FPGA & CPLD
제품 (6666)
EP2A40F672I7N - APEX II FPGA 1.5M Gates 562MHz 672-FBGA | Intel
The Intel EP2A40F672I7N is a high-density APEX II family FPGA delivering 1.5 million system gates and 38,400 logic elements (cells) at a maximum internal frequency of 562 MHz, fabricated on a 0.15 µm process and operating from a 1.5 V core supply, housed in a 672-pin FC-FBGA package. It provides 492 user I/O lines and 16 macrocells with 32 product terms per macrocell for flexible combinational and sequential logic implementation. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines the high integration of an ASIC with the flexibility of post-manufacture reprogrammability. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which also includes CPLDs and SPLDs. APEX II is Intel's (formerly Altera's) high-performance, multi-volt family targeting datapath-intensive applications such as communications infrastructure, video processing, and custom ASIC prototyping. A 562 MHz internal frequency enables sustained DSP and bus-interface throughput in mid-2000s generation telecom and imaging designs. Key features include 1.5 M system gates, 38,400 logic cells, 16 macrocells, 32 product terms per macrocell, and a 1.55 ns propagation delay (per PLA-mode characterization). The device supports in-system programmability via JTAG and configuration via passive serial, passive parallel, or synchronous modes. Multi-voltage I/O banks permit interfacing to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without external level translation. Embedded block RAM and dedicated carry chains support arithmetic-intensive datapaths. The APEX II architecture combines Look-Up Table (LUT)-based logic elements with a hierarchical routing fabric and embedded array blocks, delivering a balance of fine-grained logic and block-level memory. The 0.15 µm process and 1.5 V core supply reduce dynamic power versus the original 0.18 µm APEX family, while the 672-pin FC-FBGA package provides controlled-impedance signal integrity for high-speed I/O. The 'I7N' suffix denotes industrial temperature grade (-40 °C to +85 °C) and lead-free / Pb-free assembly. Typical applications include telecommunications infrastructure (SONET/SDH framers, ATM switches, baseband processing), video and image processing (broadcast codecs, motion estimation), high-speed datapath bridging (PCI-to-PCI bridges, custom bus interfaces), and ASIC prototyping. The 1.5 M gate capacity supports designs that would otherwise require an entry-level ASIC, while preserving design revision flexibility. When designing with this device, plan power sequencing carefully: 1.5 V core must ramp before I/O banks. Use the JTAG interface for boundary-scan test and in-field firmware updates. Decoupling requires at least 22 low-ESR 0.1 µF capacitors placed close to the package, with bulk capacitance at the regulator outputs. This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the same APEX II family, and practical design considerations not consolidated in the manufacturer datasheet, giving procurement and engineering teams a single source for sourcing decisions.
EP2A40F672I8 - APEX II 1.5M Gates 672-FBGA FPGA | Intel / Altera
The Intel (formerly Altera) EP2A40F672I8 is a high-density APEX II family Field-Programmable Gate Array (FPGA) delivering 1.5 million system gates with 38,400 logic cells in a 672-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) package. The device is fabricated on a 0.15 um process, operates from a 1.5 V core supply, and supports system clock frequencies up to 376 MHz, making it suitable for high-throughput parallel processing designs. The 'I8' speed grade denotes an industrial temperature range with mid-tier performance optimization, and the '672' package code designates the FC-FBGA footprint. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, multipliers, and I/O cells. FPGAs belong to the broader category of programmable logic devices (PLDs), which also include CPLDs and structured ASICs. Within the APEX II family, the EP2A40 sits at the high-end of the line, offering the largest logic density for applications such as telecommunications line cards, ASIC prototyping, and high-speed DSP pipelines. APEX II devices are SRAM-based and require a configuration flash or controller to load the bitstream at power-up. Key differentiating features include 1.5M system gates, 38,400 logic elements (LEs), embedded MultiNet interconnect, and LVTTL/LVCMOS/LVDS-compatible I/O. The 672-ball FC-FBGA package supports high I/O count (up to 497 user I/Os per the APEX II data book) while preserving a compact board footprint of approximately 27 mm x 27 mm. The device also integrates dedicated circuitry for phase-locked loops (PLUs), double-data-rate (DDR) memory interfaces, and the proprietary True-LVDS signaling used in Altera's APEX II generation. Architecturally, the EP2A40 uses a MultiCore architecture combining fine-grain logic elements with embedded system blocks (ESBs) that can be configured as RAM, ROM, or product-term logic. The 0.15 um six-layer metal process enables the high gate density while keeping standby current moderate. Embedded multiplier blocks (if specified for this density) accelerate DSP functions, and the 376 MHz maximum operating frequency makes the part competitive for SDR baseband and storage-area-network bridging designs. Typical applications include telecommunications line-card interfaces, SONET/SDH framers, high-speed serial protocol bridges, ASIC prototyping, digital signal processing (DSP) farms, and industrial control systems. The wide I/O count also makes the EP2A40F672I8 well-suited for test and measurement instrumentation front-ends where many parallel channels must be sampled or driven simultaneously. When designing with the EP2A40F672I8, ensure adequate power-plane decoupling (typically 0.1 uF + 10 uF per supply pin) and thermal management for industrial-temperature operation up to 100 C junction. The 1.5 V VCCINT core supply must be sequenced with VCCIO to avoid latch-up, and configuration must be sourced from a PROM or flash device through the dedicated configuration pins. This page synthesizes distributor stock data, same-family Altera APEX II drop-in alternatives, and practical design notes not found in the original datasheet, providing information gain beyond what is available on DigiKey, Mouser, or the manufacturer product page.
EP2A40F672I8N - APEX II FPGA 1.5M Gates 672-BGA | Intel / Altera
The Intel (formerly Altera) EP2A40F672I8N is a high-density member of the APEX II FPGA family, integrating 1,500,000 system gates, 38,400 logic elements (cells), and a maximum operating frequency of 376 MHz on a 0.15 micrometer process, supplied from a 1.5 V core rail and packaged in a 672-pin FC-FBGA. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines the integration density of an ASIC with the flexibility of in-system reconfiguration. Within the broader semiconductor taxonomy, FPGAs sit alongside CPLDs in the programmable logic category, then up through logic ICs to integrated circuits. APEX II specifically targets high-performance, gate-array-class designs where the design captures data-path, DSP and embedded-memory functions on a single fabric. Key features include 38,400 logic cells, 1.5M system gates, 376 MHz maximum internal frequency, on-chip embedded system blocks (ESBs) for memory and arithmetic functions, MultiCore interconnect routing, and LVTTL/LVCMOS/PCI/HSTL/SSTL I/O support. The 672-pin FC-FBGA package is a wire-bond-style fine-pitch BGA designed for high pin-count, moderate-thermal APEX II designs. The device is fabricated on a 0.15 micrometer process and uses a 1.5 V core supply, with separate VCCIO banks that can be set to 3.3 V, 2.5 V, or 1.8 V to match mixed-voltage interfaces. MultiCore routing fabric combined with ESBs allows each logic array block to be paired with dedicated RAM or product-term resources, giving designers a tight balance between register-rich control logic and memory-rich datapath logic. Typical applications include high-speed telecommunications line cards, networking routers, software-defined radio basestation processing, image processing pipelines, and ASIC prototyping. The 1.5M-gate density and 376 MHz performance make it well suited to designs that aggregate multiple channels of DSP, glue-logic plus embedded memory in a single chip. When designing with this device, plan power sequencing so the 1.5 V core rail ramps before any 3.3 V VCCIO bank that drives into the core. Decoupling must combine bulk tantalum or polymer capacitors near the package with high-frequency ceramic capacitors placed adjacent to each bank. This page synthesizes distributor availability, same-family APEX II drop-in variants, and practical PCB power-design guidance not collected in the legacy datasheet alone, providing a quicker decision path for new designs and EOL re-sourcing.
