FPGA & CPLD
제품 (6666)
EP3C16F484C6 - Cyclone III FPGA, 16K LE, 484-BGA | Altera
The Altera (Intel) EP3C16F484C6 is a Cyclone III Field Programmable Gate Array (FPGA) featuring 15,408 logic elements, 516,096 bits of embedded memory, and 346 user I/O pins, housed in a 484-ball FineLine BGA (FBGA) package. It is built on a low-power 65 nm process and is offered in the -C6 speed grade with commercial temperature rating (0C to +85C). What is a Cyclone III FPGA? The Cyclone III family is Altera's low-cost, low-power SRAM-based programmable logic family introduced in 2007, positioned between simple CPLDs and high-performance FPGAs such as Stratix. Cyclone III devices target cost-sensitive, high-volume applications where designers need moderate logic density, on-chip memory, and DSP blocks without paying for transceivers or hard processor cores. In the broader taxonomy, an FPGA is a programmable logic device (PLD) within the semiconductor category, used wherever fixed-function ASICs are too expensive or inflexible. Key features of the EP3C16F484C6 include 56 embedded 18x18 multipliers for DSP, four phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR, DDR2, and QDRII SRAM. The 484-FBGA package exposes the maximum user I/O count of 346 pins, enabling wide parallel buses and high-pin-count peripheral connectivity. Configuration is supported through passive serial (AS), active serial (PS), fast passive parallel (FPP), and JTAG modes. The Cyclone III architecture uses 4-input look-up tables (LUTs) and embedded M9K memory blocks, providing a balanced resource mix for control-plane logic, state machines, and moderate DSP workloads. Compared to the previous Cyclone II generation, Cyclone III cuts dynamic power by approximately 50 percent and adds dedicated hardware multipliers and improved clock networks. Typical applications include industrial motor control, video processing and display bridging, telecom baseband glue logic, prototyping ASIC designs, and embedded vision systems. The wide 484-ball package also makes the EP3C16F484C6 suitable for development boards and evaluation platforms where pin access is valuable. When designing with this part, pay attention to configuration mode pin strapping (MSEL pins), JTAG chain ordering, and bank-based I/O voltage planning. The F484 package is the largest in the EP3C16 family and may require multi-layer PCB stack-ups for fan-out routing. This page synthesizes distributor pricing, package-compatible same-family alternatives, and design considerations not always collected in one place on the manufacturer datasheet.
EP3C16F484C6N - Cyclone III FPGA 16K LE 484-FBGA | Intel
The Intel EP3C16F484C6N is a Cyclone III Field-Programmable Gate Array (FPGA) featuring 15,408 logic elements, 504 Kbits of embedded memory, and 56 embedded 18x18 multipliers in a 484-ball FineLine BGA package. It operates from a 1.15V to 1.25V core supply with multi-standard I/O bank voltages supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL at up to 346 user I/O pins. The device runs at a core speed grade of -6 (commercial) and is RoHS/lead-free compliant per the N package suffix. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor containing configurable logic blocks, programmable interconnect, and programmable I/O cells that engineers can customize after manufacture to implement custom digital logic. In the programmable logic hierarchy, FPGAs sit between fixed-function ASICs (lower flexibility, lower per-unit cost at volume) and microcontrollers (sequential execution, lower parallel throughput). The Cyclone III family targets the low-power, low-cost segment of the FPGA market using TSMC's 65 nm process node. Key features of the EP3C16F484C6N include four phase-locked loops (PLLs) for clock synthesis and skew management, 20 global clock networks, support for external memory interfaces including DDR, DDR2, and QDRII SRAM, and configuration via JTAG, passive serial, or fast passive parallel modes. The device also provides dedicated hardware blocks for PCI Express endpoint, gigabit Ethernet, and basic DSP functions. The Cyclone III architecture uses adaptive logic modules (ALMs) instead of legacy 4-input LUTs, yielding higher effective logic density per LE. The 484-FBGA (FineLine BGA) package uses a 1.0 mm ball pitch, supporting high-density PCB designs with standard surface-mount assembly. The N suffix indicates lead-free, RoHS-compliant packaging suitable for high-volume manufacturing. Typical applications include industrial motor control, video processing bridges, wireline telecommunications, automotive driver assistance, and embedded DSP. Designers use Quartus II or Quartus Prime design software for synthesis, place-and-route, and timing closure. When designing with this FPGA, ensure the PCB layout uses at least four PCB layers with dedicated power and ground planes for the core (1.2 V) and I/O supplies. Decoupling capacitors must be placed as close as possible to each supply pin per Quartus power delivery guidance, and unused I/O pins should be left floating or tied to ground per the configuration handbook. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3C16F484C7N - Cyclone III FPGA, 15K LEs, 484-FBGA | Intel
The Intel (formerly Altera) EP3C16F484C7N is a low-power, low-cost Cyclone III Field-Programmable Gate Array (FPGA) fabricated on a 65 nm process and packaged in a 484-ball FineLine BGA (FBGA). It integrates 15,408 logic elements, 504 Kbits of embedded memory, 56 embedded 18x18 multipliers, 4 phase-locked loops (PLLs), and 346 user I/O pins. According to the Cyclone III device family datasheet, the device supports a core voltage of 1.2 V and offers up to 437.5 MHz internal operation. A Field-Programmable Gate Array (FPGA) is a programmable logic device that allows engineers to implement arbitrary digital circuits after PCB fabrication. FPGAs sit in the programmable logic hierarchy above simple PLDs and below ASICs, bridging the gap between fixed-function ICs and full-custom silicon. The Cyclone III family in particular targets cost-sensitive, high-volume applications where the per-board BOM cost of a traditional FPGA would be prohibitive, while still offering DSP blocks, on-chip RAM, and high-speed serial capability for parallel digital processing. Key features of the EP3C16F484C7N include 346 LVDS-capable user I/O pins arranged across eight I/O banks, configurable LVDS/LVCMOS/LVTTL support, and dedicated hardware multipliers (up to 56 18x18) for DSP pipelines. The device supports JTAG (IEEE 1149.1) boundary-scan configuration via the EPCS serial configuration device family, plus 4 PLLs for clock synthesis. Speed grade -7 places this part in the mid-performance bin of the Cyclone III family. Cyclone III architecture combines look-up tables (LUTs), embedded memory blocks (M9K), DSP blocks, and routing fabric. The 65 nm process node reduces static leakage versus the prior Cyclone generation, enabling the family to operate with typical power well under 0.5 W for many designs. Cyclone III is widely used in industrial control, motor drive, video processing, and prototyping applications. Typical applications include industrial machine vision, motor control and drive interfaces, low-cost video bridging, LED wall controllers, software-defined radio (SDR) front ends, and ASIC/SoC prototyping. The combination of DSP blocks and a generous logic budget makes the EP3C16F484C7N especially suited to DSP-centric embedded designs. When designing with this device, validate thermal performance for your specific I/O switching profile and ensure the configuration scheme (EPCS flash or JTAG) is provisioned in your PCB layout. Speed grade -7 provides balanced timing margin; faster -8 grades are not stocked for this part number.
