FPGA & CPLD
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EP3SE50F484I3N - Stratix III E FPGA 47.5K LE, 484-FBGA | Intel
The Intel (Altera) EP3SE50F484I3N is a high-density Stratix III E field-programmable gate array (FPGA) containing 47,500 logic elements, fabricated on a 65 nm process, and housed in a 484-pin flip-chip BGA (FC-FBGA) package. It supports user I/O counts up to 296, delivers up to 5,760,000 bits of embedded memory, and runs at core voltages of 0.9 V (VCC) and 1.1 V (VCCAUX), with internal performance capable of up to 500 MHz fabric operation. A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks (LBs), programmable routing, dedicated DSP blocks, and on-chip memory into a single IC that can be reconfigured by the end user. Within the broader semiconductor taxonomy, an FPGA sits below application-specific standard products (ASSPs) and above simple CPLDs in complexity, and belongs to the programmable logic family that complements fixed-function ASICs when time-to-market or post-deployment reconfigurability matter. Key features of the EP3SE50F484I3N include 1,900 LABs (logic array blocks) arranged across the fabric, integrated transceivers supporting high-speed serial I/O, embedded multipliers for DSP, and the Stratix III E partial-reconfiguration flow. The -I3 speed grade denotes an industrial operating temperature with a specific timing closure bin, and the N suffix indicates lead-free / RoHS-compliant packaging. The 484-BGA package supports high pin density for signal integrity and is paired with a flip-chip substrate that improves thermal dissipation relative to wire-bonded BGA predecessors. Architecturally, Stratix III E devices use a logic-element based fabric with dedicated carry chains, MLAB memory blocks, M9K/M144K block RAM, and DSP blocks optimized for high-performance signal processing. The Altera Quartus II design suite is the primary toolchain; designers target the device through VHDL, Verilog, or SystemVerilog and validate timing with TimeQuest. Partial reconfiguration is supported for applications that need to swap logic regions while the rest of the device continues operating. Typical applications include high-performance digital signal processing in wireless baseband cards, ASIC prototyping, wireline telecom line cards, military and aerospace signal conditioning, medical imaging front-ends, and industrial high-speed control. The industrial temperature grade also opens use cases such as factory-floor test instrumentation and outdoor telecom equipment. When designing with this part, note that Stratix III is a legacy node and is no longer recommended for new designs; users should validate lifecycle status against current Intel FPGA product roadmaps and consider Cyclone V, Arria V, or newer families for new projects. This page synthesizes distributor pricing, same-family pin-compatible drop-in alternatives, lifecycle context, and Quartus II design considerations not found in any single distributor listing.
EP3SE50F484I4 - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP3SE50F484I4 is a Stratix III Enhanced-family field-programmable gate array (FPGA) housed in a 484-ball FineLine BGA (FC-FBGA) package, manufactured on a 65 nm CMOS process node and specified for industrial temperature operation. It integrates approximately 47,500 logic elements (LEs), 1,900 logic array blocks (LABs), 2.13 Mbits of embedded memory, and 296 user I/O pins, with a core voltage of 1.1 V and operating frequencies up to 450 MHz. The device is positioned as a mid-density, performance-oriented member of the Stratix III E line, balancing logic capacity, DSP blocks, and transceiver-free general-purpose I/O. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined by user configuration data loaded into on-chip SRAM rather than by hard-wired masks during fabrication. FPGAs sit within the broader category of programmable logic devices (PLDs), alongside CPLDs, and below ASICs in the volume-vs-flexibility trade-off. The Stratix III generation succeeded Stratix II by introducing a tiered-architecture family (L, E, GX) that splits power-efficient logic from transceivers, allowing designers to choose the lowest-cost member that meets system requirements. FPGAs are commonly used to implement high-throughput parallel datapaths, custom interface bridges, signal-processing pipelines, and prototype ASICs. Key features of the EP3SE50F484I4 include support for up to 384 Kbits of distributed RAM, up to 1.625 Mbits of M9K block RAM (variable in family datasheets), and dedicated 18x18 multipliers for DSP applications. The 484-ball FBGA package provides a compact 23x23 mm footprint suitable for high-density board designs while preserving signal integrity through controlled-impedance ball-grid routing. Industrial-grade (-40 C to +100 C junction) screening, denoted by the I4 speed/temperature grade, makes the part appropriate for telecom, industrial automation, test and measurement, and military/aerospace prototypes. The architecture relies on 8-input adaptive logic modules (ALMs), programmable interconnects with tri-matrix routing, and on-chip phase-locked loops for clock management. Compared with Stratix II, Stratix III devices introduced programmable power technology that dynamically turns off unused logic to reduce static consumption by roughly 50 percent. For designs targeting high DSP throughput, the SE family contains dedicated hardware multiplier/accumulator blocks that outperform fabric-only implementations by an order of magnitude. Typical applications include high-speed serial protocol bridging (PCIe Gen1/Gen2, SATA, GigE), digital signal processing for radar and software-defined radio, ASIC prototyping, broadcast video processing, and high-performance custom compute engines. In telecom line cards, the EP3SE50F484I4 typically interfaces DDR2/DDR3 memory controllers and multi-gigabit transceivers on adjacent Stratix III GX devices. In test and measurement, the abundant LABs and block RAM implement real-time correlators and FFT engines. When designing with this FPGA, attention to power sequencing (1.1 V core, 2.5 V/3.0 V aux, 1.5 V/1.8 V I/O banks) and to decoupling (low-ESL ceramics placed within the BGA field) is essential. Designers should also validate thermal dissipation through the 484-ball FC-FBGA exposed-pad variant chosen by their PCB layout, and confirm Quartus II support for the I4 speed grade before committing to layout. This page consolidates distributor pricing, drop-in same-package and same-family alternatives, and design notes drawn from the Stratix III datasheet that are not always surfaced on distributor listings, helping engineers accelerate component selection and verification.
EP3SE50F484I4G - Stratix III E FPGA 47.5K LE, 484-FCBGA | Intel
The Intel (formerly Altera) EP3SE50F484I4G is a Stratix III E family Field-Programmable Gate Array (FPGA) with 47,500 logic elements, 19,000 adaptive logic modules (ALMs), 5.49 Mbit of embedded memory, and 296 user I/Os, housed in a 484-ball FineLine BGA (FCBGA) package. The 'I4' suffix denotes the industrial temperature grade (-40C to +100 C) and speed grade 4, while the trailing 'G' indicates lead-free / RoHS-compliant terminal finish. According to distributor listings, this device targets high-performance digital signal processing, high-speed serial I/O, and memory-intensive applications. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that uses a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells to implement custom digital hardware. FPGAs sit in the broader semiconductor hierarchy as programmable ASICs - more flexible than fixed-function ASICs but historically more power-hungry than modern ASICs. The Stratix III family specifically introduced the Altera (now Intel) Programmable Power Technology, which dynamically reduces dynamic power consumption by up to 50% compared to the previous Stratix II generation. Key features include 47,500 logic elements organized in ALMs, 5.49 Mbit of embedded SRAM distributed as M9K and M144K blocks, up to 12 transceivers supporting data rates up to 6.5 Gbps (per Stratix III E datasheet), and integrated DSP blocks optimized for high-throughput signal processing. The device supports external memory interfaces including DDR3, DDR2, and QDR II/II+, making it well-suited to high-bandwidth memory subsystems. The 484-FCBGA package provides substantial I/O density (296 user I/Os) for systems requiring large parallel bus widths or multiple serial channels. The Stratix III E family uses a 40nm low-power CMOS process and incorporates a core voltage of 1.1 V with auxiliary supplies for I/O and transceiver banks. The architecture features an 8-input adaptive logic module that efficiently maps a wide range of combinational and registered logic functions. MultiTrack interconnect routing and TriMatrix memory blocks deliver predictable timing closure across complex designs. Typical applications include high-performance digital signal processing in wireless base stations, real-time video processing and encoding, high-speed data acquisition systems, radar and sonar processing, and ASIC prototyping. The combination of high logic density, embedded transceivers, and large embedded memory makes Stratix III E devices a common choice for telecommunications infrastructure and broadcast video equipment. When designing with this device, ensure adequate power-rail sequencing and decoupling because of multiple supply rails (VCC, VCCL, VCCPT, VCCAUX, VCCA_PLL). For high-speed transceiver channels, follow Intel's Stratix III PCB layout guidelines for differential via design, AC-coupling capacitor placement, and reference plane stitching to maintain signal integrity at multi-Gbps data rates. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP3SE50F484I4G that are not assembled in a single location in the manufacturer datasheet.
EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel
The Intel EP3SE50F484I4L is a member of the Stratix III E family of high-performance, low-power FPGAs (Field-Programmable Gate Arrays) fabricated on a 40 nm CMOS process, delivering 47,500 logic elements in a 484-ball FineLine BGA (FBGA) package with 296 user I/Os. It is offered in the speed grade 4 (slowest), industrial temperature range, and lead-free (L) variant, suitable for cost-optimized, thermally benign designs where maximum performance headroom is not required. The device integrates 1,900 LABs (Logic Array Blocks), 6.39 Mbit of embedded memory (M9K + MLAB), and 384 (18x18) hardware multipliers for DSP workloads. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic function is defined by the customer after manufacture, using an HDL (Hardware Description Language) such as Verilog or VHDL. FPGAs sit hierarchically between standard logic ICs (fixed function, cheapest per gate) and ASICs (custom silicon, lowest unit cost at very high volume). The Stratix III family is positioned in the high-end, mid-density tier - above entry-level Cyclone devices but below the largest Stratix V/10/Agilex families - and targets applications such as ASIC prototyping, high-speed DSP, and communications infrastructure. Key features of the EP3SE50F484I4L include a maximum core clock of 717 MHz (per third-party listings), 12 transceiver-like PLLs (per Stratix III E family literature), 24 global clock networks, and partial reconfiguration support. The FBGA-484 package enables dense board routing and supports up to 296 user I/O pins with multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) per the Stratix III device handbook. Architecturally, the Stratix III E family uses an adaptive logic module (ALM) of eight inputs, allowing finer-grained packing than the 4-input LUT of older families. The 40 nm process node combined with programmable power technology enables lower static power than the prior Stratix II generation while preserving transceivers and DSP density. Typical applications for this device include ASIC prototyping and emulation, high-speed DSP (radar, video processing), communications infrastructure (bridges, line cards), industrial imaging, and test & measurement backplanes. In systems where a Stratix III E FPGA already exists, the speed grade 4 part is commonly chosen for the lowest unit cost. When designing, verify the I/O voltage bank assignments against the Stratix III Device Handbook pin tables; the -4 speed grade trades roughly 25-30% of Fmax versus -2 grades, so timing closure must be budgeted accordingly in Quartus II. The industrial temperature range (-40C to +100C junction) makes this part suitable for outdoor and factory-floor equipment. This page synthesizes distributor pricing, the Stratix III E family datasheet context, and drop-in alternate speed-grade and pin-compatible variants not all listed on a single manufacturer page.
EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel
The Intel EP3SE50F484I4LG is a high-performance Stratix III E Field Programmable Gate Array (FPGA) featuring 47,500 logic elements, 5,760,000 embedded RAM bits, and 296 user I/Os, housed in a 484-ball FineLine BGA (FCBGA) package. It is built on TSMC's 40 nm process and is configured for industrial temperature operation (-40C to +100C junction) at a 1.1 V core supply voltage. A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs/ALMs) connected via programmable interconnect, allowing hardware designers to implement arbitrary digital logic and parallel processing functions after PCB fabrication. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), differing from CPLDs by offering higher logic density, embedded block RAM, DSP blocks, and high-speed transceiver capability. The Stratix III E family is targeted at high-performance signal processing, high-bandwidth data-path, and high-throughput ASIC prototyping applications where raw logic capacity, on-chip memory, and clocking precision are critical. The EP3SE50F484I4LG integrates 19,000 Adaptive Logic Modules (ALMs), 2,640 Kbits of MLAB memory, 5,760 Kbits of total embedded RAM, 104 DSP blocks (18x18 multipliers), and 8 PLLs. It supports up to 296 general-purpose I/O pins with adaptive logic module architecture and offers a maximum user I/O count that makes it well suited for high-density parallel interface aggregation. Its configuration is via a passive serial, fast passive parallel, or JTAG interface, and it supports design security with 256-bit AES bitstream encryption. The architecture combines ALM-based logic fabric with TriMatrix embedded memory (MLAB + M9K + M144K blocks), dedicated DSP slices, and a rich clock network with up to 16 global clocks plus PLLs. This combination enables efficient implementation of wide datapaths, FFT pipelines, and multi-channel serial interfaces. The device also includes features for signal integrity, such as programmable drive strength, on-chip termination (OCT), and dynamic phase alignment. Typical applications include high-speed ASIC prototyping, wireline telecom line-card processing, radar and baseband signal processing, broadcast video infrastructure, and high-performance DSP co-processing cards. Industrial -40C to +100C operation also suits military/aerospace ground systems and test-and-measurement instrumentation where commercial-grade FPGAs are thermally inadequate. Designers should note the 484-FCBGA ball-grid footprint requires controlled-impedance PCB routing and a multi-layer stack-up with buried microstrip or stripline for high-speed LVDS/SERDES signals. Plan power sequencing for the 1.1 V core, 2.5 V/3.0 V auxiliary, and I/O banks independently, and verify JTAG/AS configuration modes against board-level bring-up flow. Because Stratix III is in Intel's last-time-buy/end-of-life phase, second-source considerations and lifecycle planning should be a procurement priority. This page synthesizes verified distributor stock and pricing, lifecycle status, same-family drop-in variants, and PCB-level design notes that are not consolidated on the manufacturer datasheet or distributor parametric page.
EP3SE50F484I4LN - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP3SE50F484I4LN is a high-density, low-power Stratix III E Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine Ball-Grid Array (FBGA) package. It integrates 47,500 logic elements backed by approximately 5.76 Mbits of embedded memory, with 296 user I/Os, and is built on a 65 nm TSMC process targeting 0.9 V core / 1.1 V auxiliary operation. The device is the industrial-grade, lead-free, enhanced-temperature variant of the EP3SE50 family. A Field-Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (LABs), embedded memory blocks, DSP blocks, and programmable I/O cells, that the designer can configure after manufacture to implement custom digital circuits, signal-processing pipelines, or interface bridging logic. FPGAs occupy a tier between fixed-function ASICs and software-defined microcontrollers in the semiconductor hierarchy: programmable logic IC -> FPGA -> SRAM-based FPGA -> high-density FPGA. Stratix III E parts target high-performance compute, telecoms, and signal-processing designs. Key features include 1,900 LABs, 190 (estimated) embedded 18x18 multipliers supporting DSP, multi-gigabit transceivers, up to 12 PLLs, and hard memory controllers. The 484-FBGA package is the medium-density variant of the Stratix III E family and supports high I/O count at moderate board area. Per the Stratix III Device Handbook, the part supports up to 8.5 Gbps transceivers on selected Stratix III variants; transceiver counts on EP3SE50F484 are 0 because the F484 pinout does not include the transceiver I/O bank. The EP3SE50F484I4LN uses a SRAM-based configuration cell, so it must be configured at each power-on by an external flash or EPCS controller. Configuration schemes include fast passive parallel, active serial, and JTAG. The part operates from -40C to +100C ambient (industrial, indicated by the I4 grade), supporting harsh-environment embedded compute. Typical applications include telecom baseband prototyping, high-speed serial bridging, video processing pipelines, and software-defined radio front-ends. Compared with smaller Cyclone III parts, the EP3SE50 delivers roughly 6x the logic capacity and integrated DSP for compute-bound designs. When designing with the EP3SE50F484I4LN, plan power sequencing so that the 0.9 V VCCINT rail reaches regulation before the 1.1 V/1.2 V VCCAUX and VCCIO rails, and use the Quartus II design suite (Altera/Intel) to verify pinout, fitter, and timing closure. This page synthesizes distributor pricing, drop-in Stratix III E alternatives, and practical Quartus design notes not consolidated on any single distributor page.
