FPGA & CPLD
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EP3C40U484I7 - 40K LE Cyclone III FPGA, 484-FBGA | Intel / Altera
The Intel (formerly Altera) EP3C40U484I7 is a Cyclone III Field-Programmable Gate Array (FPGA) from the Cyclone® III family, integrating 39,600 logic elements, 1,161,216 bits of embedded RAM, and 331 user I/Os in a 484-ball FineLine BGA (UBGA) package. Housed in the 19x19 mm 484-FBGA, the device is specified for the industrial -40C to +100C junction temperature range, with the speed grade 7 (fastest commercial timing closure for this die in the U484 package option). A Cyclone III FPGA is a low-power, low-cost SRAM-based programmable logic device built on TSMC's 65 nm low-power process. It sits in the broader programmable-logic taxonomy above generic logic ICs and below ASICs, providing hardware-configurable parallel processing, flexible I/O, and on-chip memory blocks without the NRE cost of custom silicon. The 'U' in the part number denotes the UBGA (Ultra FineLine BGA) package, and 'I7' marks the industrial temperature grade combined with speed grade 7 internal timing. Key features include 39,600 logic elements (LEs), 113 M9K embedded memory blocks (1,161,216 total RAM bits), four general-purpose PLLs, 56 embedded 18x18 multipliers (suitable for DSP functions), and 8 clock networks per device quadrant. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across 8 I/O banks, with per-pin dynamic slew-rate and programmable drive strength. Architecturally, Cyclone III FPGAs use a 4-input lookup table (LUT) logic element with an associated register, true-dual-port M9K memory blocks, and dedicated multiplier/adder blocks for DSP. The 65 nm process and on-chip decoupling deliver low static and dynamic power, while configuration is stored in external serial or parallel flash (active serial, active parallel, passive serial, or JTAG modes). Typical applications include industrial motor control, video processing pipelines, software-defined radio front-ends, low-cost ASIC prototyping, and embedded vision systems. The combination of plentiful multipliers, abundant block RAM, and high I/O count also suits test-and-measurement and communications infrastructure designs. When designing with this part, pay close attention to the 484-FBGA breakout - it requires a 1.0 mm ball pitch PCB with HDI (microvia) stack-up. Power-decoupling requires multiple bulk + 0.1 uF + 0.01 uF caps per VCCINT/VCCIO region, and JTAG chain length must accommodate the configuration controller's TCK setup time. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes - including U484 vs F484 footprint trade-offs - that are not consolidated on any single manufacturer or distributor page.
EP3C40U484I7N - Cyclone III FPGA 39.6K LE 484-UBGA | Intel
The Intel (formerly Altera) EP3C40U484I7N is a Cyclone III family Field-Programmable Gate Array (FPGA) with 39,600 logic elements, 1,161,216 bits of embedded memory, and 126 embedded 18x18 multipliers, housed in a 484-pin Ultra FineLine BGA (UBGA) package. It supports 331 maximum user I/O pins and operates across an industrial temperature range of -40C to +100C. The device is built on a 65 nm low-power process and is offered in both 1.2 V core and 3.3 V/2.5 V/1.8 V/1.5 V I/O bank supply variants. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that contains an array of configurable logic blocks (CLBs) connected by programmable interconnect, allowing hardware designers to implement arbitrary digital circuits. FPGAs sit in the semiconductor hierarchy between application-specific integrated circuits (ASICs) and general-purpose microcontrollers: more flexible than an ASIC and far more parallel than a microcontroller. Cyclone III sits in Intel's low-cost, low-power FPGA tier - designed for high-volume, cost-sensitive applications where ASIC NRE cost is unjustified. Key features include up to 4 PLL blocks per device, dedicated DDR/DDR2/QDRII memory interfaces with 200 MHz performance, and 1.2 V core voltage operation. The 65 nm process combined with internal voltage regulation reduces static power significantly compared with the Cyclone II generation. The 484-UBGA package offers a 1.0 mm ball pitch and supports up to 331 user I/O pins for high-density parallel interfaces. The Cyclone III architecture uses four-input look-up tables (LUTs), 9-Kbit M9K memory blocks, and 18x18-bit hardware multipliers arranged in columns adjacent to the M9K blocks. This column-based layout enables efficient DSP pipelines because multipliers and memory can be co-located with logic. Embedded multipliers can also be configured as 9x9 multipliers when higher precision is not required, doubling the available multiplier count. Typical applications include industrial motor control, video processing, automotive driver assistance, telecommunications infrastructure, and embedded digital signal processing. The combination of high logic density, embedded memory, and hardware multipliers makes Cyclone III well suited to mid-range DSP and parallel data acquisition designs. When designing with this device, ensure your I/O bank voltage plan is consistent with the peripherals you connect; mixed-voltage I/O banks must not exceed the absolute maximum ratings. Use the Quartus II (or later) design toolchain for synthesis, place-and-route, and timing closure - Cyclone III support is included in current Quartus versions. This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3C55F484C6 - 55K LE Cyclone III FPGA 484-FBGA | Intel / Altera
The Intel (formerly Altera) Cyclone III EP3C55F484C6 is a low-power, high-volume Field Programmable Gate Array (FPGA) with 55,856 logic elements, 2,396,160 bits of embedded memory, and 327 maximum user I/O pins, housed in a 484-ball FineLine BGA package. Built on a 65 nm low-power process, the device is offered in the commercial speed grade 6 variant and operates from a 1.2 V core supply with multi-voltage I/O support. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor containing an array of programmable logic blocks, embedded memory blocks, and programmable interconnect that engineers can customize after manufacturing. Cyclone III belongs to the low-cost FPGA family within Intel's programmable logic hierarchy (FPGA -> programmable logic -> programmable logic device -> semiconductor). It is positioned below higher-end Stratix families and above legacy Cyclone II in power efficiency and density, targeting cost-sensitive volume applications. Key features of the EP3C55F484C6 include 55,856 logic elements for moderate-complexity digital designs, 2,396,160 bits (approximately 2.4 Mbit) of embedded SRAM organized as M9K blocks, 4 PLLs for clock management, 20 global clock networks, and 56 embedded 18x18 hardware multipliers that accelerate DSP operations. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and the F484 package exposes 327 user I/O balls for high pin-count applications. Architecturally, Cyclone III FPGAs use a 65 nm TSMC low-power process with static core power of approximately 100 mW at 1.2 V, combined with on-chip voltage regulation and hot-socketing support. The four PLLs support frequency synthesis, phase shifting, and clock deskew across the 20 global networks, while the 18x18 multipliers enable DSP building blocks without consuming general logic resources. Typical applications include industrial motor control and factory automation, video surveillance and image processing, automotive infotainment prototypes, communications infrastructure line cards, and consumer display controllers. The combination of moderate density, low power, and a high-I/O BGA package makes the EP3C55 well suited for designs that require substantial user I/O but do not justify the cost of a high-end Stratix device. When designing with this device, plan I/O bank assignments carefully because the 484-FBGA provides 8 I/O banks with separate VCCIO rails. Decoupling must follow the Quartus II Pin Planner guidelines, and unused pins should be configured as inputs with weak pull-up to avoid floating inputs. JTAG configuration via the EPCS serial configuration device is recommended for volume production. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers select between Cyclone III variants and migration paths within the Intel FPGA portfolio.
