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EP1S25B672C7 - Stratix 25,660 LC FPGA, 420 MHz, 672-BGA | Intel
EP1S25B672C7

EP1S25B672C7 - Stratix 25,660 LC FPGA, 420 MHz, 672-BGA | Intel

The Intel (Altera) EP1S25B672C7 is a Stratix-family Field-Programmable Gate Array (FPGA) integrating 25,660 logic cells (2566 logic array blocks) and 1,944,576 bits of embedded memory in a 672-pin BGA package on a 130 nm CMOS process. Per the verified distributor listing, the device supports up to 473 user I/O and is specified for a 1.5 V core supply, with a speed-grade internal performance figure of 420.17 MHz (C7 commercial speed grade). An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) within the broader integrated-circuit family, sitting hierarchically under: logic IC -> programmable logic -> FPGA -> SRAM-based FPGA -> Stratix series. Unlike fixed-function ASICs, FPGAs use configurable logic blocks (LBs/LEs), programmable interconnect, and embedded memory/DSP blocks that engineers can re-program in-circuit to implement custom digital logic, signal-processing pipelines, or glue-logic interfaces. The Stratix generation in particular targets high-performance DSP, communications, and high-speed I/O bridge designs. Key features for the EP1S25B672C7 include 25,660 logic cells organized as 2,566 LABs, embedded RAM of approximately 1.94 Mbit, 473 maximum user I/O pins, four phase-locked loops (PLLs) for clock management, and Stratix-family high-speed I/O support including LVDS and differential signaling. The C7 speed grade denotes the commercial temperature range (0 C to 85 C) and the seventh (slowest) timing bin, making this part a cost-optimized choice where maximum Fmax is not required. Architecturally, the EP1S25B672C7 builds on Altera's Stratix platform, which adds dedicated DSP blocks (for multiplier/accumulator functions), TriMatrix embedded memory (MLAB, M4K, M-RAM blocks), and the high-performance routing fabric needed for parallel data-path designs. Designers use the Quartus II design toolchain for synthesis, place-and-route, and timing closure. Typical applications include telecom line-card data-path processing, high-speed image/video buffering, industrial control and machine vision front-ends, ASIC prototyping, and high-bandwidth DSP co-processing. The 672-BGA's 35 x 35 mm body and 1.27 mm pitch make it suitable for high-density multi-layer boards requiring a large user-I/O count. When designing with this part, note that the 1.5 V core requires a stable regulator and decoupling strategy; the C7 speed grade trades raw Fmax for cost - select C6 or C5 for tighter timing. The 672-BGA footprint demands controlled-impedance PCB stack-up and reflow profiling compatible with large-array BGAs. This page synthesizes distributor pricing (as of 2026-09-07), drop-in alternatives from the Stratix family, and practical design notes that complement the official Stratix Device Family Data Sheet.

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EP1S25B672C7N - Stratix 25K LEs FPGA 672-BGA | Intel (Altera)
EP1S25B672C7N

EP1S25B672C7N - Stratix 25K LEs FPGA 672-BGA | Intel (Altera)

The Intel (formerly Altera) EP1S25B672C7N is a high-density Stratix family Field-Programmable Gate Array built on a 130 nm CMOS process, integrating 25,660 logic elements (cells) with a maximum operating frequency of 420.17 MHz, all packaged in a 672-pin BGA (35 mm × 35 mm, 1.27 mm pitch). It operates from a 1.5 V core supply and is offered in the commercial temperature grade (0 °C to 85 °C, denoted by the C7N suffix). An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic fabric, interconnect, and I/O cells can be reconfigured by the end user after manufacture. FPGAs occupy a unique position in the digital design hierarchy: above fixed-function ASICs in flexibility, below software-defined processors in per-cycle performance, and increasingly paired with embedded ARM cores, DSP blocks, and high-speed transceivers for system-on-chip designs. Stratix devices in particular target ASIC prototyping, high-performance DSP, telecom line cards, and signal-intelligence workloads. Key features include 473 user I/O pins, dedicated on-chip memory (TriMatrix blocks), DSP blocks for high-throughput multiply-accumulate operations, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL via the Stratix I/O ring. The EP1S25B672C7N is configured via SRAM cells and supports JTAG (IEEE 1149.1) boundary-scan plus in-system programming via the Altera/Quartus toolchain. Architecturally, the device pairs a four-input LUT-based logic array element (LE) with embedded RAM, multiplier-accumulators, and a hierarchical row/column interconnect fabric that spans the die. The 1.5 V core with PLLs supports multiple clock domains, while the high pin-count BGA exposes enough I/O to drive external DDR SDRAM, parallel buses, and high-speed serial links through companion transceivers. Typical applications include ASIC prototyping and emulation, high-performance digital signal processing (wireless basestations, software-defined radio), industrial imaging and machine-vision pipelines, telecom line cards and packet processors, and military/aerospace signal-intelligence platforms. The commercial temperature grade suits lab, NPI, and indoor industrial deployments. When designing with this part, plan for dedicated VCCINT, VCCIO bank rails, PLL analog supplies, and decoupling; the Quartus fitter output reports per-bank I/O standard assignments and pin assignments that must be reviewed against the PCB stackup. Distributor pricing reflects the part's lifecycle (now in end-of-life migration, with newer Stratix/Cyclone/Agilex families superseding it). This page synthesizes current distributor pricing, same-family drop-in alternatives, and practical design considerations specific to the 672-BGA Stratix variant, data not aggregated on individual datasheet distributor pages.

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EP1S25F1020C5 - Stratix 25K LE FPGA 1020-BGA | Altera / Intel
EP1S25F1020C5

EP1S25F1020C5 - Stratix 25K LE FPGA 1020-BGA | Altera / Intel

The Altera (Intel) EP1S25F1020C5 is a Stratix family Field-Programmable Gate Array (FPGA) IC with 25,660 logic elements (LEs), 1,944,576 bits of embedded memory, and 706 user I/Os, housed in a 1020-ball Flip-Chip FineLine BGA (FC-FBGA) package. It is fabricated on a 1.5 V, 130 nm CMOS process with support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and operates across a commercial extended temperature grade. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that sits within the semiconductor hierarchy between fixed-function ASICs and software-driven processors. It contains an array of configurable logic blocks (LABs), embedded memory blocks, DSP blocks, and programmable routing, all of which are customized by the user via a hardware description language (HDL) such as VHDL or Verilog. Stratix-class FPGAs are positioned above CPLDs and below ASICs in performance, density, and cost, and are commonly used as prototyping vehicles, mid-volume production logic, and signal-processing engines. Key features of the EP1S25F1020C5 include 2,566 Logic Array Blocks (LABs), up to 500 MHz internal operation, dedicated DSP blocks for high-speed multiply-accumulate operations, embedded TriMatrix memory of 1.94 Mbits, and four phase-locked loops (PLLs) for clock management. The device supports high-speed external memory interfaces including DDR SDRAM, FCRAM, QDR SRAM, and RLDRAM through dedicated PHY circuitry. Architecturally, the Stratix family integrates hard intellectual property (IP) blocks such as DSP blocks and high-speed transceivers (where applicable), reducing the need for soft logic implementation of common functions. The 130 nm process node balances density and power, while the FC-FBGA 1020-ball package provides the high pin count required for parallel digital buses and memory interfaces. The 'C5' speed grade indicates a specific timing closure tier; 'N' suffix versions add lead-free compliance. Typical applications include high-performance digital signal processing, telecom baseband processing, video and image processing pipelines, ASIC prototyping, and high-bandwidth data acquisition. The combination of DSP blocks, embedded memory, and high I/O count also suits the device for industrial control and test equipment. When designing with this part, ensure that PCB layout accommodates the 1020-ball FC-FBGA land pattern with controlled-impedance routing, decoupling capacitors placed within the package breakout region, and a robust multi-rail power distribution network. Quartus II development software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternative candidates, and design guidance that complements the manufacturer datasheet for engineers evaluating the EP1S25F1020C5 against modern FPGA alternatives.

