OEM's parked-current budget.
おすすめ
Rain/Light Sensor LIN Slave
Windshield-mounted rain/light sensors are typically LIN-attached to the BCM (Body Control Module) because CAN would be overkill for the few bytes of optical data per second. The TLE8457DSJXUMA1 is ideal because the sensor head sits inside the cabin with limited space for a regulator, so the integrated LDO is a real board-area saver. Its ±8 kV HBM ESD on the LIN pin withstands handling and assembly, and its low quiescent current keeps the always-on sensor from draining the battery. The PG-DSO-8 footprint suits the small PCB inside the sensor housing.
おすすめ
Steering-Wheel Switch LIN Cluster
Multi-function steering-wheel switches (audio, cruise, phone buttons) communicate with the instrument cluster over LIN to avoid the costly and bulky CAN wiring harness. The TLE8457DSJXUMA1 handles the LIN physical interface for these switches: its integrated 3.3 V LDO supplies the small matrix-scanning MCU, the 5.5-28 V VBAT range handles cranking, and the small PG-DSO-8 package fits behind the airbag module. AEC-Q100 Grade 1 qualification is required because the switch assembly is mounted on the steering wheel rotating hub.
おすすめ
Battery-Management Sensor LIN Slave
Auxiliary 12 V battery current and temperature sensors in start/stop vehicles communicate to the BMS over LIN to save CAN-bus capacity for higher-priority data. The TLE8457DSJXUMA1's integrated 3.3 V LDO can supply a small MCU plus a shunt-amp front end such as the NXP MC9S08DZ60, and its 20 µA standby current is critical because these sensors are permanently powered to maintain state-of-charge tracking even when the ignition is off. The wide VBAT range covers the over-voltage transients seen during load-dump events.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: TLE8457DSJXUMA1 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | TLE8457CSJXUMA1 | TJA1027T/20 | NCV7428D10R2G | TLE7259-3GE |
|---|---|---|---|---|---|
| Package | PG-DSO-8 (TSON-8) | PG-DSO-8 (TSON-8) - same | SO-8 - same footprint family | SO-8 - same footprint family | PG-DSO-8 - same |
| Brand | Infineon | Infineon (same-brand) | NXP Semiconductors | onsemi | Infineon (same-brand) |
| Integrated LDO Output Voltage | 3.3 V | 3.3 V (same) | No integrated LDO | 3.3 V (same) | 5 V (different) |
| Standby Current | 20 µA | Slightly higher (C variant) | Similar low-µA | Comparable | Similar |
| LIN Protocol | LIN 2.2A + SAE J2602 | LIN 2.2A + SAE J2602 | LIN 2.2A + SAE J2602 | LIN 2.2A + SAE J2602 | LIN 2.2A + SAE J2602 |
| Data Rate | 20 kbps | 20 kbps | 20 kbps | 20 kbps | 20 kbps |
| AEC-Q100 Grade | Grade 1 | Grade 1 | Grade 1 | Grade 1 (NCV prefix) | Grade 1 |
| Operating Temperature | -40 °C to +150 °C | -40 °C to +150 °C | -40 °C to +150 °C | -40 °C to +150 °C | -40 °C to +150 °C |
主な差別化要因
- Integrated 3.3 V/70 mA LDO eliminates external regulator （vs TJA1027T/20)
- 20 µA ultra-low standby current for permanently-attached nodes （vs NCV7428D10R2G)
- Same-family drop-in scalability (C and D variants) （vs TLE7259-3GE)
設計ノート
Place a 100 nF X7R ceramic capacitor plus a low-ESR bulk capacitor (4.7 µF to 10 µF) as close as possible to the VBAT pin to meet ISO 7637-2 pulse 1/2a/3a/3b immunity. The integrated LDO output (VCC) also requires a 1 µF to 4.7 µF ceramic decoupling capacitor placed within 2 mm of pin 6. Without these local capacitors, the device may reset or misbehave during cranking and load-dump transients. For VBAT lines exposed to the unsuppressed harness, consider a TVS diode (e.g., SMAJ28CA) on VBAT for additional transient clamping beyond what the part's internal ESD structure provides.
Route the LIN pin trace as a short, straight, guarded track to the bus connector. Keep the LIN trace away from noisy switching nodes (DC-DC converters, motor drivers) and from high-dV/dt signals to minimize coupling into the bus. The exposed pad (EP) of the PG-DSO-8 package must be soldered to a continuous copper pour on the top layer for thermal dissipation of the integrated LDO at 70 mA load; missing the EP solder connection will cause thermal shutdown at high ambient temperatures.
Do not confuse the TLE8457DSJ (this part, 3.3 V LDO) with the TLE7259-3GE (5 V LDO LIN transceiver) — both are PG-DSO-8 and Infineon LIN, but the LDO output voltages differ and will destroy a 3.3 V MCU if substituted incorrectly. Also avoid the older TLE7259-1/2 (DPAK package, different pinout) which is NOT a drop-in. Finally, ensure the LIN master node uses a master-side pull-up resistor per LIN spec (~1 kΩ with the master's reverse-polarity diode) — the TLE8457DSJ is a slave-only transceiver and does not include the master pull-up.
Estimated: At VBAT=14 V, VCC=3.3 V, IOUT=70 mA, the integrated LDO dissipates approximately (14 − 3.3) × 0.070 = 0.75 W. With the PG-DSO-8 EP properly soldered to a 1 sq-inch copper pour, θJA is approximately 50 °C/W, giving a junction temperature rise of 37 °C above ambient — acceptable up to about 110 °C ambient. At full 70 mA into a 25 °C ambient the part is fine; at 85 °C ambient derate to about 55 mA continuous. Without the EP soldered, thermal shutdown will trigger at any meaningful load.
コンプライアンス情報
RoHS compliant per Infineon product page. AEC-Q100 Grade 1 qualified per datasheet. MSL level not provided in the verified web data — marked [DATA_NEEDED]. Halogen-free status not stated in available data — set to unknown.