EP3C55F484C6N - Cyclone III FPGA, 55K LE, 327 I/O | Altera
The Altera EP3C55F484C6N is a Cyclone III Field Programmable Gate Array (FPGA) with 55,856 logic elements, 327 user I/O pins and 2,396,160 RAM bits, housed in a 484-ball FBGA package with 1 mm pitch and 23 × 23 mm body. It operates from a 1.2 V core supply and supports up to 472 MHz internal clock frequency, making it a versatile mid-capacity programmable logic device for industrial, communications, and video applications. An FPGA (Field-Programmable Gate Array) is an integrated circuit whose logic fabric can be electrically reprogrammed in the field to implement arbitrary digital hardware. Unlike fixed-function ASICs, FPGAs contain programmable look-up tables, flip-flops, block RAM, multiplier blocks, and configurable I/O buffers connected by programmable routing. In the component taxonomy, an FPGA sits under Programmable Logic Device (PLD) and Integrated Circuit (IC); it is chosen when hardware flexibility, low non-recurring engineering cost, or massive parallel data processing is required. The EP3C55F484C6N provides 2,396,160 bits of embedded SRAM for FIFOs and soft-core processor memory, supports 327 user I/O pins on multiple I/O banks, and includes embedded 18×18 multiplier resources for DSP tasks. The -6 speed grade is the highest-performance commercial timing grade in the Cyclone III family, while the N suffix denotes a lead-free, RoHS-compliant package. The FBGA-484 package is 23 mm × 23 mm, 2.60 mm maximum height, 1 mm ball pitch, and is designed for surface-mount assembly. The device is built on a 65-nm low-power process and requires a 1.2 V VCCINT core supply, which reduces dynamic power compared to earlier 1.5 V/1.8 V FPGA families. Cyclone III architecture includes a hierarchical clock network and PLL-based clock management to distribute low-skew clocks across the device. I/O banks can be powered at different voltages to interface with a range of single-ended and differential standards. The C6N ordering code indicates commercial temperature operation from 0 °C to +85 °C. Typical end applications include industrial motor control, medical diagnostic imaging, broadcast video processing, communications infrastructure, and multi-channel test instrumentation. The combination of 55K logic elements and 327 I/O pins allows implementation of soft processors, high-speed data acquisition interfaces, and custom protocol controllers in a single programmable device. Designers using the EP3C55F484C6N must pay careful attention to power-supply decoupling on the 1.2 V VCC rails, correctly configure MSEL pins for the desired configuration scheme, and validate I/O assignments against the Cyclone III pin-out files before placing the part on a board. This XAIPART page synthesizes distributor inventory data, representative current pricing, same-package drop-in speed and temperature variants, and practical PCB notes that supplement Intel/Altera's official product documentation with actionable procurement and design guidance.
EP3C55F484C7 - Cyclone III FPGA, 55K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP3C55F484C7 is a low-power Cyclone III Field-Programmable Gate Array (FPGA) with 55,856 logic elements, 2,396,160 bits of embedded memory, and 327 maximum user I/Os, housed in a 484-ball FineLine BGA (FBGA-484) package measuring 23 mm × 23 mm with 1.0 mm ball pitch. Built on a 65 nm TSMC low-k process, this industrial-grade device supports an internal clock frequency of up to 472 MHz and integrates 156 embedded 18 × 18 multipliers for DSP workloads, making it suitable for cost-sensitive parallel processing applications. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can re-program after manufacture to implement custom digital logic, signal processing pipelines, or interface bridges. FPGAs sit between general-purpose microcontrollers (fixed instruction set, software-defined behaviour) and ASICs (custom silicon, fixed hardware) - offering hardware-timed parallelism with no NRE mask cost and rapid design iteration. The Cyclone III family specifically targets low-static-power applications and is a subclass of SRAM-based FPGAs, where configuration is loaded from an external flash at every power-up. Key features of the EP3C55F484C7 include support for up to 4 PLLs, embedded multiplier blocks for DSP operations, dedicated DDR/DDR2 SDRAM memory interfaces with dedicated DQS pins, and configurable I/O standards including LVDS, SSTL, and HSTL. The device is configured via serial or parallel flash using industry-standard JTAG or Active Serial (AS) modes. Its 484-ball FineLine BGA package provides ample I/O headroom and excellent signal-integrity performance for parallel buses and high-speed memory interfaces. Typical applications include industrial motor control, video surveillance IP cameras, automotive infotainment subsystems, programmable logic controllers (PLCs), embedded vision and machine-vision pipelines, and low-power software-defined radio front-end pre-processing. The large logic capacity also makes it suitable for telecom protocol bridging and ASIC prototyping in mid-volume production. When designing with this part, ensure the PCB has a clean multi-layer stack-up with continuous ground planes under the BGA to maintain signal integrity for DDR2 interfaces. Use the Altera/Intel Quartus II design suite (or the maintained Quartus Prime 13.0sp1 legacy branch) for synthesis, place-and-route, and timing closure.
EP3C55F484C7N - Cyclone III FPGA, 55K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP3C55F484C7N is a Cyclone III Field-Programmable Gate Array (FPGA) featuring 55,856 logic elements, 2,396,160 bits of embedded memory, and 327 maximum user I/O pins in a 484-ball FineLine BGA (FBGA) package. It belongs to the lowest-cost, lowest-power Cyclone III family fabricated on a 60 nm process, with a commercial speed grade 7 device operating from 0C to 85C ambient. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect fabric. FPGAs sit above microcontrollers and fixed-function ASICs in the programmable logic hierarchy: microcontrollers run sequential firmware, ASICs are hard-wired for one function, while FPGAs deliver hardware-level parallelism and can be reconfigured in-system to implement custom digital signal processing, glue logic, control planes, and high-speed bus interfaces. The Cyclone III family is positioned by Intel as the lowest-power FPGA family of its generation, optimized for cost-sensitive, high-volume applications. Key features of the EP3C55F484C7N include 4 transceivers absent (no high-speed serial transceivers - digital I/O only), 156 embedded 18x18 multipliers for DSP blocks, dedicated hardware for memory controllers and PLL clock management, and support for external memory interfaces including DDR, DDR2, and QDRII SRAM. The device is built on TSMC's low-power 60 nm process, achieving substantially lower static and dynamic power than the prior Cyclone II generation. Embedded RAM is distributed as true dual-port M9K blocks totalling 2.4 Mbits, ideal for FIFO buffers, register files, and small lookup tables. The Cyclone III architecture provides DSP blocks, embedded multipliers, and dual-port block RAM tightly coupled to the logic array, enabling efficient implementation of video processing pipelines, motor control loops, and protocol bridging. Configuration is supported through JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes with built-in decompression and decryption using AES-256. The device is supported by the Quartus II design toolchain. Typical applications include industrial motor control and PLC logic, video surveillance image processing, machine vision front-ends, telecom protocol bridging, low-cost ASIC prototyping, and embedded display controllers. Designers choose Cyclone III when they need FPGA-class logic density and DSP performance at a unit cost below larger families such as Stratix, while still benefiting from hardened memory controllers and PLL. When designing with the EP3C55F484C7N, allocate dedicated VCCINT, VCCA, VCCD_PLL, and VCCIO bank supplies with sufficient decoupling - each bank can operate at a different I/O standard voltage (1.2V, 1.5V, 1.8V, 2.5V, 3.0V, 3.3V LVTTL/LVCMOS). A multi-rail power-on sequence (VCCINT first, then VCCA, then VCCIO) is recommended for in-system programming reliability. This page consolidates current distributor pricing, drop-in FPGA alternatives in the 484-FBGA footprint, and practical design notes beyond the manufacturer datasheet to accelerate Cyclone III part selection and supply chain decisions.