EP3C16F484C8N - Cyclone III FPGA 15K LE 484-BGA | Intel
The Intel (formerly Altera) EP3C16F484C8N is a Cyclone III family Field Programmable Gate Array (FPGA) with 15,408 logic elements, 504 Kbit embedded memory, and 346 user I/O pins, housed in a 484-ball FineLine BGA package. It is specified for commercial temperature range (0C to +85C) at speed grade 8, and is fabricated on a low-power 60 nm process that pairs high functionality with low static and dynamic power. Background Knowledge: A Field Programmable Gate Array (FPGA) is a programmable semiconductor that lets designers implement arbitrary digital logic - combinational, sequential, and memory - via a configuration bitstream. FPGAs sit within the broader taxonomy of programmable logic devices (PLD), bridging the gap between fixed-function ASICs (high NRE, high volume) and discrete glue logic. The Cyclone III family is positioned as a low-cost, low-power FPGA family from Intel/Altera, optimized for volume production in industrial, consumer, and communications applications rather than high-end signal processing. Key features include 15,408 logic elements organized in 963 LABs (Logic Array Blocks), 56 embedded 18x18 multipliers supporting up to 70 MHz DSP throughput, and 4 PLLs for clock management. The device also supports external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM through dedicated PHY blocks. Total on-chip RAM is 504 Kbit distributed across M9K memory blocks, sufficient for buffering moderate data streams. Architecturally, Cyclone III uses a LUT-based fabric with embedded multiplier blocks and hard memory controllers, providing deterministic timing and predictable performance across the commercial temperature range. The 60 nm process and 1.2 V core operation help reduce dynamic power versus prior Cyclone generations, making it suitable for thermally-constrained embedded systems. Typical applications include industrial motor control, video processing pipelines, automotive infotainment prototyping, telecommunications line cards, and consumer electronics requiring custom glue logic or moderate DSP. It also serves as a cost-effective prototyping vehicle for ASIC development. When designing with this device, careful attention must be paid to power sequencing, decoupling, and JTAG configuration routing. The 484-BGA package requires a 4-layer minimum PCB with controlled-impedance traces for high-speed interfaces. This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III family, and practical design notes not consolidated in the manufacturer datasheet alone.
EP3C16F484I7 - Cyclone III FPGA, 16K LE, 484-BGA | Intel
The Intel (formerly Altera) EP3C16F484I7 is a low-power Cyclone III Field Programmable Gate Array delivering 15,408 logic elements, 516,096 bits of embedded RAM, and 346 user I/Os in a 484-ball FineLine BGA package, operating across the industrial -40C to +100C temperature range. What is a Cyclone III FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, multipliers, and programmable I/O cells that engineers can re-program in the field to implement arbitrary digital logic, glue logic, DSP pipelines, or even soft-processor systems-on-chip. Cyclone III sits at the low-power, cost-optimized end of Intel's FPGA portfolio, fabricated on a 60 nm TSMC process and tailored for high-volume, power-sensitive designs. Key features include 15,408 logic elements organized into 963 LABs, 504 Kbit of dedicated M9K embedded memory blocks (totaling 516,096 bits), 56 embedded 18x18 multipliers for DSP, four general-purpose PLLs, and Cyclone III's signature low-power architecture that consumes roughly half the static current of the prior Cyclone II generation. The 484-FBGA package exposes 346 user I/Os supporting LVDS, SSTL, HSTL, and LVCMOS standards at up to 640 Mbps LVDS. Cyclone III devices are configured via passive serial, fast passive parallel, active serial, fast active parallel, or JTAG modes using industry-standard Altera/Intel Quartus II or Quartus Prime design software. Bitstream encryption with AES is supported on Cyclone III LS variants, and the family uses SRAM-based configuration cells requiring an external boot PROM or JTAG source. Typical applications include industrial motor control and factory automation, video surveillance and image processing pipelines, low-cost software-defined radio front-ends, USB/Ethernet bridging, medical imaging pre-processing, and automotive infotainment prototypes. The combination of low unit cost and a robust Quartus toolchain makes Cyclone III a common choice for both prototypes and production runs of 10K-100K units. When designing with this device, ensure your power budget accounts for both static (always-on) consumption and dynamic toggle power, and follow Intel's cyclone III pin connection guidelines to leave unused I/Os properly biased. Bitstream configuration time at 40 MHz DCLK with a serial EPCS flash is typically under 50 ms for a full 16K LE design. This page synthesizes distributor pricing, drop-in Cyclone III speed-grade alternatives, and practical PCB and configuration design notes that complement the manufacturer datasheet.
EP3C16F484I7N - 15408 LE Cyclone III FPGA, 484-FBGA | Altera (Intel)
The Altera (now Intel) EP3C16F484I7N is a Cyclone III family low-power Field-Programmable Gate Array (FPGA) with 15408 logic elements, 516096 bits of embedded memory, and 346 user I/Os, housed in a 484-ball FineLine BGA (FBGA) package. The 'I7' speed/temperature grade denotes an industrial temperature range (-40C to +100C case) with a 7 ns internal timing margin, and the 'N' suffix indicates a lead-free, RoHS-compliant tray packing. The Cyclone III family is fabricated on a 65 nm TSMC low-power process and operates from a 1.2 V core supply, making it one of the lowest-power mid-density FPGAs in its generation. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines an array of configurable logic blocks (LEs), routing channels, and embedded memory/DSP into a single semiconductor. The taxonomy is: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Unlike ASICs, FPGAs are programmed in the field using HDL flows (Verilog/VHDL) and an SRAM configuration bitstream. FPGAs sit above microcontrollers and DSPs in flexibility but below ASICs in cost-per-volume, making them ideal for prototyping, low-volume production, and designs requiring parallel hardware acceleration. Key features of the EP3C16F484I7N include 4 transceivers of 156 MHz / 437.5 MHz PLL support (no multi-gigabit transceivers, but ample general-purpose LVDS), 20 global clock networks, 56 embedded 18x18 multipliers for DSP, and Cyclone III's signature 1.2 V core that delivers roughly 50% lower dynamic power than Cyclone II. Configuration is via serial passive (PS), JTAG, or Altera Fast Passive Parallel modes using the cyclone programming cable or USB-Blaster. The Cyclone III architecture uses an SRAM-based configuration cell backed by a multi-level routing hierarchy (L1/L2/L3/longlines), LAB-based logic array blocks containing 16 LEs each, and embedded M9K memory blocks (typically 56 blocks, 516 kbit total in this device). The 484-FBGA package is a 1.0 mm pitch BGA suitable for 4-6 layer PCBs, supporting high I/O count without demanding fine-line manufacturing. Typical applications include industrial motor control and PLCs, video processing and image filtering, low-cost software-defined radio front-ends, factory automation and machine vision, telecom line cards, and embedded control with Nios II soft-core processors. The 56 hardware multipliers and abundant RAM make it well-suited to DSP pipelines, while the 346 I/Os support parallel bus and high-pin-count industrial protocols. Design consideration: route configuration signals (nCONFIG, nSTATUS, CONF_DONE, MSEL, nCE) per Altera reference schematics and respect the JTAG chain. Use the Quartus II (or Quartus Prime Lite 18.x for legacy device support) software flow to compile, place-and-route, and generate the .sof/.pof bitstream. The 484-FBGA requires PCB fabrication with 0.4 mm via-in-pad or 0.6 mm dog-bone fanouts and impedance-controlled traces for LVDS. This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3C16Q240C8 - Cyclone III FPGA, 16K LE, 240-Pin PQFP | Intel