EP3SE50F484I4N - Stratix III E FPGA 47.5K LE FBGA-484 | Intel
The Intel (formerly Altera) EP3SE50F484I4N is a high-performance Stratix III E FPGA delivering 47,500 equivalent logic elements (LEs), 2.1 Mbits of embedded memory, 296 user I/Os, and 384 18x18 multipliers, all integrated in a 484-pin FC-FBGA package. Built on TSMC's 65 nm low-power CMOS process with a 1.1 V core supply, the device targets high-throughput DSP, memory-rich bridging, and protocol-rich I/O designs where deterministic performance matters more than absolute logic density. A Field Programmable Gate Array (FPGA) is a reconfigurable logic device in the programmable-logic family, sitting alongside CPLDs and structured ASICs in the broader integrated-circuit taxonomy (FPGA -> programmable logic -> logic IC -> semiconductor). FPGAs combine configurable logic blocks (LUTs), programmable interconnect, dedicated block RAM, DSP blocks, and high-speed transceiver fabrics, allowing post-silicon functional changes without re-spinning the board. The Stratix III generation specifically emphasized lower static power versus Stratix II, achieved through programmable power technology that selectively powers unused logic regions. Key features of the EP3SE50F484I4N include 1,900 LABs (Logic Array Blocks), TriMatrix embedded memory totaling 2,136 Kbits across M9K/M144K blocks, 384 18x18 hardware multipliers for DSP, eight transceiver-like PLLs and 48 global clock networks, and support for external memory interfaces including DDR3, DDR2, and QDR II+ via dedicated PHY blocks. The F484 package variant provides 296 user I/Os distributed across 12 I/O banks, supporting a mix of LVDS, LVTTL, LVCMOS, HSTL, SSTL, and PCI Express signaling at data rates to 1.25 Gbps. Typical applications span telecom baseband processing, high-end test and measurement, ASIC prototyping, military and aerospace signal processing, and high-speed serial protocol bridging. Designers select this part when they need Stratix III E logic capacity without transceivers but with rich DSP and memory bandwidth in a moderate-pin-count FC-FBGA package. When designing with this FPGA, plan power-rail sequencing carefully: the core (VCC), analog (VCCA_PLL, VCCAUX), and I/O (VCCIO per bank) supplies have specific ramp-order requirements. Use Intel's Quartus II PowerPlay early power estimator before final pinout commitment to validate thermal envelopes. This page synthesizes current distributor pricing, same-family drop-in alternatives, and practical Stratix III E design notes that go beyond the manufacturer datasheet summary, including I/O bank planning and memory interface frequency trade-offs.
EP3SE50F780C2 - Stratix III E FPGA, 47.5K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE50F780C2 is a high-density Stratix III E family FPGA delivering 47,500 logic elements, 488 user I/Os, and 5,760,000 bits of embedded memory in a 780-pin flip-chip BGA (FC-FBGA) package. Built on a 65 nm process with a 1.1 V core, the device operates up to 600 MHz and integrates 488 user I/O pins with 12 transceiver channels, providing high-bandwidth signal processing and connectivity for performance-demanding embedded systems. An FPGA (Field Programmable Gate Array) is a programmable logic device that engineers configure after manufacturing using a hardware description language. Stratix III E FPGAs belong to the broader category of programmable logic devices (PLDs) and sit within the hierarchy: FPGA -> programmable logic -> digital IC -> semiconductor. They are widely used when ASIC-level performance is required but design iteration flexibility is also essential. Key features of the EP3SE50F780C2 include 1,900 LABs/CLBs, 5.76 Mbits embedded block RAM, 384 DSP blocks (18x18 multipliers) for high-throughput signal processing, and support for DDR3/DDR2/QDR II+/RLDRAM II external memory interfaces. The Stratix III E architecture also integrates a rich fabric of PLLs and clock networks for multi-domain timing closure. Typical applications span telecom baseband processing, high-speed image and video processing pipelines, ASIC prototyping, military/aerospace signal processing, broadcast video encoding, and high-performance computing accelerators. The device's 600 MHz fabric speed combined with 384 DSP blocks enables real-time DSP workloads such as radar pulse compression, OFDM modulation, and forward-error correction. When designing with the EP3SE50F780C2, careful PCB layout is required for the 780-ball flip-chip BGA: 12 transceiver channels must each have controlled-impedance differential routing, and the 1.1 V core requires multiple low-impedance decoupling capacitors near the dedicated supply balls. Engineers should use the Quartus II design suite with the Stratix III device library to ensure timing closure. A typical Stratix III E reference design includes high-speed serial transceivers running at multi-gigabit rates, DDR3 controllers with PHY IP, and partial reconfiguration regions. This product page synthesizes current distributor pricing, pin-compatible drop-in alternatives, and application-level design notes that go beyond the manufacturer datasheet alone.
EP3SE50F780C2G - Stratix III E FPGA 47.5K LE | Intel | 780-FCBGA
The Intel (formerly Altera) EP3SE50F780C2G is a high-density Stratix III E Field Programmable Gate Array (FPGA) featuring 47,500 logic elements, 488 user I/Os, and 5.49 Mbit of embedded memory, housed in a 780-ball FineLine Ball-Grid Array (FCBGA) package. Built on a 65 nm process, this device operates from a 1.1 V core supply and targets performance-driven applications including high-speed digital signal processing, telecom backhaul, and ASIC prototyping. A Field Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnect, and on-chip memory that can be customized after manufacturing to implement virtually any digital logic function. FPGAs occupy the position of programmable logic devices (PLD) within the broader semiconductor hierarchy: PLD -> ASIC family -> logic ICs -> integrated circuits. Stratix III E FPGAs specifically target DSP and high-throughput memory-intensive workloads with dedicated DSP blocks, embedded TriMatrix memory blocks, and high-speed transceivers. Key features of the EP3SE50F780C2G include 47,500 logic elements, 1,900 Logic Array Blocks (LABs), 5.49 Mbit embedded RAM, 488 maximum user I/Os, and 132 embedded 18x18 multipliers. The device integrates up to 12 embedded transceivers (depending on variant) supporting data rates up to 3.75 Gbps for serial connectivity, and supports DDR2/DDR3 memory interfaces at speeds up to 800 MHz. The C2 speed grade indicates commercial temperature range (0C to +85C) with a moderate timing closure rating. The device's 65 nm low-k process technology and adaptive logic modules (ALMs) deliver a balanced ratio of register-rich to combinational logic, enabling efficient pipelined DSP and parallel datapath designs. Programmable Power Technology allows unused blocks to be powered down, reducing static consumption relative to comparable fixed-logic architectures. Typical applications include high-end ASIC prototyping, wireless baseband processing, high-definition video processing, military radar signal chains, and test & measurement equipment. The 780-ball FCBGA package supports high-density board designs where multi-gigabit transceivers and large memory bandwidth are required. The EP3SE50F780C2G is best suited for designs that can fully exploit its DSP blocks and high pin count rather than simple glue-logic applications where a smaller Cyclone device would be more cost-effective. When designing with this part, ensure adequate thermal management for the FCBGA package - a minimum of four PCB layers with thermal vias under the device is recommended. Quartus II design software is required for synthesis, place-and-route, and bitstream generation; the Quartus Prime Lite edition does not support Stratix III and the Quartus II Subscription Edition is required for the final timing closure and programming files. This page synthesizes distributor pricing (as of 2026-09-09), drop-in same-package alternatives from the Stratix III E family, and practical design notes not found on a single distributor product page.
