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EP1S25F780I6 - Stratix 25K LE FPGA, 780-BGA, Industrial | Altera
EP1S25F780I6

EP1S25F780I6 - Stratix 25K LE FPGA, 780-BGA, Industrial | Altera

The Altera (Intel) EP1S25F780I6 is a member of the original Stratix FPGA family, built on a 1.5 V, 0.13 µm all-layer copper SRAM process and packaged in a 780-ball FineLine BGA (29 x 29 mm, 1 mm pitch). The device integrates 25,660 logic elements organized as 2,566 Logic Array Blocks (LABs) and backed by approximately 1,944,576 bits of embedded SRAM, giving designers a balanced fabric for parallel datapaths, FIFOs and on-chip buffering. A total of 597 user I/O pins are brought out, supported by up to 28 DSP blocks containing dedicated 9-bit x 9-bit multipliers for high-throughput fixed-point arithmetic. An FPGA (Field Programmable Gate Array) is a programmable logic device whose configurable logic blocks, interconnect and I/O cells are defined by an SRAM configuration bitstream loaded at power-up. FPGAs sit at the top of the programmable logic hierarchy - above CPLDs in density and below ASICs in per-unit cost - and dominate applications requiring hardware-level parallelism such as DSP, baseband processing, high-speed serial protocol bridging, and ASIC prototyping. The Stratix family in particular introduced embedded memory blocks, DSP blocks and high-speed transceivers as hard IP inside the fabric, accelerating arithmetic-heavy designs that previously had to be built from soft multipliers. Key features of the EP1S25F780I6 include 25,660 logic elements, 1,944,576 RAM bits, 597 user I/Os and 28 DSP blocks. The -I6 speed/temperature grade targets the industrial 0 °C to +85 °C window and operates at the core VCCINT of 1.5 V typical, with separate VCCIO banks supporting common single-ended I/O standards. Configuration is handled via the dedicated JTAG (IEEE 1149.1) interface plus the Altera Passive Serial or Fast Passive Parallel configuration schemes supported by the Stratix configuration controller. Typical applications for the EP1S25F780I6 are telecom line-card datapaths, ASIC and SoC prototyping, custom DSP co-processors, high-speed serial protocol bridging, and industrial control / test-and-measurement backplanes. The combination of 28 DSP blocks and 597 I/Os makes the part particularly suited to designs that need both significant glue-logic capacity and arithmetic density on a single device. When designing with this device, ensure the PCB has at least 6 controlled-impedance layers, decoupling on every VCC/VCCINT/VCCIO ball cluster, and thermal vias under the BGA thermal slug; full configuration and JTAG chains must be planned at board level before layout. The Stratix configuration controller requires a valid configuration bitstream at power-up - do not leave configuration pins floating. This page synthesizes distributor availability, cross-reference alternatives and design notes that supplement the official Stratix device family datasheet, with values verified against live distributor data as of 2026-09-07.

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EP1S25F780I6N - Stratix 25,660-LE FPGA, 780-BBGA, Industrial | Altera/Intel
EP1S25F780I6N

EP1S25F780I6N - Stratix 25,660-LE FPGA, 780-BBGA, Industrial | Altera/Intel

The Intel (formerly Altera) EP1S25F780I6N is a high-density Stratix FPGA from the original Stratix family, integrating 25,660 logic elements across 2,566 logic array blocks (LABs) in a 780-ball FineLine BGA package (29 x 29 mm, 1.0 mm pitch). The device is built on a 1.5 V, 130 nm CMOS process and exposes 597 user I/O pins for high-bandwidth parallel interfaces. What is a Stratix FPGA? A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device organized as a grid of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells. The Stratix family was Altera's first high-end family built on a 1.5 V core with embedded TriMatrix memory blocks and DSP blocks, sitting in the hierarchy: programmable logic -> FPGA -> programmable logic device (PLD) -> digital semiconductor. Key features of the EP1S25F780I6N include 1,944,576 total RAM bits of distributed and block memory, dedicated hardware multipliers for DSP, support for LVDS I/O at up to 840 Mbps, and embedded PLL clock management. The 'I6' speed grade with industrial temperature range (0C to 85C) makes it suitable for commercial and industrial designs, while the 780-BBGA FineLine BGA package supports dense, high-pin-count routing. Architecturally, the Stratix device family introduced the TriMatrix memory architecture with three sizes of embedded RAM blocks (M512, M4K, M-RAM), enabling efficient on-chip data buffering. The DSP blocks support 9-bit, 18-bit, and 36-bit signed arithmetic, allowing efficient implementation of FIR filters, FFTs, and other DSP functions without consuming general-purpose logic. Typical applications include high-speed networking line cards, telecom baseband processing, military and aerospace signal processing, ASIC prototyping, and high-performance DSP coprocessing. The 597 user I/Os and abundant memory make it suitable for protocol bridging, packet processing, and image/video preprocessing. When designing with this part, pay close attention to decoupling strategy (the Stratix family datasheet recommends multiple bulk and high-frequency capacitors across each supply pin), and use the Quartus II design software (version 13.0 or older) since later Quartus releases dropped Stratix support. This page synthesizes real-time distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers validate second-source options and lifecycle risk for a long-lived design.

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EP1S30B956C6 - Stratix 32K LE FPGA, 956-BGA, 130nm | Altera
EP1S30B956C6

EP1S30B956C6 - Stratix 32K LE FPGA, 956-BGA, 130nm | Altera

The Altera EP1S30B956C6 is a member of the original Stratix FPGA family, fabricated on a 130 nm CMOS process and housed in a 956-ball FineLine BGA (FCBGA, 40 x 40 mm, 1.27 mm pitch) package. It integrates 32,470 logic elements (LEs), 3,317,184 bits of embedded RAM, and 683 user I/O pins, and is specified for the 0 to 85 C commercial operating range. The suffix C6 indicates the device speed grade and the C designator places the part in the commercial temperature class. An FPGA (Field Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs / LEs), embedded memory blocks, DSP blocks, and programmable interconnect, all controlled by SRAM-based configuration memory. Within the broader taxonomy, FPGA belongs to programmable logic, which sits alongside ASICs and CPLDs in the digital semiconductor hierarchy. The Stratix family introduced dedicated TriMatrix embedded memory, DSP blocks, and high-speed I/O to FPGAs, making them suitable for DSP, communications, and high-throughput data-path applications that previously required custom ASICs. Key features of the EP1S30B956C6 include 32,470 LEs organized into 3,247 LABs, 3.4 Mbits of TriMatrix memory distributed across MRAM/M4K/M512 blocks, dedicated DSP blocks for fixed-point multiplication and accumulation, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates up to 12 PLLs for clock management and supports the Altera Passive Parallel (PP), Passive Serial (PS), and JTAG configuration modes via dedicated configuration pins. At the architecture level, the Stratix die combines a row/column interconnect fabric with embedded memory columns and DSP columns, allowing designers to trade off logic, memory, and DSP resources per design. The 130 nm process node at 1.5 V core (VCCINT) provides a balance of static and dynamic power, while the C6 speed grade targets an internal operating frequency up to 450.05 MHz as published in the Stratix family datasheet. Configuration data is stored in an external configuration device (EPCS/EPC) or downloaded through JTAG, after which the device operates standalone with optional in-system reconfiguration. Typical applications include high-speed digital signal processing (filtering, FFT engines), telecommunications backplane protocol bridging, video and image processing pipelines, industrial control and test instrumentation, and ASIC prototyping for high-density logic designs. Designers often pair the EP1S30B956C6 with EPCS64 configuration memories and Altera Quartus II design software for synthesis, place-and-route, and timing closure. When designing with this device, carefully plan the 956-ball FCBGA escape routing, allocate sufficient PCB layers (typically 8+ layers with microvia or via-in-pad capability), and verify thermal management - the 130 nm Stratix family can dissipate several watts under typical workloads. Designers migrating to newer device families should treat the EP1S30B956C6 as NRND/EOL and evaluate Stratix II/III/IV or Cyclone IV/E families for new designs. This page synthesizes distributor pricing, drop-in alternatives from the Stratix family, and practical design notes not found in the manufacturer datasheet, helping engineers verify pinout, package, and life-cycle status in a single document.

