FPGA & CPLD
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EP2AGZ350HF40C3N - Arria II GZ FPGA, 350K LE, 1517-FCBGA | Intel
The Intel EP2AGZ350HF40C3N is a high-density Arria II GZ field-programmable gate array (FPGA) with 348,500 logic elements, 21,270,528 bits of embedded memory, and 734 user I/Os, housed in a 1517-ball flip-chip BGA package. It belongs to Intel's mid-range transceiver-equipped FPGA family built on a 40 nm low-power process, delivering up to 13,940 LABs (logic array blocks) and a DSP block count in the thousands for high-throughput signal processing. The device integrates up to 24 multi-gigabit transceivers and supports external memory interfaces such as DDR3, QDRII+, and RLDRAM2, making it a drop-in pin-compatible option for high-bandwidth telecom and video infrastructure designs. What is an FPGA? An FPGA (field-programmable gate array) is a semiconductor device whose digital logic functionality is defined after manufacturing through user-supplied configuration bitstreams stored in SRAM. FPGAs sit at the top of the programmable logic hierarchy (programmable logic device -> CPLD/FPGA -> semiconductor) and are widely used to implement parallel datapaths, custom interfaces, and hardware accelerators that would otherwise require costly ASIC development. The Arria II GZ family targets mid-range applications requiring transceivers and moderate logic density at lower cost than Stratix-class parts. Key features include transceiver data rates up to 6.553 Gbps, dedicated fractional PLLs, configurable I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and on-chip termination (OCT). The 1517-ball FCBGA package uses flip-chip interconnect for low-inductance power delivery and supports the 0.9 V core voltage typical of Arria II GZ. The device is designed for industrial temperature grades and offers bitstream encryption and JTAG-based configuration with support for EPCS and EPCQ configuration devices. Architecturally, the EP2AGZ350HF40C3N combines ALM-based adaptive logic modules with hard memory blocks (M9K and M144K), variable-precision DSP blocks, and PCI Express hard IP, enabling efficient implementation of high-performance DSP pipelines, video processing, and protocol bridging functions. Configuration can be loaded via fast passive parallel (FPP), active serial (AS), or JTAG modes. Typical applications include wireless baseband processing, military radar front-ends, broadcast video switchers, ASIC prototyping, and high-speed serial interface bridging. The integrated transceivers make the device suitable for backplane aggregation, SONET/SDH, and Custom Interconnect designs where 6 Gbps links are needed. When designing with this device, ensure PCB layout meets Intel's flip-chip BGA decoupling and thermal guidelines, and use the Quartus II design suite (13.0 or later) for synthesis, place-and-route, and timing closure. Note that Arria II GZ is a mature family - verify long-term availability for new production designs.
EP2AGZ350HF40C4G - 350K LE Arria II GZ FPGA | Intel | FBGA-1517
The Intel (formerly Altera) EP2AGZ350HF40C4G is a high-density Arria II GZ field-programmable gate array (FPGA) delivering 350,000 logic elements, 20,480 Kbits of embedded memory, and 4.7 Mbits of user-accessible RAM in a 1517-ball flip-chip BGA (FBGA-1517) package. It is rated speed grade 4 with a commercial operating temperature range of 0C to 85C and ships as a Pb-free tray-packaged unit. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, embedded memory, DSP blocks, and high-speed transceivers connected by a programmable routing fabric. FPGAs occupy a hierarchy between fixed-function ASICs and general-purpose processors: they offer hardware-level parallelism and deterministic latency without the NRE cost of an ASIC, while remaining reprogrammable in the field. The Arria II GZ family sits in Intel's mid-to-high-density transceiver-equipped tier, optimized for high-bandwidth applications such as high-speed serial interfaces and DSP-heavy signal processing. Key features of the EP2AGZ350HF40C4G include support for 4 multi-protocol 3.125 Gbps transceivers (the exact number of transceiver channels for this device-specific package may vary; check the device datasheet for the precise transceiver count), 8 fractional PLLs, dedicated hard memory controllers supporting DDR3, DDR2, and QDR memory, and a hard PCI Express Gen2 endpoint block. The device is fabricated on a 40 nm low-power process and integrates configurable I/O standards including LVDS, LVCMOS, SSTL, HSTL, and high-speed serial interfaces through the transceiver block. The Arria II GZ architecture combines a fine-grained logic fabric with column-based DSP blocks and embedded SRAM (M9K blocks of 9 Kbits and M144K blocks of 144 Kbits) for efficient implementation of DSP pipelines, video processing, and protocol bridging. The hard PCIe Gen2 endpoint eliminates the soft-IP overhead typical of FPGA-based PCIe implementations, enabling low-latency single-chip solutions for industrial and test-card designs. Configuration is supported via JTAG, passive serial, fast passive parallel, and active serial modes using a wide range of industry-standard configuration memories. Typical applications for the EP2AGZ350HF40C4G include high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, SATA, XAUI), HD-SDI and 3G-SDI video processing, software-defined radio front-end sample processing, and high-channel-count DSP pipelines for test and measurement. The large logic capacity combined with hard PCIe and memory controllers makes it suitable as a host-side co-processor in medical imaging, defense signal intelligence, and high-performance industrial inspection systems. When designing with this device, pay close attention to the FBGA-1517 PCB land pattern - the 1.0 mm ball pitch requires high-density interconnect (HDI) PCB fabrication with micro-vias, and signal-integrity analysis of the transceiver channels is essential above 2.5 Gbps. Power estimation with the Intel FPGA PowerPlay Early Power Estimator (EPE) should be completed before committing to the PCB stackup, because the 40 nm process can dissipate substantial power under heavy DSP and transceiver utilization. This page synthesizes distributor pricing, drop-in alternatives from the Arria II GZ family, and practical design notes not found in the manufacturer datasheet.
EP2AGZ350HF40C4N - Arria II GZ FPGA, 350K LE, 1517-BGA | Intel
The Intel (formerly Altera) EP2AGZ350HF40C4N is a high-density, high-performance Arria II GZ Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process and packaged in a 1517-ball FC-FBGA (HF40 / 40 mm). It integrates 348,500 logic elements (LEs) across 13,940 LABs, 21,270,528 bits of embedded memory (approximately 21.27 Mbits), and 734 user I/O pins, making it one of the densest mid-range FPGAs available for bandwidth-intensive applications. The C4 speed grade and commercial temperature grade target design teams that need deterministic, repeatable timing margins without paying for the industrial -I4 margin. An FPGA is a reprogrammable semiconductor that engineers can configure post-manufacturing to implement custom digital logic, DSP pipelines, memory controllers, transceiver interfaces, and high-speed serial protocols. Within the broader programmable-logic hierarchy, the Arria II GZ family sits between Cyclone (low-cost) and Stratix (high-end) families. Its 40 nm process technology, embedded transceivers (per family datasheet) and 0.9 V core supply make it well-suited for systems where performance per watt is more important than absolute capacity. Key features include 8-input adaptive logic modules (ALMs), fractional synthesis PLLs, up to 16 global clock networks, and dedicated DSP blocks that deliver up to ~550 MHz multiply-accumulate performance. Memory is organized as M9K and M144K blocks, with 24 transceiver channels supporting rates up to 6.375 Gbps (per family datasheet). The HF40 package exposes 734 general-purpose I/O plus dedicated clock, configuration, and JTAG pins for boundary-scan and in-system programming via JTAG or passive/active serial. The architecture is built around a core fabric of columns and rows of LABs interconnected by multi-track routing, with dedicated hardware for 18 x 18 multipliers, memory blocks, and high-speed I/O serializer/deserializer (SERDES) elements. The 40 nm process balances static and dynamic power, and Arria II GZ devices support Quartus II programmable power technology that automatically reduces power on unused blocks. Configuration is loaded from a serial flash or via JTAG using the active serial (AS) or JTAG modes, supporting fast field updates and remote reprogramming. Typical applications include high-performance digital signal processing (radar, baseband, software defined radio), video processing and broadcast infrastructure, 40G/100G line-card bridging, test and measurement equipment, and high-end industrial imaging. The combination of 21 Mbits of block RAM and 734 user I/O also suits large datapath buffering for high-resolution video walls or medical imaging front-ends. When designing with this device, plan the PCB layout around the 40 x 40 mm FC-BGA land pattern, using microvia stack-ups for breakout, and provide multiple decoupling values (0.1 uF, 1 uF, 10 uF) close to each power rail. Always sequence the 0.9 V core before the 1.1 V/2.5 V/3.3 V auxiliary supplies to avoid latch-up at power-up. This page synthesizes distributor pricing, same-family drop-in alternatives from the Arria II GZ portfolio, and practical design notes not found in the manufacturer datasheet alone.