EP3C55F484C8 - Cyclone III FPGA, 55K LEs, 484-FBGA | Intel
The Intel (formerly Altera) EP3C55F484C8 is a Cyclone® III Field-Programmable Gate Array (FPGA) delivering 55,856 logic elements, 2,396,160 bits of embedded memory, and 327 user I/Os in a 484-ball FineLine BGA package. It is built on a low-power 65-nm process and operates with a core logic frequency up to 472.5 MHz, making it a workhorse device for cost-sensitive, high-volume digital designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and DSP blocks that can be reconfigured by the end user. FPGAs sit at the top of the digital IC hierarchy: programmable logic -> programmable logic device -> digital IC -> semiconductor. Cyclone III FPGAs specifically target applications that need abundant logic, moderate DSP, and low static power consumption without the cost of high-end transceivers or hardcore processors. Key features of the EP3C55F484C8 include 55,856 logic elements (LEs), 312 embedded 18x18 multipliers (DSP blocks), 2,396,160 bits of embedded SRAM, four phase-locked loops (PLLs), 20 global clock networks, and 327 general-purpose I/Os that support LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The device supports configuration via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes, and is supported by Intel Quartus® Prime / Quartus II design software. Architecturally, the Cyclone III family uses a low-k 65-nm process that lowers dynamic and static power versus Cyclone II by up to 50 percent. The 484-pin FBGA (23 x 23 mm body, 1.0 mm ball pitch, 2.60 mm height) provides dense board integration with lead-free Pb-free terminations, and the commercial speed grade -8 corresponds to a tighter timing margin than -7 or -6 variants. Typical applications include industrial motor control and machine vision, video processing and display bridging, communications protocol bridging, test and measurement equipment, and embedded control with soft-core processors such as Nios II. The 484-FBGA footprint and abundant I/O count make this specific variant well suited to designs requiring many parallel buses or LVDS channels. When designing with this part, verify that the Quartus II / Quartus Prime device support file for Cyclone III EP3C55 is installed. Because Cyclone III is a mature, mature product family, engineers should confirm long-term availability through Intel's product lifecycle documents or authorized distributors before committing to high-volume production. This page synthesizes distributor pricing, drop-in-compatible alternatives (same-brand and cross-brand), and practical design notes beyond what is in the manufacturer datasheet, giving engineers a single reference for selection and procurement.
EP3C55F484C8N - Cyclone III FPGA, 55K LE, 484-FBGA | Intel / Altera
The Intel (formerly Altera) EP3C55F484C8N is a Cyclone III low-cost, low-power Field-Programmable Gate Array (FPGA) with 55,856 logic elements, 327 user I/O pins, and 2,396,160 bits of embedded memory, packaged in a 484-ball FineLine BGA (FBGA) measuring 23 x 23 mm with 1.0 mm pitch. Operating from a 1.2 V core supply, the device supports up to 472 MHz internal operation per the Alldatasheet specification and is qualified for commercial temperature range (0 to +85 C). A Cyclone III FPGA is a SRAM-configurable logic device positioned in the low-cost FPGA tier, below the Stratix and Arria families. Cyclone III belongs to the broader FPGA hierarchy: programmable logic -> FPGA -> SRAM-based FPGA -> low-power FPGA. The family targets cost-sensitive applications such as industrial control, video processing, and communications infrastructure where Stratix-class performance is unnecessary but a true programmable fabric is still required. Key features include 55856 logic elements, 2396160 embedded memory bits distributed across M9K blocks, 4 PLLs for clock management, and 343 multiplier blocks (18x18) enabling DSP functions without external multipliers. Per the Alldatasheet entry the package is described as 23 x 23 mm FBGA-484 with 2.60 mm height and 1 mm pitch, lead-free, and the device is RoHS compliant. The Cyclone III family uses a 65 nm TSMC process that delivers significantly lower static and dynamic power than the prior Cyclone II generation while preserving pin compatibility in many footprints. Typical applications span industrial motor and machine control, video surveillance and image processing, software-defined radio front-ends, low-cost ASIC prototyping, automotive infotainment ECUs, and consumer display controllers. The 327 I/O and rich DSP blocks also make the part a frequent choice for educational FPGA development kits and university digital logic labs. When designing with the EP3C55F484C8N, place all VCCINT and VCCA decoupling capacitors within a few millimetres of the balls, use at least 4 signal layers to escape the dense 1.0 mm pitch BGA, and respect the Quartus II / Quartus Prime JTAG configuration sequence including nCONFIG, nSTATUS, and CONF_DONE handshakes. Power sequencing must bring VCCINT up before VCCA per the Cyclone III Device Handbook.
EP3C55F484I7 - 55K LE Cyclone III FPGA 484-BGA | Intel / Altera
The Intel (formerly Altera) EP3C55F484I7 is a low-power, high-volume Cyclone® III Field Programmable Gate Array delivering 55,856 logic elements, 327 user I/O, and 2,396,160 bits of embedded memory in a 484-ball FineLine BGA package. The device operates from an internal maximum frequency of 472.5 MHz across a 1.2 V core supply, with industrial temperature grade (-40 °C to +100 °C) and lead-free / RoHS-compliant assembly per the verified distributor listings. The 'F484' suffix designates the 23 × 23 mm, 1.0 mm-pitch FBGA-484 package with 327 maximum user I/O pins. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> programmable logic -> digital ICs -> semiconductors. Unlike a fixed ASIC, an FPGA is reprogrammed in-system via a configuration bitstream, making it the platform of choice for design prototyping, low-volume production, and applications requiring late-stage hardware changes. Key Cyclone III features include up to 4 Mbits of embedded memory, up to 156 embedded 18 × 18 multipliers, and 20 global clock networks with up to 4 PLLs per device. The EP3C55 variant specifically offers 55,856 logic elements (3,491 ALMs), 2,340 Kbits of RAM, 156 multipliers, and 4 PLLs. Configuration is supported via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, allowing flexible boot from EPCS configuration devices or external microprocessors. Typical applications include industrial motor control, video processing pipelines, telecom line cards, automotive infotainment prototypes, and cost-sensitive DSP front-ends. The 484-BGA package provides ample signal integrity margin for DDR/DDR2 memory interfaces and LVDS signaling commonly required in display and image-processing designs. When designing with this device, plan power sequencing for the 1.2 V core and the I/O bank supplies independently, and follow Altera's decoupling guidelines (typically 0.1 µF + bulk decoupling per VCC pin group). The 1.0 mm-pitch FBGA-484 requires 4–6 layer PCB with microvia or via-in-pad for reliable assembly. Use the Quartus II / Quartus Prime design software for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations beyond the Altera Cyclone III handbook.
