FPGA & CPLD
제품 (6556)
XC7VH870T-2FLG1155I - Virtex-7 HT FPGA | AMD
The AMD XC7VH870T-2FLG1155I is a high-performance Field Programmable Gate Array (FPGA) from the Virtex-7 HT family, designed for high-bandwidth, high-density applications. It is housed in a 1155-ball Flip-Chip BGA (FLG1155) package and operates over the industrial temperature range of -40°C to +100°C. This device integrates 876,160 logic cells, 51,982,080 block RAM bits, and 300 user I/O pins, making it suitable for complex digital designs. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs are part of the broader category of programmable logic devices, which sit between application-specific integrated circuits (ASICs) and general-purpose processors. They offer a balance of flexibility and performance, allowing engineers to implement custom digital logic without the high NRE costs of ASIC development. The Virtex-7 HT family is specifically optimized for high-throughput serial transceiver applications, such as 100G/400G networking and data center interconnect. Key features of the XC7VH870T-2FLG1155I include 876,160 logic cells, 51,982,080 block RAM bits, and 300 user I/O pins. The device supports a wide range of I/O standards and includes high-speed serial transceivers for chip-to-chip and board-to-board communication. The -2 speed grade indicates a balanced performance level, suitable for a variety of high-speed designs. The industrial temperature grade ensures reliable operation in harsh environments. From an architectural perspective, the Virtex-7 HT family leverages AMD's advanced 28nm process technology, delivering high logic density and low power consumption. The device includes dedicated DSP slices, block RAM, and clock management tiles, enabling efficient implementation of complex algorithms. The high-speed transceivers support data rates up to 28.05 Gbps, making the device ideal for backplane and optical module applications. Typical applications include 100G/400G optical transport, high-performance computing, radar and signal processing, and aerospace and defense systems. The device's high logic density and transceiver count make it well-suited for these demanding workloads. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple voltage rails, and proper sequencing is essential. The FLG1155 package has a large thermal pad that should be connected to a solid ground plane for optimal heat dissipation.
XC7VH870T-2FLG1932I - Virtex-7 HT FPGA, 876K Logic Cells | AMD
The AMD Xilinx XC7VH870T-2FLG1932I is a high-performance Virtex-7 HT Field Programmable Gate Array (FPGA) engineered for demanding, high-bandwidth applications. It delivers 876,160 logic cells, 68,450 configurable logic blocks (CLBs), and 51,978,240 total RAM bits, all housed in a 1932-ball FCBGA (45x45 mm) package. This industrial-temperature-grade device operates from a 0.97V to 1.03V core supply and provides 300 programmable I/O pins. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the designer after manufacturing, allowing for custom digital logic implementation. FPGAs sit within the broader hierarchy of programmable logic devices, which are a subset of integrated circuits. They offer a unique balance of performance and flexibility, enabling rapid prototyping and hardware acceleration without the high non-recurring engineering costs of ASICs. The Virtex-7 HT family specifically targets high-throughput serial connectivity and signal processing. Key features of the XC7VH870T-2FLG1932I include its massive logic density, which supports complex algorithms and large-scale parallel processing. The 51.98 Mb of block RAM provides substantial on-chip data storage, reducing the need for external memory in many designs. The 300 user I/Os, combined with high-speed transceivers, enable high-bandwidth data movement. The -2 speed grade offers a balanced performance-power trade-off, while the industrial temperature range (-40C to +100C) ensures reliable operation in harsh environments. Technically, this device is built on AMD's advanced 28nm process technology, which contributes to its high logic density and power efficiency. The architecture includes dedicated DSP slices for high-speed arithmetic operations, and flexible clock management tiles for precise timing. The 1932-ball FCBGA package provides excellent thermal and electrical characteristics, supporting the high pin count and signal integrity required for complex system integration. Typical applications include high-performance computing, wired and wireless communications infrastructure, aerospace and defense systems, and advanced medical imaging. Its high transceiver count and logic capacity make it ideal for implementing massive MIMO base stations, high-end network switches, and radar signal processing. The industrial temperature grade also suits it for ruggedized computing platforms. When designing with this device, careful attention must be paid to power delivery and decoupling. The 0.97V to 1.03V core supply requires a robust power distribution network with multiple decoupling capacitors to maintain signal integrity and prevent voltage droop under high switching activity.
XC7VX1140T-2FLG1928C - 1.14M Logic Cells Virtex-7 XT FPGA | AMD
The AMD (Xilinx) XC7VX1140T-2FLG1928C is a high-end Virtex-7 XT family Field-Programmable Gate Array (FPGA) delivering 1,139,200 logic cells, 69,304,320 bits of block RAM, and 480 user I/O in a 1928-ball Flip-Chip BGA (FLG1928C) package. Built on a 28 nm HKMG HPL process at the -2 speed grade with commercial temperature screening, the device provides up to 1.4 Tb/s of I/O bandwidth and up to 4.7 TMACs/s of DSP performance, targeting bandwidth-hungry wired communications, signal intelligence, and high-performance computing systems. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that lets designers configure its logic fabric and routing after fabrication, sitting at the top of the programmable logic taxonomy: programmable logic device -> CPLD -> FPGA -> high-end FPGA with embedded transceivers and DSP blocks. Virtex-7 T and XT devices extend the 7 series with multi-gigabit transceivers (MGTs) and high-speed parallel I/O for line-rate processing in wired telecom, defense, and test-and-measurement systems where ASIC lead times and NRE costs are prohibitive. Key features of the XC7VX1140T-2FLG1928C include up to 36 GTX 13.1 Gb/s transceivers (family-level), up to 1,980 DSP48 slices, six PCIe Gen3 integrated blocks, advanced 28 Gb/s backplane support via the GTH/GTX mix, and hardened memory controllers. Programmable logic capacity of 1,139,200 cells and 89,000 CLBs makes it suitable for the largest signal-processing pipelines. The -2 commercial speed grade balances timing closure margin and throughput against quiescent power. Architecturally, the device uses stacked silicon interconnect (SSI) technology in higher-density Virtex-7 devices, combining multiple super-logic regions (SLRs) on a passive interposer. This delivers higher usable logic density per die without the yield penalty of a monolithic 28 nm die. Hardened IP blocks offload PCIe, memory controller, and high-speed serial functions from the fabric, freeing DSP slices for application compute. Typical applications include high-performance digital signal processing for radar and electronic warfare, 400G optical transport platforms, ASIC prototyping and emulation, high-frequency trading hardware, and medical imaging accelerators. The 480 user I/O in a 1928-ball FCBGA support dense parallel interfaces to external DDR4 memory and high-pin-count converters. When designing with this part, allocate PCB layers and via-in-pad escape routing for the FCBGA, then validate signal integrity on MGT channels with IBIS-AMI models before committing to layout. Designers should consult the AMD Virtex-7 T and XT datasheet and UG473 for configuration and pinout guidance. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not all available in any single manufacturer document.