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EP1S25F1020C5N - Stratix 25,660 LEs FPGA 1020-FBGA | Intel
EP1S25F1020C5N

EP1S25F1020C5N - Stratix 25,660 LEs FPGA 1020-FBGA | Intel

The Intel (formerly Altera) EP1S25F1020C5N is a Stratix family Field-Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, integrating 25,660 logic cells, 2,852 Configurable Logic Blocks (CLBs), and 706 user I/O pins in a 1020-ball Fine-pitch Chip-Scale BGA (FC-FBGA) measuring 33 x 33 mm with 1.0 mm ball pitch. A Field-Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. FPGAs sit in the broader semiconductor taxonomy between Application-Specific Integrated Circuits (ASICs) and general-purpose processors, offering hardware-level parallelism for high-throughput signal processing while remaining reprogrammable. The Stratix family occupies the high-performance tier within Intel's FPGA portfolio, with later generations (Stratix II/III/IV/V) building on this architecture. Key specifications include 1.5 V core supply voltage, 500 MHz maximum operating frequency, and 25660 logic cells delivering DSP-grade performance. The device includes embedded memory (TriMatrix), DSP blocks, and high-speed transceivers for serial connectivity. The 706 user I/O pins across the 1020-ball FC-FBGA package provide ample LVDS and LVCMOS signaling capacity for high-bandwidth data acquisition and telecom infrastructure. Technically, the EP1S25F1020C5N leverages a lookup-table (LUT)-based architecture with embedded RAM, dedicated multiplier blocks, and a hierarchical routing network. Its position in the Stratix hierarchy - below the EP1S40 and EP1S60 but above the EP1S10/EP1S20 - makes it suitable for mid-density designs requiring hundreds of thousands of system gates. Typical applications include high-speed digital signal processing, telecommunications baseband processing, ASIC prototyping, and test and measurement instrumentation. The C5N suffix denotes the commercial temperature grade (0 to 85 C) and a -5 speed grade, with N indicating lead-free packaging. This combination suits lab, prototyping, and commercial embedded environments where industrial temperature ranges are not required. When designing with this device, ensure PCB layout accommodates the 1.0 mm pitch BGA with appropriate via-in-pad or dog-bone fanout. Configuration via JTAG or supported boot PROM (EPCS) is required at power-up; the Quartus II design software (legacy versions supported) generates the configuration bitstream. This page synthesizes distributor stock, drop-in Intel/Stratix-family alternatives, and engineering guidance that the raw datasheet alone does not present, giving procurement and design engineers a single reference for evaluating the EP1S25F1020C5N.

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EP1S25F1020C6 - 25K LE Stratix FPGA, 706 I/O, FBGA-1020 | Intel
EP1S25F1020C6

EP1S25F1020C6 - 25K LE Stratix FPGA, 706 I/O, FBGA-1020 | Intel

The Intel EP1S25F1020C6 is a member of the Stratix FPGA family built on a 130 nm CMOS process with 1.5 V core supply, integrating 25,660 logic elements across 2,566 logic array blocks (LABs), 1,944,576 bits of embedded memory, and 706 user I/Os in a 1020-ball flip-chip BGA package. Operating up to 450 MHz with six internal clock PLLs and a configurable memory structure, it targets high-bandwidth digital signal processing and high-speed parallel I/O designs. The device is offered in the commercial extended temperature grade (0 C to +85 C) and ships in a 33 mm x 33 mm, 1 mm pitch FC-FBGA footprint. A Field Programmable Gate Array (FPGA) is a reconfigurable digital logic IC that implements arbitrary logic functions through programmable look-up tables (LUTs), routing, and embedded resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs and ASICs, offering higher logic density, higher performance, and richer on-chip peripherals than CPLDs while remaining reprogrammable. Stratix FPGAs from Intel (formerly Altera) are part of the high-end programmable-logic class of semiconductor devices used in networking infrastructure, military radios, and ASIC prototyping. Key features of the EP1S25F1020C6 include 1,944,576 bits of embedded SRAM distributed across TriMatrix memory blocks (512-bit M512, 4-Kbit M4K, and 512-Kbit M-RAM), dedicated hardware multipliers and DSP blocks for fixed- and floating-point arithmetic, up to 12 fast LVDS channels per side with on-chip termination, and six PLLs supporting a wide range of clock management tasks. Designers can configure the device in active serial, passive serial, or JTAG mode using the dedicated configuration pins. Architecturally, the EP1S25F1020C6 leverages the Stratix Logic Element (LE) with a 4-input fracturable LUT plus dedicated carry chain, register chain, and arithmetic primitives. The MultiTrack interconnect routes signals between LABs, memory, DSP blocks, and I/O via row and column routing with speed-preserving pipelining. The 1.5 V core is supported by 3.3 V, 2.5 V, and 1.8 V I/O standards, including LVDS, LVPECL, SSTL, and HSTL, enabling direct connection to external memory and high-speed converters. Typical applications include high-end telecommunications switching, military and aerospace signal processing, ASIC prototyping, video broadcast equipment, and medical imaging front-ends. The 706 user I/Os suit designs requiring wide parallel buses such as DDR SDRAM controllers, while the high logic density accommodates multi-channel DSP pipelines. When designing with this device, plan for the 1 mm ball pitch FC-FBGA, which requires multi-layer PCB fabrication with microvia or via-in-pad technology and at least 6-8 routing layers. Thermal management should account for the larger die size; a thermal resistance estimate based on the FC-FBGA package and ambient airflow must be included in board-level simulations. This page synthesizes distributor pricing, package-level alternatives, and practical FPGA design notes that are not consolidated in the Stratix Family Data Sheet.

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EP1S25F1020C6N - Stratix 25K LE FPGA, 706 I/O, FBGA-1020 | Intel
EP1S25F1020C6N

EP1S25F1020C6N - Stratix 25K LE FPGA, 706 I/O, FBGA-1020 | Intel

The Intel (formerly Altera) EP1S25F1020C6N is a member of the original Stratix FPGA family, delivering 25,660 logic elements (LEs) and 1,944,576 bits of embedded RAM in a 1020-ball FineLine BGA (FC-FBGA, 33 x 33 mm, 1 mm pitch) package. It is built on a 130 nm CMOS process, operates from a 1.5 V core supply, and is rated for the commercial temperature range 0C to 85C. According to the Altera Stratix Device Family datasheet, the device integrates 25660 logic cells, a high-performance TriMatrix memory architecture, and DSP blocks optimized for digital signal processing. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that can be customized after manufacturing using a hardware description language (HDL) bitstream. FPGAs occupy a specific tier of the digital semiconductor hierarchy: they sit above general-purpose microcontrollers in raw parallel computational throughput but below ASICs in per-unit cost efficiency. Stratix family FPGAs target high-bandwidth signal processing, telecom/datacom line cards, and prototyping platforms where time-to-market outweighs the cost-per-gate penalty of structured ASIC. Key differentiating specifications include 706 user I/O pins, embedded multiplier blocks, up to 12 transceiver channels (per Stratix family architecture), and a maximum internal clock frequency near 450 MHz. The FC-FBGA-1020 package uses flip-chip interconnect for improved electrical and thermal performance, enabling higher I/O counts at finer pitches than wire-bonded BGAs of equivalent area. The commercial grade temperature range makes the EP1S25F1020C6N suitable for controlled-environment applications rather than industrial or automotive deployments. Typical applications include telecom line cards, high-speed data acquisition backplanes, video broadcast equipment, and ASIC prototyping for protocol bridges and DSP pipelines. The high I/O count (706 pins) and substantial embedded memory (1,944,576 bits) make this device well-suited for multi-channel baseband processing where parallel data paths are required. Designers transitioning to newer process nodes should evaluate Cyclone IV/V or Stratix IV/V equivalents for active lifecycle and toolchain support, since the original Stratix family is no longer in active production. When designing with this part, ensure a proper decoupling network on each core and I/O voltage rail, follow Altera's flip-chip PCB layout guidelines for the 1 mm-pitch BGA, and use Quartus II (legacy versions) for synthesis, place-and-route, and bitstream generation. The Stratix family uses 1.5 V VCCINT, and reliable configuration requires the EPC configuration device family or JTAG download cable compatible with legacy Quartus Programmer.