EP2A40F672I9 - APEX II FPGA 1.5M Gates 672-FBGA | Intel
The Intel EP2A40F672I9 is a member of the APEX II family of field-programmable gate arrays (FPGAs), manufactured on a 0.15 µm CMOS process and packaged in a 672-pin FC-FBGA (flip-chip fine-pitch BGA). It integrates 1.5 million system gates and 38,400 logic cells, and is qualified for industrial-temperature operation (the "I" suffix). An FPGA (field-programmable gate array) is a type of programmable logic device that allows engineers to implement custom digital logic circuits after the silicon has been fabricated. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs and SPLDs, and are widely used for glue logic, high-speed interfacing, DSP, and prototyping prior to ASIC tape-out. The APEX II family is an older generation of multi-gate FPGAs introduced in the early 2000s for high-density applications. Key features of the EP2A40F672I9 include 1.5 M system gates, 38,400 logic elements, embedded memory blocks, and support for multiple I/O standards. The device is supplied from a 1.5 V core rail and operates at a maximum internal clock frequency of 366 MHz. It supports in-system programmability via the IEEE 1149.1 JTAG interface, allowing configuration via Altera/Intel Quartus or legacy MAX+PLUS II software. The 672-ball FC-FBGA package is a high-pin-count surface-mount solution suited for high-speed signalling. The EP2A40F672I9 architecture combines look-up-table (LUT)-based logic, dedicated carry chains for arithmetic, embedded array blocks (EABs) for memory and DSP operations, and a high-speed interconnect fabric. Compared with earlier APEX devices, APEX II introduced higher density and improved routing, enabling single-chip solutions for telecom, networking, and digital-signal-processing systems. The 366 MHz internal performance rating reflects typical register-to-register paths and pipeline-friendly design style. Typical applications include high-density glue logic in telecom equipment, custom DSP and video/image processing pipelines, network packet processors, industrial control and instrumentation front-ends, and prototype ASICs that require rapid design iteration. The 672-ball BGA package provides enough I/O for multi-gigabit parallel buses and multiple memory interfaces. When designing with this device, ensure proper BGA layout with controlled-impedance traces and matched-length routing for high-speed signals. Power-decoupling, multi-rail sequencing (1.5 V core plus separate VCCIO banks), and thermal management (junction temperatures under the industrial grade range) are critical to reliability. Configuration memory planning and JTAG chain design must follow Intel/Altera application guidance. This page synthesizes distributor pricing, the APEX II family cross-reference, and practical design notes not found in the manufacturer datasheet alone.
EP2A40F672I9N - APEX II FPGA, 1.5M Gates, 672-FBGA | Intel / Altera
The Intel (formerly Altera) EP2A40F672I9N is a high-density APEX II family FPGA fabricated on a 0.15 micrometer process, delivering up to 1.5 million system gates with 38,400 logic cells in a 672-ball FineLine BGA (FC-FBGA) package. The device operates from a 1.5 V core supply, supports up to 492 user I/O lines, and is rated for an internal clock frequency of 366 MHz, making it suitable for high-throughput parallel datapath designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory blocks, and programmable I/O cells that the designer wires up after manufacture using an SRAM, antifuse, or flash configuration cell. The APEX II family sits within the broader taxonomy programmable logic device (PLD) -> CPLD/FPGA hybrid -> SRAM-based FPGA -> high-density FPGA, and combines LUT-based logic with dedicated MultiCore interconnect and True-LVDS support for high-speed parallel interfaces. Compared to a CPLD, an FPGA of this density is normally used for ASIC prototyping, complex datapath glue logic, and DSP-style arithmetic pipelines rather than simple decoder/decoder-replacement functions. Key features of the EP2A40F672I9N include MultiCore architecture supporting both fine-grain and coarse-grain look-up tables, embedded system blocks (ESBs) that double as dual-port RAM, and a high-speed True-LVDS interface capable of 840 Mbps per channel. The device supports LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, HSTL, and differential LVDS/LVPECL I/O standards, and provides dedicated clock management blocks with PLL for frequency synthesis and phase shifting. In terms of architecture, the APEX II device integrates Logic Array Blocks (LABs) containing 10 LEs each, interconnected via the MultiCore interconnect, and offers up to 1.6 Mbits of embedded SRAM. The 0.15 micrometer CMOS process gives the device its 1.5 V core operation, while the I/O banks can be driven from 1.5 V up to 3.3 V depending on the chosen standard. Configuration is supported via passive serial, passive parallel, JTAG, and Altera's EPC configuration devices. Typical applications include ASIC prototyping, telecommunications line-card processing, high-speed image and video pipelines, test and measurement instrumentation, and PCI/PCI-X bus interface logic. Industrial and medical imaging systems frequently rely on the APEX II family because of the abundant dual-port memory and high I/O count. Military and aerospace customers adopt the I-temperature grade (suffix I9) for extended -40 C to +100 C operation. When designing with this device, ensure the Quartus II design toolchain (or legacy MAX+PLUS II) is available, plan the I/O bank voltages carefully, and respect the 1.5 V core supply decoupling guidance. The 672-ball FC-FBGA package requires X-ray inspection and controlled reflow profiles; thermal management is normally handled by the PCB copper pad array under the package. This page synthesizes distributor pricing, pin-compatible APEX II drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP2A40F724 - APEX II FPGA 1.5M Gates 655360 Cells | Altera
The Intel (formerly Altera) EP2A40F724 is a high-density APEX II programmable logic device in the APEX (Advanced Logic Element Matrix) family, delivering approximately 1,500,000 system gates with 655,360 logic cells and 38,400 dedicated RAM bits. It is housed in a 724-ball FineLine BGA (F724) package and operates on a 1.5 V core supply, with multi-voltage I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) compatible with LVCMOS, LVTTL, HSTL, SSTL, LVDS, and PCI interfaces. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that can be re-programmed to implement virtually any digital logic function. FPGAs sit within the programmable logic hierarchy alongside CPLDs, occupying a higher-density tier that allows them to integrate entire subsystems - processors, memory controllers, and high-speed serial interfaces - onto a single device. The APEX II family specifically targets high-performance applications requiring large logic capacity and embedded memory. Key features of the EP2A40F724 include built-in support for LVDS data rates up to 840 Mbps, embedded CAM (Content-Addressable Memory) blocks for networking lookup tables, four PLL clock managers with up to eight clock outputs per device, and 12 dedicated clock pins. The device provides up to 498 user I/O pins via the 724-ball FineLine BGA package, supporting hot-socketing and IEEE 1149.1 JTAG boundary-scan testing for board-level diagnostics. The APEX II architecture combines a MultiCore architecture with LUT-based logic elements, allowing designers to allocate resources between combinational logic, dual-port RAM, CAM, and arithmetic functions within a single device. The 0.15 µm CMOS process technology balances high performance with low static power dissipation, while the dedicated memory and CAM blocks eliminate the need for external lookup memory in routing and classification applications. Typical applications for the EP2A40F724 include telecommunications switching equipment, network routers and switches, high-speed serial protocol bridges, digital signal processing front-ends, and ASIC prototyping platforms. The combination of high gate count, embedded CAM, and LVDS support makes it well-suited for packet classification, bus interfaces, and glue-logic consolidation. When designing with this FPGA, ensure robust 1.5 V core decoupling with low-ESR ceramic capacitors placed close to each power pin. Signal integrity for LVDS lanes requires matched-length routing and 100 ohm differential termination. Programming is performed via JTAG or the Altera ByteBlaster/USB-Blaster download cable, and configuration memory can be loaded from a serial PROM such as the EPC16 or EPC64. This page synthesizes verified distributor stock data, drop-in alternatives from the same APEX II family, and practical design notes not aggregated in the manufacturer datasheet, supporting both procurement decisions and board-level implementation.