The Intel (formerly Altera) EP3C16Q240C8 is a Cyclone III low-cost field-programmable gate array (FPGA) built on TSMC's 65 nm low-power process, offering 15,408 logic elements, 516,096 bits of embedded memory, and 160 user I/O pins in a 240-pin plastic QFP (240-BFQFP / PQFP-240) package with 0.5 mm pitch and 34.6 x 34.6 mm body. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs occupy a tier between fixed-function ASICs and microcontrollers: they offer hardware-level parallelism and deterministic timing without the per-unit mask cost of an ASIC, while providing far more logic capacity and I/O flexibility than a typical MCU. Cyclone III specifically targets cost-sensitive high-volume applications such as industrial control, video processing, and communications bridges. Key features include 15,408 logic elements arranged as 15408 CLBs, 516 kbits of embedded RAM, 56 embedded 18x18 multipliers, up to four PLLs for clock management, and 160 general-purpose user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and PCI signaling. The device operates from a 1.2 V core supply with separate VCCIO banks, supports up to 402 MHz internal operation, and is offered in commercial, industrial, and extended-temperature grades. The Cyclone III family is fabricated on a 60 nm low-power process node optimized for static and dynamic power reduction, delivering up to 50% lower power than the prior Cyclone II generation at the same performance. The architecture combines 4-input look-up tables (LUT4) with dedicated memory blocks (M9K), DSP blocks for arithmetic, and Coresight-based debug via JTAG. Designers typically use Quartus II / Quartus Prime to compile HDL into bitstreams that configure the SRAM-based logic at every power-up. Typical applications include industrial motor control and PLC interfaces, video format conversion and image processing pipelines, embedded display controllers, telecommunications line cards, USB and peripheral bridging, and cost-sensitive prototyping for ASIC replacement. The 240-pin QFP package supports hand-soldering and standard 1.0 mil trace/space PCB manufacturing, which simplifies low-volume prototypes and educational designs. When designing with this part, plan the power decoupling around the recommended 1.2 V core and VCCIO bank supplies, follow Altera's pin connection guidelines for unused and JTAG pins, and verify timing closure in Quartus before sign-off. The PQFP-240 footprint is non-trivial to rework, so first-spin prototypes should be carefully reviewed. This page synthesizes distributor pricing, lifecycle status, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3C16Q240C8N - Cyclone III FPGA 15K LEs PQFP-240 | Altera
The Altera EP3C16Q240C8N is a Cyclone III FPGA with 15,408 logic elements (LEs), 516,096 bits of embedded memory, and up to 160 user I/O pins, housed in a 240-pin fine-pitch Ball-Grid-Array-style QFP package (240-BFQFP / PQFP-240, 32x32 mm). It is fabricated in a low-cost 65-nm process and belongs to the commercial (C) temperature range with speed grade 8 (the most cost-effective speed bin in the family). A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks, routing resources, and embedded memory that designers configure in the field using HDL languages such as Verilog and VHDL. In the semiconductor hierarchy, the FPGA sits above fixed-function ASICs and ASSPs in flexibility, and the Cyclone III family targets the low-cost, low-power segment of that market. Key features of the EP3C16Q240C8N include 15,408 LEs organized as approximately 1,920 adaptive logic modules (ALMs), 516,096 bits (63 kbytes) of M9K embedded memory blocks, and up to 160 maximum user I/O including dedicated clock inputs. The M9K blocks support single- and dual-port operation with byte enables and initialization files, making FIFOs and line buffers easy to implement without external SRAM. Technically, the Cyclone III architecture uses 8-input fracturable look-up tables, a hierarchical multi-track interconnect, and a phase-locked-loop (PLL)-based clock network for on-chip frequency synthesis and jitter reduction. Configuration is supported through active serial (AS), passive serial (PS), and JTAG schemes, allowing standard EPCS serial configuration devices to load the bitstream at power-up. The Q240 package supports a maximum I/O count that may be reduced depending on the selected configuration scheme, per the Altera device package information data sheet. Typical applications include industrial motor-control and automation interfaces, video and image processing line cards, communications protocol bridging, and test/measurement glue logic. The 160-I/O budget and 65-nm low static power make it well suited to cost-sensitive volume products that do not need high-end transceivers. Design consideration: the PQFP-240 footprint is large and hand-solderable for prototypes, but its peripheral I/O ring limits signal counts versus BGA alternatives; plan I/O banking carefully to avoid mixing incompatible voltage standards on one bank. This page synthesizes verified distributor stock, drop-in same-package alternatives, pricing context, and practical design notes not found in the manufacturer datasheet.
EP3C16U256C8N - Cyclone III FPGA, 15K LE, 256-UBGA | Altera / Intel
The Intel (formerly Altera) EP3C16U256C8N is a low-power Cyclone III Field-Programmable Gate Array (FPGA) built on a 65 nm low-k dielectric process, offering 15,408 logic elements, 516,096 bits of embedded RAM, and 168 user I/Os in a 256-ball Ultra FineLine BGA package (Ux256). The 'U256' suffix denotes the plastic Ultra FineLine BGA, and the 'C8' speed grade corresponds to an 8 ns commercial-grade timing classification with -40 °C to +85 °C operating junction range. A Cyclone III FPGA is a SRAM-based programmable logic device that belongs to the family of low-cost, low-power FPGAs targeting high-volume, power-sensitive designs. It sits in the broader hierarchy of programmable logic devices (PLD), positioned between CPLDs and high-performance FPGAs such as Cyclone V / Stratix. Its low static and dynamic power consumption makes it attractive for portable, industrial, and consumer applications that previously used ASICs or ASSPs. Key features of the EP3C16U256C8N include up to 168 single-ended user I/O pins (multi-voltage I/O standards including LVDS, SSTL, LVCMOS, and LVTTL), 56 embedded 18 x 18 multipliers for DSP, four PLLs per device, and 56 M9K memory blocks. The 1.2 V core (VCCINT) with separate VCCIO bank supplies allows mixed-voltage interfacing without external level shifters. Configuration is supported via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes. Typical applications span industrial motor control, video processing pipelines, automotive infotainment prototypes, communication bridges, and consumer display controllers. The Cyclone III architecture is also a popular education platform due to its low cost and Quartus II / Quartus Prime tool support. When designing with this device, pay close attention to the BGA fan-out: the 256-ball U256 package requires microvia or via-in-pad PCB technology. Decoupling must include 0.1 µF caps per VCC pin and bulk caps on each supply rail. Use the Altera / Intel Quartus Prime software (free Lite edition) for synthesis, place-and-route, and configuration file generation. This page synthesizes distributor pricing, drop-in same-brand alternatives, and practical PCB design notes that go beyond what is printed in the manufacturer datasheet.
EP3C25E144I7N - Cyclone III FPGA, 24,624 LEs, 144-LQFP | Intel
The Intel (formerly Altera) EP3C25E144I7N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) housed in a 144-pin LQFP Exposed Pad (EQFP-144) package with industrial temperature grade. The device integrates 24,624 Logic Elements (LEs), 608,256 bits of embedded memory (66 M9K blocks), 66 embedded 18x18 multipliers, and 4 Phase-Locked Loops (PLLs), with 82 user I/Os available in the EQFP-144 package. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital semiconductors, sitting between fixed-function ASICs and microcontrollers in design flexibility. Key features of the EP3C25E144I7N include support for up to 4 PLLs for clock management, dedicated 18x18 hardware multipliers for DSP applications, and 66 M9K memory blocks totaling 608 Kbits. The device operates from a 1.2V core supply with separate bank I/O voltages, and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI/PCI-X. The Cyclone III family is fabricated on a 65nm low-power process, delivering a balance of logic density, performance, and static power efficiency. The architecture consists of Logic Array Blocks (LABs) each containing 16 LEs, with embedded multiplier and memory blocks distributed throughout the fabric. Cyclone III devices also support configuration via serial passive (AS), serial active, and JTAG modes, allowing flexible in-system programming. The integrated PLL blocks provide frequency synthesis, phase shifting, and clock duty-cycle correction for high-speed interfaces. Typical applications include industrial motor control, video processing and image sensor interfaces, low-cost ASIC prototyping, communication protocol bridging (UART, SPI, I2C to LVDS), and embedded DSP functions such as FIR filtering. The Cyclone III family is widely used in cost-sensitive designs requiring moderate logic density and DSP performance. When designing with this device, ensure decoupling capacitors are placed close to every power pin and that JTAG chain integrity is verified before final board assembly. The exposed thermal pad on the EQFP-144 package must be soldered to a sufficient copper area for thermal dissipation and electrical ground return. This page synthesizes distributor pricing, drop-in Cyclone III alternatives in the same EQFP-144 footprint, and practical design notes not consolidated in the manufacturer datasheet alone.