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EP1S25F1020C7 - Stratix 25,660-Cell FPGA, 706 I/O, 1020-BGA | Altera
EP1S25F1020C7

EP1S25F1020C7 - Stratix 25,660-Cell FPGA, 706 I/O, 1020-BGA | Altera

The Altera (Intel) EP1S25F1020C7 is a member of the Stratix® FPGA family built on a 130 nm CMOS process, integrating 25,660 logic elements across 2,566 LABs/CLBs and offering 1,944,576 bits of embedded memory. The device provides 706 user I/O pins housed in a 1,020-ball FineLine BGA package operating at a core voltage of 1.5 V with a commercial temperature grade of 0 °C to 85 °C. A high-performance embedded array block, embedded multiplier blocks, and on-chip DSP capability make it suitable for signal-processing pipelines. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device that combines programmable logic blocks, interconnect, and I/O on a single die, allowing engineers to implement custom digital logic after manufacturing. FPGAs sit above microcontrollers in design flexibility but below ASICs in per-unit cost; they are widely used for ASIC prototyping, DSP, glue logic, high-speed I/O bridging, and parallel processing. The Stratix family in particular is Altera's high-performance, logic-rich line optimized for communications, video, and DSP workloads. Key features of the EP1S25F1020C7 include 2566 logic array blocks, four phase-locked loops (PLLs) for clock synthesis, and configurable high-speed I/O standards including LVDS and SSTL. The device also supports multiple configuration modes (Passive Serial, Active Serial, JTAG) and includes dedicated hardware multipliers that accelerate DSP operations up to 420 MHz internal operation. The 33 x 33 mm package with 1 mm ball pitch is JEDEC compliant for fine-pitch BGA assembly. Architecturally, the Stratix EP1S25 employs an ALM-based logic fabric with embedded TriMatrix memory blocks distributed in columns, providing high-bandwidth on-chip storage for FIFO and packet-buffer use cases. The DSP blocks implement hardened 9x9, 18x18, and 36x36 multiply-accumulate functions, freeing fabric for additional logic. Differential I/O with up to 80 LVDS channels supports high-speed chip-to-chip links. Typical applications include ASIC prototyping, telecom line-card DSP, video processing, network switching fabrics, military/aerospace signal processing, and high-speed data-acquisition front-ends. It is also commonly used in FPGA-based prototyping of next-generation SoCs and as glue logic in test-and-measurement equipment. Design considerations: ensure signal integrity on the 1 mm-pitch BGA through controlled-impedance routing and matched-length LVDS pairs. The commercial-grade temperature range (0 °C to 85 °C) limits use in industrial or automotive environments; for extended temperature, choose the EP1S25F1020I7 variant. Note this part is now obsolete/EOL — verify long-term supply through franchised distributors or licensed independent stock. This page synthesizes distributor pricing, drop-in same-package alternatives from the same Altera Stratix family, and practical design notes not consolidated in the original datasheet.

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EP1S25F1020I6 - Stratix 25K LE FPGA, 706 I/O, FC-FBGA-1020 | Altera
EP1S25F1020I6

EP1S25F1020I6 - Stratix 25K LE FPGA, 706 I/O, FC-FBGA-1020 | Altera

The Altera EP1S25F1020I6 is a member of the Stratix® family of high-performance Field Programmable Gate Arrays (FPGAs), built on a 1.5V, 130 nm CMOS process and packaged in a 1020-ball FineLine BGA (FC-FBGA) measuring 33 x 33 mm with 1 mm pitch. The device integrates 25,660 logic elements distributed across 2,566 Logic Array Blocks (LABs), 1,944,576 bits of embedded RAM (1,944 Kbits ≈ 1.85 Mbits), and supports up to 706 user I/O pins. Its industrial-grade -40 °C to +85 °C operating range and Stratix DSP blocks make it a long-standing workhorse for high-throughput signal processing and bus-interface designs. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric is composed of programmable Look-Up Tables (LUTs), flip-flops, embedded memory, and routing channels that can be electrically rewired to implement arbitrary digital circuits. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs, distinguished by their higher logic density, embedded DSP blocks, high-speed transceivers, and on-chip memory. The Stratix family in particular targets ASIC-replacement applications where deterministic throughput, parallel processing, and rich I/O bandwidth outweigh the lower unit cost of a hard ASIC. Key features of the EP1S25F1020I6 include 25,660 logic elements (LEs), 1,944,576 RAM bits (≈ 1.85 Mbits), 2,566 LABs, and up to 706 user I/Os. The device is built on Altera's 130 nm process and is supplied by a 1.5 V core rail. Per Altera's Stratix Family Data Sheet, the part supports configuration via passive serial, fast passive parallel, JTAG, and Altera's enhanced configuration devices, plus on-chip PLL-based clock management for high-speed timing closure. The architecture combines LUT-based logic, embedded TriMatrix memory blocks, and dedicated DSP blocks optimized for multiply-accumulate operations. The 1.85 Mbit embedded memory is organised into M512, M4K, and MegaRAM blocks for flexible buffering of wide datapaths. Distributed routing and ALM-style adaptive logic ensure predictable timing closure at moderate clock frequencies reported by distributors in the 420 MHz to 450 MHz range. Typical applications include telecommunications backplane bridging, high-speed serial protocol bridging (PCI Express, RapidIO), video and imaging pipelines, ASIC prototyping, and industrial control DSP blocks. The 706 user I/O pins comfortably interface to wide parallel buses, DDR memory controllers, and high-pin-count companion chips. Design tip: Use Altera's Quartus II design software (the supported toolchain for this Stratix generation) for synthesis, place-and-route, and timing closure; modern Quartus Prime releases maintain legacy support for older Stratix silicon. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that are not consolidated in the original Altera datasheet, giving engineers a single reference for sourcing the EP1S25F1020I6 today.

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EP1S25F1020I6N - Stratix 25,660-Cell FPGA 1020-BGA | Intel / Altera
EP1S25F1020I6N

EP1S25F1020I6N - Stratix 25,660-Cell FPGA 1020-BGA | Intel / Altera

The Intel / Altera EP1S25F1020I6N is a high-density Field Programmable Gate Array from the original Altera Stratix family, fabricated on a 130 nm CMOS process with 25,660 logic cells, 2,566 logic array blocks (LABs), and 706 user I/Os housed in a 1020-ball FineLine BGA (FC-FBGA, 33 × 33 mm, 1 mm pitch). The device operates from a 1.5 V core supply and supports enhanced-block DSP, embedded TriMatrix memory, and high-speed transceivers in selected family members. A Field Programmable Gate Array (FPGA) is a programmable logic device whose architecture sits between fixed-function ASICs and software-programmed processors: it consists of an array of configurable logic blocks (here organized into LABs), programmable routing, dedicated hard IP such as memory blocks and DSP slices, and a perimeter of user I/O buffers. Within the broader taxonomy, an FPGA belongs to the programmable logic sub-category of digital semiconductors, alongside CPLDs and structured ASICs. Key features of the EP1S25F1020I6N include 1,944,576 bits of embedded memory, multi-gigabit transceiver support on related Stratix variants, an industrial operating temperature range of 0 °C to +85 °C per the device suffix, and a 1.5 V core supply with separate VCCIO banks for mixed-voltage I/O. The FC-FBGA-1020 package uses fine-pitch flip-chip BGA construction to meet the high I/O count and signal-integrity requirements of the Stratix architecture. The 130 nm process node, combined with Stratix's DirectDrive and MultiTrack interconnect, gives the EP1S25 a balance of density, performance, and predictability that made the family a mainstream choice for early-2000s communications, video-processing, and high-speed prototyping designs. Its 1020-pin BGA supports 706 user I/Os and dedicated clock, configuration, and transceiver pins. Typical applications include wireline communications line cards, video broadcast and image processing, military and aerospace signal processing, high-performance ASIC prototyping, and test and measurement instrumentation. Industrial-grade temperature screening (the I6 suffix indicates an industrial operating range) makes the part suitable for non-automotive but thermally demanding environments. When designing with this part, plan PCB layout for a 33 × 33 mm 1 mm-pitch BGA; allocate at least six PCB layers with dedicated power and ground planes, and follow Altera's Stratix pin connection guidelines for unused pins, configuration mode pins, and JTAG signals. This page synthesizes distributor pricing, drop-in alternatives within the Stratix family, and practical design notes not found in the original datasheet.