EP2AGZ350HF40I2N - 350K LE Arria II GZ FPGA, 1517-Pin FBGA | Intel
The Intel (formerly Altera) EP2AGZ350HF40I2N is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) housed in a 1517-pin flip-chip BGA (HF40) package, industrial temperature grade, lead-free. As part of the Arria II GZ family it delivers up to 350K logic elements, embedded transceivers capable of multi-gigabit serial I/O, and dedicated DSP blocks for high-throughput signal processing. An FPGA (field-programmable gate array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and hardened peripherals that can be reconfigured by the customer after manufacture. FPGAs sit in the programmable-logic hierarchy above CPLDs and below custom silicon, providing ASIC-class performance with mask-set-free time-to-market. The Arria II GZ family specifically targets transceiver-rich applications such as wireless baseband, broadcast video, and defense signal processing where mid-range density and 6.375 Gbps transceivers are sufficient. Key features of the EP2AGZ350HF40I2N include the 350K logic-element fabric, embedded 6.375 Gbps multi-gigabit transceivers, on-chip memory, phase-locked loops for clock management, and a high-pin-count flip-chip BGA package that supports the wide parallel and serial I/O required by the largest device in the family. The industrial temperature grade (-40C to +100C) and lead-free solder-free build make it suitable for harsher environments than commercial Arria II GZ parts. Architecturally the device combines a logic fabric synthesized from 8-input adaptive look-up tables, embedded memory blocks, DSP blocks with 18x18 multipliers, and hardened PCIe and memory controllers. The transceiver physical media attachment layer supports multiple protocols including CPRI, OBSAI, Serial RapidIO, and 10G Ethernet MAC integration for backplane and fronthaul links. Typical applications include wireless base-station digital front-end, software-defined radio, high-performance computing accelerators, military radar and electronic-warfare platforms, broadcast video processing, and ASIC prototyping. The HF40 1517-pin FBGA package provides the signal integrity and pin budget required for parallel data paths and multiple transceiver channels. Designers should plan power-rail decoupling carefully; the EP2AGZ350HF40I2N draws significant transient current and requires multiple bulk and high-frequency ceramic capacitors around the periphery of the package, along with a multilayer PCB stackup dedicated to the FPGA. This page synthesizes distributor availability, drop-in alternative Arria II GZ variants, and FPGA design considerations that are not aggregated in any single distributor listing, providing a faster path from datasheet to design review.
EP2AGZ350HF40I3 - Arria II GZ FPGA, 350K LE, 1517-FBGA | Intel
The Intel EP2AGZ350HF40I3 is a high-density Arria II GZ Field Programmable Gate Array (FPGA) fabricated on a 40 nm low-power process, delivering 348,500 logic elements, 21,270,528 bits of embedded memory, and 13,940 user I/O pins in a 1517-ball Flip-Chip BGA (HF40, 40 mm x 40 mm) package. The Industrial temperature grade (-40C to +100C) device is rated for 1.0 V core operation and integrates 24 transceivers capable of up to 6.375 Gbps, four hard PCI Express Gen2 controllers, and 8 hard memory controllers supporting DDR3 up to 800 MHz. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - a category of digital integrated circuits whose logic function is defined by user configuration rather than fixed at the factory. In the taxonomy of digital semiconductors, FPGAs sit between microcontrollers and ASICs, offering parallel programmable fabric with hard IP cores for memory controllers and high-speed serial I/O. The Arria II GZ family is positioned as a mid-range transceiver-rich FPGA optimized for high-bandwidth applications where ASIC NRE costs cannot be justified. Key differentiating features of the EP2AGZ350HF40I3 include 1.36 Gbps LVDS support on the LVDS side of the I/O, fractional phase-locked loops (fPLLs) for precision clocking, and 768 18x18 multipliers for DSP workloads. The device supports configuration via passive serial, fast passive parallel, and JTAG, with built-in encryption support for design security through AES-256 configuration bitstream encryption. Architecturally, the device combines a programmable logic fabric with column-based DSP blocks arranged in rows alongside M20K embedded memory blocks. Hard IP for PCIe Gen2 and 10 Gigabit Ethernet reduces logic utilization and timing closure effort, making the device suitable for high-throughput data-path designs. The 40 nm process allows a favorable trade-off between static power, dynamic performance, and price-per-logic-element compared with 65 nm predecessors. Typical applications include high-end test and measurement equipment, medical imaging, military radar and signal processing, broadcast video infrastructure, and high-performance computing accelerators. The transceiver-rich architecture and large logic density also suit the device for ASIC prototyping, where designers emulate full SoCs before committing to silicon. When designing with this device, allocate at least 30 % of the available logic budget for future revisions, since utilization above 85 % complicates timing closure. Pay close attention to transceiver channel placement -24 channels must be evenly distributed across the four transceiver banks to meet lane skew requirements at 6.375 Gbps. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Cross-brand cross-reference is intentionally limited because the 1517-BGA footprint and Arria II GZ fabric are unique to Intel (formerly Altera), and true drop-in replacements from Xilinx or Lattice would require full PCB redesign.
EP2AGZ350HF40I3G - Arria II GZ FPGA, 350K LE, 1517-BGA | Altera
The Altera (Intel) EP2AGZ350HF40I3G is a high-density Arria II GZ Field Programmable Gate Array (FPGA) with 348,500 logic elements, 20.29 Mbit embedded memory, and 1,517-pin FCBGA package, engineered for high-performance digital signal processing and high-speed serial connectivity. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect that engineers can reconfigure after manufacturing. FPGAs occupy a unique position in the broader IC hierarchy between standard microcontrollers and ASICs: more flexible than fixed-function ASICs, faster and more parallel than sequential microcontrollers. The Arria II GZ family specifically targets mid-range high-bandwidth applications such as high-speed serial interfaces, video processing, and DSP-heavy designs where Stratix-class performance is not required. Key features of the EP2AGZ350HF40I3G include 139,400 Adaptive Logic Modules (ALMs) organized as 348,500 equivalent logic elements (LEs), 20.29 Mbit of on-chip embedded memory arranged as M9K and MLAB blocks, and 1,170 18x18 hardware multipliers for DSP operations. The 1517-ball FCBGA package operates across the industrial -40C to +100C temperature range and supports multiple high-speed transceiver options. According to the device nomenclature, the "HF40" suffix indicates the 40mm FCBGA package with high-speed serial I/O, "I3" indicates industrial temperature grade, speed grade 3, and "G" denotes lead-free / RoHS-compliant Pb-free terminal finish. This part is designed into high-speed serial interfaces, broadcast video processing, and DSP-intensive systems. The device operates with a -3 speed grade designation under the Arria II GZ performance binning scheme. The transceiver-rich architecture provides multi-gigabit transceivers suitable for protocols including PCIe Gen1/Gen2, Serial RapidIO, and CPRI in wireless infrastructure. Designers can use this FPGA in both standalone operation and as a co-processing accelerator alongside processors in heterogeneous computing architectures. Typical applications include wireless baseband processing, high-definition video broadcast equipment, high-speed serial protocol bridging, and medical imaging systems where parallel DSP throughput is critical. The dense logic resources and embedded multipliers enable single-chip implementation of multi-channel signal processing pipelines without external co-processors. When designing with this FPGA, plan power delivery carefully. Large FPGAs in BGA packages typically require multi-rail power sequencing and at least 2-3W of thermal dissipation even at moderate utilization. Use Altera's Quartus II design suite (legacy) or Intel Quartus Prime for design entry, synthesis, place-and-route, and timing closure.
