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EP2AGX45DF29I3N - Arria II GX FPGA 42K LE 364 I/O | Intel
EP2AGX45DF29I3N

EP2AGX45DF29I3N - Arria II GX FPGA 42K LE 364 I/O | Intel

The Intel EP2AGX45DF29I3N is a member of the Arria II GX family of mid-range FPGAs fabricated on a 40 nm process, delivering 42,959 logic elements, 1,805 logic array blocks (LABs), and 3,517,440 bits of embedded RAM in a 780-ball flip-chip BGA (FC-FBGA, package code DF29). The device integrates up to eight 3.125 Gbps transceivers and a hard PCIe Gen1/Gen2 controller, making it a drop-in candidate for serial-connectivity applications such as industrial vision, broadcast video, and wireless backhaul. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory and DSP resources. Within the broader product hierarchy, an FPGA sits between a microcontroller and an ASIC: it offers far higher logic density than any MCU, yet unlike a fixed-function ASIC it can be re-programmed in the field through SRAM-based configuration. The Arria II GX family specifically targets mid-bandwidth, transceiver-rich applications that exceed the capability of Cyclone IV/V devices but do not justify the cost of high-end Stratix families. Key features of the EP2AGX45DF29I3N include 364 user I/O pins, support for DDR2/DDR3/QDRII+ external memory interfaces, dedicated DSP blocks for high-speed fixed-point and floating-point arithmetic, and industrial temperature-grade operation from -40 C to +100 C. The -I3 speed grade corresponds to the slowest industrial speed bin, optimized for lower dynamic power rather than maximum Fmax, which makes it well suited to thermally constrained enclosures. Architecture-wise, the device combines a sea-of-LABs fabric, true dual-port M9K memory blocks, MLAB blocks for distributed RAM, and multiplier-accumulators inside the DSP array. The transceiver blocks (GX) support protocols such as PCIe Gen2 x1/x4, XAUI, Serial RapidIO, CPRI, and OBSAI, while the hard PCIe IP controller reduces soft-logic overhead and latency. Typical applications for this part include software-defined radio (SDR) baseband processing, video capture and display pipelines (SDI / DisplayPort bridging), industrial control backplanes with deterministic low-latency serial links, test and measurement equipment that streams aggregated data over PCIe, and radar front-end pre-processing where transceiver density and on-chip memory matter more than absolute logic capacity. When designing with this part, use the Quartus II design suite (13.0sp1 or later is recommended for Arria II GX support) and validate signal-integrity with the IBIS-AMI models published in the device datasheet. The FC-FBGA package requires a multi-layer PCB with controlled-impedance routing; expect 6-8 routing layers for full 364 I/O breakout at production yield. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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EP2AGX45DF29I3NAD - 42K LE Arria II GX FPGA 780-FBGA | Intel
EP2AGX45DF29I3NAD

EP2AGX45DF29I3NAD - 42K LE Arria II GX FPGA 780-FBGA | Intel

The Intel EP2AGX45DF29I3NAD is a high-performance Arria II GX Field-Programmable Gate Array (FPGA) with 42,959 logic elements, 3,517,440 bits of embedded RAM, and 364 user I/Os, housed in a 780-ball FineLine BGA (FBGA) package with integrated transceivers. Built on a 40 nm low-power process, the Arria II GX family targets mid-range applications requiring a balance of logic density, memory bandwidth, and multi-gigabit serial connectivity. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure arbitrary digital logic, memory blocks, and I/O after manufacturing. In the broader taxonomy, the Arria II GX sits between Intel's Cyclone (low-cost) and Stratix (high-performance) families, with integrated transceivers that compete against Xilinx Kintex and AMD Versal mid-range devices. The 780-FBGA package places this part firmly in the high-density, transceiver-rich tier of mid-range FPGAs. Key features of the EP2AGX45DF29I3NAD include 42,959 logic elements (LEs), 1,805 Logic Array Blocks (LABs), 3,517,440 bits of embedded RAM, 364 user I/Os, and dedicated multi-gigabit transceivers. The device also integrates 156 (typical) 18x18 multipliers for DSP workloads and embedded PCIe hard IP blocks, enabling protocol bridging and high-speed serial interface implementation without consuming soft logic resources. The Arria II GX architecture combines an 8-input adaptive logic module (ALM) fabric with embedded memory, multiplier blocks, and PLLs. The integrated transceivers operate from 600 Mbps to 6.375 Gbps, supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, CPRI, and OBSAI. This makes the family well suited to wireline backhaul, broadcast video, and high-end industrial imaging. Typical applications include high-speed serial protocol bridging (PCIe to XAUI/10G Ethernet), wireless baseband and digital radio, broadcast and professional video processing, and test and measurement instrumentation. The combination of mid-range logic density and integrated multi-gigabit transceivers makes the EP2AGX45DF29I3NAD especially attractive for cost-sensitive designs that still need serial connectivity at line rates up to 6.375 Gbps. When designing with this device, ensure the PCB supports the FBGA 780-ball land pattern with appropriate via-in-pad or microvia technology for reliable manufacturing. Multi-gigabit transceivers require strict impedance control and length matching; consult the Arria II GX Transceiver User Guide for eye-diagram, pre-emphasis, and equalization settings. Power estimation should be performed using the Intel PowerPlay early power estimator before board bring-up. This page synthesizes distributor pricing, drop-in Arria II GX speed-grade and temperature-grade alternatives, and practical design considerations not consolidated in the manufacturer datasheet.