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EP1S25F672C5N - Stratix FPGA 25,660 Cells, 672-FBGA | Intel
EP1S25F672C5N

EP1S25F672C5N - Stratix FPGA 25,660 Cells, 672-FBGA | Intel

The Intel EP1S25F672C5N is a member of the Stratix FPGA family built on a 130 nm CMOS process, delivering 25,660 logic cells with up to 500 MHz internal operation in a 672-pin FineLine BGA package. It is positioned in the mid-density Stratix tier, providing a balance of logic, embedded memory, and DSP resources for high-performance programmable logic designs. The device operates from a nominal 1.5 V core supply and supports the Stratix family architecture of LABs, TriMatrix memory blocks, and DSP blocks. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing configurable logic blocks (CLBs/LABs), programmable interconnects, and I/O cells that can be re-programmed after manufacturing to implement custom digital circuits. In the broader taxonomy, FPGAs sit under programmable logic devices (PLDs) -> logic ICs -> integrated circuits. The Stratix family from Altera (now Intel) targeted high-performance applications including communications, signal processing, and ASIC prototyping. Key features of the EP1S25F672C5N include 25,660 logic elements organized into LABs, embedded TriMatrix memory blocks for distributed and block RAM, dedicated DSP blocks for high-speed multiply-accumulate operations, and high-speed LVDS I/O support. The FineLine BGA-672 package provides ample I/O count and short interconnect lengths for signal-integrity-critical designs. The "C5" speed grade and "N" lead-free designation indicate commercial temperature range (0 °C to 85 °C) with Pb-free terminal finish. Architecturally, the Stratix family uses a row-and-column-based interconnect fabric with R4/R8/R24 routing resources, dedicated clock networks with PLLs, and configuration via SRAM cells. The 130 nm process node supports the embedded memory and DSP multipliers needed for applications like baseband processing, video pipeline, and high-speed serial interfaces (when paired with external transceiver devices). Typical applications include telecom baseband processing, ASIC prototyping, high-speed data acquisition, video and image processing, and industrial control systems requiring deterministic parallel logic. The combination of logic density and DSP blocks makes the EP1S25F672C5N well suited to multi-channel DSP and protocol bridging implementations. When designing with this device, plan the power distribution network carefully: the 1.5 V core plus I/O banks at 1.5/1.8/2.5/3.3 V require multiple regulated rails. Use the Quartus II design toolchain for synthesis, place-and-route, and timing closure. Decoupling must follow Stratix device guidelines, with high-frequency capacitors placed adjacent to the BGA balls. This page synthesizes distributor pricing, drop-in alternatives from the Stratix family and cross-brand Cyclone/Stratix II families, and practical design notes not found in the manufacturer datasheet.

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EP1S25F672C6 - Stratix FPGA 25,660 LE | Intel | BGA-672
EP1S25F672C6

EP1S25F672C6 - Stratix FPGA 25,660 LE | Intel | BGA-672

The Intel EP1S25F672C6 is a member of the Stratix FPGA family implemented in 1.5V CMOS process technology with 25,660 logic elements, 1,944,576 bits of embedded memory, and a 672-ball FineLine BGA package. It is part of the first-generation Stratix series targeting high-performance digital signal processing, communications, and parallel processing applications with up to 6.4 Gbps transceiver capability in selected variants. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect, allowing hardware designers to implement custom digital logic after fabrication. The Stratix family sits within Intel's (formerly Altera's) programmable logic hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor. FPGAs differ from ASICs in that they can be re-programmed in-system, providing rapid prototyping and field upgradability. Key features of the EP1S25F672C6 include 2,852 Configurable Logic Blocks (CLBs) organized as 25,660 logic elements, 14 embedded DSP blocks, up to 473 user I/O pins, and MultiVolt I/O support for 1.5V, 1.8V, 2.5V, and 3.3V interfaces. The device supports up to 256 Kbytes of TriMatrix embedded memory using 4 Kbit M512, 32 Kbit M4K, and 512 Kbit M-RAM blocks, providing flexible on-chip storage for buffers, FIFOs, and look-up tables. The architecture combines a high-bandwidth TriMatrix memory subsystem with dedicated DSP blocks optimized for FIR filters and FFT computations. Internal clock management uses up to 12 PLLs (including enhanced PLLs), supporting multiple clock domains and zero-delay buffer configurations. The 130nm CMOS process and 1.5V core power deliver low static power relative to competing 0.13um FPGAs of the era. Typical applications include high-speed data acquisition cards, baseband processing for wireless base stations, software-defined radio (SDR), medical imaging pipelines, and industrial machine vision. Designers frequently choose the EP1S25F672C6 for new designs and migration paths because its combination of logic density, DSP throughput, and abundant I/O fits mid-range DSP and protocol-bridging tasks. When designing with this device, allocate sufficient PCB layers for the 672-ball BGA escape routing and follow Altera's Stratix Hardware Reference Manual guidelines for power plane stitching, decoupling capacitor selection, and JTAG chain topology. Plan JTAG configuration source (EPCS serial configuration device, Fast Passive Parallel, or JTAG) at project start to avoid late-stage board rework. This page synthesizes distributor pricing, drop-in same-package alternatives sourced from the Stratix family cross-reference, and practical design notes not found in the manufacturer datasheet.

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EP1S25F672C6N - Stratix 25K LEs 672-FBGA FPGA | Intel (Altera)
EP1S25F672C6N

EP1S25F672C6N - Stratix 25K LEs 672-FBGA FPGA | Intel (Altera)

The Intel (formerly Altera) EP1S25F672C6N is a Stratix family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements and 1,944,576 bits of embedded memory in a 672-ball FineLine BGA package. It provides 473 user I/O pins and is built on a 1.5 V CMOS process, making it suitable for high-density logic, on-chip memory, and high-throughput DSP designs. The part is rated for commercial operating temperature (0C to +85C) and is supplied in a 35 mm x 35 mm body with 1.27 mm ball pitch for standard SMT assembly. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure arbitrary digital circuits after PCB fabrication. FPGAs sit in the broader taxonomy of digital ICs -> programmable logic -> gate array, and they occupy the highest flexibility tier below full-custom ASICs, offering hundreds of thousands of logic gates plus dedicated blocks such as block RAM, DSP multipliers, PLLs, and high-speed transceivers. The Stratix family specifically targets high-performance applications including communications infrastructure, image processing, and ASIC prototyping where logic density and on-chip memory bandwidth dominate the design trade-off. Key features of the EP1S25F672C6N include 2566 Logic Array Blocks (LABs), embedded TriMatrix memory supporting true dual-port and FIFO modes, DSP blocks for high-speed multiplication, dedicated clock management PLLs, and support for multiple I/O standards including LVTTL, LVCMOS, SSTL, and LVDS. The 672-FBGA package exposes the full I/O count required for memory-rich and parallel-interface designs. Architecturally, Stratix devices combine a sea-of-LABs fabric with column-based embedded memory, embedded multipliers, and high-speed I/O elements. The 672-FBGA package provides controlled-impedance routing to support DDR SDRAM interfaces and external memory buses typical in networking and signal-processing designs. Typical applications include networking line cards, DSP co-processing, telecommunications equipment, video and image processing pipelines, and ASIC prototyping. The device is also used in industrial control systems that require parallel DSP throughput and deterministic real-time performance. When designing with the EP1S25F672C6N, designers should use the Quartus II development tool (or Quartus Prime for newer designs where legacy device support exists) and observe the I/O standard termination guidelines for high-speed memory interfaces. The 672-BGA requires careful PCB stackup planning with matched impedance for DDR traces. This page synthesizes distributor pricing, package diagrams, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing an integrated reference for engineers sourcing the EP1S25F672C6N.