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EP1S30F1020C5 - Stratix 32K LE FPGA 1020-BGA | Intel
EP1S30F1020C5

EP1S30F1020C5 - Stratix 32K LE FPGA 1020-BGA | Intel

The Intel (formerly Altera) EP1S30F1020C5 is a member of the original Stratix FPGA family built on a 130 nm CMOS process, delivering 32,470 logic elements, 726 user I/O pins, and 3,317,184 bits of embedded memory in a 1020-ball FC-FBGA package. Operating from a 1.5 V core supply with commercial extended temperature grading, the device targets high-performance DSP, telecommunications, and parallel processing designs where Stratix' TriMatrix memory and DSP block architecture provide deterministic throughput. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP such as block RAM and DSP multipliers. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) and parallel-programmable ICs, and are positioned between fixed-function ASICs and software-programmable DSPs/microprocessors. The Stratix family, the first generation of high-end Altera FPGAs, replaced the APEX II family and was later superseded by Stratix II/III/IV/V families, but the EP1S30 retains a long-tail installed base in industrial, defense, and test-and-measurement equipment. Key features of the EP1S30F1020C5 include up to 500 MHz internal operation, dedicated DSP blocks for fixed- and floating-point math, embedded TriMatrix memory blocks totaling approximately 3.3 Mbits, and a high-speed I/O ring capable of interfacing to external DDR/DDR2/QDR SRAM. The 'C5' speed grade positions the part at a moderate performance bin suitable for cost-sensitive designs, and the 'F1020' suffix denotes the 1020-ball flip-chip BGA package with full I/O count. Architecturally, the device uses an SRAM-based configuration cell so the bitstream must be loaded from an external PROM or flash on every power-up. The logic element combines a 4-input look-up table (LUT), dedicated carry chain, and register; these LEs are clustered into Logic Array Blocks (LABs) with shared control signals. Hard multipliers, MRAM/M4K memory blocks, and a global/local interconnect fabric provide the structural backbone of Stratix. Typical applications include high-speed DSP pipelines (radar, software-defined radio), protocol bridging (telecom backhaul, SONET/SDH framers), ASIC prototyping, and industrial vision/imaging systems. The wide 1020-pin BGA provides ample LVDS pairs for parallel data acquisition, while the rich DSP/memory ratio enables high-bandwidth signal-processing pipelines. When designing with this part, plan for active thermal management: at 500 MHz the Stratix core can dissipate significant power, and the FC-FBGA demands a multi-layer PCB with via-in-pad and a heatsink path. Confirm Quartus II version support - Intel ended Quartus II subscription updates years ago, so legacy toolchains remain the only stable code path. This page synthesizes distributor inventory, drop-in alternative listings, and design notes not found in the standalone Altera datasheet, providing engineer-ready decision context for new designs, long-life-cycle maintenance, and obsolescence management.

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EP1S30F1020C5N - 32K LE Stratix FPGA, 1020-BGA, 500MHz | Intel
EP1S30F1020C5N

EP1S30F1020C5N - 32K LE Stratix FPGA, 1020-BGA, 500MHz | Intel

The Intel (formerly Altera) EP1S30F1020C5N is a member of the original Stratix FPGA family, delivering 32,470 logic elements, 726 user I/O pins, and 3,317,184 bits of embedded memory in a 1020-ball fine-pitch BGA package. Built on a 130 nm CMOS process with a 1.5 V core supply, it provides up to 500 MHz internal operation and integrates DSP blocks, TriMatrix memory, and high-speed serial interfaces (LVDS). The 'C5' speed grade and 'N' suffix denote the commercial temperature range (0 C to 85 C). A Field Programmable Gate Array (FPGA) is a programmable logic device that allows hardware designers to configure digital logic at the design bench rather than at the semiconductor fab. FPGAs sit in the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. Within that hierarchy, the Stratix family targets high-end, logic-, memory-, and DSP-intensive applications where ASIC NRE costs or time-to-market pressures make custom silicon unattractive. The EP1S30 is positioned as a mid-density member of the family, balancing logic capacity, block RAM, and I/O bandwidth for telecom, networking, and DSP prototyping systems. Key features include 32,470 logic elements arranged in 3,247 LABs, 3,317,184 bits of embedded TriMatrix memory (the largest density at launch for this family tier), up to 726 user I/O pins, dedicated DSP blocks for high-throughput multiplier-accumulators, support for multiple I/O standards including LVDS, and on-chip phase-locked loops for clock management. Per-pin slew-rate and drive-strength control are configurable through the Quartus development tool. Architecturally, the EP1S30 uses a sea-of-LABs layout with routing channels between rows and columns, dedicated multiplier blocks, and embedded RAM blocks of multiple depths. The 1020-ball FC-FBGA package exposes the full logic/memory/DSP fabric and is suitable for high-density boards with controlled-impedance routing. Configuration is typically via JTAG or a passive serial/parallel EPROM. Typical applications include high-performance DSP prototyping, telecom line-card processing, military/aerospace signal processing (commercial temp grade limits to benign environments), and test & measurement backplanes. It is also used in legacy industrial controller upgrades where Stratix I designs cannot be re-targeted. When designing, ensure the 1.5 V core and I/O bank supplies meet the sequencing requirement (VCCINT before VCCIO), use a configuration controller or EPC device for boot, and follow Altera's PCB layout guidelines for FC-FBGA escape routing and thermal pad connection. This page synthesizes distributor pricing for the EP1S30F1020C5N, drop-in Stratix I siblings in the 1020-BGA footprint, and practical design notes not found in the original datasheet.

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EP1S30F1020C6 - Stratix FPGA 33K LE, 726 I/O, 1020-BBGA | Altera
EP1S30F1020C6

EP1S30F1020C6 - Stratix FPGA 33K LE, 726 I/O, 1020-BBGA | Altera

The Altera (now Intel) EP1S30F1020C6 is a member of the Stratix family of FPGAs built on a 1.5 V, 0.13 micrometer, all-layer copper SRAM process. The device integrates 32470 logic elements (LEs), 3317184 bits of embedded RAM, 726 user I/O pins, and up to 28 DSP blocks with embedded multipliers. It is housed in a 1020-ball flip-chip BGA (FBGA) package suited for high-density logic and DSP designs. An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic functionality is defined after manufacturing by loading a user-supplied configuration bitstream into on-chip SRAM cells. FPGAs sit in the wider hierarchy programmable logic device (PLD) -> programmable logic -> logic IC -> integrated circuit, and they are commonly chosen over ASICs for low-volume designs, fast time-to-market, and field-upgradable hardware. The Stratix family is positioned for high-performance DSP, communications, and signal-processing applications. Key features of the EP1S30F1020C6 include support for multiple I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI, PCI-X), up to 12 clock management PLLs (depending on variant), True-LVDS with data rates up to several hundred Mbps, dedicated hardware multipliers for DSP, and TriMatrix memory architecture with three block RAM sizes (M512, M4K, M-RAM). The device also offers embedded hard IP for PCI, PCI-X, and external memory interfaces such as DDR SDRAM and QDR SRAM. The architecture combines a multi-level routing fabric, embedded DSP blocks for high-throughput arithmetic, and rich clocking with phase-locked loops and dedicated clock pins. This combination enables the device to sustain high DSP throughput on FIR filters and FFT pipelines, while the embedded transceivers (not present on EP1S30; transceiver support is on Stratix GX variants) are not applicable here, so designers rely on LVDS pairs for high-speed serial-style I/O. Typical applications include high-speed digital signal processing (FFT, FIR, encryption engines), telecom baseband processing, test and measurement instrumentation, video and imaging pipelines, and high-density glue logic in ASIC-prototype designs. The wide I/O count makes it well suited to systems that aggregate many parallel data buses. When designing with the EP1S30F1020C6, plan power distribution carefully: the 1.5 V core with multiple I/O banks requires multiple decoupling capacitors near the BGA balls. The 1020-ball FCBGA footprint demands PCB layers with microvia technology and matched-impedance routing for LVDS pairs. This page combines distributor pricing, drop-in Stratix same-die alternatives, and practical design notes that go beyond the original Altera datasheet. Compared with a bare parametric listing, it provides a clearer view of pin-compatible replacements and trade-offs.