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EP2AGX45DF29I4N - Arria II GX FPGA, 45K LE, 780-FCBGA | Altera
EP2AGX45DF29I4N

EP2AGX45DF29I4N - Arria II GX FPGA, 45K LE, 780-FCBGA | Altera

The Altera (Intel) EP2AGX45DF29I4N is a 45 nm Arria II GX mid-range FPGA from the Arria II GX family, integrating 42,959 logic elements (LEs), 3,517,440 RAM bits, and up to 364 user I/Os in a 780-ball flip-chip BGA (FCBGA) package. This member of the Arria II GX Device Handbook lineup combines a programmable logic fabric with embedded transceivers, delivering an optimal balance of logic density, DSP bandwidth, and serial I/O for mid-range applications. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as transceivers, DSP slices, and block RAM. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, but unlike CPLDs they target high-density, high-throughput designs. The Arria II GX family specifically targets mid-range applications that need a balance of logic density, embedded transceivers up to 6.375 Gbps, and PCI Express hard IP, bridging the gap between Cyclone (low-cost) and Stratix (high-performance) families. Key features of the EP2AGX45DF29I4N include up to 6.375 Gbps embedded transceivers, dedicated DSP blocks for high-speed arithmetic, 8-input adaptive logic modules (ALMs), and configuration via passive serial, fast passive parallel, or JTAG. The device integrates hard IP for PCI Express Gen1 (x1/x4/x8) and external memory interfaces supporting DDR2/DDR3/QDRII+ with on-chip termination and read/write leveling. Architecturally, the EP2AGX45DF29I4N uses a 45 nm process with adaptive logic modules (ALMs) that double the effective logic capacity per LE compared to 4-input LUT architectures. Each ALM contains two combinational adaptive LUTs (ALUTs) plus two dedicated registers. The fabric also embeds M9K and M144K memory blocks, variable-precision DSP blocks, and clock management with PLLs, enabling designs that demand both flexibility and deterministic performance. Typical applications include wireless infrastructure baseband processing, video broadcast equipment, military radar signal processing, medical imaging, and high-speed serial protocol bridging. The 780-ball FCBGA package provides sufficient I/O density for high-bandwidth designs while supporting industrial temperature operation up to 100C junction. When designing with this FPGA, leverage Quartus II software (preferred version 11.1 or later) for compilation and pin planning. Pay attention to transceiver reference clock jitter and decoupling strategy; multiple decoupling capacitor values (100 nF, 10 nF, 1 uF) placed close to each power pin minimize power-supply-induced jitter on high-speed serial links. This page synthesizes manufacturer datasheet specifications, distributor pricing, drop-in Arria II GX alternatives, and practical design notes not found in the standalone datasheet.

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EP2AGX45DF29I5 - Arria II GX FPGA 42.9K LEs 780-FBGA | Intel
EP2AGX45DF29I5

EP2AGX45DF29I5 - Arria II GX FPGA 42.9K LEs 780-FBGA | Intel

The Intel (Altera) EP2AGX45DF29I5 is a member of the Arria II GX family of FPGAs, a 40nm mid-range programmable logic device that integrates transceivers and a hard PCIe Gen2 IP block. Built on 42,959 logic elements across 1,805 logic array blocks (LABs) and 364 user I/Os, the device provides 3,517,440 bits of embedded memory organized as 564 18x18 multipliers, and is housed in a 780-ball FC-FBGA package. According to the Arria II GX family datasheet, the EP2AGX45DF29I5 operates from a 0.9 V core supply, supports up to 8 transceivers at 3.75 Gbps, and includes 1 hard PCIe Gen2 x4 IP block. An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose digital logic function is defined after manufacturing by the user. Within the semiconductor hierarchy, FPGAs sit between general-purpose CPUs and application-specific integrated circuits (ASICs), offering a balance of flexibility, time-to-market, and parallel-processing performance. The Arria II GX family in particular belongs to the mid-range class, optimized for applications that require integrated high-speed transceivers and protocol hard IP but at lower cost than high-end Stratix-class parts. Key features of the EP2AGX45DF29I5 include 8 full-duplex transceiver channels supporting data rates from 600 Mbps to 3.75 Gbps, a hard PCIe Gen2 x4 IP block for direct host interface, 564 18x18 multipliers suitable for DSP-intensive signal processing, and 3.5 Mbits of on-chip RAM distributed between M9K blocks and MLABs. The 780-FBGA package supports high-speed I/O and transceiver ball assignments, with -I5 speed grade indicating a specific commercial operating temperature range and performance bin. The device is fabricated on TSMC's 40nm process node, which balances static power consumption against performance. The transceiver and PLL blocks are hardened, meaning they occupy dedicated silicon that does not consume programmable logic resources, leaving the 42.9K logic elements available for user-defined state machines, control logic, and datapath applications. Typical applications include video broadcast and professional video processing where 3G-SDI/HD-SDI transceivers can be implemented on-chip, industrial and medical imaging requiring mid-density DSP performance, and high-speed serial interface bridging (PCIe Gen2, Serial RapidIO, Gigabit Ethernet). The 780-FBGA package is also well-suited to test and measurement equipment where multiple protocol interfaces must be supported simultaneously. When designing with the EP2AGX45DF29I5, engineers should pay close attention to transceiver reference-clock routing and PCB stack-up, because the 3.75 Gbps serial links demand controlled-impedance differential pairs. Power-rail sequencing for the 0.9 V core and transceiver analog supplies is also critical; Altera's PowerPlay early power estimator must be run before board layout to confirm thermal envelope and decoupling strategy. This page consolidates distributor pricing, same-family drop-in alternatives, and practical design notes that complement the official Arria II GX Device Handbook, giving procurement and design teams a single reference for evaluation.