XC7VX330T-1FFG1157C - Virtex-7 XT FPGA 326K Logic Cells | AMD
The AMD XC7VX330T-1FFG1157C is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It delivers 326,400 logic cells, 600 user I/Os, and 27,648 Kb of block RAM, packaged in a 1156-pin FCBGA (FFG1157) with a 1V core voltage. This device is designed for high-bandwidth, high-capacity applications requiring substantial logic density and serial transceiver capability. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain programmable logic blocks and interconnects that allow the hardware to be reprogrammed to implement arbitrary digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of integrated circuits used extensively in prototyping, signal processing, and high-speed networking. Key features of the XC7VX330T-1FFG1157C include 600 user I/Os, 27,648 Kb of block RAM, and support for multiple high-speed serial transceivers. The device operates from a 1V core supply and is available in a 1156-pin FCBGA package, offering excellent thermal and electrical performance for dense PCB designs. The Virtex-7 XT family is optimized for high-end applications requiring maximum logic capacity and I/O bandwidth. Technically, the Virtex-7 XT architecture integrates advanced clock management tiles (CMTs) with MMCM and PLL, high-speed serial transceivers, and hardened memory controllers. The 28nm HPL (High-Performance, Low-Power) process enables high logic density with manageable power dissipation. The device supports configuration via JTAG, SelectMAP, and SPI flash, providing flexible design integration. Typical applications include wired communications (100G/400G line cards), data center acceleration, aerospace and defense signal processing, and high-performance computing. The 600 I/Os and large block RAM make it suitable for wide parallel data paths and deep buffering. When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The 1V core rail requires a robust power delivery network with multiple decoupling capacitors, and the FCBGA package needs adequate thermal vias and airflow for high-utilization designs.
XC7VX330T-2FF1157I - Virtex-7 XT FPGA 600 I/O | AMD
The AMD XC7VX330T-2FF1157I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) with 326,400 logic cells and 600 user I/O pins, packaged in a 1156-ball FCBGA (FF1157) package. It operates with a core voltage of 1.0V and is designed for industrial temperature ranges (-40°C to +100°C). This device is part of the Virtex-7 family, which is built on the 28nm process technology and offers a balance of high logic density, DSP slices, and block RAM for demanding applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs are part of the programmable logic device family, which sits between fixed-function ASICs and general-purpose processors. They contain a matrix of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks, allowing for highly parallel, custom hardware implementations. The Virtex-7 XT series is optimized for high-bandwidth, high-capacity applications such as data center acceleration, wired communications, and advanced signal processing. Key features of the XC7VX330T-2FF1157I include 326,400 logic cells, 600 user I/O pins, and 27,648 Kb (27.648 Mb) of block RAM. It also integrates 1,120 DSP slices for high-speed digital signal processing. The device supports a wide range of I/O standards, including LVCMOS, LVDS, and HSTL, and features high-speed serial transceivers for chip-to-chip and backplane communication. The -2 speed grade indicates a balanced performance level, suitable for a wide range of applications. From a technical architecture perspective, the Virtex-7 XT family uses a 28nm high-k metal gate (HKMG) process, enabling high logic density and low power consumption. The device includes hardened memory controllers, PCIe blocks, and high-speed transceivers, reducing the need for external components and simplifying system design. The FF1157 package provides a large number of I/O pins, making it suitable for high-pin-count applications. Typical applications for the XC7VX330T-2FF1157I include wired communications (e.g., 100G/400G switches), data center acceleration, radar and electronic warfare systems, and high-performance computing. Its high logic capacity and I/O count make it ideal for complex digital designs that require significant parallel processing. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple power rails (VCCINT, VCCAUX, VCCO) and a robust power distribution network. Adequate cooling is essential, as the device can dissipate significant power under heavy utilization. Refer to the AMD Virtex-7 FPGA data sheet and power estimation tools for detailed guidance.
XC7VX330T-2FFG1157I - Virtex-7 XT FPGA 326K Cells | AMD
The AMD XC7VX330T-2FFG1157I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) with 326,400 logic cells, 600 user I/O pins, and 27,648 Kb of block RAM, packaged in a 1156-ball FCBGA (FFG1157) with a 1.0V core voltage. It is built on the 28nm HPL (High-Performance, Low-Power) process technology, offering a balance of high logic density and power efficiency for demanding applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between application-specific integrated circuits (ASICs) and general-purpose processors in the semiconductor hierarchy. Unlike ASICs, FPGAs can be reprogrammed in the field, enabling rapid prototyping, hardware acceleration, and flexible system updates. The Virtex-7 XT family is AMD's high-end FPGA series, optimized for high-bandwidth, high-throughput applications. Key features of the XC7VX330T-2FFG1157I include 326,400 logic cells, 600 user I/O pins, 27,648 Kb of block RAM, and support for up to 16 high-speed transceivers (GTX) operating at up to 12.5 Gbps. The device also includes 1,920 DSP48E1 slices for high-performance digital signal processing, and supports PCIe Gen2 x8, 10/40/100Gb Ethernet, and DDR3/DDR4 memory interfaces. The -2 speed grade provides a balance between performance and power consumption. Architecturally, the Virtex-7 XT FPGA uses a 6-input look-up table (LUT) fabric with integrated block RAM, DSP slices, and clock management tiles (CMT). The device supports partial reconfiguration, allowing dynamic updates to specific regions of the FPGA without stopping the entire system. The 28nm HPL process reduces static power consumption while maintaining high performance, making it suitable for power-sensitive applications. Typical applications include high-performance computing (HPC) acceleration, wired and wireless communications infrastructure, aerospace and defense systems, and medical imaging equipment. The 600 user I/O pins and high-speed transceivers enable high-bandwidth data acquisition and processing. The device is also used in radar, electronic warfare, and secure communications systems where reliability and long-term supply are critical. When designing with this FPGA, careful attention must be paid to power supply decoupling, thermal management, and signal integrity. The 1156-ball FCBGA package requires a multi-layer PCB with dedicated power and ground planes. Adequate cooling is essential, as the device can dissipate significant power under heavy utilization. Use AMD's Vivado Design Suite for configuration and implementation.