EP3C55F484I7N - Cyclone III FPGA 55K LE 484-FBGA | Altera
The Altera (Intel) EP3C55F484I7N is a Cyclone III family Field Programmable Gate Array (FPGA) built on a 65 nm low-power CMOS process, integrating 55,856 logic elements (LEs), 327 user I/Os, and 2,396,160 bits of embedded memory in a 484-ball FineLine BGA (FBGA-484) package measuring 23 x 23 mm with a 1.0 mm ball pitch. According to the manufacturer datasheet and distributor listings, this part operates from a nominal 1.2 V core supply, supports up to four independent PLLs, and delivers internal clock frequencies up to 472.5 MHz at speed grade 7, making it one of the highest-density Cyclone III devices for cost-sensitive, high-volume applications. A field-programmable gate array (FPGA) is a reconfigurable semiconductor that engineers program post-fabrication to implement arbitrary digital logic, glue logic, and parallel processing pipelines. Within the system hierarchy, an FPGA sits between microcontrollers (fixed-function, firmware-defined) and ASICs (custom-silicon, NRE-defined); FPGAs dominate prototyping, low-volume production, and design flows that demand hardware parallelism without silicon re-spin costs. The Cyclone III family targets cost-sensitive, high-volume applications and integrates DSP blocks, embedded multipliers, and M9K memory blocks alongside the logic fabric. Key features include 312 M9K memory blocks totaling 2.49 Mbits of embedded RAM (some listings cite 2.29 Mbits), 4 PLLs supporting frequency synthesis and clock-tree management, 18-bit embedded multipliers for DSP operations, and LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports hot-socketing and configuration via JTAG, Active Serial, or Passive Serial modes, with built-in decompression for bitstream storage reduction. From an architectural perspective, the Cyclone III LE is built around a 4-input look-up table (LUT), a dedicated adder chain for arithmetic, and a register, interconnected by Altera's MultiTrack routing fabric. The 1.2 V core and a separate I/O bank voltage allow mixed-voltage interfacing on the same die, while the 65 nm process delivers low static power (typically less than 0.5 W quiescent) compared to older 90 nm Cyclone II generations. Typical applications include industrial motor control and factory automation, video processing and surveillance, automotive infotainment and driver assistance, software-defined radio front-ends, and embedded vision pipelines. The wide logic capacity also suits ASIC prototyping, low-cost DSP implementations, and reconfigurable I/O expansion for embedded processors. When designing with this device, ensure the PCB provides a clean, multi-rail power distribution network (1.2 V core, separate VCCPD and VCCIO per I/O bank) and a configuration mode selection circuit. Thermal management is generally light at typical industrial loads, but a copper pour directly under the FBGA improves both thermal dissipation and signal integrity for high-speed LVDS pairs. This page synthesizes distributor pricing, drop-in compatible Cyclone III alternatives, and PCB design guidance that is not aggregated in the manufacturer datasheet alone.
EP3C55F484I8N - Cyclone III FPGA, 55K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP3C55F484I8N is a low-power, low-cost Cyclone III Field-Programmable Gate Array (FPGA) integrating 55,856 logic elements organized into 3,491 Logic Array Blocks (LABs), housed in a 484-ball FineLine BGA (FBGA) package measuring 23 mm square. The device is built on a TSMC low-power 65 nm CMOS process and operates from a 1.2 V core supply (1.15 V to 1.25 V), making it one of the lowest-power FPGAs of its generation. It exposes 327 user I/O pins through eight I/O banks, supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL interfaces at up to 640 Mbps LVDS performance. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and configurable I/O cells. FPGAs belong to the broader class of programmable logic devices (PLDs), sitting above simple PLDs (SPLDs) and complex PLDs (CPLDs) in capability but below ASICs in per-unit cost. Cyclone III devices in particular target the volume-cost end of the FPGA market and are positioned in the hierarchy as: Cyclone III FPGA -> mid-range FPGA family -> programmable logic -> integrated circuit. FPGAs are typically used when designs must ship in volume but still require hardware-level parallelism, custom timing, or post-production field upgrades. The EP3C55F484I8N provides 2,396,160 bits of embedded RAM (approximately 234 Kbytes), 312 dedicated 18 x 18 hardware multipliers for DSP operations such as FIR filters and FFTs, and four general-purpose PLLs for clock synthesis and skew management. Per-device configuration is supported through active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes. The industrial temperature grade (-40 C to +100 C junction) suffix "I8" and Pb-free / RoHS-compliant "N" suffix make the EP3C55F484I8N suitable for harsh-environment designs, while the speed grade "8" denotes the slowest commercial timing bin, traded for lower dynamic power. Architecture-wise, Cyclone III uses an SRAM-based lookup table (LUT) fabric with 16 logic elements per LAB, a fine-grained M4K memory block primitive, and dedicated routing channels. Each LAB contains control logic and 16 LEs, and signal integrity is maintained by per-bank VCCIO supplies that can be set independently between 1.2 V and 3.3 V, simplifying mixed-voltage designs where the FPGA bridges 3.3 V peripherals to 1.2 V core logic. Typical applications for EP3C55F484I8N include industrial motor control and machine vision, low-cost video bridging and display controllers, software-defined radio (SDR) front-ends, telecom line cards, and embedded control boards where a microprocessor plus FPGA pair replaces a higher-cost DSP or ASIC. It is also widely used in university and prototyping labs as a general-purpose programmable platform. When designing with this device, plan power sequencing carefully: the 1.2 V VCCINT rail must rise before or simultaneously with the VCCAUX (2.5 V) and VCCIO rails to avoid internal latch-up. Use the Altera (Intel) Quartus II design suite, which provides timing-driven place-and-route, power estimation, and SignalTap II logic analyzer support for in-system debug. This page synthesizes current distributor pricing, drop-in same-package alternatives drawn from the Cyclone III EP3C55 family, and practical design notes not found in the manufacturer datasheet alone, helping engineers shorten selection cycles.
EP3C55F780C6 - Cyclone III FPGA, 55K LEs, 780-BGA | Intel (Altera)
The Intel (formerly Altera) EP3C55F780C6 is a Cyclone III field-programmable gate array (FPGA) with 55,856 logic elements, 2,396,160 bits of embedded memory, and 156 18x18 hardware multipliers, housed in a 780-ball fine-pitch BGA package with 377 user I/Os. Built on a low-power 65nm process, the Cyclone III family delivers a balance of logic density, memory, and DSP capability at a fraction of the static power of competing 90nm FPGAs. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM and DSP slices. FPGAs sit in the programmable-logic tier of the digital semiconductor hierarchy: ASIC < structured ASIC < FPGA < CPLD < microcontroller. Designers use HDL (Verilog or VHDL) to describe the desired digital function, then synthesize, place, and route the design with vendor tools (Quartus II for the Cyclone III family). Unlike fixed-function ASICs, FPGAs allow in-system reconfiguration, making them ideal for prototyping, low-volume production, and designs that must evolve in the field. Key features of the EP3C55F780C6 include a 4-Mbit embedded memory subsystem, four general-purpose PLLs for clock synthesis, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL on user I/Os. The 'C6' speed grade offers a -6 speed rating for internal logic, and the 'C' prefix denotes the commercial temperature grade of 0C to +85C. Static power consumption is significantly reduced compared to Cyclone II, enabling fan-less operation in cost-sensitive applications. From an architectural perspective, the Cyclone III device family uses 4-input look-up tables (LUTs) per logic element, M9K block RAM tiles, and 18x18 multiplier blocks optimized for DSP. The 780-FBGA package provides high I/O density suitable for memory-bus bridging, video processing pipelines, and parallel sensor aggregation. Configuration is supported through JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes via the dedicated configuration pins. Typical applications include industrial motor control, video surveillance and image processing, telecom line cards, low-cost ASIC prototyping, and embedded vision systems. The combination of DSP blocks and on-chip memory is particularly suited to digital filtering, FFT computation, and image pre-processing. Designers transitioning from older Cyclone II designs will find pin-compatible migration options within the family. When designing with this device, ensure the PCB BGA layout meets the 1.0mm ball pitch clearance rules of the 780-FBGA package and that the Quartus II power-play analysis is run early in the design cycle. Decoupling must follow the reference design guidance in the Cyclone III Device Handbook. This page synthesizes distributor pricing, drop-in Cyclone III alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers select the right Cyclone III variant for their application.