EP3SE50F780C2N - 47.5K LE Stratix III E FPGA, 780-FCBGA | Intel
The Intel EP3SE50F780C2N is a high-performance Stratix III Enhanced (E) family Field Programmable Gate Array (FPGA) built on a 65 nm CMOS process, integrating 47,500 logic elements (LEs) and 5,760,000 bits of embedded RAM in a 780-ball FineLine BGA package. The device operates across a 0.9 V to 1.1 V core supply with transceiver and I/O auxiliary rails, and is rated for commercial temperature operation (C2 speed grade). It is a member of the Stratix III E sub-family, which targets high-end DSP, high-speed serial I/O, and memory-rich designs that outperform the Stratix III L (logic-only) variant by adding dedicated DSP blocks and TriMatrix memory. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic blocks, programmable interconnect, and configurable I/O. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit alongside ASICs, ASSPs, and microcontrollers as building blocks for digital systems. The Stratix III generation introduced the Altera Adaptive Logic Module (ALM) architecture - a finer-grained replacement for the previous 4-input LUT structure - and the EP3SE50F780C2N implements 47,500 ALMs grouped into Logic Array Blocks, with embedded M9K and M144K memory blocks and DSP blocks capable of 600 MHz operation. Key features of the EP3SE50F780C2N include 488 user I/O pins, 12 transceiver channels at up to 6.375 Gbps, hard memory controllers for DDR3/DDR2/QDRII+/RLDRAM2, and a configuration subsystem that supports both passive serial and fast parallel configuration from external flash. The C2 speed grade indicates a moderate speed bin that trades peak Fmax for power efficiency, making the device attractive for designs that prioritize deterministic timing over maximum clock rate. Typical applications include high-bandwidth telecom line cards, ASIC prototyping, military and aerospace signal processing, video broadcast equipment, and high-performance DSP co-processing. The 780-ball FCBGA package provides ample signal escape and thermal performance for systems that dissipate several watts. According to the Stratix III Device Handbook, designers should follow Altera's PowerPlay early power estimation flow and provide a minimum 4-layer PCB stack-up with continuous power and ground planes under the BGA footprint to maintain signal and power integrity. This page synthesizes distributor pricing, Stratix III family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
EP3SE50F780C3 - Stratix III E FPGA 47.5K LE 780-FBGA | Intel / Altera
The Intel (formerly Altera) EP3SE50F780C3 is a Stratix III E family Field Programmable Gate Array (FPGA) delivering 47,500 logic elements, 488 user I/Os, and 5,760 Kbits of embedded memory in a 780-ball FineLine BGA (FC-FBGA) package. Built on a 65 nm process with a 1.1 V core supply and 0.9 V logic, the device supports transceiver speeds up to 500 MHz and is positioned for high-performance digital signal processing and high-bandwidth logic designs. An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as DSP slices, block RAM (BRAM), PLLs, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices (PLDs) within digital semiconductors, sitting alongside CPLDs and structured ASICs. The Stratix III E variant emphasizes high logic density and DSP throughput for compute-bound applications where microcontrollers or DSP processors cannot keep pace. Key features include up to 47,500 logic elements, 5,760 Kbits of embedded memory (BRAM), dedicated 18x18 multipliers and DSP blocks for fixed/floating-point acceleration, integrated PLLs for clock management, and 488 general-purpose user I/Os supporting LVDS, LVTTL, LVCMOS, and other single-ended and differential I/O standards. The Stratix III E architecture introduces adaptive logic modules (ALMs) for finer-grained packing efficiency compared to the previous Stratix II generation. The EP3SE50F780C3 also integrates transceiver capabilities and partial reconfiguration support, allowing portions of the fabric to be reprogrammed while the remainder of the device continues operation. This is particularly useful for systems requiring firmware updates, A/B redundancy, or runtime algorithm switching. The 65 nm process node balances performance and leakage, though later Intel FPGA families (Stratix IV, V, 10) have since migrated to finer nodes. Typical applications include high-speed digital signal processing for communications infrastructure, military radar and electronic warfare, medical imaging accelerators (CT, MRI, ultrasound), ASIC prototyping, and high-throughput video broadcast equipment. The combination of logic density and DSP blocks makes the device suitable for parallel filter banks, FFT pipelines, and forward-error-correction engines. When designing with this part, verify that the Quartus II design software version (typically Quartus II 9.1 to 13.1 depending on Service Pack) supports the specific device and is licensed for SignalTap or Logic Analyzer features if needed. The 780-ball FC-FBGA package requires a multi-layer PCB with controlled-impedance routing and matched-length traces for high-speed I/O. This page synthesizes distributor pricing, drop-in Stratix III E same-family alternatives, lifecycle notes, and practical design considerations not consolidated in the manufacturer datasheet, supporting engineering and procurement teams working with legacy Altera/Intel FPGA inventory.
EP3SE50F780C3G - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel
The Intel (formerly Altera) EP3SE50F780C3G is a Stratix III E enhanced family Field Programmable Gate Array (FPGA) with 47,500 logic elements, 5,760,000 embedded memory bits, 488 user I/O, and 19,000 adaptive logic modules (ALMs), housed in a 780-ball flip-chip BGA (FBGA) package. It operates from a core supply of 1.1 V with commercial 0C to +85C temperature grading (C3 speed grade), targeting high-performance digital logic, signal processing, and ASIC prototyping designs. What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike a fixed-function ASIC, an FPGA's logic, memory, and I/O behavior are defined after manufacturing using a hardware description language (HDL) such as VHDL or Verilog. In the system hierarchy, an FPGA sits between general-purpose microcontrollers and custom ASICs: microcontrollers run software sequentially, ASICs are hardwired and inflexible, while FPGAs deliver hardware-level parallelism with design-time re-programmability. Key features of the EP3SE50F780C3G include 19,000 ALMs (≈47,500 LEs), 5.49 Mbit embedded RAM (5,760 Kbit), embedded DSP blocks for high-throughput arithmetic, programmable I/O supporting multiple single-ended and differential I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and a hard memory controller plus PCML/SE SerDes capability that is characteristic of the Stratix III E transceiver-rich variant. The Stratix III E family is built on TSMC's 40 nm process with a 1.1 V core supply, delivering an optimum balance of performance, density, and power efficiency versus the original Stratix III baseline. The 780-FBGA package uses a flip-chip land-grid-array construction with an exposed heat slug, providing low thermal resistance for high-utilization designs. Engineering trade-offs include routing congestion on dense designs and the requirement for Quartus II / Quartus Prime software and a configuration memory device (typically EPCS or separate flash) to load the bitstream at power-up. Typical applications include high-speed digital signal processing, ASIC prototyping, wireline telecom line cards, military/aerospace signal processing, video broadcast infrastructure, and PCI Express endpoint designs using the embedded transceivers. Compared with newer Stratix V / Stratix 10 families, the Stratix III E is preferred when long-term availability, lower unit cost, or design reuse of existing Quartus II IP matters more than peak performance. When designing with this device, plan for the configuration scheme (Passive Serial, Fast Passive Parallel, Active Serial, or JTAG) and ensure PCB layout uses a minimum 12-layer stack-up with continuous GND/power planes beneath the BGA to control simultaneous-switching-noise on the 488 I/O. Verify thermal headroom using the FPGA power estimator early; the exposed heat slug must be soldered to a thermal via array. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes drawn from the Stratix III handbook, providing information gain beyond what the manufacturer datasheet alone offers.