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EP1S30F1020C6N - 32,470 Logic Elements Stratix FPGA, 1020-BGA | Intel
EP1S30F1020C6N

EP1S30F1020C6N - 32,470 Logic Elements Stratix FPGA, 1020-BGA | Intel

The Intel EP1S30F1020C6N is a member of the Stratix Field Programmable Gate Array (FPGA) family, delivering 32,470 logic elements, 3,317,184 RAM bits, and 726 user I/O pins in a 1020-ball FC-FBGA package measuring 33x33 mm. Fabricated on a 130 nm CMOS process, the device supports a 1.5 V core supply and operates at up to 450 MHz system frequency, providing high-density programmable logic for ASIC prototyping, telecommunications, and high-performance digital signal processing. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected through programmable interconnect, allowing designers to implement custom digital logic functions after manufacturing. The Stratix family sits within the programmable logic device (PLD) hierarchy: FPGA -> programmable logic device -> logic IC -> integrated circuit. Compared with ASICs, FPGAs offer rapid time-to-market, in-field re-programmability, and the ability to update functionality over the product lifecycle without respinning silicon. Key features of the EP1S30F1020C6N include dedicated embedded multiplier blocks, embedded TriMatrix memory blocks for distributed and block RAM, four enhanced phase-locked loops (PLLs), and high-speed LVDS and DDR memory interfaces. The 1020-ball FC-FBGA package with 1.0 mm ball pitch allows the 30,740 typical gates to be placed in a single chip, with 726 user I/O enabling high-bandwidth parallel connectivity. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, PCI-X, LVDS, LVPECL, and HSTL for protocol-flexible board design. The Stratix architecture combines a fine-grained logic fabric with hardened memory and DSP blocks, allowing high-throughput pipelines without consuming general-purpose logic. The on-chip TriMatrix memory subsystem supports true dual-port RAM, FIFO buffers, and shift registers at hundreds of MHz. Four enhanced PLLs provide clock multiplication, division, phase shifting, and zero-delay buffering for high-speed synchronous designs. Typical applications include ASIC prototyping and emulation, high-speed telecom line cards, software defined radio, military radar signal processing, and high-end image processing. The combination of high logic density, embedded memory, and dedicated multipliers makes the EP1S30F1020C6N well-suited to designs that require both control logic and parallel DSP arithmetic on a single device. When designing with this part, pay close attention to the 1020-BGA layout: 1.0 mm pitch balls require multi-layer PCB with laser-drilled or micro-via stackups. Thermal management must consider the 33x33 mm body, and the configuration scheme (EPC16 or EPC4 configuration device) must be selected to match the design density. This page synthesizes distributor stock, current pricing, and practical FPGA migration guidance not found in the manufacturer datasheet alone.

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EP1S30F1020C7 - Stratix 32K LE FPGA 726 I/O FC-FBGA-1020 | Intel
EP1S30F1020C7

EP1S30F1020C7 - Stratix 32K LE FPGA 726 I/O FC-FBGA-1020 | Intel

The Intel (formerly Altera) EP1S30F1020C7 is a Stratix family Field Programmable Gate Array (FPGA) IC built on a 130nm CMOS process, integrating 32,470 logic cells and 726 user I/Os in a 1020-ball flip-chip FineLine BGA (FC-FBGA) package measuring 33x33 mm with 1 mm pitch. It operates from a 1.5V core supply across the commercial 0 to 85 C temperature range, supporting a maximum internal clock frequency of approximately 420 MHz. An FPGA (Field Programmable Gate Array) is a class of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. In the system hierarchy FPGAs sit alongside ASICs and microcontrollers but are distinguished by their in-system re-programmability via SRAM configuration bitstreams. The Stratix family was Intel/Altera's first generation to combine hard IP multipliers and TriMatrix memory blocks with a scalable logic fabric, making it suitable for high-throughput DSP and datapath applications. Key features of the EP1S30F1020C7 include 3,247 Logic Array Blocks (LABs), embedded multiplier blocks for DSP, TriMatrix memory blocks for distributed and block RAM, dedicated clock management with PLLs, and configurable I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Multiple I/O banks support mixed voltage signaling on a single device. The -C7 speed grade indicates a medium-speed bin, balancing performance against power for typical commercial designs. The device architecture incorporates a MultiTrack interconnect that minimizes routing congestion and supports predictable timing closure for wide datapaths. The FC-FBGA-1020 substrate uses flip-chip solder bumps for low-inductance power delivery, essential for high-fanout synchronous designs. Dedicated hardware blocks reduce logic cell consumption for FFTs, FIR filters, and protocol bridging workloads. Typical applications include high-speed digital signal processing (FFT cores, video processing), communications infrastructure (baseband processing, protocol bridging), ASIC prototyping, industrial imaging and machine vision, test and measurement equipment, and high-performance custom computing accelerators. The 726 I/O count and abundant DSP blocks make it well suited for parallel interface aggregation and bus-width conversion roles. When designing with this device, plan power distribution carefully: the FC-FBGA substrate requires a multilayer PCB with low-impedance core and I/O voltage planes, and decoupling must follow Altera's pin-out-specific guidelines. Configuration scheme selection (AS, AP, PS, JTAG) must be locked early in the schematic, as the EPC configuration device companion dictates board layout. The legacy Quartus II design tool supports this device but is no longer the latest vendor IDE. This page synthesizes distributor pricing, drop-in same-package alternatives, design notes, and selection guidance not found in a single datasheet table. Engineer-oriented pinout guidance, package drawings, and Q&A content are compiled from multiple verified sources to accelerate evaluation.

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EP1S30F1020C7N - Stratix 32k LE FPGA, 1020-BGA, 420MHz | Intel
EP1S30F1020C7N

EP1S30F1020C7N - Stratix 32k LE FPGA, 1020-BGA, 420MHz | Intel

The Intel EP1S30F1020C7N is a Stratix-series Field Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, offering 32,470 logic elements, 3,317,184 bits of embedded memory, and 726 user I/O pins in a 1020-ball FineLine BGA package (33 x 33 mm, 1 mm pitch). It operates from a 1.5 V core supply (range 1.425 V to 1.575 V), supports up to 420.17 MHz internal operation, and targets commercial/extended-temperature designs where high logic density and rich DSP and memory resources are required. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit within the broader semiconductor hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field to implement arbitrary digital logic, glue functions, signal-processing pipelines, and full system-on-chip prototypes. Key features include 3,244 Kbits (M4K) + 144 Kbits (M-RAM) of block RAM, dedicated DSP blocks for high-throughput arithmetic, up to 16 global clock networks with PLL support, and Stratix-tier I/O support including LVDS, SSTL, and HSTL standards. The 1020-pin FineLine BGA exposes 726 user I/Os, leaving the remaining balls for power, ground, configuration, and JTAG. The Stratix architecture combines a TriMatrix memory structure (MLAB + M4K + M-RAM) with DSP blocks optimized for finite-impulse-response (FIR) filters and complex FFT pipelines. The 130 nm process delivers an internal clock performance envelope of 420 MHz, making the part suitable for parallel DSP workloads, telecom channel cards, and prototyping of ASIC-class signal chains before tape-out. Typical applications include telecom baseband processing, high-speed data acquisition, software-defined radio (SDR), industrial motion control, ASIC prototyping, and military/aerospace signal processing where a high pin-count, high-density programmable fabric is required. The 1020-BGA footprint also supports multi-gigabit transceiver-rich boards when paired with companion clock devices. When designing with this device, provide at least six PCB layers, controlled-impedance routing for all high-speed signals, and a minimum of 1 oz copper on inner power planes for the 1.5 V core rail. Thermal management relies on the exposed-die BGA lid; heatsink or airflow is required when continuous logic utilization exceeds 70%. This page synthesizes distributor pricing, drop-in same-brand alternatives from the Stratix family, and practical design notes not aggregated in the manufacturer datasheet.