EP3C25F256C8N - Cyclone III FPGA, 24.6K LEs, 256-FBGA | Intel
The Altera (Intel) EP3C25F256C8N is a Cyclone III family Field-Programmable Gate Array (FPGA) with 24,624 logic elements, 608,256 bits of embedded memory, and 66 embedded 18x18 multipliers, packaged in a 256-pin FineLine BGA (FBGA-256) and offered in the commercial 0 to 85 C temperature range with the speed grade 8 designation. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O cells are defined at hardware description language (HDL) compile time and re-programmed in-circuit. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers, sitting in the broader taxonomy as programmable logic > FPGA > SRAM-based LUT FPGA > low-power FPGA family. Key features include 156 user I/O pins, four general-purpose phase-locked loops (PLLs) for clock synthesis and skew management, support for external memory interfaces such as DDR/DDR2/QDRII, and 0.25 mW per logic element typical dynamic power consumption. The device operates from a 1.15 V to 1.25 V core supply, supports 3.3 V, 2.5 V, 1.8 V, and 1.5 V I/O standards, and is offered in a Pb-free 17 mm x 17 mm FBGA package with 1.0 mm pitch. Architecturally, the Cyclone III silicon uses a 60 nm process with a 4-input look-up table (LUT) based logic element, embedded M9K memory blocks, and 18x18 hardware multipliers optimized for digital signal processing (DSP) throughput. The device targets low-cost, high-volume designs where the balance between logic capacity, embedded memory, DSP bandwidth, and unit cost matters more than the highest serial transceiver data rate. Typical applications include industrial motor control, video surveillance and image processing, low-end protocol bridging, consumer display controllers, and entry-level software-defined radio (SDR) baseband processing. The wide I/O bank support also suits mixed-voltage board designs integrating 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals on the same PCB. When designing with this device, allocate sufficient PCB area for the 1.0 mm pitch BGA fan-out, route PLL analog supplies through a ferrite-bead-isolated rail, and configure unused I/O pins per the Cyclone III Hardware Reference to minimize leakage. Quartus II version 7.2 or later is required for synthesis, fitting, and configuration bitstream generation. This page synthesizes distributor pricing, exact-temperature speed-grade alternatives, and practical Cyclone III design notes not consolidated in the manufacturer datasheet, providing an engineer-facing summary for selection and procurement.
EP3C25F256I7N - Cyclone III FPGA 24,624 LEs | 256-FBGA | Intel
The Intel (formerly Altera) EP3C25F256I7N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) with 24,624 logic elements, 608,256 bits of embedded memory, 156 maximum user I/O pins, and 66 embedded 18x18 multipliers, housed in a 256-ball FineLine Ball-Grid Array (FBGA) package and operating from a 1.2 V core supply. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines the integration density of an ASIC with the design flexibility of in-system reconfiguration. FPGAs sit hierarchically under programmable logic, alongside CPLDs, and are widely used as the central logic platform in digital systems where high I/O count, parallel DSP performance, or rapid prototyping are required. The Cyclone III family was specifically engineered to deliver ASIC-class functionality at ASIC-like cost, targeting volume production in cost-sensitive applications. Key features of the EP3C25F256I7N include support for up to four general-purpose PLLs for clock management, 66 dedicated 18x18 multipliers for DSP acceleration, support for DDR/DDR2/QDRII/QDRII+ external memory interfaces, and hot-socketing capability that allows board-level in-system programming. The 256-FBGA package supports high-density board layouts while remaining surface-mountable with standard reflow profiles. The device is offered in the industrial temperature grade (-40C to +125C) and is lead-free / RoHS compliant per the F suffix and 7N ordering code convention. Architecturally, the EP3C25F256I7N uses a look-up-table (LUT)-based logic fabric combined with block RAM (M4K/M9K) tiles, multiplier blocks, and global/regional clock networks. The 65 nm process and 1.2 V core voltage deliver static and dynamic power consumption suitable for thermally-constrained embedded systems, while maintaining ample logic density for medium-complexity designs such as motor control, video bridging, industrial protocol conversion, and software-defined radio front-ends. Typical applications include industrial motor drives and PLCs, video surveillance and image processing, automotive infotainment and driver-assistance subsystems, telecommunication line cards, low-cost software-defined radio, and portable medical instrumentation. The 256-FBGA footprint makes the EP3C25F256I7N particularly well suited to mid-density logic replacement designs where migrating from an older Cyclone II or Spartan-3 generation device is required. When designing with this part, verify the Quartus II design software support level for the EP3C25F256I7N speed grade 7 (faster commercial, industrial temperature). Pay close attention to the 1.2 V core / 2.5 V/3.3 V auxiliary supply sequencing requirement and the multi-voltage I/O bank configuration when mixing LVTTL, LVCMOS, and SSTL signalling. Decoupling follows the Quartus II Cyclone III handbook reference design: 0.1 uF and 0.01 uF ceramic capacitors within 100 mils of every VCC pin. This page synthesizes distributor stock, drop-in same-package alternatives from the Cyclone III family, and Quartus II design considerations not found in the standalone datasheet.
EP3C25F324C6N - Cyclone III FPGA 25K LE 215 I/O 324-BGA | Intel
The Intel (formerly Altera) EP3C25F324C6N is a Cyclone III family field-programmable gate array (FPGA) featuring 24,624 logic elements, 608,256 bits of embedded memory, and 66 embedded 18x18 multipliers, housed in a 324-ball fine-pitch BGA (FBGA-324) package with 215 user I/O pins. The 'C6' speed grade targets commercial 0C to +85C operation, while the 'N' suffix denotes a lead-free, RoHS-compliant package. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic function is defined by user-loaded configuration bitstreams rather than fixed mask layers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which also include CPLDs (Complex Programmable Logic Devices). Cyclone III specifically targets low-cost, low-power, high-volume designs and is fabricated on TSMC's 65 nm low-power process, positioning it between traditional CPLDs and high-end FPGAs in the power/cost/performance envelope. Key differentiating features of the EP3C25F324C6N include four general-purpose PLLs, 66 dedicated DSP blocks (each capable of 18x18 multiply-accumulate operations), support for external memory interfaces including DDR/DDR2/QDRII, and up to 215 user I/O pins arranged across eight I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The device supports both passive serial and fast passive parallel configuration schemes via industry-standard EPCS or EPCQ flash memories. Architecturally, the Cyclone III device family combines a fabric of logic array blocks (LABs) each containing 16 logic elements, a row/column interconnect mesh, embedded SRAM blocks (M9K), and dedicated multiplier/DSP blocks. The TSMC low-power process and Cyclone III's silicon-level power optimizations deliver static power consumption typically below 100 mW in idle configurations - substantially lower than competing FPGAs in this density range. Typical applications for the EP3C25F324C6N include industrial control and machine vision, automotive infotainment and driver assistance subsystems, low-cost video processing pipelines, software-defined radio front-ends, motor control, and embedded display controllers. Its combination of moderate logic density, generous memory bandwidth, and a small-footprint BGA makes it especially attractive for space-constrained cost-sensitive designs. When designing with this FPGA, plan power sequencing for the VCCINT core rail (1.2 V typical) and the VCCIO bank rails separately, and budget for in-rush current during configuration. Designers should also verify JTAG chain integrity before final board bring-up and use the Quartus II design suite (12.0sp2 or later) with the Cyclone III device library for compilation, place-and-route, and timing closure. This page synthesizes distributor inventory, drop-in compatible Cyclone III variants, and practical PCB power-integrity guidance not found in the standalone manufacturer datasheet, providing engineering value beyond what is available on DigiKey or Mouser product listings.
EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel
Intel EP3C25F324C7N is a Cyclone III field-programmable gate array containing 24,624 logic cells, 608,256 bits of embedded memory, and 215 available I/O pins. The verified data identifies a 437.5 MHz device built on 65 nm technology with a 1.2 V core supply and a 324-ball FBGA package. It is a programmable-logic IC intended for engineers implementing configurable digital logic, interface bridging, control processing, and application-specific signal processing. A field-programmable gate array, or FPGA, is a semiconductor device whose logic functions are defined by configuration rather than fixed internal connections. Its hierarchy extends from programmable logic cells to configurable interconnects, embedded memory, I/O blocks, and a complete programmable-logic IC. Unlike an ASIC, an FPGA can be reprogrammed during development and after deployment. Compared with a fixed microcontroller, an FPGA generally provides parallel hardware execution and finely timed I/O, while trade-offs include higher power consumption, configuration requirements, and more complex implementation software. The principal verified resources are 24,624 logic cells and 608,256 memory bits, with 215 I/O pins available for external connectivity. The 324-ball FBGA package supports a substantial number of package-level connections while using surface-mount assembly. The supplied data also identifies a 437.5 MHz frequency and 65 nm process technology. These resources make the device suitable for datapaths that need more concurrent logic than a small programmable device but do not justify the cost and development cycle of a custom ASIC. Cyclone III architecture combines programmable logic arrays, routing resources, embedded memory, and programmable I/O elements. A design is captured with an FPGA development flow, synthesized into logic, mapped and placed onto available resources, routed through the device interconnect, and then loaded into configuration memory. Engineers must analyze timing closure, power, signal integrity, and configuration implementation together; an apparently efficient register-transfer design can still fail timing if fan-out, routing congestion, or unsuitable I/O constraints are ignored. Typical uses include industrial control, communications equipment, video or imaging preprocessing, test and measurement, and legacy interface emulation. The combination of 24,624 logic cells, 608,256 embedded memory bits, and 215 I/Os is relevant to glue-logic aggregation, protocol conversion, parallel acquisition, and state-machine-rich controllers. For a new high-volume product, however, lifecycle, migration, and total-cost studies are important before committing the design. PCB design should prioritize continuous power distribution, controlled-impedance connections, and clean clock routing. Because the available verified data does not provide detailed electrical limits, pin functions, configuration-interface requirements, thermal limits, or package dimensions, those values must be confirmed from the manufacturer datasheet before schematic release. Do not infer BGA ball assignments from the package name alone. This product page combines verified distributor specifications, availability signals, package context, and transparent engineering notes. Pricing is reported as of 2026-09-09, while distributor stock and lead time remain dynamic. The manufacturer ordering code, package, device family, logic-cell count, embedded memory, I/O count, process node, supply voltage, and frequency are the attributes most useful for initial device selection.
EP3C25F324C8 - Cyclone III FPGA 24,624 LE 324-FBGA | Intel
The Intel (formerly Altera) EP3C25F324C8 is a member of the Cyclone III family of low-power FPGAs fabricated on a 65 nm process, offering 24,624 logic elements, 608,256 bits of embedded memory, and 215 user I/Os in a 324-ball FineLine BGA package. It operates from a 1.2 V core supply with separate I/O bank supplies and supports commercial temperature grade (0 °C to +85 °C) at speed grade 8, with a maximum internal clock frequency of approximately 402 MHz. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. FPGAs sit between fixed-function ASICs and microcontrollers in the digital design hierarchy: programmable logic IC -> FPGA -> SRAM-based FPGA -> low-power FPGA. Cyclone III FPGAs are specifically engineered for cost- and power-sensitive applications, building on the Cyclone architecture with a 65 nm process to reduce static and dynamic power while maintaining sufficient logic density for mid-range designs. Key specifications of the EP3C25F324C8 include 66 embedded 18 x 18 multipliers for DSP workloads, four general-purpose PLLs for clock management, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device integrates 24624 logic elements organized as 1539 logic array blocks (LABs), with each LAB containing 16 logic elements. The embedded memory is configurable as RAM, ROM, or FIFO, providing flexible on-chip data buffering without external SRAM. The Cyclone III architecture supports partial dynamic reconfiguration and ships with free Quartus II design software, including IP cores for DDR/DDR2 SDRAM controllers, PCI Express, Ethernet, and common serial protocols. The 324-ball FineLine BGA package measures 19 mm x 19 mm with a 1.0 mm ball pitch, making it compatible with standard multilayer PCB manufacturing. Typical applications include industrial motor control, video processing pipelines, automotive infotainment prototypes, low-cost software-defined radio, and bridge/interface glue logic. It is also used as a prototyping vehicle for ASIC verification and as a low-volume production replacement for legacy CPLDs. When designing with this part, attention to simultaneous switching output (SSO) noise and decoupling is critical; the application notes recommend 0.1 µF and 0.01 µF high-frequency capacitors within 100 mils of each power pin. Migration paths include the Cyclone IV E family for cost reduction and Cyclone V for higher logic density. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone, supporting faster engineering decisions.
EP3C25F324C8N - 24,624 LEs Cyclone III FPGA, 324-BGA | Intel
The Intel EP3C25F324C8N is a Cyclone III family Field Programmable Gate Array (FPGA) IC integrating 24,624 logic elements, 215 user I/O pins, and approximately 608 Kbits of embedded SRAM in a 324-ball FineLine BGA package. It is built on a low-power 60-nm process and operates with core logic at 1.2 V while supporting multiple I/O standards on its LVDS/LVCMOS/LVTTL banks. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets engineers implement arbitrary digital logic, memory blocks, and DSP functions in silicon by loading a configuration bitstream. In the broader IC taxonomy, an FPGA sits below an ASIC in performance but above a microcontroller in flexibility, making it the workhorse for prototyping, low-volume custom logic, and parallel signal processing in industrial, communications, and test equipment. Key features of the EP3C25F324C8N include 66 embedded 18x18 multipliers for DSP, four general-purpose PLLs for clock synthesis and skew management, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 8 in the suffix indicates the device speed grade, while the C denotes the commercial 0 C to +85 C operating range. Compared with earlier Cyclone generations, this part delivers roughly 4x the logic capacity and significant power-per-LE reductions. Typical applications span industrial motor and motion control, video processing pipelines, software-defined radio front-ends, telecom line cards, and ASIC prototyping platforms where the 215 I/O allow dense glue-logic integration with multiple parallel buses. Designers should plan for JTAG-based configuration via a 10-pin header or Altera USB-Blaster download cable, place at least four 0.1 uF and one 10 uF decoupling capacitor near each power pin group, and consult the Cyclone III device handbook for I/O-bank VCCIO planning. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III family, and practical board-level design notes not collected in any single datasheet, giving engineers a one-stop reference for sourcing and second-sourcing this part.