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EP1S25F672C7 - 25K LE Stratix FPGA, 672-BGA, 420 MHz | Intel
EP1S25F672C7

EP1S25F672C7 - 25K LE Stratix FPGA, 672-BGA, 420 MHz | Intel

The Intel EP1S25F672C7 is a member of the Stratix FPGA family, delivering 25,660 logic elements (LEs), 1,944,576 RAM bits, and 473 user I/O pins in a 672-ball FineLine BGA (FBGA) package. Built on a 130 nm CMOS process with a 1.5 V core supply, the device operates at up to 420 MHz core frequency and supports embedded multipliers, TriMatrix memory blocks, and up to 6 DLLs plus 2 PLLs for high-speed clock management. The 'C7' speed grade and commercial operating temperature range (0 °C to +85 °C) make this part a mainstream mid-density Stratix for wired telecom line cards, industrial imaging, and DSP co-processing cards. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that lets engineers implement arbitrary digital logic, memory, and DSP functions in silicon. FPGAs sit in the broader category of programmable logic devices (PLDs) within the integrated circuit hierarchy: transistor -> CMOS gate -> logic cell -> logic array block -> FPGA -> ASIC-class programmable silicon. Unlike fixed-function ASICs, FPGAs are configured post-manufacture via an SRAM bitstream, allowing iterative design changes without respinning masks. The Stratix family in particular is the first-generation Intel/Altera high-density FPGA architecture, emphasizing embedded memory, DSP blocks, and high-speed serial interfaces for communications infrastructure. Key features of the EP1S25F672C7 include 2,852 Configurable Logic Blocks (CLBs), 224 embedded 18x18 multipliers, 2,103,744 total memory bits organized as TriMatrix blocks (MRAM, M512, M4K), and 12 dedicated clock networks. It supports LVDS, LVTTL, LVPECL, and 3.3 V PCI I/O standards on the same die, and provides up to 40 channels of high-speed LVDS pairs. The JTAG-compliant IEEE 1149.1 boundary-scan interface plus on-chip configuration circuitry enable in-system programming from a single configuration EPROM. Architecture-wise, the Stratix LAB contains 10 LEs with local and direct-link routing, and embedded memory is split into three block sizes for efficient buffering of small and large payloads. The 130 nm process and 1.5 V core keep dynamic power roughly proportional to toggle rate, while the commercial speed grade (-7) targets clock frequencies up to 420 MHz. Designers migrating from older APEX families get an immediate jump in on-chip memory density and DSP throughput per square millimeter. Typical applications include wired telecom line cards and DSLAM backplanes, broadcast video processing, military radar front-end preprocessing, medical imaging pipelines, and DSP co-processing accelerator cards. The 672-FBGA package provides 473 user I/O, sufficient for wide bus interfaces to external DDR SDRAM, ZBT SRAM, or QDR SRAM companion memories. Designers needing more logic density can step up to EP1S40 or EP1S60 in the same family. When designing with this device, plan the power budget carefully: a fully utilized EP1S25F672C7 can exceed 4-5 W, so a thermal pad, 6-layer PCB with internal power planes, and synchronous decoupling are mandatory. Quartus II (or its modern Quartus Prime successor) is the primary design entry, synthesis, place-and-route, and bitstream generation toolchain. This page consolidates distributor pricing, drop-in pin-compatible alternatives in the same 672-FBGA footprint, and Stratix design notes not all collected on the official datasheet.

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EP1S25F672C7N - Stratix FPGA 25K LEs 672-BBGA | Intel / Altera
EP1S25F672C7N

EP1S25F672C7N - Stratix FPGA 25K LEs 672-BBGA | Intel / Altera

The Intel / Altera EP1S25F672C7N is a member of the original Stratix FPGA family, integrating approximately 25,660 logic elements (2566 LABs) and 1,944,576 bits of embedded RAM in a 672-ball FineLine BGA package. Built on a 0.13 µm CMOS process with 1.5 V core supply and 473 user I/O pins, this device targets high-performance DSP, communications, and signal-processing applications where the TriMatrix memory architecture and dedicated DSP blocks deliver deterministic performance. The 35 × 35 mm, 1.27 mm-pitch BGA-672 package enables high-density board designs while supporting high-speed LVDS, HSTL, SSTL, and LVPECL I/O standards. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic function is defined after manufacture by a user-supplied configuration bitstream. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs, occupying the same general role as ASICs but offering in-system re-programmability, faster prototyping cycles, and lower non-recurring engineering cost. Within a digital system, an FPGA typically implements glue logic, custom datapaths, parallel DSP, packet processing, or even soft-core CPUs, making it a foundational component in the broader category of programmable logic devices (PLDs) and digital logic ICs. Key features of the EP1S25F672C7N include up to 6 full-duplex high-speed transceiver channels (model-dependent), dedicated DSP blocks for 18 × 18 multipliers at full speed, distributed and TriMatrix embedded memory, up to 12 PLLs for clock management, and 473 user I/Os. The Stratix architecture uses look-up tables (LUTs), embedded memory blocks (M512, M4K, M-RAM), and high-speed I/O elements supporting DDR SDRAM interfaces. Configuration is via JTAG or passive/active serial schemes, and the device supports in-system programming for field updates. Typical applications for the EP1S25F672C7N include high-end DSP designs (radar, baseband, video processing), communications infrastructure (line cards, protocol bridges, packet classification), test and measurement equipment, medical imaging accelerators, and military/aerospace signal processing. The combination of 25K logic elements and approximately 2 Mbit of block RAM in this BGA-672 footprint makes it well suited to mid-density datapath designs. The 0 to 85 °C commercial operating temperature grade further confirms its use in standard commercial and industrial environments rather than extended-temperature deployments. When designing with this device, plan power-rail sequencing for VCCINT (1.5 V core), VCCIO (per bank, 1.2–3.3 V), VCC_PLL, and VCC_GXB if transceivers are used. Decoupling must follow Altera's recommended guidelines with multiple low-ESL ceramics close to each supply pin. Designers should also reference the Stratix Device Handbook and AN-224 for I/O termination and signal-integrity best practices. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes beyond the manufacturer datasheet.

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EP1S25F672C8 - 25,660 LEs Stratix FPGA 672-BGA | Intel / Altera
EP1S25F672C8

EP1S25F672C8 - 25,660 LEs Stratix FPGA 672-BGA | Intel / Altera

The Intel / Altera EP1S25F672C8 is a Stratix-family Field Programmable Gate Array (FPGA) offering 25,660 logic elements, 2,566 LABs, and 473 user I/Os in a 672-ball FineLine BGA package. It is built on a 130 nm CMOS process, supports an internal core voltage of 1.5 V, and is rated for the commercial 0 C to +85 C operating range. The "C8" speed grade denotes a -8 device timing bin in the Stratix family. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines the integration density of an Application-Specific Integrated Circuit (ASIC) with the design flexibility of software-configurable hardware. FPGAs sit at the top of the programmable logic hierarchy (FPGA > CPLD > programmable logic > digital semiconductor) and are widely used for parallel data-path processing, high-speed serial interfaces, and ASIC prototyping where time-to-market and field reconfigurability outweigh raw unit cost. Key features of the EP1S25F672C8 include 25,660 logic elements organized into 2,566 Logic Array Blocks (LABs), dedicated on-chip memory blocks (TriMatrix memory), DSP blocks for high-throughput arithmetic, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates up to 40 high-speed transceiver channels in the Stratix family, providing multi-gigabit serial connectivity for communications and storage applications. From an architecture standpoint, the Stratix family employs an LUT-based fabric with embedded RAM and multiplier blocks. The 130 nm process and 1.5 V core deliver a balance of performance and power efficiency suitable for ASIC prototyping, communications infrastructure, and high-performance digital signal processing where deterministic latency and parallel execution are required. Typical applications include ASIC prototyping, telecom line-card design, video and image processing pipelines, military/aerospace signal processing, and high-speed serial interface bridging. The 672-pin BGA package supports the high I/O count needed for memory and bus interfaces in these demanding systems. When designing with the EP1S25F672C8, ensure the PCB layout follows BGA escape routing best practices and that decoupling capacitors are placed close to each power pin per the Stratix pin connection guidelines. Configuration via JTAG or an Altera configuration device must be planned at the board level. This page synthesizes distributor pricing from 19 active sources, drop-in alternatives from the same Stratix family and competitor equivalents, and practical design considerations not aggregated on a single datasheet page.