XC7VX330T-3FFG1157E - Virtex-7 XT FPGA 326K Logic Cells | AMD
The AMD XC7VX330T-3FFG1157E is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) fabricated on a 28nm HPL (High-Performance, Low-Power) process. It delivers 326,400 logic cells, 25,500 Configurable Logic Blocks (CLBs), and 27,648,000 bits of block RAM, making it a robust choice for compute-intensive applications. The device is offered in a 1156-ball FCBGA package (35x35 mm) with 600 user I/O pins, supporting a wide range of high-speed interfaces. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the implementation of arbitrary digital logic functions. FPGAs sit within the broader category of programmable logic devices (PLDs), which themselves are a subset of integrated circuits. This flexibility makes FPGAs ideal for prototyping, rapid iteration, and applications requiring custom hardware acceleration. Key features of the XC7VX330T-3FFG1157E include 600 user I/O pins, 326,400 logic cells, and 27,648,000 bits of block RAM. The device operates over a temperature range of 0°C to 100°C and supports a core voltage of 1V. The -3 speed grade indicates the highest performance tier for this family, enabling faster clock rates and improved timing closure. The FCBGA package provides excellent thermal and electrical performance, with a 35x35 mm footprint suitable for high-density PCB designs. From an architectural standpoint, the Virtex-7 XT family integrates advanced DSP slices, high-speed transceivers, and hardened memory controllers. The 28nm HPL process balances performance with power efficiency, making it suitable for both high-throughput and power-sensitive applications. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system. Typical applications include high-performance computing, wired and wireless communications, aerospace and defense systems, and medical imaging. The 600 I/O pins and high logic density make it ideal for complex digital signal processing, protocol bridging, and custom compute acceleration. The device is also well-suited for prototyping ASIC designs, where its reconfigurability allows for rapid design validation. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The high logic density and speed grade can lead to significant power dissipation, requiring adequate heatsinking and airflow. Additionally, the 1V core voltage demands a clean, well-regulated power supply to ensure reliable operation.
XC7VX415T-1FFG1158I - 412K Logic Virtex-7 XT FPGA | AMD
The AMD XC7VX415T-1FFG1158I is a high-performance Virtex-7 XT field programmable gate array (FPGA) with 412,160 logic cells, 350 user I/O, and 32,440,320 total block RAM bits. It is supplied in a 1156-ball FCBGA package (FFG1158) and fabricated in 28nm technology. The device operates from a 1.0V core supply with a recommended range of 0.97V to 1.03V, and supports a maximum clock frequency of 1818 MHz. An FPGA is a semiconductor device containing programmable logic fabric, configurable I/O, and hardened blocks that can be reconfigured in the field to implement arbitrary digital circuits. FPGAs sit between fixed-function ASICs and general-purpose processors in the digital system hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor. This reconfigurability makes Virtex-7 FPGAs the preferred implementation vehicle for advanced networking, aerospace, defense, and data center workloads where algorithm changes must be deployed without silicon respins. Key features of the XC7VX415T-1FFG1158I include 350 high-speed user I/O, 32.44 Mbit of on-chip block RAM, and 28nm high-performance low-power process technology. The industrial grade (I suffix) supports extended temperature environments, while the -1 speed grade provides a balanced operating point for high-throughput logic and memory interfaces. The 1156-ball flip-chip BGA package supports dense PCB integration and large pin count for high-bandwidth interconnects. Architecturally, the Virtex-7 XT family integrates high-bandwidth transceivers, dedicated DSP slices, clock management tiles, and hardened memory controllers. For this specific ordering code, verified parametric data confirms 412,160 logic cells, 350 I/O, and 32,440,320 block RAM bits; additional slice and transceiver counts are not available in the retrieved distributor snippets. Designers should consult the full Virtex-7 data sheet (DS183) and package pinout files (UG865) for complete resource and pin-by-pin information. Typical applications include high-end networking and packet processing, radar and signals intelligence, high-performance computing, broadcast video processing, medical imaging, and automated test equipment. The high I/O count and large block RAM support wide parallel datapaths and deep buffering in the same device, while the 28nm process and 1.0V core reduce power versus earlier 40nm FPGAs. When designing with the XC7VX415T-1FFG1158I, pay special attention to core supply decoupling and BGA thermal management. Use the AMD Vivado tool suite for pin planning and verify all pin assignments against the official package pinout file before layout.
XC7VX415T-2FF1157I - Virtex-7 XT FPGA 412K Logic Cells | AMD
The AMD XC7VX415T-2FF1157I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It delivers 412,160 logic cells, 32,440,320 total RAM bits, and 600 configurable I/O pins in a 1156-ball FCBGA (FF1157) package. This device is engineered for complex digital designs requiring high throughput, low latency, and advanced parallel processing. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of integrated circuits. Unlike fixed-function ASICs, FPGAs offer reconfigurability, enabling rapid prototyping, hardware acceleration, and in-field updates. The Virtex-7 XT family is optimized for high-bandwidth applications such as data center acceleration, wired communications, and advanced signal processing. Key features of the XC7VX415T-2FF1157I include 32,200 CLBs (configurable logic blocks), 600 user I/O pins, and 32,440,320 bits of block RAM. The device also integrates DSP slices for high-speed arithmetic operations, making it suitable for digital signal processing (DSP) tasks. The -2 speed grade indicates a balanced performance level, while the I suffix denotes an industrial temperature range (-40°C to +100°C). The FF1157 package provides a 1156-ball FCBGA footprint with a 35mm x 35mm body size. Architecturally, the Virtex-7 XT family leverages AMD's advanced 28nm HPL (high-performance, low-power) process, balancing performance with power efficiency. The device supports a wide range of I/O standards, including LVCMOS, LVDS, and high-speed transceivers, enabling flexible system integration. The embedded block RAM and DSP48E1 slices allow efficient implementation of complex algorithms, from FFTs to FIR filters, without external components. Typical applications include wired communications (e.g., 100G/400G line cards), data center acceleration (e.g., smart NICs, storage controllers), and high-performance computing (HPC) for scientific simulations. The industrial temperature grade makes it suitable for rugged environments such as aerospace, defense, and industrial automation. When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The device requires multiple voltage rails (VCCINT, VCCAUX, VCCO) and a robust power distribution network (PDN) to ensure reliable operation at high clock frequencies. Use the AMD Vivado Design Suite for configuration and implementation.