EP3C25F324I7 - Cyclone III FPGA, 24624 LEs, 324-FBGA | Intel
The Intel EP3C25F324I7 is a low-power, low-cost Field Programmable Gate Array from the Cyclone® III family, featuring 24,624 logic elements, 608,256 bits of embedded memory, and 215 user I/O pins in a 324-ball FineLine BGA (FBGA-324) package. The device is fabricated on a TSMC 65nm low-power process and operates at a core voltage of 1.2 V with maximum toggle performance around 437.5 MHz. The 'I7' speed grade and industrial temperature range (-40°C to +100°C junction) make it suitable for thermally constrained and environmentally demanding designs. A Cyclone III FPGA is a programmable logic device that sits in the broader hierarchy of digital semiconductors (FPGA -> programmable logic -> ASIC alternative -> semiconductor). Unlike fixed-function ASICs, the logic function, memory configuration, and I/O behavior of an FPGA are defined at boot time by a configuration bitstream loaded from external flash, allowing one silicon platform to be reused across many product variants. Cyclone III was specifically engineered to balance logic density, DSP capability (66 embedded 18x18 multipliers), and static power consumption, displacing ASICs and ASSPs in cost-sensitive high-volume applications. Key technical features of the EP3C25F324I7 include 4 PLLs for clock management, 20 global clock networks, 66 embedded 18x18 multipliers, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM II. The 1.2 V core draws substantially lower static power than the previous Cyclone II generation, while still offering LVDS, LVPECL, SSTL, HSTL, and LVCMOS I/O standards through 8 I/O banks. Configuration can be loaded via passive serial (PS), active serial (AS), or JTAG, and the device includes built-in CRC and decompression for the bitstream. Typical applications span industrial motor control, video surveillance, automotive infotainment prototypes, low-cost software-defined radio, video processing pipelines, and PCIe endpoint prototyping (using the embedded transceivers in some Cyclone III variants or soft IP cores for GPIO-based implementations). The combination of high logic density and embedded multipliers also suits DSP front-ends such as motor-control FOC loops or multi-channel audio processing. When designing with the EP3C25F324I7, engineers must supply the four power rails (VCCINT, VCCA, VCCIO per bank, VCCD_PLL) with proper decoupling and follow Intel's pin-out guidelines for the FBGA-324 footprint. Quartus II Web Edition provides synthesis, place-and-route, and timing analysis. Note that Cyclone III is now in Intel's product lifecycle as a mature, NRND device, so designers building new platforms should evaluate Cyclone IV/V/E10AX equivalents or pin-compatible successors for long-term availability.
EP3C25F324I7N - Cyclone III FPGA, 24,624 LEs, 324-FBGA | Intel
The Intel (formerly Altera) EP3C25F324I7N is a low-power Cyclone III Field-Programmable Gate Array (FPGA) fabricated on a 65 nm process, integrating 24,624 logic elements, 608,256 bits of embedded RAM, and 66 embedded 18x18 multipliers in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package. It supports up to 215 user I/O pins (66 LVDS pairs) and is rated for an industrial operating temperature range of -40C to +100C, making it well-suited for cost-sensitive, volume-driven designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to implement arbitrary digital logic functions through configurable logic blocks (LBs/LEs), programmable routing, and dedicated hard IP blocks such as memory and DSP. In the programmable-logic taxonomy, FPGAs sit alongside CPLDs as the highest-density user-configurable devices, falling under digital ICs > programmable logic > FPGA > CPLD hierarchy. Cyclone III sits at the low-power, low-cost end of Intel's FPGA portfolio, optimized for ASIC-replacement, glue-logic consolidation, and parallel DSP workloads. Key features include 4 PLLs for clock management, 20 global clock networks, support for external memory interfaces including DDR/DDR2/QDRII SDRAM, and configuration via active serial (AS), passive serial (PS), JTAG, and Fast Passive Parallel (FPP) modes. The device operates from a 1.2 V core supply and supports I/O bank voltages of 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL). The 1.2 V core and 65 nm process deliver a typical power reduction of up to 50% versus the previous-generation Cyclone II family. The architecture combines LABs (Logic Array Blocks) of 16 LEs each with M9K memory blocks (9 Kbits each) distributed across the fabric, enabling efficient implementation of FIFOs, shift registers, and small ROM/RAM functions. The hard 18x18 multipliers accelerate DSP algorithms such as FIR filters, FFTs, and motor-control loops without consuming general-purpose fabric. Cyclone III's deterministic routing fabric and Quartus II / Quartus Prime design flow support rapid design iteration and proven IP libraries. Typical applications include industrial motor control and factory automation, video processing and image sensor bridging, automotive infotainment and driver-assistance subsystems, telecommunications line cards, and portable medical instrumentation. Its combination of low static power (~100 mW typical) and moderate logic density makes it a strong fit for volume designs where a low-cost CPLD would be too small and a high-end Stratix FPGA would be over-spec. When designing with this device, validate signal-integrity and length-matching rules for DDR2/QSPI interfaces early, and ensure the 1.2 V core rail uses a low-noise LDO (such as an LDO from the LDO regulator family) to meet the core voltage tolerance. Confirm BGA fanout and via-in-pad manufacturing capability with the assembly house before committing the PCB layout. This page synthesizes distributor pricing, drop-in alternatives, comparison data and practical design notes not found on any single manufacturer or distributor page, including a cross-reference comparison with EP3C25F256I7N and EP3C16F484I7N from the same Cyclone III family.
EP3C25Q240C8 - Cyclone III FPGA, 24624 LE | Intel
The Intel (Altera) EP3C25Q240C8 is a 24,624-logic-element Cyclone III FPGA with 608,256 RAM bits and 148 user I/Os, packaged in a 240-pin PQFP/BFQFP. The device has a reported internal operating frequency of about 472 MHz to 472.5 MHz and is identified as a commercial temperature, speed grade 8 version. This QFP package provides a 34.60 x 34.60 mm body, 4.10 mm height, and 0.50 mm pitch, offering a lower assembly cost alternative to BGA packages. An FPGA, or Field Programmable Gate Array, is an integrated circuit whose logic fabric can be configured after manufacturing to implement custom digital circuits. FPGAs sit above ASICs in flexibility and below MCUs in sequential processing convenience: instead of executing software instructions, an FPGA creates parallel hardware logic such as counters, state machines, DSP datapaths, memory controllers, and bus interfaces. The EP3C25Q240C8 belongs to the Cyclone III family, which is optimized for low-cost, high-volume applications requiring substantial programmable logic with moderate power consumption. Key verified parameters include 24,624 logic elements, 608,256 total RAM bits, 148 user I/O signals, a 240-lead PQFP/BFQFP package, and a maximum internal frequency of approximately 472.5 MHz. These values are captured from distributor and datasheet-aggregator listings. The 240-pin package supports enough external connections for broad interfacing while remaining routeable on conventional low-cost multilayer PCBs. The 0.50 mm lead pitch and 34.60 x 34.60 mm body allow standard surface-mount assembly equipment to be used throughout production. Cyclone III devices implement their programmable fabric using look-up-table-based logic elements, dedicated memory blocks, and embedded multiplier resources. In this EP3C25 density, the 608,256 RAM bits provide local data storage and FIFO support, while the logic elements allow parallel functions to operate at internal clock rates approaching 472 MHz. The commercial-grade C8 version is typically used in controlled indoor environments where high-speed data processing, protocol bridging, and custom state-machine logic must be implemented without the non-recurring engineering cost of an ASIC. Typical applications include industrial automation control, communication protocol bridging, video and image processing, laboratory instrumentation, medical diagnostics, and edge-oriented FPGA systems. The high I/O count and moderate density make the EP3C25Q240C8 a practical bridge between low-end CPLDs and larger, more expensive FPGAs. For systems requiring a Nios II soft processor, the RAM and logic resources are also sufficient to implement small embedded processor subsystems alongside custom peripherals. When designing with the EP3C25Q240C8, verify the exact core and I/O supply voltages from the Cyclone III device handbook, and place decoupling capacitors close to every power pin. Because the part is an SRAM-based FPGA, a configuration memory such as an EPCS or EPCQ device, or a JTAG download path, is mandatory for a self-starting board. Plans for speed grade, temperature range, and lead-free assembly should be confirmed before layout begins. This page synthesizes distributor-level pricing, drop-in EP3C25 family alternatives, and practical FPGA board design notes that are not all present on a standard distributor product page. It is intended to give engineers a compact starting point for procurement and design review while directing them to the official Cyclone III documentation for detailed electrical specifications.