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EP2AGX45DF29I5G - Arria II GX FPGA, 45K LE, 3.5Mbit | Intel
EP2AGX45DF29I5G

EP2AGX45DF29I5G - Arria II GX FPGA, 45K LE, 3.5Mbit | Intel

The Intel EP2AGX45DF29I5G is a member of the Arria II GX family of mid-range FPGAs integrating 45,000 logic elements (LEs), 3,517,440 bits of embedded memory, and 364 user I/O pins in a 780-ball FCBGA package with integrated transceivers. The part is specified at the industrial speed grade (I5), targeting systems that require a balance of logic density, on-chip memory bandwidth, and multi-gigabit serial connectivity at moderate power. According to the verified distributor listing, the device is housed in a 780-BBGA / FCBGA package and operates from a nominal 0.9 V core supply with separate transceiver and auxiliary rails. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement arbitrary digital logic functions, memory blocks, DSP arithmetic, and high-speed serial interfaces on a single silicon die. Within the programmable-logic taxonomy, FPGAs sit between fixed-function ASICs (which offer the highest density and lowest unit cost at scale but no post-tape-out flexibility) and CPLDs (which are simpler, non-volatile, and used for glue logic). The Arria II GX family specifically targets mid-bandwidth applications that need integrated transceivers without the cost or power of higher-end Stratix-class parts, placing it in the broader hierarchy of programmable-logic devices -> FPGAs -> mid-range FPGAs with transceivers. Key features of the EP2AGX45DF29I5G include 45,000 LEs, 3,517,440 embedded memory bits, 42,959 logic elements per the simplified datasheet summary, and 364 maximum user I/Os. The device also embeds dedicated 18x18 multipliers for DSP workloads, PLLs for clock management, and multi-gigabit transceivers supporting common backplane and chip-to-chip protocols. The integrated transceivers eliminate external PHY ICs in many designs, simplifying board layout and BOM. The architectural core uses a sea-of-LUTs fabric combined with embedded SRAM blocks, hardware DSP slices, and high-speed serial interface tiles. The transceiver tiles support data rates typical of the Arria II GX family for protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and common serial digital interface rates. The 780-ball FCBGA package provides the I/O density required to break out the 364 user I/Os while preserving signal integrity for the multi-gigabit links. Typical applications include wireless baseband and radio card preprocessing, broadcast video bridging and processing, military and aerospace signal acquisition, and high-speed serial protocol bridging. The combination of mid-range logic density with integrated transceivers also suits imaging, medical imaging back-ends, and industrial test instrumentation where deterministic latency and high data throughput are required. When designing with this part, allocate the LVDS and transceiver pairs to the package's dedicated banks before general-purpose I/O to preserve signal integrity and meet the multi-gigibt routing constraints. Use the Altera/Intel Quartus II design software (which supports the Arria II GX device family) for place-and-route, timing closure, and transceiver channel configuration; failure to meet transceiver reference-clock jitter budgets is a common cause of link-up failures in production. This page synthesizes distributor availability, drop-in same-package alternatives from the Arria II GX family, and practical design notes that go beyond the manufacturer datasheet summary, giving engineers a faster path to part selection and qualification.

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EP2AGX45DF29I5N - Arria II GX FPGA 45K LE FC-FBGA-780 | Intel
EP2AGX45DF29I5N

EP2AGX45DF29I5N - Arria II GX FPGA 45K LE FC-FBGA-780 | Intel

The Intel EP2AGX45DF29I5N is a high-performance Arria II GX Field Programmable Gate Array (FPGA) featuring 42,959 logic elements, 1,805 Logic Array Blocks (LABs), and 364 user I/Os, housed in a 780-ball flip-chip FineLine BGA (FC-FBGA-780) package. Built on a 40 nm process, this device integrates up to 8.3 Mbits of embedded memory and dedicated transceivers optimized for high-speed serial connectivity, targeting cost-sensitive mid-range applications. What is an FPGA? A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that lets designers implement custom digital logic via a hardware description language, then re-program the device after manufacturing. Within the broader programmable logic taxonomy, FPGAs sit alongside CPLDs as the two main branches of programmable logic devices; the Arria II GX family further specializes as a transceiver-rich mid-range family optimized for serial connectivity protocols including PCI Express Gen2, Gigabit Ethernet, and Serial RapidIO. This positions the EP2AGX45DF29I5N as a power- and cost-optimized mid-density alternative to high-end Stratix devices and a step up from Cyclone IV/ V families. Key features include 3.5 Mbits of M9K embedded memory blocks, 4 PLLs per device, and high-speed transceivers with data rates up to 3.75 Gbps. The device operates from a 0.9 V core supply with multiple auxiliary rails and supports industrial temperature range (-40C to +100C case). The FC-FBGA-780 flip-chip package provides excellent thermal and electrical performance suitable for high-density PCB designs. The Arria II GX architecture employs logic element-based fabric with dedicated DSP blocks for signal processing, hard PCIe Gen2 IP cores, and embedded SERDES channels. This combination delivers deterministic performance and protocol-ready interfaces, reducing soft-IP development time and silicon real estate. The 40 nm low-power process reduces dynamic power consumption relative to previous-generation 65 nm Arria GX devices. Typical applications include wireless infrastructure baseband processing, video broadcast equipment, industrial imaging and machine vision, military/aerospace signal processing, and PCI Express endpoint cards. The integrated transceivers and PCIe hard IP make it particularly well-suited for protocols requiring multi-gigabit serial links with minimal external components. When designing with this device, allocate sufficient PCB layers (typically 8-12) for the FC-FBGA-780 breakout, observe controlled-impedance routing for transceiver channels, and follow Intel's recommended decoupling scheme. Designers should use Quartus II design software (v13.0 or later) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design guidance not assembled in the manufacturer datasheet.