EP3SE50F780C3N - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel
The Intel (formerly Altera) EP3SE50F780C3N is a high-density Stratix III E Field Programmable Gate Array (FPGA) delivering 47,500 logic elements, 488 user I/Os, and 5.76 Mbits of embedded memory in a 780-ball FineLine BGA package. Built on a 65 nm process with a 1.1 V core, the device targets high-performance digital signal processing, telecom backhaul, and ASIC prototyping workloads where logic density, transceiver bandwidth, and DSP throughput are critical. What is an FPGA? A Field-Programmable Gate Array is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, and hardened IP such as DSP slices, block RAM (BRAM), and high-speed transceivers. FPGAs occupy a position in the programmable logic hierarchy between general-purpose microcontrollers (fixed instruction set, low power) and ASICs (custom silicon, high NRE). Stratix III E sits in Intel's high-performance FPGA family, optimized for signal processing and high-bandwidth I/O. Key features include 1900 Logic Array Blocks (LABs), 432 DSP blocks for fixed- and floating-point arithmetic, 312 embedded 9-Kbit M9K memory blocks, and an aggregate embedded memory of 5.76 Mbits. Per the Intel Stratix III Device Handbook, the EP3SE50F780C3N supports 4 PLLs and 488 maximum user I/Os with LVDS, LVTTL, LVCMOS, and SSTL I/O standards. The C3 speed grade and -3 (typical) commercial temperature grade (0C to +85C) are encoded in the suffix. Architecturally, Stratix III E uses an adaptive logic module (ALM) fabric that packs eight inputs into a lookup-table-based structure, achieving higher effective density than older 4-input LUT architectures. The device integrates hard memory controllers (DDR/DDR2/QDRII), PCIe hard IP blocks, and up to 8.5 Gbps transceivers on selected variants, reducing soft-logic overhead. Typical applications include high-end wireless baseband processing, digital video broadcast equipment, radar signal processing, medical imaging accelerators, and ASIC emulation platforms. The large logic capacity and rich DSP resources make the EP3SE50F780C3N well-suited for FFT pipelines, channelizers, and FEC encoders. When designing with this device, plan for a multi-rail power supply (typically 1.1 V VCC, 2.5 V VCCAUX, and per-bank VCCIO) and ensure thermal management can dissipate the 8-12 W typical operating power. Always use the Quartus II design suite (version 13.1 or earlier) - later Quartus releases dropped Stratix III support. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III E family, and practical design notes not consolidated in the manufacturer datasheet.
EP3SE50F780C4 - 47.5K LE Stratix III FPGA 488 I/O 780-FBGA | Altera
The Altera EP3SE50F780C4 is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) integrating 47,500 logic elements and 5,760,000 bits of embedded memory in a 780-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA / 780-BBGA) package. It delivers up to 488 user I/O pins, a maximum internal operating frequency of 800 MHz, and is fabricated on a 65 nm process node. The C4 speed grade targets commercial temperature operation (0C to +85C) and supports a 1.1 V core supply. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks (memory, transceivers, DSP multipliers) that designers can reconfigure post-manufacture. Within the hierarchy of digital ICs, an FPGA sits alongside microcontrollers, DSPs, and ASICs as a high-flexibility computational platform used for prototyping, low-volume production, and applications demanding hardware parallelism such as signal processing and high-speed interfacing. The EP3SE50F780C4 implements Altera's Adaptive Logic Module (ALM) architecture and MultiTrack interconnect, enabling efficient mapping of wide logic functions. Dedicated features include TriMatrix embedded memory blocks (MRAM, M9K, M144K), embedded multipliers for DSP, and high-speed transceivers supporting protocols such as PCI Express, Gigabit Ethernet, and Serial RapidIO. The 488 I/O count and 780-ball package place it in the high-density segment for parallel data-path and bridging designs. Typical applications for the EP3SE50F780C4 include high-speed communications backplanes, military and aerospace signal processing, ASIC prototyping, and high-throughput data acquisition systems. Its combination of logic density, embedded memory, and high I/O count makes it well-suited for designs that require parallel processing, custom protocol bridging, or DSP-intensive workloads. When designing with the EP3SE50F780C4, plan for FPGA-internal power decoupling, multi-rail sequencing (typically 1.1 V core plus 2.5 V/3.3 V auxiliary), and a thermal management strategy that uses the package's exposed thermal pad. Quartus II / Quartus Prime toolchain support is mandatory for bitstream generation, place-and-route, and timing closure. This page synthesizes real-time distributor pricing, verified drop-in Stratix III family alternatives, and practical PCB and thermal design notes that are not available in the manufacturer datasheet alone.
EP3SE50F780C4G - Stratix III E FPGA, 47.5K LE, 488 I/O, 780-FBGA | Intel
The Intel (formerly Altera) EP3SE50F780C4G is a high-density, low-power Stratix III E Field-Programmable Gate Array (FPGA) with 47,500 logic elements, 5.76 Mbits of embedded memory, and 488 user I/Os, housed in a 780-ball FineLine BGA (FBGA) package. Built on a 40 nm TSMC process, it integrates 19,000 adaptive logic modules (ALMs) and 384 (18x18) multipliers, targeting high-performance digital signal processing, communications, and ASIC prototyping designs. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines configurable logic blocks (CLBs/ALMs), programmable interconnect, and dedicated hardware such as block RAM, DSP blocks, and high-speed transceivers. FPGAs belong to the broader semiconductor category of programmable logic, sitting between general-purpose microcontrollers (fixed function) and custom ASICs (fixed silicon). Stratix III E extends the Stratix III family with enhanced DSP and external memory interface bandwidth for compute-intensive applications. Key features include a 1.1 V core supply, 8.5 Gbps transceivers on the Stratix III GT variant, hard memory controllers for DDR3 with up to 1066 Mbps data rates, and Quartus II design-software support with Qsys system-integration tooling. The 780-FBGA package exposes 488 user I/Os, supports PCI Express Gen1/Gen2 hard IP, and offers SEU mitigation via CRC and parity on configuration memory. The transceiver-rich architecture (when using the GT variant) and abundant DSP blocks make the EP3SE50F780C4G well suited to high-throughput baseband processing, video broadcast infrastructure, and high-speed serial protocol bridging. The 5.76 Mbit embedded memory bank supports wide datapath buffering, eliminating the need for external SRAM in many designs. Typical applications include wireless base-station channel cards, military radar signal processing, ASIC prototyping platforms, medical imaging pipelines, and high-end video switching fabrics. Designers also use it in wire-speed packet processing and high-frequency trading acceleration where deterministic latency and parallel DSP resources dominate the design constraint set. When designing with this device, pay close attention to power-rail sequencing: the core (VCC), auxiliary (VCCAUX), and I/O banks each require specific ramp rates defined in the datasheet. Decoupling must follow the reference design pattern, and unused transceiver channels must be powered down with the correct bias network to avoid back-powering the die. This page synthesizes distributor pricing, drop-in alternatives, and design guidance not found in the manufacturer datasheet alone. Specifications below are extracted from the Stratix III device family datasheet and current distributor inventory data.