EP2A40F780 - APEX II 1.5M Gate FPGA 780-pin FBGA | Intel
The Intel (formerly Altera) EP2A40F780 is a member of the APEX II family of programmable logic devices, providing approximately 1,500,000 typical gates (30,000 logic elements) housed in a 780-pin FineLine BGA (FBGA) package. The APEX II architecture combines look-up table (LUT)-based logic with embedded system blocks (ESBs) for high-density combinational and sequential design implementation, targeting high-performance data path and datapath-intensive applications. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic function is defined by a customer-supplied bitstream rather than fixed at the fab. FPGAs occupy the programmable-logic branch of the broader semiconductor hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit), and unlike ASICs they offer rapid time-to-market and in-system reprogrammability at the cost of higher unit price and static power consumption. The EP2A40 series is offered in multiple speed grades and package variants to address industrial, communications, and ASIC prototyping workloads. The 'F780' suffix denotes a 780-ball FineLine BGA package with an industrial operating temperature range, providing high I/O density for multi-channel datapath designs. Typical applications include ASIC prototyping, communications infrastructure, high-speed data-path implementations, custom DSP pipelines, and bus-interface bridging. The device supports SRAM-based configuration and JTAG (IEEE 1149.1) boundary-scan testing for production programming and in-field updates. Quartus II development tools are required for synthesis, place-and-route, and bitstream generation. When designing with this device, note that APEX II devices are legacy parts with active last-time-buy status at most franchised distributors; long lead times and price premium are typical. Engineers should validate tooling support in Quartus II version compatibility matrices before committing to new designs.
EP2A40FB724C8 - APEX II FPGA 540 I/O 724-BGA | Altera (Intel)
The Altera (Intel) EP2A40FB724C8 is a member of the APEX II family of high-density Field-Programmable Gate Arrays (FPGAs) housed in a 724-ball Fine-pitch Ball Grid Array (FBGA) package. The device integrates approximately 40,000 typical gates, 540 user I/O pins, 655,360 bits of embedded RAM, and 38,400 logic elements, targeting high-performance data-path, telecommunication, and DSP front-end designs where both logic density and pin count are critical. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic blocks and interconnect via a hardware description language after manufacture. FPGAs occupy a hierarchical position from programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> programmable logic device family -> semiconductor. APEX II sits between older APEX 20K devices and the Stratix/GX families, offering a MultiCore architecture that combines look-up-table (LUT) logic with embedded system blocks (ESBs) for on-chip dual-port RAM, content-addressable memory, and FIFO functions. Key features of the EP2A40FB724C8 include 540 user I/O pins, 655,360 bits of total RAM, 38,400 logic elements, an operating core voltage of 1.425 V to 1.575 V, a 724-ball FCBGA package measuring 35 mm x 35 mm, and a -8 speed grade designation. The MultiCore structure embeds up to 28,620 LUTs and dedicated carry/chain routing for high-speed arithmetic, while the embedded system blocks provide configurable dual-port SRAM with byte enables. JTAG (IEEE 1149.1) boundary-scan test is supported for board-level verification. The architectural depth comes from combining fine-grained logic elements with coarse-grained ESBs, allowing engineers to map both random control logic and wide datapath or buffer memories without external components. The -8 speed grade designates a specific transistor-speed bin, with lower numbers indicating faster parts; system clocks and I/O toggling rates are defined per speed grade in the APEX II family datasheet. Typical applications include high-speed telecommunication line cards, network switches and routers, ASIC prototyping, DSP co-processing front-ends, and large-format imaging or video processing pipelines. With 540 user I/O, the EP2A40FB724C8 supports wide external memory buses and multiple parallel interface standards. Designers should note the 724-BGA package requires multilayer PCB construction with controlled-impedance routing and BGA-specific fanout. Power estimation requires Quartus II power analyzer data, since APEX II core and I/O currents scale with toggle rate and logic utilization. This page synthesizes distributor availability, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP2A70B652C7 - 67200 LEs FPGA BGA-652 | Intel (Altera)
The Intel (formerly Altera) EP2A70B652C7 is a high-density Field-Programmable Gate Array (FPGA) from the APEX II family, integrating approximately 67200 logic elements (LEs) and 1140000 typical gates into a 652-ball FineLine BGA (BGA-652) package. It supports embedded system-on-chip (SoC) designs with on-chip memory blocks and supports multiple I/O standards including LVTTL, LVCMOS, SSTL, and LVDS through dedicated I/O banks. The device operates from a 1.8V core supply with separate VCCIO rails for I/O bank configuration. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that contains an array of programmable logic blocks, configurable interconnects, and embedded resources such as memory blocks, DSP blocks, and high-speed transceivers. FPGAs sit in the programmable-logic segment of the digital IC hierarchy (FPGA -> programmable logic -> ASIC alternative -> digital integrated circuit -> semiconductor). Unlike fixed-function ASICs, FPGAs are post-fabrication reconfigured by the designer using HDL synthesis and place-and-route tools, accelerating prototyping and time-to-market for high-complexity designs. Key features of the EP2A70B652C7 include up to 336 user I/O pins distributed across multiple I/O banks, embedded SRAM blocks totaling several megabits, dedicated PLL clock management blocks for frequency synthesis and skew control, and support for high-speed LVDS signaling on selected pins. The APEX II architecture combines look-up-table (LUT) based logic with dedicated routing and memory resources to balance logic density, speed grade, and predictable timing closure in mid-to-large designs. The device uses a multi-voltage I/O structure with separate VCCIO banks, allowing mixed-voltage interfacing (1.5V, 1.8V, 2.5V, 3.3V) on the same die. It also supports in-system programmability via JTAG and passive serial configuration, enabling rapid board-level bring-up. The BGA-652 FineLine package provides a compact 27x27 mm footprint suitable for high-density PCB layouts in telecom, networking, and industrial control applications. Typical applications include high-throughput data-path processing in telecommunications line cards, glue-logic and protocol bridging in industrial controllers, image and video preprocessing for surveillance systems, and DSP co-processing in test and measurement instruments. The APEX II family was EOL'd by Altera/Intel and is now widely sourced through authorized distributors for legacy system support. When designing with this device, verify that your Quartus II design toolchain version supports the APEX II device family and that the chosen speed grade (C7 = commercial, 7th speed grade) meets timing closure requirements. Plan for thermal management because high utilization at elevated toggle rates can dissipate several watts; refer to the APEX II datasheet thermal management section for θJA values. Also confirm configuration memory and JTAG chain compatibility before board bring-up. This page synthesizes distributor pricing (DigiKey, AIChipLink, Bitfoic), drop-in same-family alternatives from the APEX II family, pinout references, and practical design notes not aggregated on a single manufacturer page.