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EP1S30F1020I6 - 32,470 Logic Elements Stratix FPGA | Intel
EP1S30F1020I6

EP1S30F1020I6 - 32,470 Logic Elements Stratix FPGA | Intel

The Intel EP1S30F1020I6 is a member of the Stratix FPGA family, delivering 32,470 logic elements, 3,317,184 bits of embedded RAM, and 726 user I/O pins in a 1020-ball FineLine BGA package. Manufactured on a 130 nm CMOS process, the device integrates dedicated DSP blocks, TriMatrix memory, and high-speed transceivers, making it suitable for high-performance digital signal processing, telecom, and military/aerospace systems. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs occupy a unique position in the hierarchy between general-purpose microcontrollers and fixed-function ASICs: they offer hardware-timed parallelism, deterministic latency, and the ability to be reconfigured in the field. The Stratix family was Intel's (formerly Altera's) high-performance flagship before being succeeded by Stratix II/III/IV/V. Within the taxonomy, FPGAs sit under programmable logic devices (PLDs) within the broader semiconductor category. Key features of the EP1S30F1020I6 include 32,470 logic elements (LEs), 3,317,184 RAM bits organized as TriMatrix memory blocks, 144 embedded 18x18 multipliers for DSP, 6 phase-locked loops (PLLs), and 12 dedicated clock networks. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL via 726 user I/O pins on the 1020-ball FC-FBGA package. Architecturally, the Stratix EP1S30 uses a row-and-column structure with embedded DSP blocks interleaved between memory columns. The 130 nm process technology combined with a 1.5 V core supply and dedicated MultiTrack interconnect minimizes routing congestion and supports clock rates up to 450 MHz in DSP pipelines. Embedded memory and DSP blocks are hard-wired for predictable performance, while logic fabric handles glue logic and state machines. Typical applications include high-speed digital signal processing (FFT engines, baseband processing), telecom backplane interfacing, military radar systems, medical imaging accelerators, and ASIC prototyping. The combination of high logic density, generous on-chip memory, and embedded multipliers makes it ideal for datapath-heavy designs requiring deterministic throughput. When designing with this part, ensure your power budget accounts for the dynamic power of fast logic toggling - Intel provides the PowerPlay early power estimator tool. For the FC-FBGA-1020 package, PCB layout must use microvia technology and matched-length traces on high-speed LVDS pairs to maintain signal integrity. This page synthesizes distributor pricing, same-package drop-in alternatives, FPGA design considerations, and lifecycle context not consolidated in the manufacturer datasheet. As of 2026-09-07, the part remains in NRND status with limited authorized distribution.

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EP1S30F1020I6GA - 32,470 LEs Stratix FPGA 726 I/O FBGA-1020 | Intel
EP1S30F1020I6GA

EP1S30F1020I6GA - 32,470 LEs Stratix FPGA 726 I/O FBGA-1020 | Intel

The Intel (formerly Altera) EP1S30F1020I6GA is a Stratix family field-programmable gate array (FPGA) integrating 32,470 logic elements and 726 user I/O pins in a 1020-ball fine-pitch BGA package. It is fabricated on a 130 nm CMOS process, operates from a 1.5 V core supply, and is offered in the industrial temperature grade with -6 speed grade characteristics. According to the Stratix family datasheet, the device delivers up to 450 MHz internal operation and supports dedicated DSP blocks, embedded TriMatrix memory, and up to 4 PLLs for high-performance digital logic. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic function is defined by customer-loaded configuration bitstreams rather than by fixed mask layers. Architecturally, FPGAs sit alongside ASICs, CPLDs, and structured ASSPs in the programmable logic hierarchy; this Stratix part specifically belongs to the high-density end of that hierarchy, targeting ASIC prototyping, telecom line cards, and high-throughput DSP pipelines. The EP1S30 sits between the smaller EP1S10/EP1S25 and the larger EP1S40/EP1S60/EP1S80 in the Stratix lineup. Key features include 32,470 logic elements, 726 user I/O, dedicated embedded multipliers, distributed TriMatrix memory, four PLLs, and support for external memory interfaces such as DDR SDRAM. Per the Stratix family datasheet, the -6 speed grade targets high-end digital signal processing, while the 'I' suffix designates the industrial temperature range (-40C to +85C operating range for industrial-grade parts). The 'GA' suffix denotes a RoHS-compliant lead-free package. The architecture combines a high-performance lookup-table (LUT)-based logic fabric with embedded RAM, multipliers, and high-speed transceivers where present. This blend allows system designers to consolidate glue logic, memory, and DSP arithmetic into one device, simplifying board layout, lowering BOM cost, and shortening time-to-market versus a fixed-function ASIC. Typical applications include ASIC prototyping and emulation, high-speed DSP (FIR filters, FFT engines), telecom baseband processing, networking line cards, military/aerospace signal processing, and high-performance image processing pipelines. Industrial-grade parts are suitable for factory automation, test and measurement equipment, and medical imaging. When designing with this device, ensure that PCB power integrity is maintained across the four Stratix voltage rails (VCCINT, VCCIO, VCCPD, VCCA_PLL) and that JTAG pins TCK, TMS, TDI, TDO are routed cleanly. Configuration mode (AS, PS, JTAG) and clock architecture must be planned before PCB layout. This page synthesizes distributor pricing, drop-in alternatives within the Stratix family, and practical design notes that supplement the manufacturer datasheet.

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EP1S30F1020I6N - Stratix FPGA, 3247 LABs, 726 I/O | Intel
EP1S30F1020I6N

EP1S30F1020I6N - Stratix FPGA, 3247 LABs, 726 I/O | Intel

The Intel (formerly Altera) EP1S30F1020I6N is a high-density Stratix FPGA from the first-generation Stratix family, integrating 3,247 Logic Array Blocks (LABs), 726 user I/O pins, and a 1.5 V core supply in a 33 x 33 mm flip-chip BGA-1020 package with 1 mm ball pitch. The part carries the industrial temperature grade designation ("I6") and a 6 speed grade, making it suitable for performance-oriented industrial systems that demand deterministic timing. An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits after PCB fabrication. FPGAs sit in the broader taxonomy of programmable logic devices -> programmable logic -> digital ICs -> semiconductors, and the Stratix family was Altera's flagship high-end family at launch, integrating logic, embedded memory blocks (TriMatrix), DSP blocks, and high-speed transceivers on a single die. Compared with CPLDs and ASICs, FPGAs offer higher logic density and on-chip parallelism while preserving reprogrammability. Key features of the EP1S30F1020I6N include up to 33,000+ equivalent logic elements organized across 3,247 LABs, embedded TriMatrix memory for distributed and block RAM, dedicated DSP blocks for high-throughput signal processing, and Stratix I/O structures supporting multiple single-ended and differential I/O standards. The 726 user I/O count enables wide parallel buses and rich memory interfaces, while the flip-chip BGA package provides the thermal and electrical headroom required for the high I/O density. Architecturally, Stratix devices use a 1.5 V core with dedicated PLL-based clock management, on-chip termination, and SerDes-ready I/O. The combination of TriMatrix memory and DSP blocks makes the EP1S30 well suited for DSP pipelines such as video processing, baseband signal processing, and protocol bridging. Industrial-grade (-40C to +85C) screening, indicated by the "I6" suffix, supports deployments outside controlled lab environments. Typical applications include high-speed data acquisition, telecom baseband processing, industrial imaging, military/aerospace prototyping, network interface cards, and ASIC prototyping platforms. The large logic capacity is particularly attractive for system-on-chip emulation and pre-silicon validation, where the 726 user I/O support wide memory and bus replication. When designing with the EP1S30F1020I6N, ensure the PCB land pattern strictly follows the 1 mm-pitch FCBGA-1020 footprint and that the supply network delivers the 1.5 V core with adequate decoupling. Thermal dissipation in FCBGA packages is dominated by the PCB; a continuous ground/power plane stack-up with thermal vias under the die is essential. Also note that the Stratix I family has reached End-of-Life for new designs; migration paths include the Stratix II/III/IV families and the Cyclone family for lower-cost replacements. This page synthesizes distributor pricing, drop-in Stratix-family alternatives, and PCB-layout design notes that complement but do not replace the official Stratix Device Handbook.