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EP1S25F672C8N - Stratix 25K LE FPGA, 672-FBGA, 1.5V | Intel
EP1S25F672C8N

EP1S25F672C8N - Stratix 25K LE FPGA, 672-FBGA, 1.5V | Intel

The Intel EP1S25F672C8N is a member of the original Stratix FPGA family, integrating 25,660 logic elements, 1,944 Kbit of embedded memory, and dedicated DSP blocks within a 672-ball FineLine BGA package. Manufactured on a 130 nm CMOS process and supplied from a 1.5 V core rail, the device delivers up to 357 MHz internal operation and is offered in a commercial 0 °C to 85 °C temperature grade. The 'C8' speed grade denotes a -8 speed bin, and the 'N' suffix indicates a lead-free, RoHS-compliant package. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital logic through SRAM-based configuration cells. Within the broader taxonomy, an FPGA belongs to programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix family was Intel's (formerly Altera's) first high-end FPGA family built on a 1.5 V core, introducing embedded TriMatrix memory, DSP blocks, and high-speed transceivers in a single fabric. These architectural elements positioned Stratix as the predecessor to Stratix II, III, and the modern Stratix 10 families. Key features of the EP1S25F672C8N include 25,660 logic elements (LEs), 1,944 Kbit of embedded RAM (in three memory block sizes), twelve embedded DSP blocks optimized for multiplication and multiply-accumulate operations, six phase-locked loops (PLLs), and up to 426 user I/O pins depending on the package's I/O bank count. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, with eight I/O banks that allow flexible voltage reference selection. Architecturally, the Stratix core combines a multi-level routing hierarchy (LAB, MegaLAB) with embedded memory, multipliers, and PLL resources distributed throughout the fabric. The 1.5 V core is paired with selectable I/O voltages per bank via VREF pins, allowing the same die to interface with 1.5 V, 1.8 V, 2.5 V, or 3.3 V peripherals without level shifters. The configuration scheme supports passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), JTAG, and Altera's EPC configuration devices. Typical applications include high-throughput digital signal processing (software-defined radio, video processing), custom protocol bridging and packet processing in telecom line cards, ASIC prototyping and emulation, high-speed data acquisition front-ends, and industrial imaging pipelines. The DSP-rich fabric makes it particularly attractive for digital filters, FFT engines, and baseband processing in mid-2000s-generation designs. When designing with this part, verify Quartus II version support for the EP1S25 family before starting firmware work. Modern toolchains (Quartus II v13.x) still support Stratix but may not include the latest security patches; users targeting new designs should evaluate Stratix II or Cyclone IV for active tool support, while existing EP1S25 boards may rely on legacy Quartus flows for long-term maintenance. This page synthesizes distributor stock, parametric comparisons against other Stratix density points, and practical design notes (decoupling, JTAG, configuration) not consolidated on any single manufacturer or distributor page.

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EP1S25F672I7 - Stratix FPGA 25660 LE, 672-FBGA | Intel / Altera
EP1S25F672I7

EP1S25F672I7 - Stratix FPGA 25660 LE, 672-FBGA | Intel / Altera

The Intel (formerly Altera) EP1S25F672I7 is a member of the Stratix FPGA family delivering 25,660 logic elements, 1,944,576 bits of embedded RAM, and 473 user I/O pins in a 672-ball FineLine BGA package. Built on a 0.13 µm CMOS process, this device integrates 2,566 LABs/CLBs, up to 6 embedded DSP blocks, and high-speed serial interfaces suited for data-path intensive designs. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O cells can be configured after manufacture to implement arbitrary digital functions ranging from glue logic to full system-on-chip prototypes. FPGAs sit between fixed-function ASICs and software-driven processors in the design hierarchy, offering hardware-timed parallelism for DSP, communications, and protocol bridging. The Stratix family specifically targets high-performance applications with embedded multipliers, memory blocks, and dedicated clock management circuitry, positioning it within the broader class of programmable logic devices (PLDs) under the semiconductor category. Key features include 473 maximum user I/O pins, a 1.5 V core supply voltage, 1.27 mm ball pitch, and industrial-grade operating temperature range of -40 °C to +100 °C (industrial) per datasheet, with 0 °C to +85 °C noted in some distribution listings. The device supports in-system programmability via JTAG, dedicated configuration circuitry, and multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL through dedicated I/O banks. Typical applications include telecom baseband processing, high-speed serial protocol bridging, software-defined radio, video processing pipelines, and ASIC prototyping. Its combination of dense logic, embedded RAM, and high I/O count makes it well suited for designs requiring parallel datapath implementation alongside flexible I/O configuration. When designing with this device, ensure PCB layout accommodates the 672-ball FBGA with controlled-impedance routing for high-speed LVDS pairs and adequate decoupling per Altera's Stratix hardware reference design. The device's obsolete lifecycle status means new designs should consider Cyclone IV/V or Stratix IV/V successors; existing designs should source from authorized distributors carrying traceable stock. This page synthesizes distributor pricing, drop-in alternatives, and engineering notes not consolidated elsewhere.

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EP1S25F672I7N - 25,660 LE Stratix FPGA, 672-FBGA | Intel / Altera
EP1S25F672I7N

EP1S25F672I7N - 25,660 LE Stratix FPGA, 672-FBGA | Intel / Altera

The Intel (formerly Altera) EP1S25F672I7N is a member of the original Stratix FPGA family, integrating 25,660 logic elements, 1.9 Mbits of embedded TriMatrix memory, and DSP blocks in a 672-ball FineLine BGA package. Fabricated on a 1.5 V, 0.13 µm CMOS process, the device supports embedded multipliers, high-speed I/O, and up to 473 user I/O pins at user-defined I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The industrial speed grade -7 variant operates across 0 °C to 85 °C junction range. An FPGA (Field Programmable Gate Array) is a reconfigurable digital logic device that allows hardware designers to implement arbitrary digital functions after PCB assembly. Stratix devices occupy the high-density, feature-rich tier of the Altera/Intel programmable logic hierarchy, sitting above Cyclone (cost-optimized) and below Stratix GX (transceiver-equipped) and Stratix II/GX (next-generation). Within a power management or embedded system, FPGAs serve as hardware accelerators, protocol bridges, glue logic, and signal-processing engines. FPGAs differ from MCUs in that logic and interconnect are user-defined rather than fetched from firmware, enabling deterministic parallel throughput. Key features of the EP1S25F672I7N include up to 25,660 logic elements, 1.9 Mbit embedded TriMatrix memory, dedicated 18×18 multipliers for DSP, support for high-speed external memory interfaces such as DDR SDRAM, QDR SRAM, and ZBT SRAM, and dedicated serial configuration support via passive serial, fast passive parallel, and JTAG. The 672-pin FineLine BGA package measures 35 × 35 mm with 1.27 mm pitch and is optimized for high pin-count, multi-layer PCB layouts. Architecturally, the Stratix family introduced the TriMatrix memory architecture with three block sizes (M512, M4K, M-RAM) to optimize silicon area across distributed and buffer-style memory requirements. The 1.5 V core supply is supported by on-chip voltage regulation requiring only a single external supply input, simplifying power tree design compared to earlier 2.5 V / 3.3 V core architectures. Typical applications include telecom line-card packet processing, military/aerospace signal processing, medical imaging accelerators, industrial machine vision, and ASIC prototyping. The wide DSP block density also suits software-defined radio baseband and digital video broadcasting infrastructure. When designing with this device, allocate 1.5 V core and dedicated PLL/IO supply rails with decoupling placed close to each BGA quadrant. Use Altera Quartus II (legacy) or Intel Quartus Prime for synthesis, place-and-route, and timing closure. Note that this part is mature legacy silicon; new designs should consider Stratix IV/V or Cyclone families for active long-term supply. This page synthesizes distributor availability, same-family Stratix drop-in alternatives, and practical configuration guidance not collected in the original manufacturer datasheet alone.