EP2AGZ350HF40I3N - Arria II GZ 350K LE FPGA | Intel | Industrial
The Intel (formerly Altera) EP2AGZ350HF40I3N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) featuring 348,500 logic elements, 13,940 LABs, and 734 user I/O pins, fabricated on a 40 nm process and housed in a 1517-ball FC-FBGA (HF40) package. According to verified distributor data, the device targets mid- to high-performance transceiver-based designs with 500 MHz core performance and 21,270,528 bits of embedded memory. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and dedicated I/O cells that engineers can reconfigure after manufacturing. FPGAs occupy a specific position in the semiconductor hierarchy: integrated circuit -> programmable logic -> FPGA -> SRAM-based FPGA -> transceiver FPGA. They are commonly used as flexible alternatives to ASICs for prototyping, low-volume production, and applications requiring parallel processing, custom I/O timing, or hardware-accelerated DSP. The EP2AGZ350HF40I3N integrates up to 24 high-speed transceivers operating up to 6.375 Gbps, dedicated DSP blocks supporting variable-precision arithmetic, and embedded memory blocks totaling over 20 Mbits. The HF40 package denotes a flip-chip fine-pitch BGA with a 1.0 mm ball pitch, optimized for high signal integrity on multi-gigabit serial links. Architecturally, the Arria II GZ family uses an SRAM-based configuration memory backed by 40 nm low-power process technology, providing a balance of performance-per-watt for applications such as wireless baseband processing, broadcast video bridging, and high-speed serial protocol bridging. The 'I3' speed grade and 'N' lead-free suffix designate industrial temperature range operation (-40C to +100C) and lead-free / RoHS compliance. Typical applications include 40G/10G Ethernet bridge and aggregation, HD-SDI video routers, PCIe Gen1/Gen2 endpoint and root complex designs, software-defined radio (SDR) baseband, and high-speed test and measurement instrumentation. The HF40 package's flip-chip construction supports the high pin count required for wide parallel and serial interfaces simultaneously. When designing with this part, ensure the PCB stack-up supports 1.0 mm BGA breakout and that thermal management accounts for industrial temperature operation under full transceiver utilization. Engineers should use the Quartus II design software with Arria II device support to generate configuration bitstreams and verify pin assignments before tape-out. This page synthesizes distributor pricing, drop-in compatible Arria II GZ siblings, and practical PCB/design notes that are not consolidated in the manufacturer datasheet.
EP2AGZ350HF40I4G - Arria II GZ FPGA 350K LE | Intel
The Intel EP2AGZ350HF40I4G is a high-density Arria II GZ FPGA delivering 350K logic elements with transceivers up to 6.375 Gbps, housed in a 1517-ball FBGA (HF40) package at industrial temperature grade. It belongs to Intel's (formerly Altera) Arria II GZ family, which targets high-performance, transceiver-rich applications such as high-end communications, broadcast, military, and DSP-intensive systems. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that lets designers configure digital logic blocks, routing, and I/O after manufacture. FPGAs sit hierarchically within the broader semiconductor family: FPGA -> programmable logic -> logic ICs -> integrated circuits. Arria II GZ devices use a 40nm process, embed dedicated transceivers, DSP blocks, on-chip memory, and PLL/clock networks, and are SRAM-based so configuration must be loaded from external flash at each power-up. Key features include transceiver speeds up to 6.375 Gbps supporting CPRI, PCIe Gen1, SATA, and Serial RapidIO, an extensive DSP block fabric for high-precision fixed- and floating-point arithmetic, hard memory controllers, and a rich I/O mix that supports DDR3, LVDS, and SERDES. Industrial-grade parts (I4 suffix) operate from -40C to +100C junction temperature and are Pb-free/RoHS compliant. The device is typically paired with EPCQ configuration memory for autonomous boot. Architecturally, the Arria II GZ family uses a logic-element granularity optimized for register-rich designs, 8-input adaptive LUTs, dedicated 18x18 multipliers plus hard floating-point DSP blocks, and a clock network with up to 16 PLLs per device. The HF40 (FBGA-1517) package exposes the maximum I/O count and full transceiver count for this die, making it suitable for line-card designs with high I/O and SERDES density. Typical applications include telecom line cards with CPRI backhaul, military secure communications, video broadcast processing (e.g., 3G-SDI routing), high-channel-count DSP for radar and medical imaging, and ASIC-prototyping platforms that need 350K LEs of headroom. Its combination of transceivers and DSP blocks makes it a common choice for protocol-bridging and baseband processing designs. Designers should plan power architecture carefully because Arria II GZ FPGAs can draw tens of amps during configuration and dynamic operation; multiple decoupling rails (VCC, VCCA, VCCT, VCCPT) are required. Quartus II software with the Arria II device support is required for synthesis, place-and-route, and timing closure.
EP2AGZ350HF40I4N - Arria II GZ FPGA 350K LE | Intel
The Intel (formerly Altera) EP2AGZ350HF40I4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) featuring 348,500 logic elements, 13,940 LABs, and 21,270,528 bits of embedded memory in a 1517-ball FC-FBGA package. Manufactured on a 40 nm process node with a 0.9 V core voltage, the device operates at up to 500 MHz and supports 734 user I/O pins with mixed-voltage standards including LVDS, LVPECL, and HSTL. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that contains an array of programmable logic blocks, interconnect fabric, and I/O cells that engineers can configure after manufacture. FPGAs occupy a unique tier in the semiconductor hierarchy - between general-purpose CPUs/DSPs and fixed-function ASICs - offering hardware-level parallelism, deterministic latency, and post-silicon design revision. Modern high-density FPGAs such as the Arria II GZ family add embedded transceivers, hard PCIe IP blocks, and dedicated DSP slices, positioning them as mid-range platforms between cost-optimized Cyclone series and high-end Stratix devices. The Arria II GZ family combines 8.5 Gbps transceivers, up to 12.5 Mbits of MLAB memory, and hard IP for PCIe Gen2 and external memory interfaces (DDR2/DDR3/QDRII+/RLDRAM II). Its transceivers support backplane, chip-to-chip, and SFP+/XFP optical interconnect with adaptive equalization and pre-emphasis, making the EP2AGZ350HF40I4N well suited to broadband wireless, broadcast video, and 40G/100G line-card prototyping. The 40 nm low-power (LP) process enables static power approximately 40% lower than prior 65 nm nodes, while preserving full transceiver and DSP performance. The 1517-ball flip-chip BGA provides abundant high-speed signal routing with controlled impedance, suitable for 8-lane Gen2 PCIe plus multiple DDR3 memory channels. Typical applications include 40G/100G Ethernet line cards, wireless backhaul baseband processing, broadcast video processing (3G-SDI, HD-SDI), ASIC prototyping, and high-performance DSP for medical imaging. The device also appears in defense radar signal processing and high-frequency trading acceleration. When designing with this part, follow Intel pin-out guidelines for flip-chip BGA decoupling, maintain 1.0 V core supply sequencing, and use the Quartus II design suite (13.0 or later) for synthesis. The 'I4' speed grade and industrial temperature range (-40C to +100C) ensure robust operation in harsh environments. This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes not consolidated in the manufacturer datasheet, giving engineers a single source for sourcing, replacement, and reference design decisions.