EP3C25Q240C8N - 25K LE Cyclone III FPGA | Intel
Intel EP3C25Q240C8N is a Cyclone III field-programmable gate array built on 65 nm technology, providing 24,624 logic elements, 608,256 bits of embedded memory, and 148 user I/O in a 240-pin BFQFP package. It operates from a 1.2 V core supply and is specified for a maximum frequency of 402 MHz in the supplied reference data. The C8 speed grade makes this member suitable for cost-sensitive applications that still require a substantial programmable-logic fabric. A field-programmable gate array, or FPGA, is an integrated circuit containing configurable logic blocks, programmable interconnects, embedded memory, and input/output resources. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacture. It therefore occupies the semiconductor hierarchy between programmable logic devices and custom digital ICs, allowing engineers to implement interfaces, control logic, signal processing, and bus functions without a fabrication run. The principal Cyclone III resource is 24,624 logic elements for combinational and sequential digital functions. The device also integrates 608,256 memory bits, giving designers capacity for FIFOs, lookup tables, buffering, and control-state storage. With 148 I/O, the EP3C25Q240C8N supports many board-level interfaces. The 240-pin BFQFP package uses through-hole leads rather than a fine-pitch surface-mount ball grid, which can simplify inspection, prototyping, and legacy assembly processes. Architecture and technology determine the balance between programmable density, power, and performance. The listed 65 nm process and 1.2 V core supply characterize the Cyclone III generation, while the 402 MHz specification describes a maximum reference frequency rather than a guarantee for every customer design. Actual performance depends on logic placement, routing, clock resources, I/O standards, timing constraints, and power-supply integrity. The FPGA also supports boundary-scan testing, allowing pin connections to be checked without physical probes. Typical applications include industrial control, legacy communication equipment, test and measurement hardware, motor-control interfaces, and embedded systems requiring replaceable or updateable logic. It is particularly relevant where a 240-pin through-hole FPGA is already designed in, such as an upgrade or lifecycle-support board. Engineers can use it to consolidate board functions, implement a custom peripheral, or reproduce obsolete interface behavior. Design planning should begin with the target package, configured I/O count, required speed grade, available configuration interface, and supported power rails. Verify every pin, bank voltage, configuration mode, and timing constraint against the manufacturer documentation before schematic release. For production, assess configuration storage, JTAG access, decoupling, thermal behavior, and the availability of compatible design software and bitstream generation tools. This product data combines the supplied manufacturer and distributor specifications, package constraints, verified commercial references, and a conservative cross-reference assessment. Because no verified pin-compatible drop-in alternative was identified, the replacement list is intentionally limited rather than padded with footprint-changing devices.
EP3C25Q240I8N - Cyclone III FPGA, 25K LEs, 240-Pin PQFP | Intel (Altera)
The Intel (formerly Altera) EP3C25Q240I8N is a Cyclone III low-cost Field Programmable Gate Array (FPGA) housed in a 240-pin Plastic Quad Flat Pack (PQFP / FQFP) package with gull-wing leads, offering 24,624 logic elements, 66,432 total registers, and 24624 logic cells organized into 1,539 Configurable Logic Blocks (CLBs). The device operates from a 1.2 V nominal core supply and is rated for the industrial temperature range of -40C to +100C, making it well suited to factory-floor, outdoor, and ruggedized embedded applications. As a member of the Cyclone III family, the EP3C25 occupies the low-power, low-cost tier of Altera's 65 nm FPGA portfolio, balancing logic density, on-chip memory, and DSP block count at a price point optimized for volume production. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and dedicated hardware blocks such as multipliers and block RAM into a single semiconductor IC. Within the broader taxonomy, FPGAs sit alongside microcontrollers and ASICs as flexible compute substrates: an FPGA is more power-efficient than a CPU at fixed parallel workloads, and faster to deploy than an ASIC at low-to-medium volumes. Cyclone III devices specifically target cost-sensitive applications such as industrial control, video bridging, and consumer electronics where designers need hardware-level parallelism without ASIC NRE cost. Key features of the EP3C25Q240I8N include 594 Kbits of embedded RAM distributed across M9K blocks, 66 embedded 18x18 multipliers for DSP operations, up to 148 maximum user I/O pins, and support for common configuration schemes including JTAG, Active Serial, and Passive Serial. The 240-pin PQFP body is surface-mountable but retains through-hole-style lead footprints, simplifying prototyping on 2-layer boards and hand-rework for low-volume builds. The Cyclone III architecture also embeds PLLs for clock management and supports LVDS, LVTTL, SSTL, and other I/O standards directly from the core without external transceivers. Typical applications include industrial motor control, video processing and image aggregation, low-cost software defined radio front-ends, factory automation backplanes, and bridge logic between legacy microcontrollers and modern high-speed buses. The combination of 24K logic elements with on-chip DSP multipliers is enough to implement H.264 encoding engines, multi-channel UART bridges, or a soft RISC-V core alongside customer-specific glue logic. Industrial -40C to +100C rating and the easy-to-solder PQFP package make this device attractive for long-life industrial designs. When designing with the EP3C25Q240I8N, allocate at least four PCB layers for proper power-plane decoupling of the 1.2V VCCINT rail, and use a JTAG header for in-system programming. Pair the device with an Altera/Intel EPCS serial configuration flash such as EPCS16 or EPCS64, and always include a dual-footprint option for migration to the larger Cyclone III variants if design requirements grow. This page consolidates distributor pricing, drop-in alternatives, and design notes not found on the bare datasheet.