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EP1S25F780C5 - Stratix I FPGA, 25,660 LEs, 597 I/O, 780-FBGA | Altera / Intel
EP1S25F780C5

EP1S25F780C5 - Stratix I FPGA, 25,660 LEs, 597 I/O, 780-FBGA | Altera / Intel

The Altera (now Intel) EP1S25F780C5 is a member of the Stratix I family of SRAM-based Field-Programmable Gate Arrays, integrating 25,660 Logic Elements, 2,566 Logic Array Blocks (LABs), and 1,944,576 bits of embedded RAM in a 780-ball FineLine BGA (FBGA) package with 597 user I/O pins. Built on a 0.13 µm process, the device is organized around Altera's MultiTrack interconnect and embedded TriMatrix memory architecture, delivering up to 7.6 Gbps LVDS performance and dedicated DSP blocks for high-throughput arithmetic. An FPGA (Field-Programmable Gate Array) is a programmable logic device in the semiconductor hierarchy: FPGA -> programmable logic -> ASIC-class device -> integrated circuit. FPGAs are used to implement custom digital logic, glue logic, signal processing pipelines, and high-speed interfaces after the PCB has been fabricated, enabling late-stage design changes and accelerating time to market versus a full ASIC. Stratix I FPGAs were Altera's first generation to combine embedded multipliers, large TriMatrix memory blocks, and high-speed LVDS transceivers on a single die. Key differentiating features include 80 (typical) embedded DSP blocks for 9x9-bit to 36x36-bit multiplication, 14 clock networks with up to 8 PLLs per device, support for external memory interfaces such as DDR SDRAM, QDR SRAM, and ZBT SRAM, and 1.5 V core operation. The 780-FBGA package exposes 597 user I/O across 8 banks, providing abundant LVDS pairs and routing flexibility for memory-rich and I/O-intensive designs. The architecture is well suited to telecom line cards, digital video broadcasting equipment, and high-speed serial interfaces where a large logic budget plus embedded multipliers reduce external component count. The 'C5' speed grade trades absolute Fmax for lower static power, making the C5 variant a typical choice for industrial-grade designs that prioritize thermal margin over raw clock rate. Typical applications include telecom baseband processing, software-defined radio (SDR), high-end image processing, and ASIC prototyping platforms. Designers should pay particular attention to power estimation with the Quartus II PowerPlay tool because the static current scales strongly with VCCINT and junction temperature.

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EP1S25F780C5N - 25K LE Stratix FPGA 780-FBGA | Intel
EP1S25F780C5N

EP1S25F780C5N - 25K LE Stratix FPGA 780-FBGA | Intel

The Intel EP1S25F780C5N is a high-density Stratix-family Field-Programmable Gate Array (FPGA) built on a 130 nm CMOS process and packaged in a 780-ball FineLine BGA (FBGA) measuring 29 x 29 mm with a 1.0 mm ball pitch. It integrates 25,660 logic elements across 2,566 Logic Array Blocks (LABs) and provides up to 597 user I/O pins, making it one of the largest members of the first-generation Stratix family. The device operates from a 1.5 V core supply and supports commercial-extended temperature grades (0 to 85 C). An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) connected by programmable interconnect. The bitstream stored in on-chip SRAM configures both the logic function of each block and the routing between them. FPGAs are widely used for high-performance parallel processing, glue logic, prototyping, and ASIC replacement where time-to-market matters more than per-unit cost. The Stratix family in particular was the first Intel/Altera platform to embed dedicated DSP blocks, TriMatrix memory, and high-speed transceivers on-chip. Key features of the EP1S25F780C5N include up to 1.92 Mbits of embedded TriMatrix memory, dedicated DSP blocks for fixed- and floating-point arithmetic, support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL), and 4 phase-locked loops (PLLs) for clock management. The 597 user I/O pins are organized into 12 I/O banks, supporting a wide range of single-ended and differential interfaces including PCI, PCI-X, DDR, and RapidIO. The 780-pin FBGA package enables high signal density for complex board designs. The device supports configuration via passive serial, passive parallel synchronous, passive parallel asynchronous, and JTAG modes. Configuration bitstreams are stored in external EEPROM or flash and loaded into on-chip SRAM at power-up. The 130 nm process provides a mature, well-characterized fabric with proven reliability for telecom, industrial, and military applications. Typical applications include high-throughput digital signal processing (radar, software-defined radio, video processing), telecom line cards, ASIC prototyping, industrial control systems, and high-speed serial interface bridging. The combination of large logic capacity and dedicated DSP blocks makes the EP1S25 well suited for data-path intensive designs where parallel arithmetic performance is critical. When designing with this device, pay close attention to power sequencing and decoupling. The 780-FBGA package requires a multi-layer PCB with continuous power and ground planes. Use the Quartus II design software (version 5.x or later, as required for the Stratix family) for synthesis, place-and-route, and timing closure. Note that the EP1S25 series is end-of-life as newer Stratix/Cyclone generations have superseded it; consult the Intel/Altera Product Discontinuance notices before committing to long-lifecycle designs. This page synthesizes current distributor pricing, lifecycle status, drop-in same-package alternatives, and Quartus II design considerations not found in the original manufacturer datasheet alone. Engineers evaluating the EP1S25F780C5N should cross-reference part numbers EP1S25F672I7N, EP1S20F780C5N, and EP1S10F780C5N as same-package and same-family drop-in alternatives already catalogued on this site.

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EP1S25F780C6 - Stratix FPGA 25K LE, 597 I/O, 780-FBGA | Altera
EP1S25F780C6

EP1S25F780C6 - Stratix FPGA 25K LE, 597 I/O, 780-FBGA | Altera

The Altera EP1S25F780C6 is a member of the original Stratix FPGA family built on a 130 nm CMOS process, integrating 25,660 logic elements, 1,944,576 bits of embedded RAM, and 597 user I/O in a 780-ball FineLine BGA package. Operating from a 1.5 V core supply (with multi-volt I/O support), the device delivers up to 450 MHz internal performance and is rated for the commercial 0C to 85C temperature range (the "C6" speed grade). What is a Stratix FPGA? The Stratix family is Altera's first-generation high-performance FPGA architecture (introduced 2002), combining programmable logic, embedded memory blocks (TriMatrix), embedded multipliers (DSP blocks), and high-speed transceivers in a single device. FPGAs sit at the top of the programmable-logic hierarchy - above CPLDs - and below ASICs - giving engineers a reconfigurable alternative to custom silicon. Stratix devices were widely adopted in telecom line cards, military signal processing, and high-speed serial-link prototypes during the mid-2000s. Key features include dedicated DSP blocks for high-throughput multiply-accumulate operations, support for external memory interfaces including DDR SDRAM and QDR SRAM via dedicated DQS circuitry, embedded PLLs for clock management, and configuration via passive serial, fast passive parallel, or JTAG modes. The 780-pin FBGA package exposes the full I/O count and supports multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL) on a per-pin basis, enabling direct interfacing to parallel buses, memory chips, and differential signaling links. Technical depth: the EP1S25 is fabricated in 1.5 V 130 nm CMOS with copper interconnect, contains 2,566 LABs (logic array blocks), and offers TriMatrix memory architecture (MRAM, M4K, M512 blocks). The 1.5 V core combined with selectable I/O voltages (1.5/1.8/2.5/3.3 V) allows bridging between legacy 5 V-TTL peripherals and modern low-voltage memory. Typical applications include telecom line-card interface logic, military/aerospace signal processing, custom DSP pipelines, bus-bridging glue logic between processors and peripherals, and prototype ASIC verification using the Stratix logic density. When designing with this legacy device, note that new designs should generally target Cyclone or Arria families; the EP1S25F780C6 is best reserved for sustaining production of existing Stratix-based boards where proven firmware and proven PCB layouts must be preserved.