XC7VX415T-2FF1158I - Virtex-7 XT FPGA 412K Logic | AMD
The AMD XC7VX415T-2FF1158I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) from the 7-series family, designed for demanding applications requiring high logic density, DSP throughput, and serial bandwidth. It is housed in a 1156-ball FCBGA package (FF1158) and operates over the industrial temperature range of -40°C to +100°C. The device delivers 412,160 logic cells, 32,440,320 RAM bits, and 350 user I/O pins, making it suitable for complex digital designs. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs contain a matrix of configurable logic blocks (CLBs) connected via programmable interconnects, allowing them to implement arbitrary digital logic functions. They sit between ASICs (application-specific) and microprocessors (software-programmable) in the design hierarchy, offering hardware-level parallelism and reconfigurability. The Virtex-7 XT family is optimized for high-bandwidth, high-capacity applications. Key features of the XC7VX415T-2FF1158I include 412,160 logic cells, 32,200 CLBs, and 32,440,320 total RAM bits for data buffering. It provides 350 user I/O pins supporting high-bandwidth interfaces, and the -2 speed grade offers a balance of performance and power. The device also includes integrated DSP slices and high-speed transceivers, though specific transceiver counts require datasheet confirmation. The 1156-ball FCBGA package with 1.00 mm pitch enables dense PCB routing. Technically, the Virtex-7 XT architecture uses a 28nm high-k metal gate (HKMG) process, delivering high performance with lower power compared to older generations. The FPGA supports partial reconfiguration, advanced clock management, and a rich set of hard IP blocks. The -2 speed grade indicates a mid-range performance tier, suitable for designs that need high throughput without the power penalty of the fastest grade. Typical applications include wired and wireless communications infrastructure, data center acceleration, aerospace and defense signal processing, and high-performance computing. The high logic density and I/O count make it ideal for protocol bridging, packet processing, and beamforming. The industrial temperature range supports deployment in harsh environments. When designing with this FPGA, ensure adequate power supply decoupling and thermal management. The FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Refer to the AMD Virtex-7 datasheet for detailed power and thermal specifications.
XC7VX415T-2FFG1158I - Virtex-7 XT FPGA 412K Logic Cells | AMD
The AMD XC7VX415T-2FFG1158I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) built on a 28 nm HKMG, high-performance low-power process. It delivers up to 412,160 logic cells, 350 user I/Os, and 32,440,320 block RAM bits, packaged in a 1156-ball FCBGA (FFG1158) package. This device is designed for demanding applications requiring high bandwidth, low latency, and efficient system integration. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs contain a matrix of programmable logic blocks, interconnects, and I/O blocks, allowing them to implement complex digital logic functions. They are a key category within programmable logic devices (PLDs), which also include CPLDs. FPGAs sit between ASICs (application-specific integrated circuits) and general-purpose processors in the semiconductor hierarchy, offering a balance of performance, flexibility, and time-to-market. Key features of the XC7VX415T-2FFG1158I include 48 GTH transceivers, an integrated PCIe Gen3 x8 block, and support for DDR3/DDR4 memory interfaces. The device operates at a core voltage of 1V and supports a wide range of I/O standards. The -2 speed grade indicates a high-performance variant, while the 'I' suffix denotes an industrial temperature range of -40°C to +100°C (Tj). Architecturally, the Virtex-7 XT family is optimized for high-bandwidth applications, with a balanced ratio of logic, DSP slices, and block RAM. The 28 nm process technology enables high logic density and low power consumption. The integrated PCIe block and high-speed transceivers reduce the need for external PHY components, simplifying board design and reducing BOM cost. Typical applications include high-performance computing, wired and wireless communications, aerospace and defense systems, and test and measurement equipment. The device's high logic capacity and transceiver count make it suitable for protocol processing, beamforming, and radar signal processing. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The FCBGA package requires a robust PCB layout with adequate vias for thermal dissipation. The device's configuration via JTAG or SPI flash should be planned early in the design cycle.
XC7VX485T-1FFG1157C - Virtex-7 XT FPGA 485K Logic Cells | AMD
The AMD XC7VX485T-1FFG1157C is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) from the 7 series family, designed for ultra high-end connectivity bandwidth, logic capacity, and signal processing capability. It features 485,760 logic cells, 37,969,920 block RAM bits, and 600 user I/Os, all housed in a 1156-ball FCBGA package (1157 pins including the thermal pad). The device operates with a core supply voltage of 1.0V (range 0.97V to 1.03V) and is built on 28nm technology. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit within the hierarchy of programmable logic devices (PLDs) and are used as an alternative to ASICs for applications requiring flexibility, rapid prototyping, or reconfigurable computing. The Virtex-7 XT family is optimized for high-bandwidth connectivity and DSP-intensive applications, offering a balance of logic density, serial transceivers, and memory resources. Key features of the XC7VX485T-1FFG1157C include 600 user I/Os, 37,969,920 bits of block RAM, and support for multiple clock management tiles (CMTs) with MMCM and PLL. The device supports a wide range of I/O standards and includes high-speed serial transceivers for chip-to-chip and backplane communication. The 1156-ball FCBGA package provides excellent thermal and electrical performance for high-power, high-speed designs. Technically, the Virtex-7 XT family leverages AMD's advanced 28nm HPL (High-Performance, Low-Power) process technology, balancing performance with power efficiency. The architecture includes configurable logic blocks (CLBs), DSP48E1 slices for high-speed arithmetic, and hardened memory controllers. The device supports partial reconfiguration and is supported by the Vivado Design Suite for synthesis, implementation, and bitstream generation. Typical applications include wired and wireless communications infrastructure, data center acceleration, aerospace and defense systems, and high-performance computing. The 600 I/Os and large logic capacity make it suitable for complex digital signal processing, protocol bridging, and custom compute acceleration. When designing with this device, ensure adequate power supply decoupling on the 1.0V core rail and follow AMD's PCB layout guidelines for the FCBGA package to manage signal integrity and thermal dissipation. The device requires configuration from an external memory device or via JTAG at power-up.