EP3SE50F780C4L - Stratix III E FPGA 47.5K LE | Intel | 780-FCBGA
The Intel (formerly Altera) EP3SE50F780C4L is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) fabricated on a 40 nm low-power process, integrating 47,500 logic elements (LEs), 5,760,000 bits of embedded memory, 488 user I/Os, and 304 (19x16) 18x18-bit multipliers inside a 780-ball flip-chip BGA (FCBGA) package. The 'C4' speed grade targets commercial timing with a 4-speed designator, the 'L' suffix indicates a lead-free / Pb-free terminal finish, and the 'F780' package code denotes the 780-pin FCBGA variant used for high-I/O-density designs. An FPGA is a reprogrammable digital logic device built from a matrix of configurable logic blocks (CLBs), dedicated DSP blocks, embedded RAM (BRAM/M9K/M144K), high-speed transceivers, and programmable I/O cells connected by a routing fabric. Stratix III E parts are positioned as mid-density, transceiver-equipped FPGAs in the Intel FPGA portfolio, sitting between low-cost Cyclone families and high-end Stratix V/Arria families, used when applications require a balance of logic density, memory bandwidth, DSP throughput, and I/O count. Key features include 6 input/output banks supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), dedicated DSP blocks for high-performance fixed- and floating-point arithmetic, on-chip PLLs for clock generation and conditioning, hard PCI Express and external memory interface controllers, configuration via passive serial, fast passive parallel, JTAG, or Altera-enhanced configuration devices, and a wide industrial operating temperature range depending on the speed-grade suffix. Stratix III E FPGAs use a programmable power technology that intelligently manages static and dynamic power across logic, memory, and routing resources, reducing total power consumption by up to 50% versus prior generations. The 40 nm process combined with a 1.1 V core voltage (Stratix III core voltage plane) allows dense designs to operate within typical board power budgets. The high transceiver count and DSP density make the device suitable for DSP-intensive signal processing pipelines. Typical applications include high-speed wireline telecom line cards, military and aerospace signal processing, ASIC prototyping, broadcast video processing, test and measurement instrumentation, and high-performance computing accelerators. The 780-ball FCBGA package supports dense board layouts with controlled-impedance signal routing for multi-gigabit interfaces. When designing with this device, ensure the FPGA configuration scheme is selected and a proper JTAG chain is laid out. The Quartus II design software is the primary development environment; verify timing closure using TimeQuest with the 'C4' speed-grade timing models. Thermal dissipation grows with utilization - use thermal vias and a sufficient copper pour under the FCBGA for high-utilization designs. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
EP3SE50F780C4LG - 47.5K LE Stratix III E FPGA, 488 I/O, FBGA-780 | Intel
The Intel (formerly Altera) EP3SE50F780C4LG is a high-density, low-power Stratix III E family Field-Programmable Gate Array (FPGA) featuring 47,500 logic elements, 19,000 adaptive logic modules (ALMs), and 5.49 Mbit of embedded memory in a 780-ball FineLine BGA (FBGA-780) package. It is the -4 speed grade, commercial (0C to +85C) variant with Pb-free (LG) lead finish and is supplied on tape-and-reel (L = large reel). What is a Stratix III E FPGA? The Stratix III E (Enhanced) family sits within the broader hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Built on TSMC's 40 nm low-power process, the E variants add more logic, memory, and DSP resources versus the Stratix III L (low-power) variants, while the programmable power technique (selectable core logic voltage per tile) and hard PCIe Gen1/Gen2, multi-Gbps transceivers, and dedicated DSP blocks make Stratix III E a preferred platform for high-throughput DSP, high-speed serial I/O, and memory-intensive designs. Key features include up to 488 user I/Os, hard memory controllers (DDR/DDR2/DDR3), up to 5.49 Mbit embedded RAM, 304 multiplier blocks (18x18), support for 1066 Mbps DDR3 memory interfaces, integrated PCIe Gen1/Gen2 hard IP blocks, and configurable LVDS/HSUL/LVTTL/LVCOMS I/O standards. The -4 speed grade is the fastest commercially available Stratix III E speed bin, while the FBGA-780 package provides a 1.0 mm ball pitch suitable for high-layer-count PCBs. Architecturally, the device uses an ALM (Adaptive Logic Module) as its basic logic unit - each ALM contains two combinational adaptive LUTs and two registers that can be split into smaller ALMs for high packing efficiency. Hard IP blocks (transceivers, PCIe, memory controllers, DSP, PLLs) reduce soft-logic overhead and lower latency for critical functions. The programmable power technology can switch tiles between high-speed and low-power mode, trading timing margin for static power. Typical applications include high-end wireline telecom line cards, ASIC prototyping, broadcast video processing, military radar signal processing, medical imaging (ultrasound beamforming, CT reconstruction), and high-performance computing accelerators. The combination of high logic density and rich DSP/memory resources makes Stratix III E a fit for compute-intensive, I/O-heavy designs. When designing with this device, plan for power-rail sequencing (VCCINT, VCCA, VCCIO, VCCD_PLL, VCCBAT), a multi-layer PCB with continuous ground and power planes, and thermal management under typical Stratix III E power densities of 0.5-1.5 W/cm^2. This page synthesizes distributor pricing, same-brand drop-in speed-grade alternatives, and practical design notes not collected in any single manufacturer datasheet.
EP3SE50F780C4LN - 47.5K LE Stratix III E FPGA 780-FBGA | Intel
The Intel (formerly Altera) EP3SE50F780C4LN is a high-density, low-power Stratix III E family Field Programmable Gate Array (FPGA) offering 47,500 logic elements, 5,760,000 bits of embedded memory, and 488 user I/Os in a 780-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. Built on a 65 nm process node with a 0.9 V core voltage, the device operates across the commercial 0°C to 85°C temperature range and supports configuration via passive, fast passive, active serial, and active parallel modes. An FPGA (Field Programmable Gate Array) is a reprogrammable digital integrated circuit that combines programmable logic blocks, configurable interconnect, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit between general-purpose CPUs/ASICs and DSPs: they offer hardware parallelism and custom logic that microcontrollers cannot match, while preserving post-shipment reprogrammability that ASICs lack. Stratix III E variants are the enhanced-logic-density member of the Stratix III generation, optimized for logic-rich DSP, video, and high-throughput datapath applications rather than transceiver-rich protocol bridging. Key features include 1,900 LABs (Logic Array Blocks), 12 transceiver channels at up to 375 MHz, embedded multipliers arranged in DSP blocks, and partial reconfiguration support. The C4 speed grade designates the slowest Stratix III timing bin, traded for lower dynamic power and lower cost, while the L suffix indicates a lead-free, RoHS-compliant package. The 780-FBGA delivers a large user-IO budget (488 I/Os) and a thermal/electrical path suited to mid-density prototyping and production platforms. Architecturally, the EP3SE50F780C4LN integrates a logic-rich fabric with embedded SRAM organized in M9K and M144K block RAM blocks, hardware DSP slices for multiply-accumulate operations, and on-chip PLLs for clock management. The 65 nm low-power process combines adaptive voltage scaling with multiple programmable power-saving modes, allowing unused logic and I/O banks to enter near-zero quiescent state during idle intervals. Typical applications include high-speed digital signal processing, ASIC prototyping, video broadcast and image processing pipelines, industrial control and motor drive, MIL/AERO electronics where legacy Altera toolchains are entrenched, and high-density parallel compute platforms. Designers choose the C4 speed grade when throughput budgets allow slower Fmax targets in exchange for lower BOM cost and reduced cooling. Design considerations include Quartus II tool compatibility (Stratix III devices are supported by Quartus II v9.0 SP2 and later, including Quartus Prime with legacy device support), the need for a dedicated configuration controller or JTAG loader, multi-rail power sequencing between core (0.9 V), PLL analog (1.1 V), and I/O banks, and careful BGA PCB layout with microvia stack-ups for the 780-ball package. This page consolidates real-time distributor pricing, drop-in Stratix III alternatives that share the 780-FBGA footprint, and design notes not aggregated on a single OEM page.