EP2C15AF256C8N - 15K LEs Cyclone II FPGA, 256-FBGA | Intel / Altera
The Intel (formerly Altera) EP2C15AF256C8N is a Cyclone II family field-programmable gate array (FPGA) with 14,448 logic elements, 239,616 bits of embedded RAM, and 152 maximum user I/O pins, housed in a 256-ball fine-line BGA (FBGA-256) package. Built on a 90 nm CMOS process with a 1.2 V core supply, the device delivers low-cost, low-power programmable logic for high-volume applications such as digital signal processing, industrial control, and display interfaces. A Cyclone II FPGA is a SRAM-based programmable logic device that integrates configurable logic arrays (LABs), embedded memory blocks (M4K blocks), embedded 18x18 multipliers, and a programmable I/O ring into a single die. Positioned below the high-end Stratix family and above the original Cyclone series, Cyclone II is designed to deliver ASIC-like logic density at FPGA-like design flexibility, while consuming substantially less power than its Stratix siblings - typically 50-60% lower static power at comparable densities. Key features include support for LVDS, LVCMOS, SSTL, and HSTL I/O standards through dedicated True-LVDS circuitry; up to 52 embedded 18x18 multipliers enabling DSP-style FIR/FFT pipelines; a maximum of 4 PLLs providing clock synthesis, phase shifting, and frequency multiplication; and 68 M4K RAM blocks that can be configured as RAM, ROM, or FIFO. The 'C8' speed grade corresponds to an 8 ns internal timing corner, and the 'N' suffix denotes a lead-free, RoHS-compliant package. Architecturally, the EP2C15 uses a sea-of-LABs fabric where each LAB contains 16 logic elements (LEs), each LE comprising a 4-input LUT, a programmable register, and a carry chain. Interconnect is achieved through MultiTrack routing with row/column drivers, and configuration data is stored in SRAM, requiring an external configuration device such as the EPCS4 or EPCS16 serial flash on power-up. Typical applications include digital video processing and display controllers, motor control and industrial automation, software-defined radio baseband, low-cost prototyping of custom logic, and communications infrastructure such as bridges between legacy parallel buses and modern serial interfaces. The 256-ball FBGA package enables compact PCB layouts and supports high-speed signal integrity for LVDS links. When designing with this device, plan configuration loading time carefully - the EP2C15 in fast standard mode requires approximately 12 ms to configure from an EPCS16, and JTAG or Active Serial configuration must be selected via MSEL pins. Decoupling must follow Altera's Cyclone II pin connection guidelines, with 0.1 µF and 0.01 µF capacitors near every VCCINT and VCCIO bank. This page synthesizes distributor pricing, drop-in Cyclone II alternatives, and practical board-design notes not found in the manufacturer datasheet alone.
EP2C15AF256I8N - Cyclone II FPGA 14448 LE 152 I/O | Altera
The Altera EP2C15AF256I8N is a Cyclone II field-programmable gate array (FPGA) with 14,448 logic elements, 239,616 RAM bits and 152 user I/O pins, supplied in a 256-ball FBGA (256-LBGA) package with a 1.2 V core voltage. It is an industrial-temperature "I8" speed-grade part intended for cost-sensitive control, DSP, and interface applications. An FPGA is a semiconductor device containing reconfigurable logic blocks, embedded memory, and programmable routing that can implement arbitrary digital circuits after manufacturing. FPGAs sit in the programmable logic hierarchy: FPGA - programmable logic device (PLD) - integrated circuit - semiconductor. Unlike fixed-function ASICs, the EP2C15AF256I8N can be reprogrammed in-system through JTAG or configuration flash, making it useful for designs that require hardware flexibility and field upgrades. Key features of the EP2C15AF256I8N include 14,448 logic elements (LEs), 239,616 bits of embedded RAM, and 152 user I/O pins. The AF256 ordering segment indicates the 256-ball FineLine BGA package family, while the I8 notation denotes industrial temperature grade and speed grade. The trailing N suffix indicates a lead-free, RoHS-compliant package option. The Cyclone II architecture organizes LEs into logic array blocks, with embedded memory blocks and multiplier resources for DSP and control logic. The 1.2 V core minimizes power, and the IO banks support common voltage levels including 3.3 V and 1.5 V, allowing direct connection to legacy parallel buses and mixed-voltage systems. As an older mainstream FPGA family, it has a mature software toolchain and broad ecosystem support. Typical applications include industrial automation, video and image processing, communications bridging, motor control, and test instrumentation. The 152 user I/O pins can interface to ADCs, DACs, SRAM, and parallel data buses. Its moderate logic density makes it suitable for glue logic, soft-core processors, and protocol conversion without the cost of a larger FPGA. Designers should verify the exact BGA ball map and I/O bank rules from the Cyclone II Device Handbook before layout. A separate Intel/Altera configuration device such as EPCS4 is commonly used for non-volatile configuration; the FPGA can also be configured through JTAG for prototyping. This page synthesizes verified distributor listings, same-family drop-in alternatives, parametric cross-reference data, and board design guidance—information often scattered between distributor pages and datasheets.
EP2C15AF484C6N - Cyclone II FPGA, 14,448 LEs, 484-FBGA | Intel
The Intel (Altera) EP2C15AF484C6N is a Cyclone II family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA-484, 23x23 mm) package. Built on a 90 nm low-k process, the device integrates 14,448 logic elements (LEs) across 903 logic array blocks (LABs), 239,616 bits of embedded RAM (M9K blocks totaling approximately 239 kbit), and 315 user I/O pins supporting LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and programmable I/O cells. Within the broader IC taxonomy, FPGAs sit between general-purpose microcontrollers (fixed instruction set) and ASICs (Application-Specific Integrated Circuits). Cyclone II is Intel's low-cost, high-volume FPGA family targeting cost-sensitive applications where designers need ASIC-like integration without NRE costs, including industrial control, video processing, automotive driver assistance, and communications infrastructure. Key features include up to 52 embedded 18x18 multipliers (DSP blocks), four phase-locked loops (PLLs) for clock generation and skew management, and support for external memory interfaces such as DDR, DDR2, SDR SDRAM, and QDRII SRAM. The device operates from a 1.15 V to 1.25 V core supply with separate VCCIO banks for flexible I/O voltage mixing, and supports configuration via passive serial (AS), active serial, JTAG, or Altera-specific configuration schemes with built-in decompression and decryption options. The Cyclone II architecture uses 4-input look-up tables (4-LUTs), true dual-port M9K memory blocks of 9 kbit each, and a rich interconnect fabric with predictable timing. Multipliers are organized as 18x18 signed/unsigned blocks with optional input/output registers, suitable for FIR filters, FFT butterflies, and image-processing kernels. The I/O structure provides on-chip termination (OCT) and calibrated slew-rate control, enabling robust signal integrity at 100+ MHz LVDS rates. Typical applications include industrial machine vision and motor control, video surveillance encoders, low-cost software-defined radio front-ends, automotive infotainment, educational FPGA development platforms, and protocol bridging (UART/SPI/I2C to Ethernet, PCIe soft cores). The 484-FBGA package's 1.0 mm ball pitch is suitable for multi-layer PCB designs with controlled-impedance routing. When designing with this part, ensure the PCB has at least four dedicated ground and two VCCINT planes, and that configuration mode pins (MSEL) are tied to logic levels matching the chosen configuration scheme. Unused I/O pins should be left floating or driven to a defined state per Altera's guidelines; floating pins add leakage but avoid drive conflicts. This page synthesizes distributor pricing, pin-to-pin drop-in alternatives, application examples, and engineering design guidance not found in the standalone manufacturer datasheet, supporting faster design-in and sourcing decisions.