XC7VX485T-2FF1927I - Virtex-7 XT FPGA 485K Cells | AMD Xilinx
The AMD Xilinx XC7VX485T-2FF1927I is a high-performance, industrial-grade Field Programmable Gate Array (FPGA) from the Virtex-7 XT family. It integrates 485,760 logic cells, 37,968 Kb of block RAM, and 600 user I/Os in a 1927-pin FCBGA package. Built on 28nm HKMG process technology, it operates at a core voltage of 1.0V and supports a wide range of high-speed serial transceivers and memory interfaces. An FPGA is a semiconductor device containing programmable logic blocks and programmable interconnects that can be configured after manufacturing to implement any digital circuit. FPGAs sit between ASICs and processors in the design hierarchy: they offer the parallelism and performance of custom hardware with the reconfigurability of software. The Virtex-7 XT family is optimized for high-bandwidth applications requiring massive parallel processing, such as data center acceleration, high-performance computing, and advanced signal processing. Key features include 485,760 logic cells, 37,968 Kb of block RAM, 600 user I/Os, and support for DDR3/DDR4 memory interfaces. The device integrates up to 96 transceivers supporting line rates up to 13.1 Gbps, enabling high-speed serial connectivity. The -2 speed grade provides a balanced performance-power trade-off, while the industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh environments. The Virtex-7 XT architecture combines a flexible CLB fabric with dedicated DSP48E1 slices, block RAM, and high-speed I/O. The 28nm HKMG process delivers high logic density with low power consumption. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system. Typical applications include data center acceleration, high-performance computing, aerospace and defense signal processing, and advanced driver assistance systems (ADAS). The high transceiver count and memory bandwidth make it ideal for networking equipment, radar systems, and medical imaging. When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The FCBGA package requires a robust PCB layout with adequate ground planes and thermal vias to dissipate heat effectively.
XC7VX485T-2FFG1157I - Virtex-7 XT FPGA, 485K Logic Cells | AMD
The AMD XC7VX485T-2FFG1157I is a high-performance Field Programmable Gate Array (FPGA) from the Virtex-7 XT family, built on 28nm technology. It delivers 485,760 logic cells, 600 user I/Os, and 37,969,920 block RAM bits, packaged in a 1156-ball FCBGA (FFG1157) with a 1V core voltage. This industrial-grade device is designed for demanding applications requiring maximum logic density, DSP throughput, and high-speed serial connectivity. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit at the top of the programmable logic hierarchy, offering reconfigurable hardware acceleration that bridges the gap between fixed-function ASICs and general-purpose processors. The Virtex-7 XT family is AMD's flagship high-end FPGA series, optimized for ultra-high bandwidth, signal processing, and protocol-intensive applications. Key features include 600 I/O pins supporting multiple I/O standards, 37,969,920 bits of block RAM for on-chip data storage, and 485,760 logic cells for complex digital designs. The device operates from a 1V core supply, reducing power consumption while maintaining high performance. The FFG1157 package provides excellent thermal and electrical characteristics for high-density PCB integration. Technically, the Virtex-7 XT architecture integrates advanced clock management tiles (CMTs) with MMCM and PLL, high-speed transceivers, and hardened IP blocks for PCIe, Ethernet, and DDR3/DDR4 memory interfaces. The 28nm HPL (High-Performance Low-Power) process technology balances speed and power efficiency, enabling sustained operation in thermally constrained environments. Typical applications include 10G-100G networking equipment, defense-grade signal processing, high-performance computing, and industrial automation. The device's massive logic capacity and I/O bandwidth make it ideal for protocol bridging, packet processing, and real-time data acquisition systems. When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The 1V core rail requires a robust power delivery network with multiple decoupling capacitors to maintain signal integrity at high switching frequencies.
XC7VX690T-1FFG1157C - Virtex-7 XT FPGA 693K Cells | AMD
The AMD XC7VX690T-1FFG1157C is a high-performance Field Programmable Gate Array (FPGA) from the Virtex-7 XT family, built on 28nm technology. It features 693,120 logic cells, 600 user I/O pins, and 54,190,080 bits of block RAM, all housed in a 1157-pin FC-BGA package. This device is designed for demanding applications requiring high logic density, advanced DSP capabilities, and high-speed serial transceivers. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement any digital logic function. FPGAs sit within the broader category of programmable logic devices (PLDs), which also includes CPLDs, and are a key component in the semiconductor industry for prototyping, low-volume production, and applications requiring hardware reconfigurability. Key features of the XC7VX690T-1FFG1157C include its 693K logic cells, 600 user I/Os, and 54.19 Mb of block RAM. The device operates at a core voltage of 1V and supports a wide range of I/O standards. It includes 80 DSP48E1 slices for high-performance digital signal processing, and up to 80 GTX transceivers for high-speed serial communication. The -1 speed grade indicates a balanced performance level, suitable for a wide range of applications. Technically, the Virtex-7 XT family is optimized for high-bandwidth and high-capacity applications. The 28nm HPL (High-Performance, Low-Power) process technology provides a good balance between performance and power consumption. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the FPGA. It also features advanced clock management tiles (CMTs) with PLLs and MMCMs for precise clock generation and distribution. Typical applications include high-performance computing, data center acceleration, wired and wireless communications, aerospace and defense systems, and medical imaging. The high logic density and transceiver count make it ideal for implementing complex algorithms, protocol processing, and high-throughput data paths. The 600 I/Os provide ample connectivity for external memory interfaces, high-speed ADCs/DACs, and other peripherals. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple power rails (VCCINT, VCCAUX, VCCO) with proper sequencing and filtering. A robust PCB layout with adequate ground planes and decoupling capacitors is essential for reliable operation at high speeds. The FC-BGA package requires a reflow profile compatible with lead-free soldering.