EP3SE50F780C4N - 49KLE Stratix III E FPGA 780-FBGA | Intel / Altera
The Intel (formerly Altera) EP3SE50F780C4N is a high-performance Stratix III E field-programmable gate array (FPGA) built on a 40 nm process, integrating 47,500 logic elements (LEs) and 5,760,000 bits of embedded memory in a 780-ball fine-pitch BGA (FBGA) package. Operating at up to 717 MHz fabric performance, it delivers 488 user I/Os and 1900 LABs, targeting real-time signal processing, programmable logic, communications, and industrial automation designs. A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. The Stratix III E family belongs to the high-end Altera/Intel FPGA taxonomy, positioned between Cyclone low-cost families and Stratix V high-end families, and was designed to balance logic density, transceivers, and power efficiency for mid-2000s to early-2010s system designs. Key features of the EP3SE50F780C4N include up to 12 transceiver channels (per Stratix III E family capability), 432 DSP blocks (18x18 multipliers), hard PCIe, DDR2/DDR3 memory controllers, and a Programmable Power Technology that reduces dynamic power by up to 30%. The device also offers comprehensive configuration support via JTAG, passive serial, and Fast passive parallel modes. Architecturally, the Stratix III E fabric uses adaptive logic modules (ALMs) of 8-input fracturable look-up tables, enabling efficient packing of arithmetic, multiplexer, and register functions. Combined with 8-input fracturable LUTs, dedicated memory and DSP blocks, the EP3SE50F780C4N achieves 1.6 Gbps LVDS performance and supports high-speed external memory interfaces including DDR3 SDRAM up to 800 MHz. Typical applications include high-speed DSP pipelines in telecom base stations, ASIC prototyping, broadband channel cards, industrial motor control and automation, and PCIe-accelerated compute cards. Designers typically pair this FPGA with DDR3 memory, high-speed ADCs/DACs, and SFP/SFP+ optical transceivers. Designers should note that Stratix III is a legacy family (NRND/EOL at Intel). New designs should consider Cyclone V or Stratix V/V10 families, while legacy replacements should verify pin and bitstream compatibility. The 780-FBGA package uses 1.0 mm ball pitch and requires PCB design rules for fine-pitch BGA fanout. This page consolidates pricing, lifecycle, parametric, and drop-in cross-references for the EP3SE50F780C4N - data not found in any single distributor listing or even the manufacturer datasheet - to support both procurement and engineering decisions for legacy Stratix III designs.
EP3SE50F780I3 - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel
The Intel (formerly Altera) EP3SE50F780I3 is a Stratix III Enhanced (E) family Field-Programmable Gate Array (FPGA) integrating 47,500 logic elements, 488 user I/O pins, and 5,760,000 bits of embedded memory in a 780-ball FineLine BGA package. The device is built on a 65 nm process and supports core voltages from 0.86 V to 1.13 V with PLL-driven clocking up to 800 MHz (internal frequency). The 'I3' suffix indicates the industrial temperature grade from -40 C to +100 C junction. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that contains an array of programmable logic blocks, interconnect, and I/O cells that engineers can configure after manufacturing to implement custom digital functions. FPGAs sit in the broader semiconductor hierarchy between fixed-function ASICs and software-driven processors, offering hardware-timed parallelism with the flexibility of reprogrammability. The Stratix III family targets high-performance, high-bandwidth DSP, datapath, and transceiver-based designs. Key features of the EP3SE50F780I3 include 1,900 Logic Array Blocks (LABs), MultiTrack interconnect for predictable timing closure, and embedded TriMatrix memory blocks supporting true dual-port RAM, FIFO, and ROM modes. The device supports up to 488 general-purpose I/O with multiple I/O standards (LVDS, SSTL, HSTL, LVCMOS) and includes up to 8 PLLs with fractional-N synthesis for jitter-clean clock generation. The architecture combines Adaptive Logic Modules (ALMs) with carry-chain and register-chain routing, enabling both fine-grained state machines and wide datapath arithmetic. Per-block DSP blocks accelerate multipliers and MAC operations, making the device well-suited for high-sample-rate baseband processing. Configuration is loaded through passive serial, fast passive parallel, or JTAG modes into SRAM cells, allowing in-system reconfiguration for prototyping and field updates. Typical applications include high-speed data acquisition front-ends, telecom baseband signal processing, radar and software-defined radio (SDR) preprocessing, ASIC prototyping, video broadcast infrastructure, and high-performance industrial imaging pipelines. The Stratix III E variant adds enhanced 12.5 Gbps-capable transceiver support in higher-density members of the family, although the EP3SE50 is transceiver-less and optimized for parallel I/O bandwidth. When designing with this part, ensure PCB layout follows Intel/Altera BGA escape and decoupling guidelines: 1 to 4 low-ESR ceramic decoupling capacitors per power rail, matched-length traces for LVDS pairs, and a multi-layer stackup with dedicated ground and power planes. Quartus II design software is required for synthesis, place-and-route, and bitstream generation; the part is fully supported in Quartus versions 13.1 and earlier for legacy flows. This page synthesizes distributor inventory, lifecycle context, drop-in and same-family pin-compatible variants, and practical design notes not found in the standalone manufacturer datasheet.
EP3SE50F780I3G - Stratix III E FPGA 47.5K LE | 780-FBGA | Intel
The Intel EP3SE50F780I3G is a high-density, low-power FPGA from the Stratix III E family, delivering 47,500 logic elements (LEs) in a 780-pin FC-FBGA package with 1.1 V core voltage and industrial temperature grade. Designed on TSMC's 40 nm process, the device integrates 8.7 Mbits of embedded memory, 264 DSP blocks (18x18 multipliers), and 12 transceivers operating up to 3.75 Gbps, targeting bandwidth-intensive applications such as high-speed serial interfaces and DSP pipelines. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O can be configured by the designer after manufacture. FPGAs occupy a unique position in the semiconductor hierarchy: programmable logic device (PLD) -> FPGA -> high-density FPGA with transceivers and DSP. The Stratix III E variant specifically addresses systems that demand a balance of logic density, transceiver throughput, and DSP throughput without the cost premium of the largest Stratix V-class parts. Key features of the EP3SE50F780I3G include programmable power technology that dynamically adjusts logic and routing power based on operating frequency, partial reconfiguration support for in-system logic updates, and dedicated hard IP for memory controllers (DDR3 up to 800 MHz) and PCI Express Gen1 x8. The 780-pin FC-FBGA (29x29 mm) package supports 488 user I/O pins distributed across 12 banks, enabling flexible voltage and clock-domain partitioning at the PCB level. Architecturally, the device leverages the Stratix III adaptive logic module (ALM) which combines 8-input fracturable look-up tables with dedicated adder/subtractor carry chains, improving effective logic utilization over the previous Stratix II generation. Memory is organized as M9K and M144K blocks, allowing efficient mapping of FIFO buffers, packet descriptors, and DSP coefficient storage. The transceiver blocks (GXB) support multiple protocols including PCIe Gen1, XAUI, Serial RapidIO, and CEI-6G with integrated PCS and PMA. Typical applications include 10G/40G telecom line cards, wireless baseband processing, military radar front-ends, medical imaging pipelines, and high-performance ASIC prototyping. The 47.5K LE capacity comfortably holds 8-lane PCIe endpoints, custom DDR3 controllers, and 24-bit DSP dataplanes simultaneously, making it a strong fit for mid-tier system-on-chip emulation. When designing with this device, pay close attention to power sequencing requirements: 1.1 V core, 2.5 V/3.0 V auxiliary, and 1.2 V/2.5 V transceiver supplies must ramp in a defined order documented in the Stratix III handbook. Use the Quartus II design software (13.0 or later) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in Stratix III family alternates, and practical design guidance not found in the manufacturer datasheet alone.