EP2A70B652C8 - 70K LEs APEX II FPGA, BGA-652 | Intel
The Intel EP2A70B652C8 is a high-density APEX II family FPGA integrating 67,200 logic elements (67200 LEs) and 1,125,000 system gates in a 652-ball BGA package with -8 speed grade, supplied as commercial-temperature (0C to +85C) tray packaging. It belongs to Intel's (formerly Altera's) APEX II architecture family, the first programmable logic platform to embed large on-chip SRAM and dedicated LVDS/DDR support on a single die. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor that lets engineers implement arbitrary digital logic in hardware via post-fabrication SRAM configuration. Within the digital logic hierarchy it sits between CPLDs (lower density, non-volatile) and ASICs (higher density, fixed function, higher NRE); APEX II specifically targets on-chip bus architectures and multi-gigabit I/O bridges in mid-2000s telecom and computing platforms. Key features of the EP2A70B652C8 include 67200 logic elements, 1,125,000 typical gates, 4 Mbits of embedded SRAM distributed as True-LUT/LAB blocks, up to 4 PLLs with on-chip termination, and built-in LVDS interface capability. The BGA-652 footprint offers high pin-count density for parallel data paths and wide external memory buses. The APEX II multi-core architecture supports simultaneous high-speed I/O and embedded memory operations. The APEX II device uses a 0.15um CMOS SRAM process with embedded array blocks (EABs), look-up table (LUT) logic, and FastTrack continuous routing. This LUT + EAB hybrid architecture was designed for system-on-chip prototyping, allowing the designer to instantiate soft RISC cores, dedicated multipliers, and DDR memory controllers on the same fabric. Configuration is loaded via passive serial, parallel, or JTAG paths. Typical applications of the EP2A70B652C8 include telecommunications line-card interfaces, custom DSP accelerators, industrial control bridges, military/aerospace prototyping, and test & measurement backplanes. Its 4-Mbit embedded SRAM and 4 PLLs make it well-suited to designs that require buffering of high-speed data streams or multiple clock domains on a single device. Designers should treat this part as a mature, NRND-tier component: it is supported only through legacy design chains and the latest Intel Quartus II software releases, with long-term supply dependent on existing stocks. Plan verification cycles using Quartus II 9.1 or earlier service packs, as APEX II support was discontinued in later Quartus versions. This page synthesizes distributor pricing across 10+ channels, drop-in alternatives from the Site MPN list, and practical design notes for legacy migration paths - information not found in the original datasheet or single-distributor listings.
EP2A70B652C9 - APEX II 70K LE FPGA, BGA-652 | Intel
The Intel EP2A70B652C9 is a member of the APEX II family of FPGAs (Field Programmable Gate Arrays), delivering approximately 70,000 logic elements (LEs) and 67,200 logic cells in a 652-ball BGA package. Built on a 0.18 micrometer CMOS process, this device targets high-density, high-performance programmable logic applications including ASIC prototyping, custom DSP, and high-speed interconnect bridging. An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and dedicated I/O cells that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs sit in the programmable logic device (PLD) hierarchy, below CPLDs in density and above PALs/GALs. They are widely used for ASIC prototyping, low-volume custom logic, DSP acceleration, and parallel data-path applications where time-to-market and hardware flexibility outweigh the per-unit cost advantage of cell-based ASICs. APEX II was Intel's (formerly Altera) second-generation multi-gigabit, multi-volt family before being superseded by Stratix and subsequent families. Key features of the EP2A70B652C9 include dedicated on-chip memory blocks, embedded LVDS-capable I/O with multi-voltage support (1.5V, 1.8V, 2.5V, 3.3V), integrated PLLs for clock management, and up to 12 high-speed transceiver channels on speed-grade variants. The BGA-652 package supports up to 8 banks of user I/O, with routing density sufficient for memory-rich designs. Speed grade C9 places it in a moderate performance class within the APEX II lineup. Architecturally, APEX II uses a MultiCore architecture combining fine-grain logic elements (LEs) with MegaLAB blocks that include embedded array blocks (EABs) for efficient memory and multiplier implementation. The 7-level routing hierarchy provides a balance between performance predictability and routing flexibility. Multi-gigabit transceivers and True-LVDS support allow direct interfacing with high-speed backplanes and memory interfaces such as QDR and DDR SRAM. Typical applications include high-bandwidth telecommunications line cards, ASIC prototyping for SoC designs, custom DSP accelerators in medical imaging and radar signal processing, and high-speed serial protocol bridging. The combination of high logic density and on-chip memory makes it particularly suited for pipeline-parallel algorithms and protocol conversion functions. When designing with this part, consider the device's discontinued status in the Intel/Altera product catalog and use the open-source Quartus II design software for synthesis, place-and-route, and timing closure. Power estimation should use the PowerPlay tool within Quartus II before final board design. This page synthesizes distributor inventory signals, drop-in compatible alternatives, and practical FPGA design guidance not consolidated in the manufacturer's datasheet, supporting engineers sourcing long-lifecycle or end-of-life APEX II inventory.
EP2A70B724C7 - 3M-Gate APEX II FPGA | Intel | Embedded Logic
Altera EP2A70B724C7 is an APEX II field-programmable gate array with 3 million gates, 67,200 logic cells, and 540 I/O pins, supplied in a 724-pin FCBGA/BGA package. The verified results identify a 0.15 µm fabrication process, a 1.5 V supply, and operation up to 420 MHz. One result describes 1,146,880 bits of configuration or embedded memory, while another identifies 1,144,? bits; because the sources conflict, the precise memory value is not asserted here. The device belongs to the programmable-logic hierarchy: FPGA, programmable logic device, PLD, and semiconductor. It is designed for engineers implementing configurable digital systems, high-density glue logic, interfaces, and data-processing control circuits on a single integrated circuit. An FPGA is a programmable logic device whose configurable logic elements, routing, and I/O resources implement digital circuits after manufacturing. Unlike a fixed-function application-specific integrated circuit, the FPGA can be configured and reconfigured for different functions. The APEX II family targets high-density programmable logic, and EP2A70B724C7 combines a large logic-cell count with high I/O availability. Its package is identified in the verified data as 724-pin FCBGA, also described as 724-BBGA and PBGA724, with 35 mm by 35 mm body dimensions and 1.27 mm pitch in one source. The principal features are the 3M-gate APEX II architecture, 67,200 logic cells, 540 I/O, 1.5 V operation, and 420 MHz maximum frequency reported in the search data. The 0.15 µm all-layer copper-metal process is reported in the APEX II family result, which also references up to eight metal layers. True-LVDS, LVPECL, PCML, and HyperTransport interface capabilities are described in the family-level source. These characteristics make the device relevant to high-density, multi-interface equipment, although the verified text does not establish a single universal speed grade or all interface ratings for this exact ordering code. The reported 2.17 ns loadable-PLD figure and 420 MHz frequency should be interpreted as device-family or listing data rather than independently confirmed timing specifications for every configuration. A design must account for the selected device grade, process corner, voltage, temperature, routing, I/O standard, and implementation constraints. The part is therefore best treated as a high-density configurable platform whose practical throughput depends on the synthesized logic and the surrounding PCB environment. Typical uses include industrial control and automation, communications equipment, high-speed interface aggregation, test and measurement systems, and legacy digital-system replacement. The 540 I/O count supports systems with many parallel or serialized external connections, while the 67,200-cell capacity suits substantial datapath, protocol, and control integration. Buyers should confirm the exact package drawing, ball map, configuration interface, speed grade, and available inventory before release to production. The main design trade-off is density versus verification effort. A 724-ball BGA requires controlled fan-out, power distribution, decoupling, and signal-integrity review, while the large logic capacity can reduce the number of support devices in a system. This page provides a traceable starting point for EP2A70B724C7 sourcing and comparison, but the manufacturer datasheet and current distributor records remain the controlling documents for design approval.