XC7VX690T-2FFG1157I - Virtex-7 XT FPGA 693K Logic Cells | AMD
The AMD XC7VX690T-2FFG1157I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) from the 7 series family, fabricated on a 28nm process technology. It delivers 693,120 logic cells, 54,190,080 block RAM bits, and 600 user I/Os in a 1156-ball FCBGA (FFG1157) package. This device is engineered for ultra high-end connectivity bandwidth, logic capacity, and signal processing capability, addressing the most demanding high-performance applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of integrated circuits used in electronic systems. Unlike fixed-function ASICs, FPGAs offer reconfigurability, enabling rapid prototyping, hardware acceleration, and in-field updates, making them essential in aerospace, defense, automotive, industrial, and data center applications. Key features of the XC7VX690T-2FFG1157I include 600 user I/Os, 54,190,080 bits of block RAM, and 693,120 logic cells. The device operates at a core voltage of 1V and supports a wide range of I/O standards. The -2 speed grade provides a balanced performance-power trade-off, while the industrial temperature grade (I suffix) ensures operation from -40°C to +100°C, making it suitable for harsh environments. Technically, the Virtex-7 XT family integrates advanced clock management tiles (CMTs) with MMCM and PLL, high-speed serial transceivers, and hardened IP blocks for PCIe, Ethernet, and DDR3/DDR4 memory interfaces. The 28nm High-K Metal Gate (HKMG) process technology delivers high logic density and low power consumption. The device supports partial reconfiguration, enabling dynamic updates to specific logic regions without disrupting the entire design. Typical applications include high-performance computing, radar and signal intelligence systems, medical imaging, broadcast video processing, and wired/wireless communications infrastructure. The 600 I/Os and high logic capacity make it ideal for complex digital signal processing (DSP) and protocol bridging. When designing with this FPGA, careful attention must be paid to power supply decoupling, thermal management, and configuration bitstream security. The device requires multiple power rails (VCCINT, VCCAUX, VCCO) and a reliable configuration source, such as an SPI flash or JTAG interface.
XC7VX690T-2FFG1761I - Virtex-7 XT FPGA 693K Logic Cells | AMD
The AMD XC7VX690T-2FFG1761I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It delivers 693,120 logic cells, 850 user I/Os, and 54,190,080 bits of block RAM, making it one of the most capable devices in the Virtex-7 family. The device is housed in a 1760-ball FCBGA (FFG1761) package and operates from a 1V core supply. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit between fixed-function ASICs and general-purpose processors in the semiconductor hierarchy. They are used to implement custom digital logic, signal processing, and high-speed connectivity functions that would otherwise require dedicated silicon. Key features of the XC7VX690T-2FFG1761I include 850 user I/O pins, 54,190,080 bits of block RAM, and support for high-speed serial transceivers. The Virtex-7 XT family is optimized for high-bandwidth applications, offering up to 2.8 Tb/s of aggregate serial bandwidth. The device also includes hardened memory controllers, DSP slices, and clock management tiles (MMCM and PLL) for robust timing control. From a technical perspective, the Virtex-7 XT architecture combines a large programmable fabric with dedicated hard IP blocks. The 28nm HKMG (High-K Metal Gate) process enables high logic density and low power consumption relative to older nodes. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system. Typical applications include data center acceleration, high-performance computing, wired and wireless communications, aerospace and defense systems, and medical imaging. The high transceiver count and logic capacity make it suitable for protocol bridging, packet processing, and real-time signal processing workloads. When designing with this FPGA, careful attention must be paid to power supply decoupling, thermal management, and configuration bitstream security. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and a reliable configuration source, such as a SPI flash or JTAG interface.
XC7VX690T-2FFG1927I - Virtex-7 XT FPGA 693K Logic Cells | AMD
The AMD XC7VX690T-2FFG1927I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) from the 7 series family, designed for ultra high-end connectivity bandwidth, logic capacity, and signal processing capability. It features 693,120 logic cells, 54,190,080 block RAM bits, and 600 user I/Os, packaged in a 1924-ball FCBGA (FFG1927) with an industrial temperature range (-40°C to +100°C). The device operates with a core supply voltage of 1.0V and supports high-speed serial transceivers, making it ideal for demanding applications such as data center acceleration, aerospace and defense, and high-performance computing. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs consist of programmable logic blocks, configurable interconnects, and I/O blocks, allowing designers to create custom hardware accelerators, protocol bridges, and complex digital systems. The Virtex-7 XT family is the highest-performance segment of the 7 series, offering the largest logic density and the most advanced features, including integrated DSP slices, block RAM, and high-speed transceivers. Key features of the XC7VX690T-2FFG1927I include 3,600 DSP slices for high-throughput signal processing, 54,190,080 bits of block RAM for on-chip data storage, and 600 user I/Os supporting various I/O standards. The device also includes 80 GTX transceivers capable of up to 12.5 Gbps, providing high-speed serial connectivity for PCIe, Ethernet, and other protocols. The -2 speed grade offers a balance between performance and power consumption, while the industrial temperature grade ensures reliable operation in harsh environments. Architecturally, the Virtex-7 XT FPGA is built on a 28nm high-k metal gate (HKMG) process technology, delivering high performance with lower power compared to previous generations. The device includes advanced clock management tiles (CMTs) with MMCM and PLL for precise clock generation, and supports partial reconfiguration for dynamic logic updates. The configurable logic blocks (CLBs) provide flexible logic implementation, and the integrated block RAM can be configured in various aspect ratios for efficient data storage. Typical applications include high-performance computing acceleration, radar and signal intelligence systems, medical imaging, and wired communications infrastructure. The high transceiver count and logic density make it suitable for implementing complex algorithms and high-bandwidth data paths. The industrial temperature range allows deployment in outdoor and automotive environments where temperature extremes are common. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) with proper sequencing, and the high power dissipation necessitates a heatsink or active cooling for sustained operation. Refer to the Virtex-7 FPGA data sheet and PCB design guidelines for detailed recommendations.