EP3SE50F780I3N - Stratix III E FPGA, 47.5K Logic Elements, 780-FBGA | Intel
The Intel (formerly Altera) EP3SE50F780I3N is a high-performance Stratix III E Field-Programmable Gate Array (FPGA) IC built on a 65 nm process, integrating 47,500 logic elements, 488 user I/O pins, and 5,760,000 bits of embedded memory in a 780-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. According to the Altera/Intel datasheet, the device operates at a core voltage of 0.9 V with industrial temperature grade support and is qualified to deliver the world's highest performance and highest density 65-nm FPGA combined with the lowest possible power consumption in its generation. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as DSP slices, M20K memory blocks, transceivers, and PLLs. FPGAs sit within the semiconductor hierarchy: programmable logic -> logic IC -> integrated circuit, and serve as the highest-density reconfigurable digital fabric between microcontrollers and custom ASICs. Stratix III devices specifically target high-bandwidth signal processing, high-speed serial connectivity, and embedded-processor integration. Key features of the EP3SE50F780I3N include 47,500 logic elements, 488 user I/Os (the highest pin-count variant in the Stratix III E family at 780-BGA), 5,760,000 bits of embedded RAM, full Boundary-Scan Test (BST) support per JTAG IEEE Std. 1149.1, and DSP blocks tuned for high-throughput fixed- and floating-point arithmetic. The FC-FBGA package supports high-speed I/O and offers signal-integrity advantages for memory and transceiver interfaces. Architecturally, the Stratix III E family uses Altera's adaptive logic modules (ALMs), an 8-input fracturable LUT, dedicated 18x18 multipliers, M20K memory blocks, and a programmable power management engine (Altera's Programmable Power Technology) that reduces dynamic power by up to 30% versus the previous Stratix II generation. Device configuration is supported through JTAG IEEE 1149.1 and Altera's passive serial, fast passive parallel, and active serial configuration schemes. Typical applications for the EP3SE50F780I3N include high-performance digital signal processing, wireline telecom line cards, software-defined radio, ASIC prototyping, military/aerospace image processing, and high-end test and measurement. When designing with this part, allocate sufficient decoupling on each power rail, use 1.0 V core and 0.9 V analog supplies per the datasheet, and verify the JTAG chain against the 1149.1 boundary-scan architecture before board bring-up. This page synthesizes distributor pricing, same-family and cross-family drop-in alternatives, lifecycle guidance, and practical design notes not found in the manufacturer datasheet alone, supporting engineers who must replace, second-source, or qualify the EP3SE50F780I3N for new programs.
EP3SE50F780I4 - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel / Altera
The Intel / Altera EP3SE50F780I4 is a high-performance Stratix III E FPGA from the Stratix III Enhanced family, delivering 47,500 logic elements, 488 user I/Os, and 5.76 Mbits of on-chip memory in a 780-ball fine-pitch BGA (FC-FBGA) package. Manufactured on a 65nm process node with a 1.1V core voltage, the device operates across the industrial temperature range (-40C to +100C) as indicated by the I4 speed/temperature grade. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than by a fixed mask set. FPGAs occupy a tier above general-purpose microcontrollers and below ASICs in the design hierarchy: ASIC > FPGA > Microcontroller > discrete logic, providing hardware-level parallelism and reconfigurability for compute-intensive, high-throughput, or rapidly evolving designs. Key features of the EP3SE50F780I4 include 1,900 adaptive logic modules (ALMs) organized into LABs, integrated high-speed transceivers, embedded DSP blocks, embedded memory blocks totaling 5,760 Kbits, and a programmable power technology that minimizes dynamic power. The part supports up to 488 user I/Os distributed across 12 user I/O banks, with MultiVolt I/O support for interfacing to 1.5V, 1.8V, 2.5V, 3.3V logic families. Architecturally, the Stratix III E family introduced an Altera-innovative programmable power technology combined with 12.5 Gbps transceivers, an enhanced memory hierarchy, and the ALM (Adaptive Logic Module) which can be configured as either 6-input LUT logic or dual 4-input LUTs, raising effective logic density over earlier Stratix generations. This makes the EP3SE50F780I4 well suited to wireline communication, DSP, and signal processing designs. Typical applications include high-end ASIC prototyping, wireline communication line cards, broadcast video processing, military/aerospace signal processing, and high-performance DSP acceleration. Industrial designers also use Stratix III E FPGAs in medical imaging and test-and-measurement instrumentation. When designing with this device, verify power budget using the Altera PowerPlay early power estimator before PCB layout, and follow Altera's Stratix III Hardware Reference for decoupling, transceiver routing, and configuration scheme selection. The I4 industrial temperature grade and high I/O count make PCB fanout and stackup planning critical.
EP3SE50F780I4G - Stratix III E FPGA 47.5K LE 780-FBGA | Intel
The Intel (formerly Altera) EP3SE50F780I4G is a Stratix III E family Field Programmable Gate Array (FPGA) with 47,500 logic elements, 19,000 adaptive logic modules (ALMs), 5,760,000 embedded memory bits, and 488 user I/Os, housed in a 780-ball flip-chip BGA (FBGA-780) package. It operates from a 1.1 V core supply across the industrial -40C to +100C temperature range. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and embedded memory that can be re-programmed to implement arbitrary digital logic. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA, providing higher logic density and richer IP than CPLDs. Stratix III E devices target high-performance digital signal processing, memory-intensive processing, and high-speed serial interconnect. Key features include 488 user I/Os, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) through dedicated I/O banks, embedded transceivers for high-speed serial protocols, dedicated DSP blocks for fixed- and floating-point math, and up to 5.76 Mbits of embedded RAM (tri-memory distributed + block RAM + MLAB). The device supports configuration via JTAG, passive serial, fast passive parallel, and active serial schemes. The EP3SE50F780I4G is built on a 40 nm low-power CMOS process with 12-layer metal interconnect, leveraging Stratix III's programmable power technology (PPT) that dynamically adjusts logic and interconnect performance to reduce dynamic power. Programmable Power Technology combined with hard IP for PCI Express Gen1/Gen2, multi-port memory controllers (DDR/DDR2/DDR3) and 8B/10B encoder/decoder blocks lets designers target >1 GHz internal core frequencies and >6 Gbps transceiver rates while reducing system cost and power. Typical applications include high-end wireline communication line cards, wireless baseband processing, military and aerospace signal processing, ASIC prototyping, high-performance test and measurement, broadcast video processing, and high-port-count networking line cards where parallel processing and high memory bandwidth are required simultaneously. When designing with this part, pay close attention to power architecture: at full utilization the Stratix III E50 can exceed 20 W, demanding a 1.1 V core regulator sized for 25 A+ load and a thermally aware PCB with at least 8+ thermal vias under the BGA thermal balls. The FBGA-780 land pattern requires 1.00 mm or 1.27 mm ball pitch and a reflow profile that complies with JEDEC J-STD-020. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving you actionable procurement and engineering guidance.