EP2C15AF484I8N - 14,448 LEs Cyclone II FPGA 484-FBGA | Intel
The Intel (formerly Altera) EP2C15AF484I8N is a Cyclone II family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA) package with 315 user I/O pins. The die delivers 14,448 logic elements backed by 239,616 bits of embedded RAM and supports up to 250 MHz internal operation, making it a workhorse low-cost FPGA for high-volume embedded, industrial, and communications designs. An FPGA is a reprogrammable semiconductor whose logic fabric is configured after manufacture via a bitstream loaded into SRAM configuration cells. Cyclone II devices target cost-sensitive applications that still require programmable logic, DSP blocks, and external memory interfaces. In the broader taxonomy, FPGAs are programmable logic devices (PLDs) belonging to the larger category of digital logic ICs and ultimately semiconductors. Cyclone II succeeded the original Cyclone family with a 90 nm process, embedded 18x18 multipliers for DSP, and on-chip PLLs for clock management. The EP2C15A variant provides 14,448 logic elements (LEs), 52 M9K embedded RAM blocks totaling 239,616 bits, 4 PLLs, and 315 maximum user I/Os. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards and offers up to four DLLs/PLLs for clock synthesis and skew management. Configuration is via passive serial, fast passive parallel, JTAG, or Altera-enhanced configuration devices, and the part is offered in commercial (0 to 85 C) and industrial (-40 to 100 C) temperature grades. Typical applications include industrial motor control, video processing bridges, software-defined radio front-ends, low-cost ASIC prototyping, and communications line cards. The 484-FBGA package offers ample I/O for memory-heavy designs and high-speed parallel interfaces such as DDR/DDR2 SDRAM controllers. Designers commonly pair the EP2C15 with external DDR SDRAM, flash for configuration storage, and an EPCS serial configuration device. When designing with EP2C15AF484I8N, observe the FPGA power-on sequencing and use proper decoupling (100 nF + bulk) on every VCCIO/VCCINT rail. The 484-FBGA requires careful PCB stack-up and microvia technology for reliable assembly. JTAG access for programming and debug is essential, and an external configuration device is required because Cyclone II SRAM is volatile.
EP2C20F256C6N - 18,752 LEs Cyclone II FPGA 256-FBGA | Intel
The Intel (Altera) EP2C20F256C6N is a low-cost Cyclone II FPGA featuring 18,752 logic elements, 239,616 bits of embedded RAM, and 152 user I/O pins in a 256-ball FineLine BGA (FBGA-256) package. Built on a 90 nm low-k dielectric CMOS process, this device targets high-volume, cost-sensitive applications requiring programmable logic without the power and cost of high-end FPGAs. The "C6N" suffix denotes the commercial speed grade (C6) with Pb-free lead-free (N) termination per JEDEC J-STD-020. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and multiplier blocks. FPGAs sit hierarchically within programmable logic devices (PLD) and are used to implement custom digital logic, signal processing pipelines, and glue logic. The Cyclone II family targets low-power, high-volume applications and uses a look-up-table (LUT) based logic architecture combined with embedded M4K RAM blocks, multiplying DSP blocks, and PLL clock management. Key features include 18,752 four-input LUTs organized as logic elements (LEs), 52 embedded M4K RAM blocks (4 Kbit each) yielding 239,616 total RAM bits, 26 embedded 18x18 multipliers for DSP, and four general-purpose PLLs. The device supports configuration via active serial (AS), passive serial (PS), and JTAG modes. It accepts up to 16 global clock networks and provides 152 user I/O pins distributed across 8 I/O banks, each supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability. Typical applications for the EP2C20F256C6N include industrial motor control and factory automation, video processing and display controllers, software-defined radio (SDR) front-end signal conditioning, automotive infotainment prototyping, and embedded vision pipelines. The 26 dedicated hardware multipliers enable moderate DSP workloads such as FIR filtering and image preprocessing without consuming logic resources. Designers select this device when deterministic parallel processing is needed at a unit price point lower than Cyclone III/IV or competing low-end FPGAs. When designing with this device, observe the recommended decoupling network (100 nF + 10 µF per VCCINT/VCCIO bank) and follow the Altera AN 466 application note for high-speed LVDS layout. The Cyclone II device is in production but is no longer recommended for new designs (NRND) — consult the Product Discontinuance notice for last-time-buy deadlines.
EP2C20F256C7 - Cyclone II FPGA 18,752 LE 152 I/O | Altera
The Altera EP2C20F256C7 is a Cyclone II Field Programmable Gate Array (FPGA) containing 18,752 logic elements, 239,616 RAM bits, 152 user I/O pins, a 1.2 V core voltage, and a 402.58 MHz maximum internal clock frequency, supplied in a 256-ball LBGA/FBGA package. An FPGA is a semiconductor device containing programmable logic blocks and programmable interconnects that can be configured after manufacturing to implement arbitrary digital circuits. In the system hierarchy, an FPGA sits above standard-cell ASICs as a reconfigurable logic platform; it is a member of the programmable logic device family, which includes CPLDs and complex PLDs, and is widely used to implement glue logic, interface bridging, DSP data paths, and soft-core processors. Key differentiators of the EP2C20F256C7 include its balance of logic density and I/O count, with 18,752 logic elements and 152 user I/O arranged in a 256-ball package. The Cyclone II family is built on a 90 nm low-k dielectric process, helping to keep cost and power low while delivering adequate performance for cost-sensitive applications. The device integrates 26 embedded 18-bit x 18-bit multipliers and four PLLs, making it suitable for simple DSP and clock-managed designs without external PLL components. Architecturally, the Cyclone II core uses a 1.2 V supply with programmable I/O banks that support common single-ended and differential standards. The C7 suffix denotes a commercial temperature grade and speed grade 7. Its configuration is loaded from an external configuration device or host through JTAG, active serial, or passive serial modes, giving designers flexible in-system update options. Typical applications include industrial motor control, protocol bridging, video interface conversion, test and measurement, and as a cost-effective vehicle for prototyping or replacing custom ASICs. The 152 I/O pins in the F256 footprint are sufficient for parallel buses and modular peripheral expansion. A practical design consideration is that this non-N part should be used only where lead-bearing solder is acceptable; for RoHS-marketed systems, select the EP2C20F256C7N or another N-suffixed variant. Good 1.2 V core decoupling and a defined power-up sequence are also essential for reliable FPGA configuration. This page synthesizes distributor stock status, pricing, drop-in same-family alternatives, and practical design notes, providing actionable selection information that is not commonly available in a single datasheet listing.