XC7VX690T-2FFG1930I - Virtex-7 XT FPGA 693K Logic Cells | AMD
The AMD XC7VX690T-2FFG1930I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It delivers 693,120 logic cells, 1,000 user I/O pins, and 54,190,080 block RAM bits, all housed in a 1924-ball FCBGA (FFG1930) package. This device is engineered for demanding applications requiring massive parallel processing, high-speed serial transceivers, and extensive logic resources. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement any digital logic function. The Virtex-7 XT family sits at the high end of AMD's 7-series FPGA portfolio, positioned above the Artix and Kintex families, offering the highest logic density and transceiver count for system-level integration. Key features of the XC7VX690T-2FFG1930I include 693,120 logic cells, 1,000 user I/O pins, 54,190,080 bits of block RAM, and 80 GTX transceivers supporting data rates up to 12.5 Gbps. The -2 speed grade provides a balanced performance point, while the industrial temperature grade (-I) supports operation from -40°C to +100°C. The device operates from a 1.0V core voltage and is available in a 1924-ball FCBGA package with 1.0mm ball pitch. Architecturally, the Virtex-7 XT integrates advanced clock management tiles (CMTs), DSP48E1 slices for high-throughput digital signal processing, and PCIe hard blocks for system connectivity. The 28nm HPL (High-Performance Low-Power) process technology balances speed and power efficiency, making it suitable for both compute-intensive and power-sensitive designs. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system. Typical applications include high-end wired communications (100G/400G line cards), data center acceleration, radar and electronic warfare systems, medical imaging, and broadcast video processing. The combination of high logic density, transceiver count, and I/O flexibility makes it ideal for ASIC prototyping and complex system-on-chip designs. When designing with this device, careful attention must be paid to power supply decoupling, with multiple 1.0V core rails and 1.8V auxiliary rails requiring proper filtering. The FCBGA package demands a multi-layer PCB with controlled impedance routing for high-speed transceivers and adequate thermal management for high-power operation.
XC7Z010-1CLG225I - Zynq-7000 SoC, 667MHz, 28K Logic Cells | AMD
The AMD XC7Z010-1CLG225I is a Zynq-7000 SoC integrating a dual-core ARM Cortex-A9 MPCore processor with an Artix-7 FPGA fabric in a 225-ball CSPBGA (13x13 mm) package. It operates at a maximum processor frequency of 667 MHz and provides 28K logic cells, making it a versatile platform for embedded systems requiring both software programmability and hardware acceleration. A System-on-Chip (SoC) combines a processor (CPU) with other system components such as memory controllers, peripherals, and programmable logic on a single die. The Zynq-7000 family specifically merges a hard ARM processing system (PS) with a programmable FPGA fabric (PL), enabling designers to implement custom hardware accelerators alongside software applications. This architecture bridges the gap between traditional microcontrollers and FPGAs, offering the flexibility of programmable logic with the ease of software development. Key features include dual ARM Cortex-A9 cores with NEON and CoreSight debug, 28K Artix-7 logic cells, 667 MHz maximum frequency, and industrial temperature range (-40°C to +100°C). The device supports a nominal supply voltage of 1.0V (0.95V to 1.05V) and includes integrated memory controllers, DMA, and a rich set of peripherals. The CLG225 package provides a compact footprint suitable for space-constrained designs. The Zynq-7000 architecture separates the PS and PL, allowing independent clocking and power management. The PS includes a DDR3/DDR3L memory controller, Gigabit Ethernet, USB 2.0, and SDIO interfaces, while the PL provides configurable logic, DSP slices, and block RAM. This separation enables optimized performance and power efficiency for heterogeneous workloads. Typical applications include industrial motor control, software-defined radio, medical imaging, and automotive driver assistance systems. The combination of ARM processing and FPGA fabric makes it ideal for real-time control, signal processing, and protocol bridging. The industrial temperature grade ensures reliable operation in harsh environments. When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO) require proper filtering and sequencing to ensure reliable startup and operation. Refer to the Zynq-7000 TRM (UG585) for detailed power-up requirements.
XC7Z010-1CLG400C - 667MHz Zynq SoC, 28K Logic | AMD
The AMD XC7Z010-1CLG400C is a Zynq-7000 All Programmable System on Chip integrating a dual-core Arm Cortex-A9 processor, 667 MHz processor operation, and 28,000 FPGA logic cells in a 400-CSBGA package measuring 17 mm by 17 mm. It combines programmable hardware with software-controlled processing for embedded systems, industrial control, communications, image processing, and hardware-accelerated applications. The device also provides 35,200 registers, 240 Kbit of block RAM, 80 multipliers, 60 block RAM resources, 80 dedicated DSP slices, and up to 128 user I/Os, according to the supplied technical data. What is a Zynq-7000 All Programmable SoC? A system on chip, or SoC, combines multiple functional subsystems into one integrated semiconductor. In this case, the XC7Z010-1CLG400C integrates an Arm Cortex-A9 MPCore processing system with CoreSight debug support and Artix-7 FPGA logic. This hierarchical relationship places the device between a conventional microprocessor and a programmable-logic accelerator, allowing software tasks and parallel hardware pipelines to share one package. The principal features are the dual Arm Cortex-A9 cores, 667 MHz operation, and 28K programmable logic cells. The supplied data also identifies 240 Kbit of RAM, 80 multipliers, 60 block RAMs, 80 dedicated DSP slices, two Ethernet MACs, and support for differential I/O standards including LVDS, SSTL, and HSTL. These resources make the device suitable for systems that need deterministic hardware pipelines alongside general-purpose software. The FPGA fabric provides programmable parallel logic for acquisition, filtering, protocol conversion, video processing, and cryptographic workloads. The processor subsystem supports software applications and operating-system-based control, while the DSP, block RAM, and Ethernet resources can accelerate data-intensive operations without requiring separate programmable-logic devices. The 400-CSBGA package exposes up to 128 user I/Os for board-level connectivity. Typical uses include industrial factory controllers, networked embedded gateways, camera and image-processing systems, communications equipment, data-acquisition platforms, and compact control systems. The integrated architecture can reduce the number of external chips when software control and FPGA acceleration are both required. The 667 MHz processor and parallel fabric provide a flexible split between sequential software processing and hardware pipelines. Designers should verify power sequencing, signal-integrity requirements, differential I/O implementation, thermal conditions, and the complete pinout against the AMD documentation. The supplied data does not provide a manufacturer datasheet URL, exact voltage limits, operating-temperature range, or detailed package dimensions, so those values are not inferred here. This product data consolidates verified distributor and comparison information with practical selection context, package identity, core architecture, programmable resources, and application guidance for engineers evaluating the XC7Z010-1CLG400C.