EP3C55F780C6N - Cyclone III FPGA 55K LE 780-BGA | Intel (Altera)
The Intel (formerly Altera) EP3C55F780C6N is a Cyclone III family Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package, delivering 55,856 logic elements, 2,396,160 bits of embedded memory and 377 maximum user I/O pins in a cost-optimized 65nm process. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that belongs to the broader category of integrated circuits and sits in the digital semiconductor hierarchy: FPGA > programmable logic > logic IC > integrated circuit. Cyclone III is positioned in the low-power, cost-sensitive segment of Intel's FPGA portfolio, targeting volume production in industrial, communications and consumer applications where Stratix-class performance is unnecessary. Key features of this device include 55,856 logic elements, 312 embedded 18x18 multipliers, 2,396,160 bits (approximately 234 Kbits) of RAM, 4 PLLs and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL and PCI through 377 user I/O pins. The 'C6' speed grade and commercial temperature rating (0C to +85C) suit typical indoor and laboratory environments rather than extended industrial or automotive conditions. From an architectural standpoint, the Cyclone III family uses a 65nm low-power process with on-chip termination, dedicated DSP blocks and embedded memory arranged in M9K blocks. The 780-FBGA package provides high I/O density suitable for parallel bus interfaces, video bridging and multi-channel data acquisition subsystems. Typical applications include industrial motor control, video processing and bridging, software-defined radio, factory automation controllers, and test and measurement equipment where deterministic parallel logic and embedded DSP are required at low total system cost. When migrating designs between Cyclone III variants, verify pin compatibility because the F780 (780-pin FBGA) footprint differs from F484 and F324 package options within the same family.
EP3C55F780C7 - Cyclone III FPGA, 55K LE, 780-FBGA | Intel / Altera
The Intel (formerly Altera) EP3C55F780C7 is a Cyclone III series low-power Field-Programmable Gate Array (FPGA) delivering 55,856 logic elements, 2,396,160 bits of embedded memory, and 377 user I/O pins in a 780-ball FineLine BGA package. The device operates at a core voltage of 1.2 V with a maximum internal clock frequency of 437.5 MHz and is fabricated on a 65 nm TSMC low-power process, providing a balance of density, performance, and power efficiency for cost-sensitive applications. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit that allows hardware designers to implement custom logic functions through programmable logic blocks, embedded multipliers, memory blocks, and I/O cells. Cyclone III FPGAs sit within Intel's mainstream low-power FPGA hierarchy: FPGA -> programmable logic -> programmable logic device (PLD) -> digital IC. The 55K logic-element tier sits between Cyclone III entry-level (EP3C5/EP3C10/EP3C16) and high-density (EP3C120) devices, optimized for mid-volume, mid-complexity designs where unit cost and power consumption dominate over raw performance. Key features of the EP3C55F780C7 include 55,856 logic elements (LEs), 234 embedded 18x18 multipliers (suitable for DSP blocks), 2,396,160 bits of embedded RAM (M9K blocks), 4 PLLs for clock management, and 377 single-ended user I/Os (or differential pairs). The device supports DDR/DDR2/QDRII external memory interfaces through dedicated PHY blocks and provides 8.6 Mbits of usable memory bandwidth. The 780-FBGA package is the high-density option for this die, exposing nearly the maximum I/O count and supporting industrial temperature grades. The Cyclone III architecture is built on a 65 nm low-power CMOS process with a 1.2 V core supply and dedicated I/O banks that support multiple single-ended standards (LVCMOS, LVTTL, PCI, PCI-X) and differential standards (LVDS, RSDS, mini-LVDS, LVPECL on input). Each logic array block (LAB) contains 16 LEs, and the device integrates a configuration controller that supports multiple FPGA configuration modes including JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP). The Quartus II design software is the primary design entry, synthesis, and place-and-route tool. Typical applications for EP3C55F780C7 include industrial motor control and automation, video processing and image filtering, automotive infotainment and driver assistance subsystems, telecom line cards, baseband signal processing for SDR platforms, medical imaging front-ends, and embedded industrial controllers. The 55K LE density supports designs ranging from multiple soft processor cores (NIOS II) to wide DSP pipelines. When designing with EP3C55F780C7, ensure the board has a clean 1.2 V core supply with at least 6 decoupling capacitors (one 0.1 uF + one bulk per supply pin group), a 2.5 V/3.3 V auxiliary supply for configuration, and properly terminated LVDS or LVCMOS signals at each I/O bank. For high-speed memory interfaces, follow Intel's pin connection guidelines for OCT (on-chip termination) calibration and impedance matching. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III family, and practical design notes that complement the official Cyclone III Device Handbook.
EP3C55F780C7N - 55K LEs Cyclone III FPGA 780-FBGA | Intel
The Intel (formerly Altera) EP3C55F780C7N is a Cyclone III family Field-Programmable Gate Array (FPGA) built on a 65 nm low-power process, providing 55,856 logic elements, 377 user I/Os, and 2,396,160 bits of embedded memory in a 780-pin FineLine BGA package. It targets cost-sensitive, power-conscious applications that previously required ASIC or higher-cost FPGAs. The device operates across commercial temperature grades with core logic powered at 1.2 V and I/O banks supporting multiple single-ended and differential standards (LVTTL, LVCMOS, LVDS, SSTL, PCI, etc.). A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured by the end user after manufacture. Cyclone III FPGAs sit in the low-power, mid-density branch of programmable logic, hierarchically above CPLDs (smaller, non-volatile) and below high-end FPGA SoCs. They are typically used as glue logic, high-speed parallel interfaces, video/image processing pipelines, and protocol bridges where microcontrollers alone cannot meet throughput or latency requirements. Key features of the EP3C55F780C7N include 312 M9K embedded memory blocks (approximately 2.4 Mbit), 156 dedicated 18x18 multipliers enabling DSP-grade throughput without external DSP ICs, four general-purpose PLLs for clock synthesis and skew management, and 8 Kbits of configuration memory supporting passive serial, fast passive parallel, and JTAG programming. The 780-FBGA FineLine BGA package exposes 20 transceivers-free I/O banks totaling 377 usable pins, enabling wide parallel buses (16- and 32-bit) plus control and clock signals on a single device. The Cyclone III architecture is built around LABs (Logic Array Blocks) of 16 logic elements, each comprising a 4-input LUT, register, and carry chain. Multipliers and LEs share a column- and row-based routing fabric, and embedded memory is distributed as M9K blocks alongside LAB columns, giving the tool chain predictable timing closure up to the device fMAX. Configurable I/O standards per bank, with on-chip termination, eliminate most external resistor networks. Typical applications include industrial machine vision, motor control and factory automation, low-cost digital video capture/display, wireless baseband preprocessing (alongside a host processor), and ASIC prototyping. Designers value the Cyclone III family for its combination of density, low static power, and the mature Quartus II design toolchain, which supports both Verilog/VHDL and higher-level block-based design. When designing with the EP3C55F780C7N, plan your I/O bank voltage assignment before PCB layout: each bank has a fixed VCCIO and VREF pair, and mixing incompatible standards in one bank is not allowed. Use the Quartus II Early Power Estimator (EPE) to confirm thermal envelope prior to PCB layout, and follow Intel's pinout guidelines for BGA decoupling and power plane stitching to avoid signal-integrity issues at 100 MHz+ LVDS rates. This page synthesizes distributor pricing as of 2026-09-09, real same-brand and cross-brand drop-in alternatives drawn from verified web data, and practical design notes not found on the manufacturer datasheet alone.