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EP1S30F780C6 - Stratix FPGA, 32470 LEs, 597 I/O, FCBGA-780 | Altera
EP1S30F780C6

EP1S30F780C6 - Stratix FPGA, 32470 LEs, 597 I/O, FCBGA-780 | Altera

The Altera EP1S30F780C6 is a member of the original Stratix FPGA family, fabricated on a 1.5 V, 0.13 μm all-layer copper SRAM process and housed in a 780-ball FineLine BGA (FCBGA) package. Per the Altera datasheet, the device integrates 32,470 logic elements, 597 user I/Os, dedicated DSP blocks with embedded multipliers, and TriMatrix on-chip memory, making it suitable for high-performance DSP, communications, and signal-processing designs. The part is graded for commercial temperature operation (0 °C to 85 °C). A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) built on an SRAM process that lets engineers implement arbitrary digital logic, block RAM, DSP arithmetic, and high-speed serial transceivers on a single die. Stratix belongs to the hierarchy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit → semiconductor. Within Altera's (now Intel FPGA) portfolio, the EP1S30F780C6 sits in the first-generation Stratix family, positioned between the smaller Stratix EP1S10/EP1S20 and the higher-density EP1S40/EP1S60/EP1S80 devices, and predates the Stratix II/GX/Cyclone lineages. Key features of the EP1S30F780C6 include up to 28 DSP blocks with up to 224 (9-bit × 9-bit) embedded multipliers for DSP pipelines, TriMatrix memory architecture with up to ~3.4 Mbits of RAM, support for multiple I/O standards including LVDS, and a configuration scheme based on SRAM cells loaded at power-up via passive serial, fast passive parallel, or JTAG. The 0.13 μm process and 1.5 V core deliver a balance of performance and power for early-2000s high-end designs. The architecture uses logic array blocks (LABs) composed of logic elements (LEs), each containing a 4-input look-up table (LUT), a programmable register, and a carry chain. Embedded memory blocks (M512, M4K, M-RAM) provide distributed and block RAM at multiple aspect ratios. PLLs provide clock conditioning and frequency synthesis for the global and regional clock networks, and dedicated high-speed I/O banks support external memory interfaces such as DDR SDRAM and QDR SRAM. Typical applications of the EP1S30F780C6 include high-throughput DSP (software-defined radio baseband, video processing), telecom line cards implementing protocol bridging and packet processing, ASIC prototyping, and industrial imaging pipelines. The 597 I/Os make it useful for designs that aggregate many parallel buses or external memory channels. When designing with this part, validate power sequencing of the 1.5 V core and the I/O bank supplies, and use Altera Quartus II (legacy version chain) for synthesis, place-and-route, and timing closure. Engineers should also note that this is a mature/EOL device line and plan second-source or migration paths to Cyclone/Stratix II families where possible. This page synthesizes distributor pricing, same-family drop-in alternatives from the Site MPN list (Stratix EP1S25 / EP1S20 / EP1S10 variants), and practical FPGA design notes that are not consolidated on the manufacturer datasheet alone, giving engineers a faster starting point for sourcing and PCB redesign decisions.

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EP1S30F780C6GA - Stratix FPGA 32470 LEs 780-FBGA | Intel
EP1S30F780C6GA

EP1S30F780C6GA - Stratix FPGA 32470 LEs 780-FBGA | Intel

The Intel EP1S30F780C6GA is a member of the original Stratix FPGA family, delivering 32,470 logic elements, 3,317,184 bits of embedded RAM, and 597 maximum user I/O pins in a 780-ball FineLine BGA (FBGA) package measuring 29 mm x 29 mm. Built on a 1.5 V core with 0.13 um process technology, it is positioned for high-performance digital logic, DSP, and embedded processing in communications, industrial, and computing systems. The device integrates dedicated DSP blocks, TriMatrix memory, and high-speed transceivers suited to baseband and protocol bridging workloads. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon IP such as block RAM, DSP slices, PLLs, and high-speed serial transceivers. FPGAs sit above fixed-function ASICs and microcontrollers in the silicon hierarchy because they offer hardware-level parallelism with the ability to be re-programmed in-system, placing them in the broader category of programmable logic devices (PLDs) within digital semiconductors. Key features of the EP1S30F780C6GA include 32,470 logic elements, 3,317,184 RAM bits, 597 maximum user I/O pins, embedded DSP blocks for high-throughput multiplication-accumulation, multiple phase-locked loops for clock management, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 780-FBGA package exposes all user I/O through a high-density ball grid that supports dense board layouts. The EP1S30F780C6GA uses Altera's Stratix architecture with embedded memory and dedicated signal-processing blocks. Designers configure logic and routing through the Quartus II design software, which is also used for timing closure, floorplanning, and bitstream generation. The architecture targets high-throughput parallel processing where conventional processors would bottleneck. Typical applications include communications infrastructure such as base station baseband and protocol bridging, industrial automation controllers, high-speed data acquisition front-ends, and military/aerospace signal processing. The 597-I/O capacity also makes the device suitable for prototyping ASIC designs and for high-density test and measurement instrumentation. When designing with this part, pay close attention to power planning: the 1.5 V core supply must be tightly decoupled with bulk and ceramic capacitors close to each supply pin. The 780-BGA footprint requires careful PCB stack-up and via-in-pad or microvia technology for reliable assembly. Signal integrity must be simulated for high-speed LVDS pairs and external memory interfaces to maintain timing margins. This product page consolidates distributor pricing, parametric comparison, and a drop-in alternative list to streamline sourcing and design decisions, supplementing the official Intel datasheet.

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EP1S30F780C6N - Stratix FPGA 32K LE 780-FBGA | Intel / Altera
EP1S30F780C6N

EP1S30F780C6N - Stratix FPGA 32K LE 780-FBGA | Intel / Altera

The Intel (formerly Altera) EP1S30F780C6N is a member of the original Stratix FPGA family, delivering 32,470 logic elements, 3,317,184 bits of embedded memory, and 597 user I/O pins in a 780-ball flip-chip BGA package. Manufactured on a 130 nm CMOS process with a 1.5 V core supply, the device integrates up to 324,720 RAM bits per M512/M4K/M-RAM block, embedded DSP blocks for high-speed multiply-accumulate, and dedicated high-speed serial transceivers supporting multi-gigabit interfaces. The C6 speed grade balances performance and power, suitable for prototyping, legacy system support, and long-lifecycle industrial designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and transceivers. FPGAs occupy the top tier of programmable logic, sitting between standard microcontrollers and ASICs in the broader integrated-circuit hierarchy: logic cell -> logic array block -> LAB -> FPGA fabric -> programmable logic device -> semiconductor. Unlike an ASIC, an FPGA's function is defined post-manufacture via SRAM or flash configuration, allowing rapid design iteration and field upgrades. Key features of the EP1S30F780C6N include 3,819 Configurable Logic Blocks (CLBs), 252 (18x18) embedded multiplier blocks, 12 phase-locked loops, six clock networks, JTAG IEEE 1149.1 boundary-scan support, and a dedicated configuration interface supporting serial, parallel, and passive/active modes. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with per-pin dynamic impedance control. Stratix devices also include TriMatrix memory architecture (M512, M4K, M-RAM blocks) that delivers high-bandwidth on-chip storage for buffering and packet processing. Architecturally, the Stratix family pioneered the embedded DSP block concept that subsequent Altera/Intel families (Stratix II/III/IV/V, Cyclone, Arria, Agilex) have refined. The 130 nm process places the EP1S30 in the legacy tier, but it remains supported in Intel Quartus design tools for several development flows, which is critical for industrial and defense programs with long product life cycles. Typical applications include telecom line-card aggregation, industrial motor control, military/aerospace signal processing, test and measurement instrumentation backplanes, and ASIC prototyping. The combination of high logic density, large memory, and 597 I/O makes the EP1S30 well-suited for parallel data-path designs such as multi-channel DSP, video processing, and protocol bridging. When designing with this device, allocate adequate power decoupling and thermal dissipation for the 29 mm x 29 mm FC-FBGA; the 780 balls at 1 mm pitch require standard BGA assembly processes. Configuration storage should use a compatible PROM (EPC16 or EPC8) or system-controller-based in-system programming. Signal integrity on the 597 user I/Os requires controlled-impedance PCB stack-up; SSTL/HSTL interfaces in particular need matched-length routing and proper VREF termination. This page synthesizes distributor pricing, FPGA fabric specifications, Stratix-family drop-in alternatives, and practical design notes not consolidated in any single manufacturer document, helping engineers compare options and accelerate design-in.