EP2A70B724C7ES - Altera APEX II FPGA 3M Gates 67200 Cells | Intel
The Altera (Intel Programmable Solutions Group) EP2A70B724C7ES is a high-density FPGA from the APEX II family, delivering 3 million system gates with 67,200 logic elements in a 724-pin FCBGA package operating at 420 MHz core performance on 0.15 µm process technology at 1.5 V core supply. The device combines programmable logic, embedded memory, and high-speed I/O in a single die, targeting high-throughput ASIC-replacement and glue-logic designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be re-programmed in-system after manufacturing. APEX II sits in the high-density tier of pre-Cyclone Altera families, between the APEX 20K and the Stratix line, and is characterized by its MultiCore architecture combining fine-grain logic with embedded ESB (Embedded System Block) memory blocks. Within the broader taxonomy, this places EP2A70B724C7ES in the programmable logic family, which sits above ASICs and CPLDs in flexibility/cost trade-off, and below modern SoC FPGAs in integrated features. Key features of the EP2A70B724C7ES include 3,000,000 typical gates (3M gates), 67,200 logic elements (cells), a maximum operating frequency of 420 MHz, on-chip ESB memory, support for multiple I/O standards including LVTTL, LVCMOS, PCI, and GTL+, and dedicated clock management with up to 8 PLLs per device. The 724-pin FCBGA package exposes 540 user I/O pins, enabling high-bandwidth parallel interfaces such as 64-bit PCI, DDR memory controllers, and multi-channel DSP pipelines. The architecture is based on Altera's MultiCore building block with a high-speed interconnect fabric and Look-Up Table (LUT) based logic cells. The 1.5 V core with 0.15 µm process technology reflects the APEX II generation's focus on balancing performance-per-watt with density, while the high I/O count supports wide external buses and multiple high-speed serial/parallel interfaces simultaneously. The C7 speed grade indicates a commercial temperature rating, with the 'ES' suffix denoting an engineering sample. Typical applications include high-speed telecommunications line cards, ASIC prototyping and replacement, ASIC emulation platforms, multi-channel DSP processing, video/image processing pipelines, and high-speed industrial data acquisition. The combination of high gate count and 420 MHz performance makes it suitable for designs previously requiring multiple FPGAs. When designing with this device, ensure your Quartus II design tool version supports the APEX II device family (Quartus II 5.0 or later is recommended) and verify BSDL files for boundary-scan programming. Note that APEX II is an older, mature family and may have limited long-term availability - confirm lifecycle status with authorized distributors before committing to new designs.
EP2A70B724C7N - APEX II FPGA, 67.2K LEs, 3M Gates, 724-FCBGA | Altera
The Altera (now Intel) EP2A70B724C7N is a high-density APEX II family FPGA delivering 3,000,000 system gates and 67,200 logic cells in a 724-pin FCBGA (Flip-Chip Ball Grid Array) package. Operating from a nominal 1.5V core supply at up to 420 MHz internal performance, it is built on a 0.15 µm CMOS process and is fabricated as a loadable programmable logic device with 536 user I/O pins and 16 mega cells of embedded memory. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all of which can be redefined by the designer after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs), which also include CPLDs and SPLDs. APEX II devices specifically target high-performance, high-density applications such as data-path acceleration, telecommunications backplanes, and ASIC prototyping, where the combination of embedded memory, PLLs, and high-speed I/O is critical. Key features include up to 420 MHz internal clock frequency, a propagation delay as low as 2.17 ns, 536 user I/O lines, and a 1.5 V core supply with multi-voltage I/O support. The device supports in-system programmability via JTAG and configuration via the Fast Passive Parallel (FPP) or Passive Serial (PS) modes. The 724-pin FCBGA package uses a 1.27 mm ball pitch and provides 3.5 mm seated height, making it suitable for high-density PCB designs with controlled impedance routing. Architecturally, the APEX II family combines Look-Up Table (LUT)-based logic elements with embedded system blocks (ESBs) that can be configured as dual-port RAM, ROM, or CAM. MultiVolt I/O pins allow interfacing with 1.5V, 1.8V, 2.5V, 3.3V, and 5V systems, which simplifies mixed-voltage designs. Built-in PLLs support clock multiplication, division, and phase shifting for high-speed serial or parallel interfaces. Typical applications include ASIC prototyping, telecommunications switching, high-speed data acquisition systems, DSP co-processing, and video/image processing pipelines. Industrial controls and military/aerospace systems also leverage the device for its high logic density and reconfigurability. Design considerations include careful power-rail sequencing on the 1.5V core, decoupling close to every supply pin, controlled-impedance routing for high-speed I/O, and JTAG chain management for board-level programming. Designers must also verify Quartus II device support and bitstream compatibility, as APEX II is supported by legacy Altera toolchains rather than the latest Intel Quartus Prime releases. This page synthesizes distributor inventory, drop-in same-package alternatives, application examples, and practical design notes that go beyond the manufacturer datasheet summary.
EP2A70B724C8 - APEX II FPGA 67200 LE 724-BGA | Altera
The Altera (now Intel) EP2A70B724C8 is an APEX II Field Programmable Gate Array (FPGA) featuring 67200 logic elements, 1146880 bits of embedded memory, and 540 user I/Os, housed in a 724-ball Fine-pitch Chip-Scale Ball Grid Array (FCBGA / BBGA) package. It is built on a 0.15 µm SRAM-based process and supports MultiVolt I/O operation, making it a high-density programmable logic platform for ASIC prototyping and complex parallel processing. An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, programmable interconnects, and configurable I/O pads that the designer can reconfigure after manufacturing. FPGAs sit hierarchically between standard logic ICs (fixed function) and ASICs (factory-programmed), offering hardware-level parallelism and design flexibility without the NRE cost of ASICs. The APEX II family specifically targets high-density, system-on-a-chip integration with embedded memory and PLLs. Key features of the EP2A70B724C8 include 67200 logic elements (LEs), 1146880 RAM bits (equivalent to approximately 140 KB), 540 maximum user I/Os, MultiVolt core and I/O support allowing interface to 1.8V, 2.5V, 3.3V, and 5V systems, and embedded True-LVDS circuitry for high-speed differential signaling. The 724-BGA package uses a 1.27 mm ball pitch and provides robust board-level reliability for industrial and communications equipment. Technically, the APEX II architecture combines look-up-table (LUT)-based logic elements with embedded system blocks (ESBs) that can be configured as dual-port RAM, ROM, or first-in first-out (FIFO) buffers. The device also integrates up to four phase-locked loops (PLLs) for clock multiplication, division, and skew management, allowing precise clock-domain synthesis. Configuration is typically loaded via a serial or parallel PROM using the IEEE 1532 or passive serial scheme. Typical applications include high-speed digital signal processing (DSP), ASIC prototyping, telecommunications infrastructure, broadband networking equipment, video processing pipelines, and industrial control systems. Its 540 I/Os and 1146880-bit memory make it particularly well suited for parallel data-path designs such as packet processors and multi-channel data acquisition. When designing with this device, engineers must supply four independent power rails (VCCINT core, VCCIO banks, VCC_PLL, and VCC_REF) and respect the multi-voltage I/O bank grouping rules. Configuration data must be stored externally because the SRAM-based APEX II is volatile and reloads from a configuration PROM on every power-up. Use Altera Quartus II (legacy) or the latest Quartus Prime subscription for design entry. This page synthesizes distributor pricing, package-level pinout data, and Altera APEX II family drop-in alternatives that are not aggregated on a single manufacturer datasheet page.