EP3C55F780C8 - Cyclone III FPGA 55K LEs 780-FBGA | Intel
The Intel EP3C55F780C8 is a Cyclone III Field-Programmable Gate Array (FPGA) delivering 55,856 logic elements, 2,396,160 bits of embedded memory, and 156 embedded 18x18 multipliers in a 780-ball FineLine BGA package. Built on a 65 nm low-power process, this device operates from a 1.2 V core supply and supports I/O standards up to LVDS at data rates of approximately 402 MHz, with 377 user I/O pins for high-density digital system integration. A Cyclone III FPGA is a reprogrammable logic device that belongs to the broader category of programmable logic devices (PLDs), which also include CPLDs. Positioned between fixed-function ASICs and discrete logic, Cyclone III FPGAs are widely deployed in cost-sensitive, low-power applications such as industrial control, video processing, and communications infrastructure. They offer ASIC-like density and parallelism with the flexibility of in-system reprogrammability via SRAM configuration memory. Key features of the EP3C55F780C8 include 4 PLLs for clock management, 4 memory controller blocks, support for DDR/DDR2/QDRII SRAM interfaces, 156 dedicated hardware multipliers optimized for DSP, and 20 global clock networks. The device also integrates 4 phase-locked loops and supports configuration via JTAG, Active Serial, or Passive Serial modes, enabling flexible boot options in production and development environments. Architecturally, the Cyclone III family uses a logic-element (LE) based fabric with embedded RAM blocks (M9K) and 18x18 multiplier blocks. The 65 nm process technology delivers a balance between static power (suitable for thermally constrained designs) and switching performance. Power dissipation is dominated by dynamic switching activity; Altera's PowerPlay early power estimator enables accurate budgeting before place-and-route. The 780-FBGA package supports high I/O count with multiple package migration paths. Typical applications include industrial motor control, video surveillance, automotive infotainment pre-processing, wireline telecom line cards, and low-cost software-defined radio front-end interfaces. This device suits designs where mid-range logic density and DSP capability are needed without the cost of high-end FPGAs. When designing with the EP3C55F780C8, ensure proper decoupling of VCCINT and VCCA supplies. Follow Altera's recommended pin-connection guidelines for unused I/O banks and configure unused Multiplier blocks to logic-only mode to minimize leakage. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the Altera Cyclone III Device Handbook, giving engineers an actionable cross-reference for legacy Cyclone III designs.
EP3C55F780C8N - 55K LE Cyclone III FPGA, 780-FBGA | Intel/Altera
The Altera (now Intel) EP3C55F780C8N is a Cyclone III field-programmable gate array with 55,856 logic elements, 3,491 logic array blocks, and 2,396,160 bits of embedded RAM, housed in a 780-pin FineLine BGA (29x29 mm, 1.0 mm pitch) package at commercial speed grade 8. It exposes 377 user I/O pins and four PLLs, runs on a 1.15 V to 1.25 V core supply, and supports active serial, passive serial, and Fast Passive Parallel configuration schemes through dedicated JTAG (IEEE 1149.1) and configuration pins. What is a low-cost FPGA? A field-programmable gate array is a semiconductor device whose logic function is defined after PCB assembly rather than at the wafer fab, allowing rapid hardware iteration. The Cyclone III family is positioned in the hierarchy as low-cost programmable logic -> FPGA -> programmable logic device -> semiconductor, manufactured on a 65 nm TSMC process and tailored for high-volume cost-sensitive designs where Cyclone IV or Cyclone V would be over-specified. Key features include 55856 logic elements, 3,491 LABs, 2,396,160 bits (2396 Kbit) of RAM, 156 embedded 18x18 multipliers, four PLLs, 377 maximum user I/Os, and 4 user I/O banks that support LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device also provides 20 global clock networks and supports Nios II embedded processor soft cores via Altera/Intel Quartus design tools. Architecturally, the Cyclone III uses a logic-element-based fabric with 16 logic elements per LAB, distributed M9K memory blocks (totaling 260 blocks), and DSP blocks formed from the 18x18 multipliers. The 65 nm process and 1.2 V core supply keep dynamic power low for a device of this logic density, while the 4 PLLs allow flexible clock synthesis across multiple I/O banks. Typical applications include industrial motor control and machine vision, video processing and display bridges, communications line cards and protocol bridging, consumer electronics such as flat-panel TVs and set-top boxes, and test & measurement front ends. The 55K LE capacity is well matched to designs that require soft processor cores plus moderate DSP throughput. When designing with this device, plan the 780-BGA PCB layout early: the 1.0 mm pitch and 29x29 mm body demand 4 or 6 layer stack-ups with microvia or HDI technology for escape routing, and at least 8 decoupling capacitor placements around the package perimeter. Configuration pin mapping must be verified against the chosen AS/PS/FPP mode before committing the schematic. This page synthesizes distributor pricing, drop-in Cyclone III variants, and practical PCB and toolchain guidance not found in the manufacturer datasheet alone.
EP3C55F780I7 - Cyclone III FPGA, 55K LEs, 780-FBGA | Altera
The Altera EP3C55F780I7 is a Cyclone III Field-Programmable Gate Array (FPGA) IC integrating 55,856 logic elements, 2,396,160 bits of embedded memory, and 377 user I/O pins in a 780-ball FineLine BGA (FBGA) package. Built on a low-power 65 nm process, the device operates at a core voltage of 1.2 V and supports internal clock rates reaching 472 MHz, providing a balance of logic density and energy efficiency for cost-sensitive applications. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to configure arbitrary digital circuits after manufacturing. Architecturally, an FPGA sits between an ASIC (fully custom, high NRE cost) and a standard microcontroller, occupying the same hierarchy as a CPLD and other programmable logic devices. The Cyclone III family in particular targets low-cost, high-volume markets by combining LE fabric, M9K memory blocks, embedded multipliers, and PLL-based clock management in a single device. Key features include 55,856 logic elements, 156 embedded 18x18 multipliers, 234 Kbits of distributed RAM (MLABs), 2,396,160 bits of block RAM, four PLLs for clock synthesis, and 377 single-ended user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The industrial temperature grade (-40C to +100C) and 780-FBGA package with 1 mm ball pitch make the device suitable for moderate-density, board-constrained designs. Typical applications include digital signal processing pipelines, video bridging and conversion, motor control, industrial communication bridges, and low-cost ASIC prototyping. Designers rely on the Cyclone III family for power-efficient glue logic and parallel signal processing. When designing with this device, plan power distribution carefully: the 1.2 V core rail typically draws hundreds of milliamps and must be decoupled with 0402/0603 ceramics placed close to each power ball. JTAG configuration via the dedicated MSEL pins should be reserved for production programming. This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list, and practical design notes not found in the standalone manufacturer datasheet.