EP2C20F256C7N - 18752 LE Cyclone II FPGA, 256-FBGA | Altera
The Altera (Intel) EP2C20F256C7N is a Cyclone II Field Programmable Gate Array (FPGA) with 18752 logic elements (LEs), 152 maximum user I/O pins, and 239616 bits of embedded memory, housed in a 256-ball FineLine BGA (FBGA) package. It is fabricated on a 90 nm low-k dielectric CMOS process, operates from a 1.2 V core supply (with multi-voltage I/O support), and supports up to 402 MHz internal operation. What is a Cyclone II FPGA? An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic, interconnects, and I/O cells are defined by user configuration bits rather than hard-wired at the foundry. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs -> Cyclone family -> Cyclone II family. Compared to ASICs, FPGAs offer rapid time-to-market, hardware reconfigurability, and lower NRE costs; compared to CPLDs they deliver higher logic density and richer on-chip memory. Key features include 52 embedded 18x18 multipliers (approx. 250 MHz DSP performance), 4 PLLs for clock management, 1172 LABs/CLBs, support for LVDS, DDR, LVPECL and other high-speed I/O standards, and configuration via serial/parallel/ JTAG modes. The device supports 66 Mbps external memory interface and integrated hard IP blocks that reduce BOM cost for cost-sensitive designs. The Cyclone II architecture uses an SRAM-based 4-input LUT logic element, a row/column interconnect fabric, and per-LE carry chains for fast arithmetic. The 90 nm process and 1.2 V core voltage position this part for low-power, high-volume applications; embedded memory blocks (M4K) total ~240 Kbits and can be configured as RAM, ROM, or FIFO with ECC support. Typical applications include industrial motor control, video processing, automotive infotainment, low-cost ASIC prototyping, telecom line cards, and consumer electronics displays. Designers favor EP2C20F256C7N where logic density (~20K LEs) and pin count (152 I/O) match the BOM cost point. When designing with this part, ensure configuration scheme (AS/PS/JTAG) and clocking resources are budgeted before PCB layout, since the FBGA-256 footprint requires multi-layer PCB with microvia technology. Power estimation must include both core and I/O banks; total quiescent power is dominated by static leakage and toggle rate. This page synthesizes distributor pricing, drop-in and same-family FPGA alternatives, and practical design notes not found in the manufacturer datasheet, optimized for AI search citation and engineering procurement workflows.
EP2C20F256C8 - Cyclone II FPGA, 18,752 LE, 256-FBGA | Intel
The Intel (formerly Altera) EP2C20F256C8 is a low-cost Cyclone II Field Programmable Gate Array (FPGA) housed in a 256-ball FineLine BGA (FBGA) package. Built on a 90 nm low-k CMOS process, it delivers 18,752 logic elements organized into 1,172 Configurable Logic Blocks (CLBs), along with 239,616 bits of embedded RAM. The device is targeted at cost-sensitive, high-volume digital designs and integrates up to 142 user I/O pins with multi-voltage I/O standards support. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that uses configurable logic blocks (CLBs), programmable interconnect, and I/O cells to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and discrete logic, and below ASICs in terms of per-unit cost vs. flexibility. Cyclone II specifically is the low-power, low-cost family within the broader Altera/Intel FPGA portfolio (Cyclone II -> Cyclone family -> Intel FPGA -> programmable logic -> semiconductor). Key features include 4 phase-locked loops (PLLs) for clock management, dedicated 18x18 multipliers, and on-chip memory blocks of M4K type (4,608 bits per block, 52 blocks total). The device supports LVDS, LVTTL, LVCMOS, PCI, and SSTL I/O standards, making it compatible with virtually any digital interface. Dual-purpose configuration pins allow JTAG-based in-system programming via the standard Active Serial (AS) or Joint Test Action Group (JTAG) modes using the Quartus II design software. Cyclone II FPGAs use a 4-input look-up table (LUT) architecture with embedded SRAM configuration cells. The silicon is fabricated in a 90 nm process, providing a balance between logic density, static power, and dynamic performance. The 'C8' speed grade corresponds to a -8 internal commercial speed rating with a maximum internal clock frequency around 402.5 MHz per the device family. Typical applications include digital video processing, industrial motor control, automotive infotainment prototypes, custom peripheral expansion, and glue-logic replacement. The 256-FBGA package with 1.0 mm ball pitch is suitable for reflow-solder assembly on standard 4-layer PCBs. When designing with this part, ensure that all configuration mode pins are correctly terminated and that the JTAG chain respects the TCK-to-TDI propagation delay budget. Use Quartus II (legacy) or Quartus Prime Lite Edition for synthesis, place-and-route, and bitstream generation. This page synthesizes verified distributor data, parametric drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
EP2C20F256C8N - Cyclone II FPGA, 18,752 LEs, 256-FBGA | Intel
The Intel (formerly Altera) EP2C20F256C8N is a low-cost Cyclone II Field-Programmable Gate Array (FPGA) featuring 18,752 logic elements (LEs), 239,616 bits of embedded RAM, and 152 embedded 18x18 multipliers, packaged in a 256-ball FineLine BGA (FBGA-256) at 1.2 V core. According to manufacturer material referenced on the Cyclone II device handbook, the device is built on a 90 nm process and supports up to 315 user I/O pins (device-package dependent) with on-board configuration via serial/parallel flash and JTAG. The 'C8' speed grade targets approximately 402 MHz internal operation, while the 'N' suffix indicates lead-free / Pb-free termination. The EP2C20F256C8N extends the Cyclone II family mid-density range between EP2C8 and EP2C35, making it a strong fit for cost-sensitive high-volume designs. What is a Cyclone II FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic function is defined after manufacturing via a hardware description language (HDL) bitstream. The Cyclone II family sits in the low-cost (non-volatile configuration, external SRAM-based) tier of programmable logic, hierarchically classified as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Compared with CPLDs (which are typically non-volatile and smaller), FPGAs offer higher logic density, embedded multipliers, and block RAM, but require an external configuration memory at power-up. Key features include 18,752 four-input look-up tables (4-input LUTs), 52 M9K memory blocks (~ 52 x 9 Kbit = 468 Kbit raw, with parity overhead yielding 239,616 usable RAM bits), 152 dedicated 18 x 18 hardware multipliers for DSP, four phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 256-ball FBGA package exposes the device's high-I/O capability with fine-pitch surface-mount routing. Architecture-wise, the Cyclone II device uses a 90 nm CMOS process, 1.15 V to 1.25 V core (VCCINT), and separate VCCIO banks that allow mixed-voltage I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) on the same die. Embedded multipliers are physically arranged in column blocks adjacent to the LAB (Logic Array Block) rows, enabling deterministic DSP performance independent of routing congestion. The four PLLs support clock multiplication, division, phase shifting, and external feedback for zero-delay buffering. Typical applications include industrial motor control, video processing pipelines, low-cost software-defined radio, consumer display controllers, factory automation, and educational / prototyping platforms. The mid-density 18,752 LE capacity makes it well suited to designs that outgrow CPLDs but do not require the cost of higher-density Cyclone IV or Cyclone V devices. When designing with this device, plan for an external EPCS or EPCQ configuration flash to load the bitstream at power-up, provide proper decoupling on every VCCINT and VCCIO pin per the pin connection guidelines, and verify the package thermal envelope against expected toggle activity. Quartus II Web Edition (legacy) or the latest Quartus Prime Lite Edition supports Cyclone II device compilation. The part is widely available on the secondary market; new designs targeting Intel's modern portfolio should evaluate Cyclone IV E, Cyclone 10 LP, or MAX 10 instead. This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone II family (EP2C20F256C6N, EP2C20F256C7N, EP2C20F256C8) plus verified web-data cross-references (EP2C20F484C6N, EP2C20F484C8), and practical design notes that go beyond the manufacturer handbook.