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EP2AGX45DF29I6N - Arria II GX FPGA 43K LE, 780-FCBGA | Intel (Altera)
EP2AGX45DF29I6N

EP2AGX45DF29I6N - Arria II GX FPGA 43K LE, 780-FCBGA | Intel (Altera)

The Intel (formerly Altera) EP2AGX45DF29I6N is a mid-density Arria II GX Field Programmable Gate Array (FPGA) from the 40-nm Arria II device family, packaged in a 780-ball FineLine BGA (FCBGA, also called UBGA-780) and shipping in the industrial temperature grade (-40C to +100C ambient). It integrates approximately 42,960 logic elements (ALMs/LEs, vendor-reported 42,959 / 43,000 marketing figure), 1,728 Kbits of embedded memory (M9K + M144K blocks, ~1.7 Mb per Altera naming), 364 user I/O pins, and up to 8 high-speed transceiver channels capable of supporting multi-gigabit serial protocols. The device family is engineered specifically to ease transceiver-based design by integrating hard IP for PCI Express (PIPE), Gigabit Ethernet (GigE, XAUI, SGMII) and DDR3 memory interfaces, removing the need for soft PHY implementations. An FPGA is a programmable logic device that lets engineers implement arbitrary digital logic, DSP blocks, memory controllers, and high-speed serial interfaces by configuring an array of logic elements, dedicated multipliers, and hard IP blocks after manufacture. FPGAs sit between general-purpose microcontrollers (fixed instruction set, lower performance) and ASICs (highest performance, no field reprogrammability). The Arria II GX family occupies the mid-range "transceiver-rich" tier - below Stratix IV/V but above Cyclone IV/IV GX - optimized for cost-sensitive applications that still need multi-gigabit serial links. Key features of EP2AGX45DF29I6N include up to 8 integrated transceivers supporting data rates up to 6.375 Gbps (C6 speed grade, "6" suffix), on-chip hard memory controllers for DDR3, hard PCI Express Gen1/Gen2 endpoints (x1/x4), and a programmable logic fabric based on 8-input adaptive logic modules (ALMs). The device is built on TSMC's 40-nm process, dramatically reducing static and dynamic power versus the prior 65-nm Stratix IV generation, while maintaining signal integrity for serial interfaces. Adaptive logic modules (ALMs) provide 8-input fracturable look-up tables, which improve effective logic utilization for wide multiplexers and adder trees common in DSP pipelines. The 780-FCBGA FineLine BGA package offers controlled-impedance escape for the 8 transceiver channels and ample user I/O for parallel interfaces. The "I6" speed/temperature suffix indicates industrial temperature grade and speed grade 6 (one of the fastest transceiver speed bins in Arria II GX). Lower speed grades (C6, I5, C5, I4, C4, I3, C3) trade maximum transceiver frequency for lower dynamic power. Typical applications for the EP2AGX45DF29I6N include PCI Express endpoint cards (Gen2 x4), broadcast video processing, motor control DSP back-ends, software-defined radio (SDR) baseband, medical imaging pre-processing, and industrial vision systems that need 1-3 Gbps LVDS links to image sensors. The integrated hard PCIe and DDR3 controllers reduce soft logic overhead, leaving more ALMs available for application-specific signal processing. When designing with the EP2AGX45DF29I6N, allocate at least 4 PCB layers for transceiver break-out routing, provide continuous ground planes under the BGA array, and follow the Quartus II pin connection guidelines for unused transceiver pins (tie Rx to VCCR, Tx to VCCT through the documented bias network). Engineers migrating from Arria II GZ, Stratix IV, or Cyclone IV GX can reuse much of the Quartus IP catalog, but should regenerate timing constraints for the target speed grade. This page synthesizes verified distributor data, package-level pin compatibility across Arria II GX speed grades, and practical design notes not found in the manufacturer datasheet, helping procurement engineers, FPGA designers, and supply-chain managers evaluate the EP2AGX45DF29I6N against its alternatives.

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EP2AGX65CU1713N - Arria II GX FPGA 65K LE BGA-1713 | Altera
EP2AGX65CU1713N

EP2AGX65CU1713N - Arria II GX FPGA 65K LE BGA-1713 | Altera

The Altera (Intel PSG) EP2AGX65CU1713N is a member of the Arria II GX family of mid-range, transceiver-equipped FPGAs, integrating 65,210 logic elements (LE), 2,620 Kbit of embedded memory, and eight 3.125 Gbps multi-gigabit transceivers in a 1713-ball flip-chip BGA package. This device is built on a 40 nm low-power process and is targeted at applications requiring a balanced combination of logic density, on-chip memory bandwidth, and serial connectivity. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, programmable I/O, and dedicated hard-IP blocks such as transceivers, memory controllers, and DSP slices. The Arria II GX family belongs to the mid-range tier of Altera's FPGA portfolio, positioned below the high-end Stratix series and above the low-power Cyclone series, and optimized for cost-sensitive applications that still demand integrated transceivers and DSP capability. Key features include 2,620 Kbit of embedded SRAM, 12 PLLs, 8 transceiver channels supporting data rates from 600 Mbps to 3.125 Gbps, hard IP for PCI Express Gen1 (x1, x4) and Gen2 (x1, x4), and dedicated 6x9-bit to 36x36-bit hardware multipliers for DSP. The device supports up to 612 user I/Os arranged across multiple I/O banks with LVDS, LVPECL, HSTL, SSTL, and LVCMOS standards. Configuration is supported via JTAG, AS, PS, and FPP modes, with on-chip 8-bit CRC and bitstream encryption (AES-128/256). The Arria II GX architecture features dedicated transceiver physical coding sublayer (PCS) blocks, dynamic reconfiguration support via Partial Reconfiguration, and SignalTap II embedded logic analyzer capability. The 1713-ball BGA package uses flip-chip technology with a 40 mm x 40 mm body, providing high I/O count and excellent thermal performance. Typical applications include wireless baseband processing, video broadcast equipment, industrial imaging, military radar signal processing, and PCI Express endpoint cards. The integrated transceivers make it particularly suitable for serial backplane interfaces, SRIO, CPRI, and Aurora protocol applications. When designing with this device, pay close attention to transceiver reference clock jitter, PCB laminate selection for SerDes channels, and thermal management of the 1713-ball BGA. The BGA package requires X-ray inspection during PCB assembly. This page synthesizes distributor pricing, drop-in alternatives from the Arria II GX family, and practical design notes that complement the manufacturer datasheet for procurement and engineering decisions.