EP2A70B724C8N - APEX II FPGA, 3M Gates, 724-FCBGA | Altera / Intel
The Altera (now Intel) EP2A70B724C8N is a high-density APEX II family field-programmable gate array (FPGA) delivering 3 million system gates and 67,200 logic elements in a 724-ball fine-pitch BGA (FCBGA-724) package. Built on a 0.15 um CMOS process, the device supports a maximum internal clock frequency of 281 MHz and operates from a 1.5 V core supply. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device that integrates configurable logic blocks, programmable interconnect, and embedded memory into a single die. Within the broader taxonomy, the EP2A70B724C8N belongs to the PLD (programmable logic device) family, which encompasses CPLDs and FPGAs; within Altera's portfolio it sits in the APEX II series, a high-density, SRAM-based, look-up-table (LUT) architecture targeting data-path, communications, and DSP workloads. Key features of this device include a 2.49 ns propagation delay, 16 embedded macrocells per logic array block with 32 product terms, 536 maximum user I/O lines, 1.270 mm ball pitch, and a square 724-terminal FCBGA package optimized for high-speed signal integrity. The APEX II architecture combines LUT-based logic with embedded array blocks (EABs) for distributed RAM and DSP, enabling on-chip implementation of multipliers, FIFOs, and dual-port memories without external components. Typical applications for the EP2A70B724C8N include high-throughput telecommunications line cards, baseband signal processing, networking switches and routers, custom DSP pipelines, and prototyping for ASIC-class designs. The 724-pin FCBGA and 1.5 V core make it suitable for high-density boards with multiple supply rails. When designing with this device, ensure decoupling capacitors are placed adjacent to every supply pin and that the 1.5 V core rail is generated by a low-noise LDO or DC-DC converter with adequate transient response. Note that the APEX II family has been classified as mature/end-of-life by Altera/Intel; confirm long-term availability before committing to new production designs. This page synthesizes distributor pricing, drop-in same-package APEX II variants, and practical design notes not found in the manufacturer datasheet.
EP2A70B724C9 - APEX II 540 I/O 724-BGA FPGA | Altera / Intel
The Intel / Altera EP2A70B724C9 is a member of the APEX II Field-Programmable Gate Array family, delivering 67,200 logic elements backed by 1,146,880 bits of embedded memory and 540 user I/Os in a 724-ball FineLine BGA package. Built on a 0.15-micrometer all-layer copper process with up to eight metal layers, it integrates up to eight LVDS channels operating at 1 Gbps and offers True-LVDS, LVPECL, PCML, and HyperTransport-compatible I/O standards. The 'C9' speed grade denotes the commercial temperature range (0C to +85C) and the 9th-order speed bin for this family. The 'B724' suffix confirms the 724-ball FineLine BGA footprint, while the package name on the part is listed as 724-BBGA, FCBGA. An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) that combines the flexibility of software-based design with near-ASIC performance and parallelism. APEX II sits in the hierarchy of programmable logic: PLD -> CPLD/FPGA family -> high-density SRAM-based FPGA -> multi-gigabit transceiver-capable device. APEX II was engineered for high-bandwidth DSP, datapath-intensive designs, and on-chip memory-rich applications requiring up to 1.146 Mbits of embedded system block (ESB) RAM and PLLs for clock management. Key features include embedded RAM blocks (ESBs) configurable as true dual-port, simple dual-port, or single-port synchronous memory, with self-timed write enable that eliminates external WE signal generation. The device supports up to four PLLs for clock multiplication, division, and phase shifting, and offers true 1 Gbps LVDS I/O for chip-to-chip interconnect. The 540 user I/Os include dedicated high-speed channels suitable for HyperTransport, RapidIO, and LVDS signalling, making APEX II well suited to high-throughput bridging and protocol conversion designs. The architecture combines Look-Up Table (LUT)-based logic with ESB memory, allowing designers to trade logic capacity against memory capacity per design block. Multi-level interconnect with fast row and column paths targets DSP and datapath workloads where sustained arithmetic throughput matters more than raw clock rate. FineLine BGA packaging supports dense board layouts while preserving signal integrity for the high-speed LVDS channels, which require matched impedance routing and careful length matching. Typical applications include high-speed serial protocol bridging (RapidIO, HyperTransport, custom LVDS links), DSP co-processing for wireless baseband or video pipelines, datapath acceleration in telecom line cards, and high-density glue logic with embedded memory buffering. The wide I/O count also suits it for memory-controller fanout and large bus-conversion designs where many parallel interfaces must be aggregated. When designing with this device, ensure proper LVDS signal integrity with controlled-impedance routing and matched-length traces; verify JTAG chain integrity in production programming; and follow Altera's power estimation flow using the Quartus APEX II power calculator before sign-off. Synchronous RAM blocks require careful clock-domain crossing analysis when shared with asynchronous logic. This page synthesizes distributor pricing for EP2A70B724C9, same-family drop-in alternatives within the APEX II lineup, and practical design notes beyond what the manufacturer datasheet alone provides.
EP2A70B724C9ES - APEX II FPGA 3M Gates 67200 Cells 724-FCBGA | Intel
The Intel (formerly Altera) EP2A70B724C9ES is a high-density APEX II family Field Programmable Gate Array (FPGA) with 3 million system gates, 67,200 logic elements, and 1,146,880 bits of embedded memory, housed in a 724-pin flip-chip BGA (FCBGA) package. It is built on a 0.15 µm CMOS process, operates from a 1.5 V core supply, and delivers up to 198 MHz internal performance, with 540 user I/O pins supporting multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, and LVDS. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines the architecture of gate arrays with the programmability of logic cells. Within the broader semiconductor taxonomy, FPGAs sit alongside CPLDs, microcontrollers, and ASICs as reconfigurable computing fabrics used to implement custom digital logic, glue logic, signal processing, and hardware-accelerated functions. APEX II belongs to Intel's (Altera's) mid-2000s high-density family targeting communications, video, and DSP designs, and was later succeeded by Stratix and Cyclone families. Key features include 540 user I/O pins, 1,146,880 bits of embedded SRAM, built-in PLLs for clock management, and multi-voltage I/O support allowing 1.5V, 1.8V, 2.5V, and 3.3V interface to external memory and bus devices. The device integrates dedicated multiplier blocks, True-LVDS support, and a high-speed embedded array for DSP and communications pipelines. With 3M system gates and 198 MHz performance, the EP2A70B724C9ES was the flagship of the APEX II line for high-bandwidth parallel processing tasks. The architecture uses a MultiCore interconnect with embedded memory blocks distributed across the die, providing predictable timing closure for wide data-path designs. The 724-pin FCBGA package supports hundreds of general-purpose and high-speed serial pins and is intended for high-density, high-performance PCB designs with controlled-impedance routing and matched-length differential pairs. Compared with later FPGA generations, APEX II lacks hard processor cores, transceivers, and DSP blocks, but its parallel fine-grained logic fabric remains useful for legacy designs and replacement applications. Typical applications include telecommunications baseband processing, high-speed video bridging and image processing, network switches and routers, PCI/PCI-X bridge logic, custom DSP pipelines, and industrial control systems. It is also used in legacy test equipment and aerospace/defense subsystems where long lifecycle and pin-compatible replacement are required. The wide operating temperature range and 540 I/O make it suitable for board-level integration with multiple memory and bus devices. When designing with EP2A70B724C9ES, ensure the PCB has a 1.5V core regulator with adequate decoupling, configure I/O banks according to the Quartus design tool, and follow Intel's layout guidelines for FCBGA packages including microvia stacks, signal-integrity-aware stackup design, and thermal management. Note that APEX II is in production for legacy/long-lifecycle customers and lead times may be longer than for current-generation FPGAs. This page synthesizes distributor pricing, drop-in APEX II and APEX-family alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers shorten selection time and qualify second-source parts.