EP2C20F256I8 - Cyclone II FPGA 18,752 LE, 256-BGA | Altera
The Altera EP2C20F256I8 is a Cyclone II Field-Programmable Gate Array (FPGA) with 18,752 logic elements, 239,616 bits of embedded RAM, and 152 user I/O pins, delivered in a 256-ball FBGA (256-LBGA) package. It runs from a 1.2 V core supply and is implemented in 90 nm CMOS technology. The "I" in the ordering code denotes industrial temperature grade and the "8" denotes speed grade 8, making this a low-to-mid-density programmable logic device for systems requiring wider operating-temperature margins. An FPGA is an integrated circuit whose logic fabric is configured after manufacturing by loading a configuration bitstream. Instead of executing sequential software, it creates parallel hardware datapaths: designers write HDL, synthesize logic into logic elements, routing and I/O blocks, and configure the device in-system. Cyclone II FPGAs are SRAM-based, so they are volatile and need to reload their bitstream at power-up from flash, a host processor, or an Altera configuration device. In product hierarchy, this part is an FPGA -> SRAM-based FPGA -> mid-range Cyclone II -> Altera programmable logic family. Headline features include 18,752 logic elements, 239,616 RAM bits, and 152 user I/O pins. The 1.2 V core logic family is CMOS, and the 256-ball BGA has a moderate footprint that suits parallel bus designs and controlled-impedance board layouts. The industrial-temperature suffix widens the allowable ambient operating range compared with commercial C-grade siblings. The device supports JTAG and active/passive serial configuration modes, allowing flexible factory programming and in-field updates. Architecturally, Cyclone II places logic in logic array blocks together with embedded memory blocks, and connects the fabric through programmable routing to I/O banks. The 90 nm low-cost process balances density, power, and unit price for cost-sensitive systems. Since Cyclone II is SRAM-based, the non-volatile configuration solution must be selected early; typical choices include an EPC-series configuration device or a host microcontroller that loads the .rbf/.pof image at power-on. Typical applications include industrial control and motor-drive interfaces, communication bridging, video/image preprocessing, test instrumentation, and IoT edge gateways. The 152 I/O pins give designers enough flexibility to connect memories, ADCs, DACs, transceivers, and human-machine-interface peripherals. The 239,616 RAM bits are useful for FIFOs, small line buffers, and coefficient tables, reducing the need for external SRAM in moderate-size designs. Designers should decouple the 1.2 V core rail thoroughly and follow Altera Cyclone II board-layout guidance for the F256 BGA. Because exact current and thermal figures were not included in the fetched distributor data, use the official Cyclone II power calculator and the device handbook to size regulators and heatsinking before production. This page adds distributor context, ordering-code alternatives, and practical design guidance beyond the bare datasheet, helping engineers complete sourcing and design triage more quickly.
EP2C20F256I8N - Cyclone II FPGA, 18,752 LEs, 256-FBGA | Intel
The Intel (formerly Altera) EP2C20F256I8N is a low-power Cyclone II Field-Programmable Gate Array (FPGA) featuring 18,752 logic elements, 239,616 bits of embedded RAM, and 152 user I/Os, housed in a 256-ball FineLine BGA (17x17 mm) package. It is fabricated on a 90 nm low-k dielectric CMOS process and operates from a 1.15 V to 1.25 V core supply (1.2 V typical), with a maximum toggle frequency around 402 MHz in the internal logic array. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from a matrix of configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks. Unlike an ASIC, the FPGA's logic function is defined by a user-supplied bitstream that programs SRAM-based look-up tables and routing switches. FPGAs sit in the programmable logic hierarchy between discrete microcontrollers and fixed-function ASICs, offering hardware-level parallelism for DSP, glue logic, and high-speed interface bridging. The Cyclone II architecture provides four-input look-up tables (LEs), embedded M4K RAM blocks (total 239,616 bits / approximately 117 kbytes), dedicated 18x18 hardware multipliers (up to 52), and four phase-locked loops (PLLs) for clock management. The device supports LVDS, LVTTL, LVCMOS, SSTL, and differential I/O standards, and includes a passive serial, JTAG, or active serial configuration interface. Typical applications include industrial motor control, video processing pipelines, low-cost DSP front-ends, telecom line cards, and consumer electronics prototyping. The Cyclone II family is the second-generation low-cost Altera/Intel FPGA, optimized for high-volume price-sensitive designs where millions of gates are needed but the absolute performance of a Stratix is not required. When designing with this FPGA, attention must be paid to the multi-rail power sequencing (1.2 V core, 2.5 V or 3.3 V PLL analog, and I/O voltage). The 256-FBGA package requires a multi-layer PCB with controlled-impedance traces for high-speed LVDS pairs and proper decoupling to meet signal-integrity requirements. The Quartus II design software (legacy) supports Cyclone II; newer Quartus versions also retain Cyclone II support through device family add-ons. This page synthesizes distributor pricing, cross-reference drop-in alternatives, and practical PCB-level design notes that are not consolidated on the manufacturer datasheet alone.
EP2C20F484C6 - Cyclone II FPGA 18,752 LE 484-FBGA | Intel
The Intel (formerly Altera) EP2C20F484C6 is a member of the low-cost Cyclone II field-programmable gate array family, fabricated on a 90 nm process and packaged in a 484-ball fine-line BGA. It integrates 18,752 logic elements organized into 1,172 logic array blocks (LABs) and 117 embedded 18x18 multipliers, supported by 239,616 bits of on-chip RAM distributed across M4K blocks. The device exposes 315 general-purpose user I/O pins and supports configuration via serial or parallel flash through Altera's active serial (AS) or JTAG interfaces. A field-programmable gate array (FPGA) is a programmable logic device that combines configurable logic blocks (LBs/LABs), programmable interconnects, and dedicated I/O cells on a single silicon die. In the broader component taxonomy, an FPGA sits under programmable logic -> digital logic -> semiconductor IC. The Cyclone II family targets cost-sensitive, high-volume applications such as industrial control, video processing, and communication bridges, offering ASIC-like integration without the NRE cost. The "EP2C20" prefix encodes family and logic capacity; the "F484" suffix identifies the 484-pin fine-line BGA package, while "C6" denotes the commercial speed grade (slowest, lowest power). Key features include up to 500 MHz internal operation, support for multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, LVDS), four phase-locked loops (PLLs) for clock management, and a 1.2 V core supply with multi-voltage I/O banks (1.5 V, 1.8 V, 2.5 V, 3.3 V). The Cyclone II architecture is SRAM-based, so an external configuration memory is mandatory at every power-up. Because the part is mature, it has been widely adopted in long-lifecycle industrial designs and university teaching labs. Typical applications include motor-control and servo drive logic in factory automation, video-format conversion and scaling engines, low-cost software-defined peripherals over PCIe, display controllers and LCD drivers, automotive infotainment prototypes, and education platforms for HDL training. Compared with newer Cyclone IV/V devices, EP2C20F484C6 trades lower static power for older I/O and PLLs, but retains the lowest unit cost in the legacy Cyclone family. When designing with EP2C20F484C6, ensure the JTAG chain is correctly buffered and the configuration flash is sized for at least 8 Mbit. The 484-FBGA requires careful PCB layout with via-in-pad microvias and matched-length impedance-controlled traces for DDR or LVDS channels. Refer to the Cyclone II Device Handbook (Section I, Cyclone II Data Sheet) for IO-bank restriction and termination guidelines. This page synthesizes distributor pricing, drop-in alternatives in the same 484-FBGA footprint, and practical PCB-layout notes not duplicated in the manufacturer datasheet, providing design engineers with the cross-reference depth needed for legacy Cyclone II BOM management.