EP3C55F780I7N - Cyclone III FPGA, 55K LEs, 780-FBGA | Intel
The Intel (formerly Altera) EP3C55F780I7N is a Cyclone III field-programmable gate array (FPGA) delivering 55,856 logic elements and 2,396,160 bits of embedded memory in a 780-ball fine-pitch BGA package. Built on a low-power 65 nm process, this device operates at a core voltage of 1.2 V and supports user I/O counts up to 377 with internal frequencies reaching 472 MHz. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all controlled by a configuration bitstream. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs and structured ASICs in the logic IC hierarchy. Cyclone III devices specifically target high-volume, cost- and power-sensitive applications by combining the flexibility of programmable logic with ASIC-like unit pricing in the low hundreds of dollars. Key features of the EP3C55F780I7N include 55,856 logic elements, 2,396,160 RAM bits distributed across M9K and M144K memory blocks, 56 embedded 18x18 multipliers for DSP operations, four phase-locked loops (PLLs) for clock management, and a maximum user I/O count of 377. Industrial temperature-grade operation from -40 °C to +100 °C is supported, and the device is lead-free and RoHS compliant. The 780-FBGA measures 29 mm x 29 mm with a 1 mm ball pitch, well suited to dense multi-layer PCBs. Architecturally, Cyclone III devices use a Logic Array Block (LAB) structure containing 16 logic elements each, with routing channels and a global clock network distributed across eight quadrants. Hard IP blocks - including M9K memory blocks, 18x18 multipliers, and PLLs - are placed in dedicated columns and rows to optimize performance and silicon efficiency. The device is configured via a passive serial, JTAG, or Active Serial scheme using industry-standard Altera/Intel Quartus II design software. Typical applications include industrial motor control and machine vision, video processing and display controllers, telecommunications line cards, automotive driver assistance (pre-Linux infotainment), and protocol bridging such as PCIe Gen1 endpoints. The device is also widely deployed in test and measurement front-ends and military/aerospace prototypes where FPGA flexibility is required. When designing with this part, ensure that the Quartus II fitter reports timing closure within the I/O and core timing budgets for the chosen speed grade (-7). Decoupling must include 0.1 µF and 10 µF capacitors near every power pin to meet simultaneous-switching-noise specifications, and the JTAG chain should be ESD-protected at the connector. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, enabling engineers to compare the EP3C55F780I7N against alternative Cyclone III, Cyclone IV, and Lattice parts on the same 780-FBGA footprint.
EP3C55F780I8N - Cyclone III FPGA, 55K LEs, 780-FBGA | Intel
The Intel EP3C55F780I8N is a high-density, low-cost Field Programmable Gate Array (FPGA) from the Cyclone III family, integrating 55,856 logic elements (LEs) and 3,491 logic array blocks (LABs) in a 780-ball FineLine BGA package with 1.0 mm ball pitch. It is fabricated on a low-power CMOS process and operates from a nominal 1.2 V core supply (range 1.15 V to 1.25 V), making it well-suited for cost-sensitive, power-aware designs. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs/LABs), embedded memory, and programmable interconnect. FPGAs sit within the broader hierarchy: programmable logic device (PLD) -> FPGA -> semiconductor -> integrated circuit. Compared with fixed-function ASICs, FPGAs offer hardware-level parallelism, in-system reconfigurability, and fast time-to-market, which is why they dominate prototyping, DSP, video processing, and industrial control designs. Key features include up to 234 Kbits of embedded RAM (M9K blocks), up to 156 hardware multipliers (18x18) for DSP operations, four phase-locked loops (PLLs) for clock management, and 20 global clock networks. The device supports industry-standard I/O standards (LVDS, LVCMOS, SSTL) and exposes up to 377 user I/Os depending on package selection. Configuration is via JTAG or active/passive serial/parallel modes using the built-in decompression and encryption circuitry. The Cyclone III architecture balances logic density, DSP throughput, and low static power. Its 1.2 V core, on-chip termination, and dynamic power gating enable designs to consume less than 100 mW in many typical configurations. The fabric is supported by Quartus II design software, which provides synthesis, place-and-route, timing analysis, and on-chip debug via SignalTap II. Typical applications include industrial motor control, video surveillance and image processing, software-defined radio, automotive infotainment, medical instrumentation, and embedded DSP. With its combination of logic capacity and embedded multipliers, the EP3C55 can absorb multiple parallel processing functions onto a single device, replacing discrete DSPs and glue logic. When designing, allocate I/O banks carefully to avoid mixing incompatible voltage standards on the same bank, and verify that the Quartus II fitter can close timing before committing the PCB layout. A JTAG header must be brought out to allow in-system programming. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the same Altera Cyclone III family, and practical design notes not all found in the manufacturer datasheet.
EP3C55U484C6 - Cyclone III FPGA 55K LE 484-FBGA | Intel/Altera
The Intel (formerly Altera) EP3C55U484C6 is a Cyclone® III Field Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (UBGA) package with 327 user I/O. Built on a 65 nm low-power process, this device delivers 55,856 logic elements, 2,396,160 bits of embedded memory, and 156 embedded 18x18 multipliers, targeting cost-sensitive high-volume applications. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as multipliers, memory, and transceivers. Within the broader taxonomy, the Cyclone III family belongs to low-cost, low-power SRAM-based FPGAs that sit between discrete microcontrollers and high-end DSP or ASIC solutions, providing hardware-level parallelism for digital signal processing, glue logic, and bus interfacing tasks. Key features of the EP3C55U484C6 include 55,856 logic elements, 2,396,160 bits of embedded RAM (approximately 234 Kbits of M9K blocks plus 65 Kbits of M144K blocks), and 156 18x18 hardware multipliers for DSP workloads. The device supports up to 4 PLLs for clock management, 327 maximum user I/O pins, and operates from a 1.15 V to 1.25 V core supply with 0°C to +70°C commercial temperature range. The C6 speed grade corresponds to a commercial temperature rating and a specific Fmax tier for the internal logic. Architecturally, Cyclone III FPGAs use a logic-element fabric of 4-input look-up tables (LUTs), configurable as distributed RAM or shift registers, paired with dedicated routing and embedded hard IP. The 65 nm process gives the family its signature low static and dynamic power characteristics, making it suitable for thermally constrained or battery-powered products where competing 90 nm FPGAs could not be deployed. Typical applications include industrial motor control, video surveillance processing, automotive infotainment prototypes, telecom line cards, and portable medical instrumentation. The combination of moderate logic density, abundant multipliers, and a fine-pitch 484-ball BGA makes it attractive for designs that need hardware acceleration but want to stay inside a low-power budget. When designing with this FPGA, plan the power distribution network carefully - the core requires 1.15 V to 1.25 V, while I/O banks can be configured to 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V. The 484-FBGA package demands a 4 or 6-layer PCB with microvia technology for reliable assembly.