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EP2AGX65CU17C4G - 65nm Arria II GX FPGA, 156 I/O, 358-UBGA | Altera
EP2AGX65CU17C4G

EP2AGX65CU17C4G - 65nm Arria II GX FPGA, 156 I/O, 358-UBGA | Altera

The Altera (Intel) EP2AGX65CU17C4G is a 65 nm Arria II GX Field Programmable Gate Array (FPGA) delivering 60,214 logic elements and 5,371,904 bits of embedded memory in a 358-ball UBGA (FCBGA) package. Per the Arria II device family datasheet, it is configured with 156 user I/O pins and integrates up to 12 transceiver channels, making it cost-optimized for mid-range serial connectivity and digital signal processing workloads. What is an FPGA? A Field Programmable Gate Array is a semiconductor device built from a matrix of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory blocks, programmable I/O, and (in GX-class parts) multi-gigabit transceivers, all wired through a programmable interconnect. FPGAs sit at the intersection of ASIC efficiency and processor flexibility within the broader semiconductor hierarchy: programmable logic > FPGA > configurable logic device > integrated circuit. Arria II GX is positioned as the mid-density, transceiver-rich node in the Arria II family, above Cyclone but below Stratix in Altera's portfolio. Key features of the EP2AGX65CU17C4G include: 60,214 logic elements, 5,371,904 bits of embedded RAM, 312 (18x18) multipliers, support for DDR2/DDR3/QDRII external memory interfaces, eight 3.125 Gbps transceivers, and an operating temperature range of 0 °C to 85 °C. The "C4" speed grade denotes a specific Fmax tier relative to other C-speed parts in the family. The 17 mm × 17 mm 358-ball FCBGA package is the standard footprint for the EP2AGX65 family in this ballout, preserving pin-compatibility with other C-speed and I-speed EP2AGX65 devices in the same ball array. The architecture combines an 8-input adaptive logic module (ALM), embedded RAM blocks (M9K and M144K), variable-precision DSP blocks, and PLL-based clock management with up to 12 global clock networks. The transceiver hard IP supports PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI protocols, removing the need for external PHY silicon in many designs. Typical applications include wireless baseband processing, video broadcast and image processing pipelines, industrial protocol bridging, and PCI Express endpoint cards. The transceiver density is well matched to designs requiring two or three 3G-SDI links, dual GbE ports, or single x4 PCIe endpoints. Compared with pure logic-only FPGAs of the era, the integrated transceivers reduce BOM count and board area for serial-interface designs. When designing with this device, plan power sequencing early - the EP2AGX65 requires multiple supply rails (core, I/O, transceiver, auxiliary) and a smart power controller such as an Altera Enpirion or compatible LDO/DC-DC solution. Pin-compatible speed-grade and temperature variants allow Fmax or temperature upgrades without PCB rework. This page synthesizes distributor pricing, drop-in alternatives, comparison data, and practical design guidance not found in a single manufacturer document, providing engineers with a consolidated reference for sourcing and designing around the EP2AGX65CU17C4G.

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EP2AGX65CU17C4N - Arria II GX FPGA 60K LE 358-UBGA | Intel
EP2AGX65CU17C4N

EP2AGX65CU17C4N - Arria II GX FPGA 60K LE 358-UBGA | Intel

The Intel (Altera) EP2AGX65CU17C4N is a high-density, low-power Arria II GX Field Programmable Gate Array (FPGA) integrating 60,214 logic elements, 5,371,904 bits of embedded memory, and up to 156 general-purpose user I/Os in a 358-ball flip-chip Ultra FineLine BGA (UBGA) package. Built on a 40nm process and supplied from a 0.9V core, the device is optimized for high-throughput serial connectivity with multi-gigabit transceivers, making it well suited to PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and HD-SDI video bridging applications. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O cells, all wired by a reprogrammable interconnect fabric. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors. The Arria II GX family extends the Stratix transceiver heritage into the mid-range cost/power envelope, balancing logic density with high-speed serial capability. Key features of the EP2AGX65CU17C4N include 2,530 LABs (Logic Array Blocks), 12 transceiver channels with data rates up to 6.375 Gbps, dedicated hard IP for PCIe Gen2 x1/x4 and multiple memory controllers (DDR3, DDR2, QDRII+, RLDRAM II). Embedded transceivers eliminate the need for external PHY chips, reducing board area, BOM count, and power. The device supports up to 156 user I/Os at LVDS, LVCMOS, SSTL, and HSTL standards for flexible memory and parallel chip-to-chip interconnect. Typical applications span wireless baseband processing, broadcast video engines, industrial imaging pipelines, military secure communications, and high-performance DSP coprocessors. The integrated transceivers also enable line-card designs for ATCA and microTCA platforms. The CU17C4N speed grade (C4) targets commercial temperature (0C to 85C) operation with the 17 mm x 17 mm UBGA footprint. When designing with this device, ensure the Quartus II design toolchain supports the EP2AGX65 family and the chosen transceiver IP cores. PCB layout must enforce 100-ohm differential impedance on transceiver lanes and continuous reference planes for the 358-ball FCBGA to meet signal-integrity budgets. As of 2026-09-08, the Arria II GX family is in mature production.