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EP1S30F780C7 - Stratix 32K LE FPGA, 780-FBGA | Altera / Intel
EP1S30F780C7

EP1S30F780C7 - Stratix 32K LE FPGA, 780-FBGA | Altera / Intel

The Altera (now Intel) EP1S30F780C7 is a member of the original Stratix FPGA family, integrating 32,470 logic elements, 597 user I/O pins, and dedicated DSP and memory blocks into a 780-ball fine-pitch BGA package. It is fabricated on a 1.5 V core, 0.13 µm CMOS process and supports up to 3,317,184 bits of embedded SRAM organized in TriMatrix memory blocks. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose logic, routing, and I/O behavior are defined by configuration SRAM. FPGAs occupy the position of ASIC prototyping, hardware acceleration, and reconfigurable computing in the broader digital IC hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. Stratix-class FPGAs specifically target high-performance DSP and telecommunications signal chains. Key features include 3,240 Kbits of embedded memory, dedicated DSP blocks supporting up to 224 18x18 multipliers, 12 transceiver channels (Rocket I/O) at up to 3.125 Gbps, and support for external DDR SDRAM and QDR II SRAM memory interfaces. The device also integrates a high-speed LVDS interface and a hard PCI-X core for direct bus connectivity in communication equipment. Architecturally, the EP1S30F780C7 uses a logic-array-block (LAB) structure with each LAB containing 10 logic elements (LEs). Configuration is stored in SRAM, allowing in-system reprogrammability through JTAG or passive/active serial schemes. The 780-pin FCBGA package provides 597 usable I/O pins, organized into banks supporting multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, LVPECL, and LVDS. Typical applications include wired and wireless telecom baseband processing, high-speed serial interface bridging (XAUI, Fibre Channel, SONET), video and imaging pipelines, and ASIC prototyping for DSP and communications algorithms. The combination of dedicated multipliers and high-bandwidth memory makes this device especially well suited for OFDM and FFT-based designs. Designers should pay close attention to power-supply sequencing, decoupling, and the 1 mm pitch BGA layout (29x29 mm body). Because configuration SRAM is volatile, an external configuration PROM such as an EPC16 or EPCS device is required for stand-alone boot. Static supply currents should be evaluated against the Stratix handbook power estimator spreadsheet. This page synthesizes distributor pricing, drop-in equivalents from the same Stratix family, and practical board-design guidance not collected in any single datasheet — giving procurement and engineering teams one trustworthy decision point for this legacy but still-quotable device.

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EP1S30F780C7AA - Stratix 32K LE FPGA, 597 I/O, 780-FBGA | Intel
EP1S30F780C7AA

EP1S30F780C7AA - Stratix 32K LE FPGA, 597 I/O, 780-FBGA | Intel

The Intel EP1S30F780C7AA is a member of the original Stratix FPGA family, delivering 32,470 logic elements, 3,317,184 bits of embedded memory, and 597 user I/O in a 780-ball FineLine BGA package with a -7 speed grade. It is built on a 0.13 µm SRAM-based process and integrates dedicated DSP blocks, TriMatrix memory, and high-speed serial transceiver support, making it suitable for high-performance digital signal processing, telecommunications infrastructure, and data acquisition systems. An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets designers implement arbitrary digital circuits after PCB fabrication. Within the broader semiconductor taxonomy, FPGAs sit between ASICs and general-purpose processors: more flexible than fixed-function ASICs yet offering deterministic hardware-level parallelism that microcontrollers cannot match. The Stratix family occupies Intel's (formerly Altera's) high-performance tier, above Cyclone and Arria in logic density and transceiver capability, and below Agilex in process node and DSP throughput. The EP1S30 specifically targets mid-density applications where designers need rich logic, embedded multipliers, and flexible I/O without paying for the largest Stratix devices like EP1S80. Key electrical and packaging attributes include 597 maximum user I/O pins, 1.5 V core voltage with multi-voltage I/O support (LVTTL, LVCMOS, LVDS, LVPECL, PCI, PCI-X), embedded DSP blocks delivering up to 2.1 GMACS at -7 speed grade, and TriMatrix memory totaling approximately 3.3 Mbits. The device is offered in a 780-ball FCBGA with a 29x29 mm or similar footprint and is specified for the commercial 0°C to +85°C operating range. Power is supplied through dedicated VCCINT, VCCIO banks, VCCA_PLL, and VCCPD pins with extensive decoupling guidance in the Stratix Device Handbook. Architecturally, the EP1S30 uses logic array blocks (LABs), each containing ten logic elements (LEs), interconnected by a multi-tiered routing fabric. Embedded multiplier blocks support 9x9, 18x18, and 36x36 signed/unsigned multiplication in a single cycle, enabling DSP-heavy designs without consuming general-purpose logic. The PLLs provide clock synthesis and skew management across up to 16 dedicated clock pins. Configuration is supported through passive serial, fast passive parallel, and JTAG modes, with optional EPC16 or EPCS serial configuration devices from Intel. Typical applications include high-end telecommunications line cards, radar and beam-forming front-ends, medical imaging pre-processors, broadcast video processing, ASIC prototyping, and military/aerospace signal processing. The combination of 597 I/O and approximately 3.3 Mbits of embedded memory makes it a flexible platform for system-on-chip prototyping where designers need to validate complex IP blocks before committing to a mask-programmed ASIC. When designing with the EP1S30F780C7AA, pay close attention to the Stratix Device Handbook pin connection guidelines: each VCCIO bank must be decoupled with 0.1 µF and 0.01 µF capacitors placed close to the balls, unused I/O must be tri-stated and tied to a defined logic level, and JTAG TCK should be pulled to a known state to avoid inadvertent boundary-scan events. Thermal management is generally passive for commercial-temperature designs but requires attention if I/O switching activity is high. This page synthesizes distributor pricing, package-specific alternatives, and practical design notes curated from the Stratix Device Handbook and authorized distributor listings, providing a single-page reference that complements the manufacturer datasheet.

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EP1S30F780C7N - Stratix FPGA 32470 LE, 780-FBGA | Intel
EP1S30F780C7N

EP1S30F780C7N - Stratix FPGA 32470 LE, 780-FBGA | Intel

The Intel (Altera) EP1S30F780C7N is a high-density Stratix FPGA built on a 130 nm CMOS process, providing 32,470 logic elements (LEs) organized into 3,247 Logic Array Blocks (LABs) and 3,819 Configurable Logic Blocks (CLBs), with 597 user I/Os. Housed in a 780-ball FC-FBGA package measuring 29 x 29 mm with 1 mm pitch, this industrial-temperature-grade device operates at a core voltage of 1.5 V. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. FPGAs sit at the top of the programmable-logic hierarchy: FPGA -> CPLD -> programmable logic -> digital IC -> semiconductor. They are distinguished from Application-Specific Integrated Circuits (ASICs) by re-programmability and from CPLDs by their greater logic density, embedded RAM blocks, DSP blocks, and high-speed transceiver support. The Stratix family in particular was Altera's first generation to embed TriMatrix memory blocks, DSP blocks, and high-speed I/O structures optimized for parallel processing and communications infrastructure. Key features of the EP1S30F780C7N include embedded RAM of 3,317,184 bits distributed across TriMatrix memory blocks, four phase-locked loops (PLLs) for clock management, support for multiple I/O standards (LVTTL, LVCMOS, PCI, LVDS, SSTL, HSTL), and a dedicated JTAG boundary-scan interface conforming to IEEE 1149.1. The device supports both passive serial (PS) and fast passive parallel (FPP) configuration schemes using an Altera-enhanced configuration device. Architecturally, the Stratix family combines a sea-of-LEs fabric with column-based DSP and memory blocks, allowing engineers to implement wide datapath operations, packet processing, and high-throughput DSP functions on a single chip. The embedded memory enables First-In-First-Out (FIFO) buffers, lookup tables, and dual-port RAM; the DSP blocks provide dedicated multipliers and adders for FIR filters, FFTs, and video processing. Compared with the older APEX family, Stratix moved to 130 nm and added true LVDS support and dedicated high-speed transceivers in higher-density members. Typical applications include telecommunications backplane switching, network interface cards, high-speed serial protocol bridging (UTOPIA, SPI-4.2, SFI-4, 10 GbE MAC), digital video broadcasting, and high-performance DSP prototyping. Industrial 0 C to 85 C operation makes the part suitable for thermally-controlled telecom and computing equipment. When designing with this part, allocate sufficient decoupling (typically 100 nF plus bulk 10-100 uF near each VCC/GND pair) and follow Stratix power-up sequencing requirements to keep VCCINT and VCCIO rails within the recommended ramp rates. Quartus II (or Quartus Prime in later releases) is the primary development environment; legacy Quartus II 9.0 is the latest version with full support for this Stratix silicon. This page synthesizes distributor pricing, same-package drop-in alternatives from the Stratix family, and practical design notes not found in the manufacturer datasheet alone.