EP3C40F324C7N - Cyclone III FPGA, 39.6K LE, 324-FBGA | Intel
The Intel (formerly Altera) EP3C40F324C7N is a Cyclone III Field-Programmable Gate Array (FPGA) from the low-power, low-cost Cyclone III family built on a 65 nm TSMC process. The device integrates 39,600 logic elements (LEs), 1,161,216 bits of embedded memory (1161 Kb / 141.25 Kbytes per the FPGAkey listing), 195 user I/O pins, and 4 PLLs in a 324-pin FineLine BGA (FBGA) package with a 1.2 V core supply. The C7 speed grade targets commercial 0 to 85 °C operation at 437.5 MHz internal performance. A Cyclone III FPGA is a programmable logic device that combines lookup-table (LUT)-based fabric, distributed and block RAM (M9K/M144K), DSP blocks, and PLL clock management in a single chip. In the broader taxonomy it sits under programmable logic -> FPGA -> SRAM-based FPGA -> low-power FPGA -> semiconductor. The Cyclone III family introduced hard 3.125 Gbps transceivers-free design with significantly lower static and dynamic power than Cyclone II, making it a common choice for cost-sensitive, high-volume designs. Key differentiating features of the EP3C40F324C7N include 4 phase-locked loops for flexible clock synthesis, embedded multiplier blocks for moderate DSP workloads, support for external memory interfaces such as DDR/DDR2 SDRAM, QDRII SRAM, and single data-rate SRAM through dedicated DQS pins, and a MultiTrack interconnect optimized for high-utilization designs. The device supports serial configuration via EPCS or EPCQ devices as well as JTAG (IEEE 1149.1) and parallel passive/active configuration. Architecturally, the EP3C40F324C7N employs logic-array-block (LAB) tiles of 16 LEs each, with carry chains and register chains spanning LABs for efficient arithmetic. Logic is paired with M9K (9 Kbit) block RAM blocks and dedicated 18x18 hardware multipliers, giving designers a balanced fabric for control logic, FIFOs, and signal processing. Configuration data is stored in SRAM; an external configuration device (EPCS4/EPCS16/EPCQ16, etc.) or JTAG programmer loads the bitstream at power-up. Typical applications include industrial motor control, video surveillance and image processing pipelines, low-cost software-defined radio (SDR) front-end glue logic, telecom baseband glue logic and protocol bridging, prototyping of ASIC designs, and consumer display controllers. The 324-FBGA package's compact footprint suits space-constrained boards while retaining enough I/O for parallel external memory buses and high-speed LVDS pairs. When designing, treat the 1.2 V core and 2.5 V/3.3 V I/O rails as separate supply domains and decouple each with 0.1 µF and 10 µF capacitors near the balls. Configure PLL loop-bandwidth settings per the datasheet for jitter-sensitive applications, and verify FPGA timing with TimeQuest (Quartus Prime) against the chosen speed grade. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III family, and practical PCB/power design notes not consolidated in any single manufacturer document.
EP3C40F324C8N - 39.6K LE Cyclone III FPGA, 324-FBGA | Intel
The Intel (formerly Altera) EP3C40F324C8N is a Cyclone III family Field-Programmable Gate Array (FPGA) featuring 39,600 logic elements, 1,161,216 bits of embedded memory (approximately 1.16 Mbit), and 126 embedded 18x18 multipliers, housed in a 324-ball FineLine BGA (FBGA-324) package. The device is fabricated on a low-power 60 nm process and operates from a 1.2 V core supply with a maximum core clock frequency of 402 MHz in the speed grade 8 commercial temperature part. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement arbitrary digital logic circuits through a configuration bitstream stored in SRAM. FPGAs sit in the broader taxonomy of programmable logic device -> programmable logic IC -> semiconductor. They are widely used to implement glue logic, high-speed parallel DSP, custom bus interfaces, and hardware-accelerated functions that would otherwise require multiple discrete logic ICs or an ASIC. The Cyclone III family specifically targets cost-sensitive, low-power applications that still need the parallel processing and DSP density of an FPGA. Key features of the EP3C40F324C8N include up to 215 user I/O pins (the 324-FBGA variant exposes the largest I/O count in the EP3C40 group), four general-purpose PLLs for clock synthesis and skew management, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. Each logic element (LE) contains a 4-input look-up table (LUT), a programmable register, and carry-chain logic. Configuration is volatile (SRAM-based) so the bitstream must be reloaded from a flash or microcontroller on every power-up. Architecturally, the Cyclone III device uses a 60 nm TSMC low-power process with a 1.2 V core. The Logic Array Block (LAB) is composed of 16 LEs, and columns of embedded memory and DSP blocks are interleaved across the fabric to provide local high-bandwidth connectivity. The four PLLs support programmable frequency synthesis, phase shifting, and spread-spectrum clocking. This combination enables the EP3C40 to drive high-throughput parallel DSP pipelines, video processing, and protocol bridging at low static and dynamic power. Typical applications for the EP3C40F324C8N include industrial motor control and factory automation, video surveillance and image processing, automotive infotainment and driver-assistance prototypes, telecommunications line-card glue logic, low-cost software-defined radio front ends, and portable medical instrumentation. The 324-FBGA package makes the device suitable for board designs where maximum I/O count is required but a fine-pitch BGA assembly process is acceptable. When designing with this part, note that the 1.2 V core and the PLL analog supply both require decoupling - place 0.1 uF and 10 uF capacitors close to each supply pin and use a power-plane cutout beneath the BGA to control return-current paths. The BGA also requires a multi-layer PCB with microvia or via-in-pad technology to reliably route all 324 balls. Finally, because the configuration memory is SRAM-based, a boot source (EPCS flash, parallel flash, or microcontroller) must be present at every power-up. This page synthesizes distributor pricing, drop-in alternatives across the Cyclone III EP3C family, and practical design notes not found in the manufacturer datasheet alone, giving a single reference for sourcing and engineering the EP3C40F324C8N.
EP3C40F324I7N - Cyclone III FPGA, 39.6K LE, 324-BGA | Intel
The Intel (formerly Altera) EP3C40F324I7N is a Cyclone III low-cost, low-power field-programmable gate array (FPGA) offering 39,600 logic elements (39600 cells / 39600 4-input LUTs as logic resources), 1,161,216 bits of embedded memory, and 195 user I/O pins in a 324-ball FineLine BGA (FBGA-324) package at 19 x 19 mm with 2.2 mm height. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened blocks such as embedded RAM, multipliers (DSP blocks), PLLs, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices (PLDs) and sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs) in the design-flexibility vs. unit-cost spectrum. They are typically used to implement custom digital logic, high-speed parallel processing, glue logic, and hardware acceleration that would be too expensive, slow, or power-hungry on a CPU or MCU. The EP3C40F324I7N is fabricated on TSMC's low-power 65 nm process and operates from a 1.15 V to 1.25 V core supply (VCCINT), giving it the lowest static and dynamic power envelope of the Cyclone III family. It integrates 126 embedded 18 x 18 multipliers, 4 general-purpose PLLs, and supports configuration via Active Serial (AS), Passive Serial (PS), JTAG, and Fast Passive Parallel (FPP) modes. Maximum internal clock frequency is 437.5 MHz and the maximum user I/O count is 195. Typical applications include industrial motor control and factory automation, video processing and display bridges, telecom line cards and baseband preprocessing, low-cost ASIC prototyping, and software-defined radio (SDR) front-end glue logic. The device's combination of logic density and DSP block count makes it well-suited for parallel signal-processing pipelines. When designing, ensure that the 324-ball FBGA land pattern meets JEDEC MS-034 tolerances and that at least four PCB layers are dedicated to GND/VCCINT planes for power integrity. JTAG chain ordering must place the FPGA before or after other JTAG devices without signal-integrity stubs to avoid boundary-scan failures. This page synthesizes distributor pricing as of 2026-09-09, same-package drop-in alternatives, and engineering design notes that are not aggregated in any single manufacturer datasheet.