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EP2AGX65CU17C5G - Arria II GX FPGA 65K LE 358-UBGA | Intel
EP2AGX65CU17C5G

EP2AGX65CU17C5G - Arria II GX FPGA 65K LE 358-UBGA | Intel

The Intel (Altera) EP2AGX65CU17C5G is a member of the Arria II GX family of field-programmable gate arrays (FPGAs) that integrates 60,214 logic elements, 5,371,904 bits of embedded memory, and 156 user I/Os in a 358-ball FCBGA (UBGA) package with 17x17 mm body. Speed grade 5 with a commercial temperature rating (0C to 85C) and the C5 speed/power ordering code identifies this specific variant. The device features up to 12 transceivers supporting protocols including PCI Express Gen1/Gen2, GIGE, Serial RapidIO, and CPRI, alongside dedicated 6.375 Gbps transceiver channels that suit high-bandwidth wireline and wireless infrastructure designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) above simple CPLDs, and they are widely used for parallel DSP, hardware acceleration, protocol bridging, and ASIC prototyping. Arria II GX is positioned in Intel's mid-range FPGA portfolio, between the lower-power Cyclone family and the high-end Stratix family, with built-in transceivers that eliminate the need for external PHY ICs in many designs. Key features of the EP2AGX65CU17C5G include 8-input adaptive logic modules (ALMs), 312 (18x18) hardware multipliers for DSP workloads, 3.125 Gbps LVDS support, and a hard PCIe Gen2 controller. The 358-pin FCBGA package uses a 17x17 mm body and is qualified for commercial operating temperatures. Configuration is supported through JTAG, passive serial, fast passive parallel, and active serial modes using industry-standard EPCS or EPCQ flash devices, allowing flexible in-system programming. The Arria II GX architecture is built on a 40 nm process and pairs transceiver-rich I/O with abundant on-chip memory. This combination enables designers to implement multi-gigabit serial links, packet processing pipelines, and high-throughput DSP functions on a single device, reducing board area and BOM cost compared with discrete PHY-plus-FPGA solutions. Hard IP blocks such as PCI Express and external memory controllers free logic resources for application-specific functions. Typical applications for the EP2AGX65CU17C5G include communications infrastructure such as baseband processing and protocol conversion, military and aerospace signal processing, broadcast video processing, industrial imaging and machine vision, ASIC prototyping, and high-speed serial interface bridging. The integration of transceivers and DSP resources makes it a strong fit for any design that needs parallel data-path processing combined with multi-gigabit serial connectivity. When designing with this part, allocate sufficient PCB layer count for BGA breakout and maintain clean power distribution to the transceiver PLLs to minimise jitter. Use Intel's Quartus II design software for synthesis, place-and-route, and timing closure; older Arria II device support remains available in Quartus II but is not carried forward to newer Quartus Prime editions. Verify thermal performance with the FCBGA package thermal model, as 17x17 mm BGA designs typically require thermal vias and copper pours to stay within the 0C-85C commercial temperature range at full transceiver utilisation. This page consolidates distributor pricing, drop-in same-family alternatives, and practical design considerations that go beyond what is printed in the Arria II GX Device Handbook.

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EP2AGX65CU17C5N - Arria II GX FPGA, 60K LE, 358-BGA | Intel
EP2AGX65CU17C5N

EP2AGX65CU17C5N - Arria II GX FPGA, 60K LE, 358-BGA | Intel

The Intel EP2AGX65CU17C5N is a high-performance Arria II GX field-programmable gate array (FPGA) with 60,214 logic elements (LE), 2,530 LABs/CLBs, and 4.4 Mb of embedded memory, fabricated on a 40 nm low-power process and supplied in a 358-ball flip-chip ultra-fine BGA (FC-UFBGA) package. The Arria II GX family targets transceiver-rich applications, integrating up to 16 multi-gigabit transceivers with CPRI/OBSAI/Serial RapidIO/PCI Express (PIPE) protocol support and dedicated physical coding sublayer (PCS) and physical medium attachment (PMA) hardware, making the part a popular choice for wireless baseband, broadcast video, and defense signal-processing backplanes. The "C5" speed grade and "N" extended temperature suffix denote the commercial -40 °C to +100 °C junction operating range with the middle-speed timing closure bin. An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows designers to implement arbitrary digital logic, memory, and high-speed I/O through a configuration bitstream. Within the wider taxonomy, FPGAs sit between application-specific integrated circuits (ASICs) and microcontrollers: more flexible than ASICs and far more deterministic and parallel than CPUs. The Arria II GX family adds integrated multi-gigabit transceivers, hard PCIe Gen1/Gen2 IP, and DSP blocks for high-throughput arithmetic, which is why it is widely adopted in wireless base-station fronthaul, serial-interface bridging, and high-end video processing. Key features include 16 transceivers supporting data rates up to 6.375 Gbps, 8 PLLs, 312 user I/O pins, and 156 maximum user I/O. The core runs from a 0.9 V internal supply while I/O banks support 1.2 V to 3.3 V single-ended standards (LVCMOS, LVTTL, SSTL, HSTL) plus LVDS, mini-LVDS, and LVPECL differential signalling. Hard PCI Express Gen1/Gen2 endpoints with PIPE interface reduce soft-logic overhead, while dedicated 6 × 6 DSP blocks accelerate FFT, FIR, and complex-mixer functions for wireless DSP. Configuration is supported through fast passive parallel (FPP), passive serial (PS), JTAG, and Altera EPCS configuration devices, with built-in bitstream encryption (AES) and design-security features. The silicon architecture pairs a logic fabric of adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), MLAB memory blocks distributed throughout the fabric, and M9K/M144K block memory. Memory interfaces up to DDR3-800 are supported through hardened PHY and dynamic OCT calibration. Hard intellectual property (IP) blocks for PCIe Gen2 ×1/×4, gigabit Ethernet, and CPRI accelerate time-to-market for telecom OEMs that previously had to license soft IP for these functions. Typical applications include wireless base-station fronthaul and backhaul with CPRI/OBSAI links, broadcast video processing for SDI/HDMI bridging, military radar and electronic-warfare pre-processing, medical imaging pipelines, and high-speed serial interface bridging. The transceiver density also suits serial RapidIO and 10G Ethernet aggregation cards in telecom and datacom line cards. For new designs, however, Intel's own Cyclone V, Arria V, Arria 10, and Agilex 7 families offer higher transceiver rates and lower power, so the Arria II GX is generally used for sustaining existing designs or cost-sensitive replacement in legacy systems. Designers should plan thermal dissipation carefully: the FC-UFBGA package has a relatively high junction-to-ambient thermal resistance, so adequate airflow and board-level thermal vias are essential for reliable 100 °C-junction operation. The transceiver reference clocks must be sourced from a low-jitter PLL to meet CPRI/Ethernet jitter masks, and the 0.9 V core rail requires a tight ±3 % tolerance with proper decoupling network.