EP2A70B724C9N - APEX II 70K FPGA, 724-FCBGA | Intel / Altera
The Intel (formerly Altera) EP2A70B724C9N is a high-density APEX II family Field Programmable Gate Array (FPGA) delivering approximately 3 million system gates and 67,200 logic elements, housed in a 724-pin FCBGA package. Built on a 0.15 µm CMOS process, the device operates from a nominal 1.5 V core supply (1.425 V–1.575 V) with maximum internal clock frequencies up to 198 MHz, and provides up to 536 user I/O lines for high-bandwidth parallel interfacing. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be re-programmed to implement arbitrary digital logic functions. FPGAs sit in the digital IC hierarchy as: FPGA -> Programmable Logic Device (PLD) -> Logic IC -> Integrated Circuit -> Semiconductor. The APEX II family targets high-performance, multi-gate designs such as telecommunication infrastructure, high-speed datapath processing, and ASIC prototyping, bridging the gap between mid-range CPLDs and full custom ASICs. Key features include 3 M system gates, 67,200 logic cells, embedded memory blocks, four phase-locked loops (PLLs) for clock management, multi-standard I/O support including LVDS, and 198 MHz internal operation. The 0.15 µm process technology reduces die size while delivering low static power, and the FCBGA-724 package offers a thermal-resistance advantage suitable for high-utilization designs. Each APEX II device is built around Look-Up Table (LUT)-based logic elements combined with a hierarchical interconnect fabric optimized for predictable timing closure. The architecture combines LUT-based logic elements, embedded system blocks (ESBs) for RAM/ROM, fast interconnect, and on-chip PLLs for clock synthesis. This combination enables designers to absorb entire subsystems — including memory controllers, datapath engines, and bus interfaces — into a single device, eliminating the need for multiple CPLDs or ASIC gates. The 3 M system-gate rating positions the EP2A70 well above mid-range FPGAs in capacity and below high-end Stratix-class devices. Typical applications include telecommunications line cards, ASIC prototyping, high-speed image processing pipelines, network switches/routers, and DSP co-processing. The 724-pin FCBGA package supports dense I/O layouts required by parallel bus architectures and high-pin-count memory interfaces. APEX II devices are commonly deployed in designs migrated from APEX 20KE families where higher logic density or extended I/O is needed. When designing with this part, ensure robust 1.5 V core power decoupling with low-ESR ceramic capacitors placed adjacent to every VCC/VCCIO pin pair. The FCBGA-724 package requires controlled-impedance PCB stack-up and microvia technology; reflow profile must respect the 724-ball mass and the moisture sensitivity level (MSL) preconditioning. Signal integrity at 198 MHz operation demands matched-length routing and proper termination on LVDS pairs. This page synthesizes distributor pricing, drop-in alternatives from the same APEX II family, and practical design notes not found in the manufacturer datasheet, helping engineers select, source, and integrate the EP2A70B724C9N efficiently.
EP2A70B724I-7 - 70k LE APEX II FPGA, BGA-724, Industrial | Intel
The Intel (formerly Altera) EP2A70B724I-7 is a member of the APEX II family of field-programmable gate arrays (FPGAs), housed in a 724-pin BGA package and rated for the industrial temperature range. The APEX II architecture combines look-up table (LUT)-based logic elements, embedded system blocks (ESBs) for memory and arithmetic, and high-speed I/O, positioning the family between traditional gate arrays and complex programmable logic devices. The EP2A70 variant denotes the largest device in the family with approximately 70,000 logic elements, targeting high-density data-path and datapath-intensive designs. The APEX II family occupies the programmable logic device category in the broader semiconductor hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. APEX II FPGAs are fabricated on a sub-micron CMOS process and offer multi-voltage I/O standards including LVTTL, LVCMOS, PCI, SSTL, and GTL+, enabling direct interfacing with a wide range of memory and bus standards without external translators. Each embedded system block provides dual-port RAM, ROM, product-term logic, and dedicated arithmetic chains, allowing the same silicon to implement FIFOs, CAMs, multipliers, and registered memories. Key features of the EP2A70B724I-7 include approximately 70,000 logic elements (per family marketing), 156,000 to 220,000 typical system gates depending on configuration, multiple embedded system blocks, multi-standard I/O support, and in-system programmability through the IEEE 1149.1 (JTAG) interface or passive/active serial configuration. The "I-7" suffix denotes the industrial temperature grade and a speed grade of -7. The BGA-724 package provides the pin density required to expose the full I/O and supply the power-distribution network needed for the device's logic capacity. Typical applications include high-speed telecommunications line cards, network switches and routers, RAID controllers, channel cards for storage area networks, DSP co-processing, and glue logic for complex processor subsystems. The 724-ball BGA package supports high pin-count board layouts where the large logic and memory resources of the device are fully utilized. When designing with this device, ensure the PCB has a minimum of six PCB layers with dedicated power and ground planes to maintain signal integrity for the LVTTL/LVCMOS and SSTL I/O. Provide a JTAG header for in-system programming and boundary-scan test, and follow the Altera configuration device datasheet for selecting compatible EPC4, EPC8, or EPC16 configuration memories when using passive or active serial modes. This page synthesizes distributor pricing, FPGA family alternatives, and APEX II design considerations not found in the original datasheet, giving engineers an integrated view of availability, footprint compatibility, and supply-chain options for legacy Altera FPGA designs.
EP2A70B724I-8 - APEX II FPGA, 67.2K Cells, 724-BGA | Altera
The Altera (now Intel) EP2A70B724I-8 is a member of the APEX II family of Field-Programmable Gate Arrays (FPGAs), offering 67,200 logic cells backed by 3 million system gates in a 0.15 µm CMOS process. The device operates from a 1.5 V core supply, integrates high-speed LVDS-capable I/O, and is delivered in a 724-pin FCBGA package with industrial temperature grade (-40 °C to +100 °C ambient) and a peak reflow rating of 220 °C. Key features of the APEX II architecture include MultiCore interconnect with embedded array blocks (EABs) for fast on-chip memory, a hierarchical Look-Up Table (LUT) fabric supporting 4-input LUTs, embedded multiplier support via dedicated DSP rows, and four phase-locked loops (PLLs) for clock multiplication and deskew. The family supports up to 281 MHz internal operation and is built around the LUT-based logic element combined with embedded system blocks, which combine SRAM and dedicated logic for efficient data-path implementation. From a system-architecture perspective, FPGAs occupy a distinct tier in programmable logic: they sit above standard Complex Programmable Logic Devices (CPLDs) in capacity and below Application-Specific Integrated Circuits (ASICs) in per-unit cost, while offering parallel hardware fabrics that can be reconfigured after PCB assembly. The APEX II family targets high-density data-path applications such as telecommunications backplanes, parallel DSP, and high-speed bus bridging, where a designer needs ASIC-class throughput without NRE tooling costs. Typical applications for the EP2A70B724I-8 include communications infrastructure (SONET/SDH framer ICs, ATM switching fabrics, 10/40 Gb Ethernet packet processors), high-performance DSP (FIR filters, FFT engines, baseband modem processing), and ASIC prototyping/emulation platforms. The 724-pin FCBGA package exposes roughly 380 user I/O pins, sufficient for wide parallel buses such as 64-bit SDRAM interfaces or multi-channel LVDS links. When designing with this part, pay particular attention to multi-rail decoupling: the 1.5 V core, 3.3 V I/O bank supplies, and PLL analog supply must each be filtered with low-impedance ceramic capacitors placed within 5 mm of their respective pins. Configuration via JTAG or passive serial should be planned against the board's boot-time budget because the configuration image for a 70K-cell device typically exceeds 1 Mbit. This page synthesizes distributor availability, same-family APEX II alternatives, and practical PCB design notes not found in a single Altera datasheet chapter. Engineers evaluating EP2A70B724I-8 for legacy or long-lifecycle programs should review the lifecycle status carefully before committing to new board designs.