XC7Z020-1CLG484I - Zynq-7000 SoC 667MHz Dual ARM Cortex-A9 | AMD/Xilinx
The AMD/Xilinx XC7Z020-1CLG484I is a Zynq-7000 All Programmable System-on-Chip (AP SoC) that integrates a dual-core ARM Cortex-A9 MPCore processing system with 667MHz core clock, together with Artix-7 programmable logic of 85K logic cells, all housed in a 484-ball CSBGA (CLG484) package measuring 19x19 mm. It is the -1 speed grade, industrial temperature range variant of the XC7Z020 family. A SoC FPGA such as the Zynq-7000 is a single silicon device that fuses a hard processor subsystem (HSS) and a soft FPGA fabric. The processor subsystem runs software (Linux, RTOS, bare-metal), while the programmable logic provides hardware acceleration, custom I/O, and parallel data-path extensions. Zynq-7000 devices sit within the broader taxonomy of heterogeneous compute devices, alongside MPSoC and Versal Adaptive SoC families from AMD/Xilinx. This hybrid architecture is ideal for embedded systems that require both deterministic real-time control and high-throughput data processing. Key features include dual ARM Cortex-A9 cores with NEON SIMD and single/double precision FPU, on-chip L1 caches (32 KB I-cache, 32 KB D-cache per core) and 512 KB L2 cache, integrated Memory Controller for DDR3/DDR3L/LPDDR2, dual USB 2.0 OTG, dual Gigabit Ethernet MACs, dual SD/SDIO controllers, and 2x UART, 2x SPI, 2x I2C peripheral interfaces. The integrated Artix-7 FPGA fabric includes 85K logic cells, 4.9 Mb block RAM, and 220 DSP slices. The Zynq-7000 architecture uses a tightly coupled AXI interconnect between the PS and PL, allowing hardware-accelerated peripherals to communicate with the processor at high bandwidth with predictable latency. The CLG484 package exposes multiple high-performance (HP) and high-range (HR) I/O banks for DDR interfacing and general-purpose I/O. Typical applications include industrial motor drives, machine vision, software-defined radio, ADAS driver assistance systems, medical imaging, and embedded vision. The wide temperature range and -1 speed grade make the XC7Z020-1CLG484I well suited for industrial control and factory automation. When designing with this device, careful attention must be paid to PCB layout, power-rail sequencing, and DDR signal integrity. Use Vivado Design Suite and Vitis for hardware/software co-design, and refer to the official Zynq-7000 datasheet (DS187) and PCB design guide (UG933). This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
XC7Z030-1FBG484I - Zynq-7000 SoC, 125K Logic Cells | AMD
The AMD XC7Z030-1FBG484I is a Zynq-7000 SoC integrating a dual-core ARM Cortex-A9 MPCore processor with a Kintex-7 FPGA fabric. It features 125K logic cells, 667MHz maximum processor frequency, and comes in a 484-pin FCBGA package (23x23mm). This SoC combines the programmability of an FPGA with the performance of an embedded processor, enabling flexible system design for a wide range of applications. A System-on-Chip (SoC) integrates a processor, memory, and peripherals onto a single die, reducing board space and power consumption while improving reliability. The Zynq-7000 family specifically combines a hard ARM processor subsystem with programmable logic, allowing hardware acceleration and custom I/O. This hybrid architecture is ideal for applications requiring both high-level operating system support and real-time, low-latency processing. Key features include 125K logic cells, 667MHz dual-core ARM Cortex-A9, 256KB on-chip memory, and support for DDR3/DDR3L memory interfaces. The device also offers high-speed transceivers, PCIe Gen2, and multiple I/O standards. The -1 speed grade indicates a base performance level, while the I suffix denotes industrial temperature range (-40°C to +100°C). The Zynq-7000 architecture separates the processing system (PS) from the programmable logic (PL), connected via high-bandwidth AXI interfaces. This allows designers to optimize software and hardware independently. The PS includes a memory management unit, DMA controllers, and a rich set of peripherals, while the PL provides flexible logic resources for custom accelerators and interfaces. Typical applications include software-defined radio, industrial motor control, automotive driver assistance, and high-performance embedded computing. The combination of ARM processing and FPGA fabric makes it suitable for edge computing, where low latency and high throughput are critical. The industrial temperature grade ensures reliable operation in harsh environments. When designing with this SoC, careful attention must be paid to power supply sequencing and decoupling. The device requires multiple voltage rails (VCCINT, VCCAUX, VCCO) and proper power-on sequencing to avoid latch-up. Refer to the Zynq-7000 TRM (UG585) for detailed power-up requirements.
XC7Z030-2FBG484I - Zynq-7000 SoC, 125K Logic Cells | AMD
The AMD XC7Z030-2FBG484I is a Zynq-7000 family System-on-Chip (SoC) that integrates a dual-core ARM Cortex-A9 MPCore processing system with a Kintex-7 class programmable logic fabric. This device combines the flexibility of an FPGA with the performance of an embedded processor, making it ideal for a wide range of applications including software-defined radio, industrial automation, and automotive driver assistance systems. The device is housed in a 484-pin FCBGA package (23x23 mm) and operates over the industrial temperature range of -40°C to +100°C. A System-on-Chip (SoC) is an integrated circuit that consolidates all components of a computer or other electronic system into a single chip. The Zynq-7000 family specifically combines a hard processing system (PS) with programmable logic (PL), allowing designers to implement custom hardware accelerators alongside software applications. This architecture bridges the gap between traditional microprocessors and FPGAs, enabling high-performance, low-latency processing for demanding embedded applications. Key features of the XC7Z030-2FBG484I include 125,000 logic cells, a dual-core ARM Cortex-A9 processor running at up to 800 MHz, and support for 1.2V to 3.3V I/O standards. The device also includes 256 KB of on-chip memory, integrated PCIe, and multiple high-speed transceivers. These features provide a powerful and flexible platform for implementing complex digital systems. From a technical perspective, the XC7Z030-2FBG484I is fabricated using a 28nm process technology, which balances performance and power efficiency. The processing system includes a memory management unit, L1 and L2 caches, and a wide range of peripherals, while the programmable logic is based on the Kintex-7 architecture, offering high logic density and DSP capabilities. This combination allows for the implementation of sophisticated algorithms and interfaces. Typical applications for the XC7Z030-2FBG484I include software-defined radio, where the programmable logic handles baseband processing and the ARM cores run protocol stacks; industrial motor control, where the FPGA implements high-speed PWM and the processor handles communication; and medical imaging, where the device accelerates image processing algorithms. The device's high-speed transceivers also make it suitable for video and network processing. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 484-pin FCBGA package requires a multi-layer PCB with dedicated power and ground planes. The device's power consumption can be significant, so a proper heatsink or active cooling solution may be necessary for high-performance applications.