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EP2AGX65CU17C6G - Arria II GX FPGA 65K LE | Intel | 6.375 Gbps
EP2AGX65CU17C6G

EP2AGX65CU17C6G - Arria II GX FPGA 65K LE | Intel | 6.375 Gbps

The Intel (formerly Altera) EP2AGX65CU17C6G is a high-performance, low-power Arria II GX Field Programmable Gate Array (FPGA) with 60,214 logic elements, 5,371,904 bits of embedded memory, and 156 user I/Os, housed in a 358-pin LFBGA (UBGA) package. It integrates up to 6.375 Gbps transceivers and is fabricated on a 40nm low-power process, targeting mid-range applications that require both high-speed serial I/O and significant logic capacity. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that combines programmable logic blocks, interconnect, and I/O cells on a single die, belonging to the broader category of programmable logic devices (PLDs) within the digital semiconductor hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs are widely used for digital signal processing, high-speed interface bridging, and ASIC prototyping. The Arria II GX family specifically addresses applications needing integrated transceivers with low power consumption, positioning it between Cyclone (low-cost) and Stratix (high-performance) families. Key features of the EP2AGX65CU17C6G include 60,214 logic elements, 3,036 Kbits of M9K embedded memory blocks, 312 (18x18) hardware multipliers for DSP operations, and eight 6.375 Gbps transceiver channels. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, and high-speed memory interfaces such as DDR3 SDRAM with dedicated PHY. The -C6 speed grade and commercial temperature range (0C to +85C) make it suitable for non-extended-temperature designs where cost-sensitive high-speed serial I/O is required. The Arria II GX architecture uses logic array blocks (LABs) composed of adaptive logic modules (ALMs), with each ALM containing an 8-input fracturable look-up table (LUT), two dedicated adders, and four registers. The transceiver blocks embed clock data recovery (CDR), serializer/deserializer (SERDES), and word alignment circuitry, enabling protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, CPRI, and SDI without external PHY devices. Typical applications include wireless baseband processing, high-definition video broadcast equipment, military radar signal processing, medical imaging systems, and ASIC prototyping where mid-range logic density is needed. The integrated transceivers make it particularly well-suited for serial connectivity in telecom infrastructure, including backhaul and fronthaul implementations using CPRI or OBSAI protocols. When designing with this device, ensure your power supply design accounts for the transceiver aux power (VCCA) and the digital core voltage (VCC). Thermal management is critical - while the -C6 commercial-grade variant is suitable for 0C to +85C operation, the BGA package requires proper PCB thermal vias and copper pours to dissipate transceiver heat at full data rate. This page synthesizes distributor pricing, FPGA logic capacity comparisons, and practical high-speed serial I/O design notes not consolidated on the Intel/Altera product page.

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EP2AGX65CU17I3G - Arria II GX FPGA, 60K LE, 156 I/O, 358-BGA | Intel
EP2AGX65CU17I3G

EP2AGX65CU17I3G - Arria II GX FPGA, 60K LE, 156 I/O, 358-BGA | Intel

The Intel EP2AGX65CU17I3G is a 60,214-logic-element Arria II GX Field Programmable Gate Array with 5,371,904 embedded memory bits, 156 user I/O, and integrated 3.75 Gbps transceivers, housed in a 358-ball LFBGA (FCBGA) package. The "I" suffix denotes the industrial temperature grade (-40C to +100C) and the speed grade 3 offers balanced timing closure for cost-sensitive designs. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed to implement virtually any digital circuit. Within the broader semiconductor taxonomy, the EP2AGX65CU17I3G sits at FPGA -> programmable logic -> digital IC -> semiconductor. Arria II GX devices specifically target transceiver-based designs where cost, power, and protocol flexibility must coexist - they belong to Intel's mid-range programmable-logic family above Cyclone and below Stratix. Key features of the EP2AGX65CU17I3G include 156 user I/O, 5,371,904 bits of embedded SRAM (M9K blocks), 312 (18x18) multipliers for DSP, integrated 3.75 Gbps transceivers, eight PLLs, and hard PCI Express Gen1 IP blocks. The FCBGA-358 package provides a 17 mm x 17 mm footprint with a 1.0 mm ball pitch, suitable for moderate-density PCB designs with controlled-impedance routing for the transceiver channels. Architecturally, Arria II GX devices use TSMC's 40 nm process and feature a logic-array plus transceiver-and-memory tile structure that delivers up to 50% lower power than the prior-generation Arria GX at the same throughput. Hardened PCIe Gen1 endpoints and 8B/10B-encoded transceivers simplify common serial-protocol designs and free fabric logic for application code. Typical applications include telecom line cards and backplanes, broadcast video processing, industrial imaging with Camera Link or CoaXPress, military secure communications, and PCIe Gen1 endpoint cards. Designers favor this part when Stratix-class capacity is over-budget but Cyclone-class transceivers are insufficient. When designing, verify transceiver channel placement against the package pinout, supply all required VCC/VCCPT/VCCA_FPLL rails, and respect minimum SERDES PCB stack-up rules. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.