EP3C55U484C6N - 55K LE Cyclone III FPGA | Intel | Embedded Systems
Intel EP3C55U484C6N is a Cyclone III field-programmable gate array (FPGA) with 55,856 logic elements, 327 I/O pins, and 2,396,160 bits of embedded memory in a 484-ball FBGA package. Verified distributor data identifies it as the EP3C55U484C6N Cyclone III FPGA, while the supplied comparison information also associates the device with 55,856 cells and a 65 nm process technology. Its combination of programmable logic, embedded memory, and a large I/O count makes it suitable for digital control, communications, industrial, and embedded processing systems. An FPGA, or field-programmable gate array, is a semiconductor device containing configurable logic blocks, programmable interconnects, and memory resources. Unlike a fixed-function application-specific integrated circuit (ASIC), an FPGA can be configured after manufacturing to implement custom digital circuits. Cyclone III devices belong to Intel's programmable-logic family and occupy a tier between small CPLDs and high-density, high-power FPGAs. The broader hierarchy is FPGA, programmable logic device, digital integrated circuit, and semiconductor. The key architectural figures are 55,856 logic elements, 327 I/O pins, 55856 cells as reported by the supplied comparison snippets, and a 484-FBGA package. The device is listed for 1.2 V core technology and 3.3-, 3.0-, and 2.5-V LVTTL/LVCMOS JTAG operation in the supplied datasheet snippet. A 65 nm process technology is also cited in the comparison results. These characteristics support moderate-to-large digital designs where configurable logic and high pin availability matter. The device can implement parallel datapaths, control logic, protocol bridges, state machines, and digital signal-processing structures. Embedded memory can support FIFOs, lookup tables, buffers, and other data-handling functions. The 327 I/O count provides substantial connectivity for external memories, converters, sensors, and industrial buses. As a result, the FPGA is useful when a system needs hardware timing flexibility without the development cost and non-recurring engineering associated with a custom ASIC. Typical applications include industrial automation controllers, communications-interface equipment, test and measurement systems, video and image-processing hardware, medical monitoring equipment, and aerospace or defense prototypes. The package's 484 balls provide the physical interface for these designs, while the programmable architecture allows the logic to be adapted as requirements evolve. Designers should confirm the exact supported I/O standards, configuration interface, timing limits, and power requirements from the manufacturer datasheet before releasing a board. The provided web data does not include all of those values, so missing electrical and timing parameters are explicitly marked as data-needed. This page combines verified distributor and manufacturer-related search data with a drop-in comparison that should be validated against the original Cyclone III family documentation. This data set preserves the values available from the supplied search results while identifying unverified parameters instead of guessing. It is intended to support component research, procurement decisions, and preliminary FPGA architecture planning; final hardware sign-off should use the complete manufacturer datasheet and the applicable Intel device documentation.
EP3C55U484C7 - Cyclone III FPGA, 55K LEs, 484-FBGA | Intel
The Intel (Altera) EP3C55U484C7 is a low-power, high-volume Cyclone III FPGA offering 55,856 logic elements, 2,396,160 bits of embedded memory, and 156 embedded 18x18 multipliers in a 484-ball FineLine BGA package. The 'U' suffix denotes the UBGA (Ultra-fine BGA) 19x19 mm variant with 0.8 mm ball pitch, and the 'C7' speed grade delivers a maximum core performance around 437 MHz in the 65 nm CMOS process node. Operating voltage is 1.2 V core with a 1.2/2.5/3.0/3.3 V flexible I/O bank scheme. A Field-Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM (BRAM), DSP blocks, PLLs, and high-speed transceivers. Within the broader semiconductor taxonomy, FPGAs sit above general-purpose MCUs in design flexibility and below ASICs in unit-cost efficiency, making them ideal for parallel processing, custom datapaths, and hardware-accelerated computation. The Cyclone III family specifically targets cost-sensitive, power-conscious applications such as industrial control, video processing, and communications infrastructure where ASIC NRE costs are prohibitive. Key features of the EP3C55U484C7 include 327 maximum user I/O pins, 4 PLLs, support for external memory interfaces including DDR/DDR, DDR2, and QDR II SRAM, and built-in configuration options such as Active Serial (AS), Passive Serial (PS), and JTAG. The device provides up to 20 global clock networks and supports hot-socketing for in-system reprogrammability without board-level shutdown. Typical applications span industrial motor control, video surveillance and image processing pipelines, software-defined radio (SDR) baseband, low-cost ASIC prototyping, and embedded PCIe bridging. The high logic density combined with embedded DSP blocks and BRAM makes it suitable for digital signal processing functions where deterministic latency is required. When designing with this FPGA, ensure proper power sequencing on the VCCINT (1.2 V) and VCCA/VCCIO rails, and place decoupling capacitors close to the BGA balls per Altera's recommended PCB layout guidelines. Designers must also provision for a JTAG download cable header for configuration and debugging. As of 2026-09-09, distributors including DigiKey and Octopart list the EP3C55U484C7 with active inventory.
EP3C55U484C7N - Cyclone III FPGA, 55K LE, 484-UBGA | Intel / Altera
The Intel (formerly Altera) EP3C55U484C7N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) with 55,856 logic elements, 2,396,160 bits of embedded memory, and 327 maximum user I/Os, housed in a 484-pin Ultra FineLine BGA (UBGA) package. Fabricated on a 65 nm low-power process and operating from a 1.2 V core supply, the device is rated for commercial temperature (0 °C to +85 °C) and supports a maximum internal clock frequency of approximately 437.5 MHz. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnects, embedded memory blocks, and dedicated multiplier/PLL resources on a single die. FPGAs sit in the broader hierarchy of digital semiconductor devices between Application-Specific Integrated Circuits (ASICs) and general-purpose microcontrollers, and are widely used as prototyping platforms, hardware accelerators, and glue-logic bridges. The Cyclone III family specifically targets cost-sensitive, power-sensitive, high-volume applications, offering a balance of logic density, embedded RAM, and DSP blocks at lower static and dynamic power than prior generations. Key features of the EP3C55U484C7N include 55,856 logic elements, 234 embedded 18 × 18 multipliers (DSP blocks), 4 PLLs, and 56 embedded 9-Kbit M9K memory blocks (totalling 2,396,160 bits, or about 2.4 Mbit). The device supports industry-standard I/O standards such as LVDS, LVTTL, LVCMOS, SSTL, and HSTL through 8 I/O banks, enabling direct interfacing with DDR/DDR2 SDRAM memories. Configuration can be loaded via active serial (AS), passive serial (PS), fast passive parallel (FPP), or JTAG modes, supporting in-field updates and secure bitstream programming. Typical applications span industrial motor control, video surveillance and image processing, automotive infotainment pre-production prototypes, telecom line cards, test and measurement instrumentation, and consumer electronics requiring parallel processing or custom interfacing. The Cyclone III 65 nm process gives the EP3C55 a typical static power well under 100 mW at 25 °C, making it suitable for fanless or sealed enclosures. When designing with this FPGA, always respect the I/O-bank VCCIO grouping rules and provide a clean 1.2 V VCCINT rail with adequate decoupling. Quartus II (or its newer Intel Quartus Prime equivalent) is the supported development environment; legacy designs targeting this device should be re-validated against the latest Quartus version for timing closure, since the part is approaching end-of-life for new designs but is still broadly available in the distribution channel.