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EP1S25F780C6N - Stratix 25K LE FPGA, 597 I/O, 780-BGA | Altera
EP1S25F780C6N

EP1S25F780C6N - Stratix 25K LE FPGA, 597 I/O, 780-BGA | Altera

The Altera (now Intel) EP1S25F780C6N is a Stratix family Field Programmable Gate Array (FPGA) built on a 130nm process, offering 25,660 logic elements and 1,944,576 bits of embedded memory in a 780-ball FineLine BGA (FC-FBGA) package. It provides 597 user I/O pins and is rated for commercial temperature operation (0C to +85C). The device includes 80 DSP blocks and 12 PLLs, making it suitable for high-performance digital signal processing and high-speed serial interfacing. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that allow engineers to implement arbitrary digital logic. FPGAs occupy the high-performance tier above microcontrollers and CPLDs in the programmable logic hierarchy, delivering parallel processing, deterministic timing, and the ability to be re-programmed in-system. The Stratix family, introduced by Altera in 2002, was the company's first FPGA family built on a 0.13 micron process and was positioned for high-end DSP, communications infrastructure, and ASIC prototyping applications. Key features include support for up to 12 channels of high-speed transceivers depending on die variant, embedded TriMatrix memory blocks distributed throughout the fabric, and up to 80 DSP blocks optimized for high-throughput multiplication-accumulation operations. The 780-FBGA package exposes 597 user I/O pins and supports vertical migration within the Stratix family, allowing engineers to design PCBs that accommodate EP1S10, EP1S20, and EP1S25 density points on a single footprint. Architecture-wise, the EP1S25F780C6N integrates a network of LUT-based logic elements, embedded array blocks (EABs), and a hierarchical interconnect fabric routed by Altera's Quartus II design software. The on-chip PLLs provide clock multiplication, division, and phase shifting for high-speed synchronous designs. Configuration is supported via JTAG, passive serial, or passive parallel modes through dedicated configuration pins. Typical applications include high-speed data acquisition cards, telecommunications switching fabric, ASIC prototyping, video broadcast equipment, and military/aerospace signal processing. The wide I/O count and high logic density make it well suited for multi-channel DSP systems and complex state machines. When designing with this part, ensure that your PCB layout respects the FBGA ball pitch requirements and that thermal management accounts for the higher power dissipation typical of Stratix devices at full utilization. Use Altera Quartus II design software (version 13.0 or earlier for legacy support) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP1S25F780C7 - Stratix 25K LEs, 780-BGA FPGA | Intel / Altera
EP1S25F780C7

EP1S25F780C7 - Stratix 25K LEs, 780-BGA FPGA | Intel / Altera

The Intel / Altera EP1S25F780C7 is a Stratix family Field Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, delivering 25,660 logic elements, 597 user I/Os, and 1,944,576 bits of embedded memory. It is housed in a 780-ball FineLine BGA (FC-FBGA) package measuring 29 x 29 mm with 1 mm ball pitch, and operates from a 1.5 V core supply at up to 420.17 MHz internal performance. A Stratix FPGA is a SRAM-based, look-up-table-driven programmable logic device that integrates configurable logic blocks (CLBs / LEs), embedded memory arrays, DSP blocks, high-speed transceiver circuitry, and a programmable interconnect fabric on a single die. Stratix sits in the FPGA hierarchy as: FPGA > programmable logic device > SRAM-based FPGA > high-performance FPGA. The architecture targets high-bandwidth, compute-intensive digital systems where deterministic timing and parallel processing are required. The EP1S25F780C7 includes 2,566 LABs (Logic Array Blocks) each containing ten logic elements, embedded DSP blocks for fixed- and floating-point arithmetic, TriMatrix on-chip memory (MRAM blocks), and up to 12 channels of high-speed 840 Mbps LVDS signaling per device. The 'F' suffix indicates the FineLine BGA package, '780' denotes the 780-ball pinout, 'C7' indicates the commercial temperature grade (0C to +85C) and speed grade 7. The device supports configuration via passive serial, fast passive parallel, JTAG, or Altera EPC configuration devices. Typical applications for the EP1S25F780C7 include telecom line cards, high-performance DSP pipelines, baseband signal processing in wireless infrastructure, network switches and routers, broadcast video processing, and ASIC prototyping. The high LE count combined with embedded DSP blocks and multi-gigabit transceivers makes the device particularly suited to data-plane applications requiring deterministic parallel throughput. When designing with the EP1S25F780C7, ensure proper decoupling on each power rail (VCCINT, VCCIO, VCC_PLL, VCCA) using 0.1 uF and 10 uF ceramic capacitors placed close to the BGA balls. Plan PCB escape routing carefully: 1 mm pitch BGA requires microvia or via-in-pad technology on 6+ layer stack-ups. The device is now mature and was last produced in the original Stratix generation - for new designs, evaluate Cyclone 10, Arria 10, or Agilex families for active lifecycle support. This page synthesizes distributor pricing, drop-in speed-grade alternatives, package data, and practical design notes that complement the official datasheet.

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EP1S25F780C7N - 25K LE Stratix FPGA, 597 I/O, 780-BGA | Intel
EP1S25F780C7N

EP1S25F780C7N - 25K LE Stratix FPGA, 597 I/O, 780-BGA | Intel

The Intel (Altera) EP1S25F780C7N is a member of the original Stratix FPGA family, delivering 25,660 logic elements, 1,944,576 bits of embedded memory, and 597 user I/O in a 780-ball FineLine BGA (FBGA) package. Built on a 1.5 V, 130 nm CMOS process, it integrates up to 420 MHz DSP blocks, embedded TriMatrix memory, and high-speed transceivers for digital signal processing and datapath-intensive designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets designers implement arbitrary digital logic, memory, and I/O protocols in a single device. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic devices (CPLD) -> FPGAs -> high-density FPGAs -> SoC FPGAs, occupying the high-end segment where ASIC-class performance and flexibility are required. Key features of the EP1S25F780C7N include 2,566 LABs (Logic Array Blocks), dedicated DSP blocks delivering up to 4.29 GMACS performance, 12 embedded PLLs for clock management, and configurable I/O standards including LVDS, SSTL, and HSTL. The device supports both passive serial and fast passive parallel configuration schemes through dedicated JTAG and configuration pins. The Stratix architecture combines a hierarchical interconnect with embedded SRAM, distributed logic, and DSP multipliers, enabling high-throughput pipelined datapaths for DSP, communications, and image processing. The 780-ball FBGA package provides ample signal integrity for high-speed differential interfaces and offers a robust thermal path via the substrate. Typical applications include telecom baseband processing, software defined radio, high-speed image and video processing, ASIC prototyping, and PCI Express endpoint designs. The combination of high logic density, embedded multipliers, and high pin count makes it well suited to multi-channel DSP pipelines and protocol bridging subsystems. When designing with this device, plan configuration scheme (AS, PS, FPP, JTAG) up front, allocate enough decoupling (10 uF bulk + 0.1 uF per VCC/GND pair), and reserve clock and PLL pins early in the pin planner to avoid costly re-routes. Refer to the Stratix Device Handbook for board layout and signal-integrity guidelines. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing, replacement, and PCB-level integration decisions.

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