EP2A70B724I-9 - APEX II FPGA 70K LE, BGA-724, -9 Speed | Altera / Intel
The Altera (Intel) EP2A70B724I-9 is a member of the APEX II family of Field-Programmable Gate Arrays (FPGAs) that delivers up to 70,000 typical logic elements and 4,290 Kbits of embedded RAM in a 724-pin BGA package with -9 speed grade and industrial temperature rating. As part of the APEX II series, it integrates LUT-based logic, embedded memory blocks, and a MultiCore interconnect that supports high-performance data-pipeline designs. The -9 speed grade designates one of the faster bin positions in the APEX II family, providing higher Fmax than -10 (slower) grades at typical process corners. APEX II (Advanced Programmable Element Matrix II) is Altera's second-generation MultiCore architecture FPGAs that combine look-up-table (LUT) logic, embedded system blocks (ESBs) for memory, and a hierarchical row/column interconnect for predictable timing closure. They are positioned in Altera's product hierarchy as APEX II -> APEX family -> SRAM-based programmable logic -> FPGA -> programmable logic device -> semiconductor. APEX II devices were widely adopted in high-density glue logic, data-path processing, and pre-SOC prototyping designs of the late 1990s and early 2000s. Key features include high-density fine-grained logic with 70K typical LEs, 4,290 Kbits of embedded system block (ESB) memory for distributed RAM and FIFO applications, and the MultiCore interconnect that provides predictable row-and-column based routing. The -9 speed grade targets higher clock-frequency designs versus the slower -10 bin. The 'I' suffix designates the industrial temperature range (-40C to +100C operating), making it suitable for harsh-environment deployments. The BGA-724 package with 1.27 mm pitch is the largest in the APEX II family and supports maximum user I/O for dense interconnect. Typical applications include high-performance data-path processing, telecom protocol engines, network switch fabric, and legacy high-density glue-logic replacement. The large embedded memory count makes it suitable for FIFO-intensive designs such as ATM/SDH framers and base-station channel cards. APEX II devices retain an installed base in industrial control and military/aerospace systems where long lifecycle support and ITAR/legacy compatibility matter more than raw modern Fmax. When designing with the EP2A70B724I-9, engineers must use the legacy Altera Quartus II design tool (versions 4.x-9.x recommended) since later Quartus versions dropped APEX II device support after Altera's 2010+ portfolio refresh. Configuration requires an EPC4, EPC8, or EPC16 enhanced configuration device or a passive serial/PROM-based boot. Decoupling guidelines call for at least 12 bulk + 24 high-frequency capacitors distributed around the BGA power pins to control simultaneous switching noise.
EP2A70B724I7 - APEX II FPGA 3M Gates 67200 Cells 420MHz 1.5V 724-FCBGA | Intel
The Intel EP2A70B724I7 is a high-density FPGA from the APEX II family, integrating 3 million system gates and 67200 logic elements in a 724-pin FineLine BGA (FCBGA) package. It is fabricated on a 0.15 um CMOS process, operates from a 1.5 V core supply, and is specified for the industrial temperature range. The device includes an embedded MultiCore interconnect, up to 4 PLL blocks, and dedicated True-LVDS circuitry, supporting high-speed serial and parallel I/O up to 420 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all of which can be re-programmed after manufacture. APEX II belongs to the broader hierarchy of programmable logic devices (PLDs), sitting between traditional CPLDs (Complex Programmable Logic Devices) and modern SoC FPGAs. The 3 M-gate class places EP2A70B724I7 in the high-density tier, alongside DSP and embedded-processor cores, typically used for data-path and bus-interface glue logic. Key features include 67200 logic elements, approximately 429 Kbits of embedded system memory (ESBs), 4 PLLs, 8 True-LVDS channels, multi-voltage I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) on a per-bank basis, and JTAG-based in-system programmability via IEEE 1149.1 (Boundary-Scan) and IEEE 1532 (ISP). The 724-pin FCBGA package exposes the maximum I/O count of the family, enabling wide parallel buses and high-pin-count ASIC replacement designs. The architecture combines a MultiCore array, look-up-table-based logic elements, fast row/column interconnect, and embedded memory blocks. The 0.15 um process and 1.5 V VCCINT minimize dynamic power, while the True-LVDS interface delivers source-synchronous signaling for video, telecom, and backplane applications up to 840 Mbps per channel. Typical applications include high-speed communications backplanes, ASIC prototyping, video broadcast equipment, military and aerospace signal processing, and industrial control systems. The wide I/O count also makes it a frequent choice for legacy PCI, RapidIO, and custom parallel bus bridges. The industrial temperature grade (-40 C to +100 C case) supports deployment in harsher environments than commercial-grade FPGAs. When designing with EP2A70B724I7, follow Intel/Altera APEX II layout guidelines: provide solid VCCINT and VCCIO planes with low-ESR decoupling placed within 5 mm of every supply pin, and respect the simultaneous-switching-output (SSO) limits in the family datasheet. This device is mature (introduced circa 2002) and is now typically sourced through distributors stocking obsolete or last-time-buy inventory; design teams should plan a long-term supply path or pin-compatible migration to APEX 20K/Stratix families. This page synthesizes distributor availability, parametric equivalents, and APEX II design guidance not bundled in the legacy datasheet, helping engineers evaluate lifecycle risk and migration options in a single view.
EP2A70B724I7N - APEX II 3M Gates 67200 Cells FPGA | Intel
The Intel (formerly Altera) EP2A70B724I7N is a high-density programmable logic device from the APEX II family, integrating 3 million system gates and 67,200 logic elements in a 724-pin FCBGA package. Built on a 0.15 um CMOS process, it operates from a 1.5 V core supply and supports system frequencies up to 420 MHz, making it suitable for high-performance parallel processing, telecom line cards, and DSP-intensive designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that the engineer can reconfigure after manufacturing. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and offer higher logic density, embedded multipliers, and high-speed serial transceivers. APEX II is positioned within Intel/Altera's high-density, pre-Stratix family aimed at data-path and DSP applications. Key features of the EP2A70B724I7N include 67,200 logic elements, embedded system gates of 3 million, embedded memory of approximately 425 Kbytes, support for multiple I/O standards including LVDS, PCI-X, HSTL, and SSTL, and 16 high-speed clock networks with up to 420 MHz internal performance. The device supports in-system programmability via passive serial, passive parallel, and JTAG configuration modes, and provides built-in boundary-scan test. Architecturally, the APEX II device combines a MultiCore architecture with embedded Look-Up Tables (LUTs), Embedded System Blocks (ESBs) for memory, and dedicated carry chains for arithmetic. Its 0.15 um process and 1.5 V VCCINT deliver a balance of speed and power, and the 724-pin FCBGA package provides 536 user I/O pins distributed across multiple I/O banks supporting mixed-voltage signaling. Typical applications include telecom line-card interfaces, high-speed packet processing, DSP co-processing for imaging and video, military/aerospace signal processing, and ASIC prototyping where high gate count and predictable timing closure are required. When designing with this device, ensure proper power sequencing on VCCINT (1.5 V) and VCCIO bank supplies, and use the Altera Quartus II design tool (or its later successors) for synthesis, place-and-route, and timing analysis. Decoupling and ground-plane design must follow FCBGA layout guidelines. This page synthesizes pricing, drop-in alternatives, and practical design considerations specific to the EP2A70B724I7N, providing engineering value beyond the manufacturer datasheet summary.