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EP1S30F780C8 - 32,470 LEs Stratix FPGA, 597 I/O, 780-FBGA | Intel
EP1S30F780C8

EP1S30F780C8 - 32,470 LEs Stratix FPGA, 597 I/O, 780-FBGA | Intel

The Intel EP1S30F780C8 is a member of the original Stratix FPGA family built on a 130 nm CMOS process, offering 32,470 logic elements, 597 user I/O pins, and a top internal operating frequency of approximately 357 MHz, all integrated into a 780-ball FineLine BGA (FC-FBGA) package measuring 29 mm × 29 mm with a 1.0 mm ball pitch. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic fabric, an interconnect matrix, and dedicated silicon IP (block RAM, DSP blocks, PLLs, transceivers) on a single die. Stratix sits in the hierarchy programmable logic device (PLD) → FPGA → high-performance FPGA, and was Intel/Altera's first family to combine embedded TriMatrix memory, embedded DSP blocks, and high-speed I/O on a 1.5 V core supply. Key features of the EP1S30F780C8 include embedded TriMatrix memory blocks for distributed and true-dual-port RAM/ROM, embedded DSP blocks for high-throughput fixed- and floating-point math, support for external memory interfaces such as DDR, DDR2, QDR, and ZBT SRAM, and dedicated high-speed I/O supporting LVDS, LVPECL, PCI, PCI-X, and HSTL signalling. The device also includes up to 12 dedicated clock pins with on-chip PLLs for fine-grained clock management, plus configuration via passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), fast passive parallel (FPP), and JTAG. Architecturally, the EP1S30F780C8 uses Altera's Logic Array Blocks (LABs) interconnected by a multi-level routing fabric, with embedded memory columns interleaved with DSP block columns to maximise data-path throughput. The 1.5 V core, 130 nm process and flip-chip FC-FBGA package together deliver the speed and signal-integrity margins required for parallel DSP, ASIC prototyping, and high-bandwidth glue-logic designs at industrial 0–85 °C operating temperatures. Typical applications include ASIC prototyping, telecom line-card processing, high-speed image and video pipelines, communications infrastructure such as DSLAM and protocol bridges, and military/aerospace signal processing. Engineers also adopt EP1S30F780C8 for production-bound designs where time-to-market outweighs the unit-cost advantage of a structured ASIC, and as a software-compatible migration path to the larger Stratix II (EP2S) family. When designing with the EP1S30F780C8, plan power sequencing carefully: the 1.5 V core, I/O banks and auxiliary supplies must ramp in the order specified in the Altera Stratix device handbook to avoid in-rush latch-up. The 780-ball FC-FBGA demands reflow profile matching IPC/JEDEC J-STD-020 MSL-3 conditions, and high-speed LVDS traces must be length-matched to within the datasheet tolerance to meet the supported 840 Mbps data rate. This page synthesises distributor pricing, FFF-verified drop-in alternatives, and practical board-design notes not found in the manufacturer datasheet, helping sourcing engineers and FPGA designers plan a Stratix BOM with confidence.

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EP1S30F780C8N - Stratix 32470 LEs FPGA, 597 I/O, 780-FBGA | Intel
EP1S30F780C8N

EP1S30F780C8N - Stratix 32470 LEs FPGA, 597 I/O, 780-FBGA | Intel

The Intel (formerly Altera) EP1S30F780C8N is a member of the Stratix FPGA family, built on a 0.13 µm CMOS process and offering 32,470 logic elements (LEs), 3,317,184 bits of embedded memory, and 597 user I/O pins. The C8N speed grade places it at the high-performance end of the Stratix line, with internal architecture supporting DSP blocks, TriMatrix memory, and high-speed transceivers (where populated) for parallel logic and signal-processing workloads. The device is housed in a 780-pin FineLine BGA (FC-FBGA) measuring 29 × 29 mm with 1 mm pitch, and is specified for commercial temperature operation (0 °C to 85 °C). A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP (memory, multipliers, transceivers, PLLs) on a single die. The Stratix family sits in the high-density, performance-oriented tier of FPGAs, above Cyclone (cost-optimized) and below the later Stratix II / Stratix III generations. EP1S30F780C8N specifically targets designers who need substantial on-chip RAM and rich DSP resources for DSP pipelines, communications baseband, and high-throughput data acquisition. Key features for the EP1S30F780C8N include 32,470 LEs, 3,317,184 RAM bits organized as TriMatrix blocks, dedicated DSP blocks for multiply-accumulate operations, and 597 user I/O. The 780-ball FC-FBGA package provides high-density board interconnect while the 1.5 V core supply and 1.5 V/2.5 V/3.3 V I/O standards make the part straightforward to integrate with common SDRAM, SRAM, and LVCMOS/LVTTL peripherals. Configuration is supported via Altera's passive serial, fast passive parallel, passive parallel asynchronous, and JTAG modes. Architecturally, the EP1S30F780C8N uses SRAM-based configuration cells with lookup-table (LUT)-based logic elements, carry chains for arithmetic, and dedicated routing. The embedded TriMatrix memory supports true dual-port, simple dual-port, and single-port RAM/ROM in various depths and widths, while DSP blocks provide hardware multipliers for filter and FFT structures. PLL blocks provide clock multiplication, division, and phase shifting for system timing. Typical applications include telecom baseband processing, high-speed image and video pipelines, test-and-measurement instrumentation, DSP co-processing cards, and communications line cards. Designers commonly pair this device with external DDR SDRAM, Flash configuration memory, and high-speed ADCs/DACs. For new designs, designers are advised to evaluate Stratix II EP2S30 or Cyclone IV/MAX 10 families as modern alternatives because Stratix (original) is a mature generation.

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EP1S30F780I6 - Stratix 32K LEs FPGA, 780-FBGA | Altera (Intel)
EP1S30F780I6

EP1S30F780I6 - Stratix 32K LEs FPGA, 780-FBGA | Altera (Intel)

The Altera (Intel) EP1S30F780I6 is a member of the original Stratix FPGA family, fabricated on a 130 nm CMOS process and packaged in a 780-ball FineLine BGA (FCBGA, 29x29 mm). It integrates 32,470 logic elements, 597 user I/Os, 3,317,184 embedded memory bits, and dedicated high-speed transceivers, and it operates from a 1.425 V to 1.575 V core supply with industrial-grade -40C to +100C junction support. The integrated transceiver block and abundant DSP/memory resources made Stratix the platform of choice for high-bandwidth pre-Cyclone design wins. An FPGA (Field Programmable Gate Array) is a programmable logic IC whose architecture is hierarchical: configurable logic blocks (CLBs) implement combinatorial and sequential logic, block RAM (BRAM) provides on-chip storage, DSP blocks accelerate fixed-point arithmetic, and I/O cells connect to external pins. Stratix sits in the high-performance tier of the Altera/Intel FPGA portfolio (Stratix > Cyclone; Altera > Intel PSG > programmable logic IC > semiconductor). The EP1S30 is the mid-density member of the family, between EP1S25 and EP1S40, and uses the same Quartus II design flow still maintained for legacy IP reuse. Key features of the EP1S30F780I6 include 3,247 logic array blocks (LABs), embedded multiplier blocks for DSP, a phase-locked loop (PLL) network for clock management, and support for external memory interfaces including DDR SDRAM and QDR SRAM via dedicated DQS circuitry. The 130 nm process supports core clock rates up to approximately 450 MHz per the manufacturer's data, and the FCBGA substrate delivers the signal-integrity headroom needed for LVDS, SSTL, and HSTL I/O standards operating simultaneously. Typical applications include high-speed serial protocol bridging, telecom line cards, military/aerospace signal processing, and image processing pipelines. Stratix FPGAs were also widely deployed in ASIC prototyping platforms where the combination of on-chip RAM and DSP blocks allowed engineers to validate multi-million-gate designs before tape-out. When designing with the EP1S30F780I6, plan your power budget around the 1.5 V core rail, the auxiliary 3.3 V I/O supply, and the PLL analog rail. Stratix parts typically require multi-rail sequencing - consult the Stratix device family datasheet for the canonical power-on sequence. The 780-FBGA (29x29 mm) package is not user-reworkable, so socket-based debug is recommended during bring-up. This page synthesizes distributor inventory, same-family drop-in alternatives from the Site MPN list, and practical design guidance not consolidated in the original datasheet PDF.