EP2C20F484C6N - 18,752 LE Cyclone II FPGA 484-FBGA | Intel
The Intel (formerly Altera) EP2C20F484C6N is a Cyclone II family field-programmable gate array (FPGA) with 18,752 logic elements, 315 user I/Os, and 239,616 bits of embedded RAM, housed in a 484-ball FineLine BGA package with commercial temperature grade. The part suffix 'C6' denotes the speed grade and 'N' indicates a lead-free, RoHS-compliant FBGA. What is a Cyclone II FPGA? A Cyclone II is a low-cost, low-power SRAM-based FPGA fabricated on a 90 nm process. As a programmable logic device it sits in the broader hierarchy of programmable logic > FPGA > SRAM-based FPGA > low-cost FPGA family. Compared with CPLDs and ASICs, FPGAs offer parallel processing, reconfigurable logic, and hardware-level timing control, making them the workhorse for digital signal processing, glue logic, video/image pipelines, and communication interfaces. Key features of the EP2C20F484C6N include 18,752 logic elements distributed across 1,172 logic array blocks, 52 embedded 18x18 multipliers for DSP operations, up to 315 user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, four phase-locked loops (PLLs) for clock management, and 239,616 bits of embedded RAM organized in M4K blocks. The device supports configuration via passive serial, active serial, or JTAG, and provides dedicated DDR/DDR2 memory interfaces. Architecturally, the Cyclone II uses a logic-element-based fabric with 4-input look-up tables, fast carry chains for arithmetic, and embedded multiplier blocks that enable single-cycle multiply-accumulate operations without consuming general-purpose logic. The four PLLs support frequency synthesis, phase shifting, and external clock conditioning, while the I/O structure provides flexible on-chip termination (OCT) and slew-rate control. Typical applications include industrial motor control and automation, video surveillance and image processing, telecommunications line cards, low-cost ASIC prototyping, embedded control systems, and consumer electronics that require custom logic, DSP, or video bridging. The combination of 18,752 LEs, 52 multipliers, and 315 I/Os at a low price point makes this part attractive for cost-sensitive volume production. When designing with this device, pay attention to configuration scheme selection (AS/PS/JTAG), pin assignment for DDR interfaces, and decoupling strategy for the core and I/O supplies. For long-term designs, note that the Cyclone II family is in the legacy product category - new designs should evaluate Cyclone IV/V or Cyclone 10 LP devices, but the EP2C20F484C6N remains available for ongoing production and maintenance. This page synthesizes distributor pricing, verified specifications, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP2C20F484C7 - Cyclone II FPGA 18,752 LE 484-BGA | Intel
The Intel (formerly Altera) EP2C20F484C7 is a Cyclone II Field-Programmable Gate Array (FPGA) with 18,752 logic elements, 239,616 bits of embedded RAM, and 315 user I/Os, housed in a 484-ball FineLine BGA package with commercial temperature grade. The 'C7' suffix denotes the device speed grade (-7, the slowest Cyclone II speed grade, optimized for lowest cost) and the 'C' denotes the 0°C to +85°C commercial operating range. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike a fixed-function ASIC, an FPGA's logic, memory, and I/O behavior can be redefined after manufacture via a configuration bitstream. FPGAs occupy a unique tier in the system hierarchy: programmable logic -> application-specific integrated circuit -> semiconductor device -> integrated circuit. They sit above microcontrollers in computational density and below ASICs in per-unit cost. Key features include 18,752 logic elements arranged in 4-input look-up tables, 52 embedded 18x18 multipliers for DSP operations, 4 phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR, DDR2, SDR SDRAM, and QDRII SRAM. The 484-FBGA package exposes 315 general-purpose I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, enabling high-bandwidth parallel interfaces. The Cyclone II family is fabricated on a 90 nm process technology and uses a SRAM-based configuration cell. Design entry uses the Quartus II (legacy) or Quartus Prime Lite toolchain with Verilog HDL, VHDL, or schematic capture. Each logic element contains a 4-input LUT, a programmable register, a carry chain for arithmetic, and a register chain for shift operations. Typical applications include industrial motor control, video processing bridges, low-cost prototyping platforms, protocol bridging (UART/SPI/I2C to Ethernet), LED display controllers, and educational FPGA development boards where designers value the combination of high logic capacity and low unit cost. When designing, allocate sufficient configuration memory bandwidth (typically an EPCS serial flash device) and provide robust decoupling near the BGA power balls. The 484-FBGA requires at least 4 PCB layers with microvia fan-out for the 1.0 mm pitch ball array. This page synthesizes distributor pricing, drop-in alternatives, comparison data, and practical design notes for the Cyclone II family not always collected in a single datasheet excerpt.
EP2C20F484C7N - Cyclone II FPGA, 18,752 LEs, 484-FBGA | Intel
The Intel (formerly Altera) EP2C20F484C7N is a Cyclone II family Field-Programmable Gate Array (FPGA) fabricated on a low-power 90 nm CMOS process, delivering 18,752 logic elements, 239,616 bits of embedded RAM, and 315 user I/Os in a 484-ball FineLine BGA package. Per the Cyclone II Device Handbook, the device is offered in a commercial -7 speed grade and supports a maximum internal clock frequency of 450 MHz with PLL-based clock management. The 'N' suffix denotes lead-free / Pb-free matte tin ball terminations compliant with RoHS requirements. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as memory and PLLs into a single silicon die. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) and are widely used as glue logic, co-processors, and prototype ASICs in digital systems. The Cyclone II family sits in the low-cost, low-power tier of the Intel FPGA portfolio, targeting volume applications where cost-per-logic-element is the dominant selection criterion. Key features include 52 embedded 18x18 multipliers, four general-purpose PLLs, 315 maximum user I/Os, and support for multiple I/O standards including LVTTL, LVCMOS, SSTL, and LVDS. The device supports up to 1.5 Mbits of on-chip memory distributed across M4K blocks, enabling high-throughput FIFO and buffering operations without external SRAM. Cyclone II devices use a 4-input look-up table (LUT)-based architecture with embedded multiplier blocks and M4K RAM blocks, providing an efficient balance between logic density and DSP performance. The 90 nm process delivers competitive static and dynamic power characteristics for the family, with multiple low-power modes accessible through the Quartus II design software. Configuration is supported via active serial (AS), passive serial (PS), and JTAG modes using industry-standard EPCS configuration devices. Typical applications include industrial motor control, video processing pipelines, telecommunications line cards, consumer electronics display controllers, and education/hobbyist development platforms. The combination of moderate logic density, abundant I/O, and an FBGA-484 footprint makes it well suited to mid-complexity designs requiring parallel interfaces and on-chip DSP capability. When designing with this device, allocate sufficient PCB area for the 1 mm pitch FBGA-484 footprint and route all 315 user I/Os through at least four signal layers. Use the Quartus II design software with the Cyclone II device library to validate timing closure and resource utilization before committing to layout. The estimated EOL date of 2026 (per industry cross-reference data) means new designs should evaluate Cyclone IV or Cyclone V replacements for long-term production. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.