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EP1S30F780I6N - Stratix FPGA, 32.5K LE, 780-BGA | Intel / Altera
EP1S30F780I6N

EP1S30F780I6N - Stratix FPGA, 32.5K LE, 780-BGA | Intel / Altera

The Intel (formerly Altera) EP1S30F780I6N is a member of the Stratix FPGA family, delivering 32,470 logic elements in a 780-pin FineLine BGA (FBGA) package with industrial-grade temperature rating. Built on a 130 nm process and fabricated by Intel/Altera, this device integrates 3,317,184 bits of embedded memory and 597 user I/O pins to support high-bandwidth parallel interfaces and DSP-intensive workloads. According to the Stratix Device Handbook, the device is targeted at high-performance logic, on-chip memory, and DSP-intensive applications such as communications infrastructure and signal processing. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically configured by the customer after manufacture to implement arbitrary digital logic. In the system hierarchy, FPGAs sit between general-purpose CPUs/GPUs and fixed-function ASICs: they offer parallelism and customizable I/O like an ASIC, but are reprogrammable like software. FPGAs belong to the broader category of programmable logic devices (PLDs), which also include CPLDs (Complex Programmable Logic Devices). The Stratix family is positioned as a high-performance, feature-rich tier above the lower-cost Cyclone and MAX families within Intel/Altera's portfolio. Key features of the EP1S30F780I6N include 32,470 logic elements (LEs), dedicated DSP blocks for high-speed arithmetic, embedded RAM (TriMatrix memory), high-speed transceivers in selected device variants, and built-in support for multiple I/O standards including LVDS, LVTTL, SSTL, and HSTL. The 'I6' suffix indicates industrial temperature range (-40C to +100C ambient), while 'N' indicates lead-free / Pb-free terminal finish. The device is supported by the Quartus II design toolchain, enabling logic synthesis, place-and-route, timing analysis, and on-chip debugging via SignalTap. Typical applications for the EP1S30F780I6N span telecommunications infrastructure (line cards, protocol bridges), DSP front-ends for base stations and radar, high-speed serial protocol bridging (custom bridges for legacy parallel buses), video processing and image pre-processing, and high-performance industrial control. With 597 I/O pins, it can drive multi-channel data acquisition or memory interfaces without external bus switches. When designing with this device, verify PCB footprint dimensions against the 780-ball FBGA FineLine BGA package datasheet. The 130 nm process has relatively high static current compared to modern 28 nm FPGAs, so thermal management and power-supply decoupling require careful budgeting for production-grade reliability. For engineers evaluating alternatives, the EP1S30F780I6N is part of the Stratix I family of FPGAs and shares the 780-pin FBGA footprint with speed-grade (-6) and temperature-grade (industrial) siblings. Re-use of layout depends on the specific variant. For new designs targeting Stratix, note that the Stratix family is now mature and design teams typically migrate to Stratix V or Cyclone V / Cyclone 10 for new projects. This page synthesizes distributor pricing from DigiKey/Mouser/Octopart, the Stratix Device Handbook specifications, and practical design notes not found in the manufacturer datasheet alone - including drop-in cross-references and PCB layout guidance for the 780-ball FBGA package.

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EP1S40B956C6 - Stratix FPGA, 41,250 Cells, BGA-956 | Intel
EP1S40B956C6

EP1S40B956C6 - Stratix FPGA, 41,250 Cells, BGA-956 | Intel

The Intel (formerly Altera) EP1S40B956C6 is a high-density Stratix-family field-programmable gate array (FPGA) implementing 41,250 logic cells and 4,125 logic array blocks (LABs) in a 956-ball fine-pitch BGA (40 x 40 mm, 1.27 mm pitch) package. It belongs to the -6 commercial speed grade and is specified for operation from 0C to 85C, with up to 683 user I/O pins. The device is fabricated on a 1.5 V core CMOS process and is one of the largest members of the original Stratix family. A field-programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs/LABs), programmable interconnects, programmable I/O cells, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit at the top of the programmable logic hierarchy (below ASICs but above CPLDs) and are classified as programmable logic devices (PLDs) within the broader semiconductor category. Stratix FPGAs in particular target high-performance applications requiring embedded memory, DSP, and gigabit serial I/O. The EP1S40B956C6 differentiates from lower-density Stratix parts through its 4,125 LABs and 46,970 CLB-equivalent register count, providing the capacity to host multi-million-gate system designs. It integrates TriMatrix memory (M512/M4K/M-RAM blocks), embedded DSP blocks, and up to twelve global clock networks with PLL support. Compared with Stratix GX variants, the EP1S40B956C6 omits dedicated gigabit transceivers, positioning it for parallel-I/O and memory-rich designs rather than serial-protocol applications. Typical applications include high-performance digital signal processing, telecom line cards, ASIC prototyping, video and image processing pipelines, and embedded control with on-chip processors. The 956-ball BGA package and 683 user I/O pins support high-bandwidth parallel memory interfaces (DDR/DDR2) and multiple industry-standard buses. Combined with the Quartus II design toolchain, the EP1S40B956C6 enables rapid design iteration for prototyping and production deployment. When designing with this device, pay close attention to power-plane decoupling and thermal dissipation of the FCBGA package. Use at least one 0.1 uF decoupling capacitor per power pin, distribute multiple VTT and VCCINT planes across the PCB stack-up, and verify signal-integrity simulations for high-speed DDR/DDR2 interfaces. The -6 speed grade is the slowest in the Stratix family and is typically chosen for cost-sensitive designs or for engineering prototypes.

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EP1S40B956C6N - Stratix FPGA, 41250 LEs, 956-BGA | Intel / Altera
EP1S40B956C6N

EP1S40B956C6N - Stratix FPGA, 41250 LEs, 956-BGA | Intel / Altera

The Intel (formerly Altera) EP1S40B956C6N is a Stratix-family Field-Programmable Gate Array (FPGA) housed in a 956-ball FineLine BGA package measuring 40 mm x 40 mm with 1.27 mm ball pitch. Built on a 0.13 µm CMOS process, the device integrates 41,250 logic elements, 3,423,744 RAM bits, and 683 user I/Os, while operating from a 1.425 V to 1.575 V supply and supporting commercial 0 °C to 85 °C ambient temperatures. It belongs to the Altera Stratix generation, the first family to embed TriMatrix memory blocks and DSP blocks alongside the Logic Array Blocks (LABs), enabling high-throughput DSP and memory-intensive designs. A Field-Programmable Gate Array is a semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that designers can configure after manufacture using an HDL-defined bitstream. FPGAs sit between fixed-function ASICs (best performance per watt, highest NRE) and microcontrollers (lowest flexibility, lowest cost at low volumes), and are typically chosen for ASIC prototyping, signal processing, custom I/O bridging, and time-to-market-critical glue logic. The Stratix family, introduced in 2002, was Altera's first high-end family with embedded DSP and TriMatrix memory, paving the way for subsequent Stratix II/III/IV/V families. The EP1S40B956C6N's headline specifications include 4,125 LABs, 6 embedded DSP blocks (or per-die DSP rows depending on speed grade), 14 embedded memory blocks totaling approximately 3.4 Mbit, and 683 maximum user I/O pins. The 956-BGA (FCBGA) package exposes 16 high-speed transceiver channels and multiple PLL blocks for clock synthesis. Configuration is supported via JTAG (IEEE 1149.1) and passive/active serial schemes using Altera's classic Quartus II design flow. Typical applications include ASIC prototyping for networking line cards, telecom baseband preprocessing, military/defense signal processing, broadcast video switching fabrics, and high-performance DSP co-processing. Its combination of high logic density and embedded memory also made the part popular for early Software Defined Radio (SDR) and image processing pipelines. When designing with this part, allocate generous PCB routing layers for the 1.27 mm-pitch BGA, use multiple decoupling capacitor values (0.1 µF, 1 µF, 10 µF) per power pin, and verify signal-integrity on high-speed LVDS and clock traces. The legacy -6 speed grade indicates slower timing closure than -7/-8 grades; budget 15-25 % additional timing margin. Engineers should consult the official Stratix Device Handbook for transceiver and PLL block-level schematics before tape-out.

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