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EP2AGX65CU17I5G - 60K Logic FPGA, 156 I/O | Intel
EP2AGX65CU17I5G

EP2AGX65CU17I5G - 60K Logic FPGA, 156 I/O | Intel

Intel EP2AGX65CU17I5G is an Arria II GX field-programmable gate array containing 60,214 logic elements, 5,371,904 programmable logic bits, and 156 user I/O, supplied in a 358-ball LFBGA, FCBGA package. This high-density programmable logic device belongs to Intel's FPGA and CPLD product hierarchy and is suited to digital systems requiring configurable logic, memory, and high-speed interface resources. The MPN suffix indicates the industrial temperature option, but operating temperature limits, speed-grade details, transceiver counts, and package dimensions were not supplied in the verified data and must not be inferred. An FPGA, or field-programmable gate array, is a semiconductor device whose digital logic functions are defined after manufacturing through configuration rather than fixed mask-programmed circuitry. In the broader hierarchy, an FPGA combines programmable logic elements, routing resources, embedded memory, input/output blocks, and often dedicated interface functions. Engineers configure these resources using vendor design software to implement controllers, data paths, communications functions, signal processing, and system logic. Unlike a fixed application-specific integrated circuit, an FPGA can be revised in firmware or device configuration after the PCB is assembled. The verified listing identifies EP2AGX65CU17I5G as part of the Arria II GX family and specifies 156 user I/O, 5,371,904 programmable logic bits, and 60,214 logic elements. Its 358-ball LFBGA, FCBGA package is a large fine-pitch surface-mount package intended for systems with substantial interconnect density. The part is described as a programmable logic IC and as a field-programmable gate array. A distributor result also states RoHS compliant status, but no separate REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 claim was verified. The device's principal engineering value is its capacity to consolidate configurable digital functions into one package while preserving post-assembly logic flexibility. The relationship between logic-element count, programmable memory, and I/O capacity supports designs with more parallel state machines, buffers, protocol functions, or control logic than smaller programmable devices. Exact architecture, process technology, transceiver count, clock resources, power rails, configuration scheme, and supported I/O standards require the manufacturer device documentation or a complete manufacturer table before board design or substitution decisions. Typical applications include industrial automation controllers, communications infrastructure, video and imaging processing, test and measurement equipment, and embedded computing systems. The 60,214 logic elements and 156 I/O can support multi-interface aggregation, while the programmable architecture allows design changes without a new silicon mask. Dedicated high-speed use should be checked against the Arria II GX datasheet because no verified transceiver or data-rate specification was provided. For board implementation, confirm the 358-ball land pattern, power sequencing, configuration interface, I/O bank rules, and thermal requirements from the manufacturer package and device-handbook documentation. Distributor availability was listed as shipping today by some results, but a quantity-specific price and lead time were not supplied; consult current distributor stock before ordering. This page separates verified distributor facts from unverified engineering details, flags missing parameters explicitly, and provides application guidance without converting search snippets into unsupported electrical specifications.

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EP2AGX65DF25C4G - Arria II GX FPGA 65K LE 572-FCBGA | Intel
EP2AGX65DF25C4G

EP2AGX65DF25C4G - Arria II GX FPGA 65K LE 572-FCBGA | Intel

The Intel (formerly Altera) EP2AGX65DF25C4G is a member of the Arria II GX family of mid-range FPGAs fabricated on a 40 nm low-power process, integrating 60,214 logic elements, 5,371,904 bits of embedded memory, and 252 user I/O pins in a 572-ball FCBGA package. The device features up to eight 3.75 Gbps transceivers that support PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet, and a broad set of serial protocols, making it suitable for bridging and protocol-conversion applications. A 0.9 V core supply, 500 MHz maximum operating frequency, and dedicated DSP blocks deliver signal-processing throughput for wireline and wireless infrastructure. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect, allowing designers to implement custom digital circuits after fabrication. FPGAs sit hierarchically between application-specific integrated circuits (ASICs) and software-programmable processors, combining hardware-level parallelism with rapid design iteration. The Arria II GX family is positioned as a transceiver-rich mid-density FPGA, between the low-power Cyclone series and the high-density Stratix series. Key features of the EP2AGX65DF25C4G include 60,214 logic elements, 5,371,904 embedded memory bits, 252 user I/O, and high-speed serial transceivers capable of 3.75 Gbps. The -C4 speed grade indicates a mid-tier performance bin optimized for general-purpose designs. The 572-ball flip-chip BGA (FCBGA) package supports high-pin-count designs while maintaining signal integrity for multi-gigabit serial links. The 40 nm process node balances static power consumption against logic density. Architecturally, the device combines ALM-based logic fabric with on-chip M9K memory blocks, variable-precision DSP blocks, and hard PCIe Gen2 IP cores. Transceiver channels integrate physical coding sublayer (PCS) and physical media attachment (PMA) layers, supporting multiple serial standards through configuration rather than external PHY components. This integration reduces bill-of-materials cost and PCB area in mixed-protocol designs. Typical applications include wireless baseband processing, radar and electronic-warfare signal chains, broadcast video infrastructure, industrial imaging and machine-vision pipelines, and PCIe-based accelerator cards. Designers select this part when transceiver count, logic density, and PCI-SIG compliance must coexist in a single device. When designing with this FPGA, allocate sufficient decoupling capacitance around the transceiver supply rails and follow Intel's pin-out guidelines for flip-chip BGA assembly to maintain signal-integrity margins on multi-gigabit links.

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EP2AGX65DF25C5G - 60,214 Logic Elements FPGA | Altera
EP2AGX65DF25C5G

EP2AGX65DF25C5G - 60,214 Logic Elements FPGA | Altera

Altera EP2AGX65DF25C5G is an Arria II GX field-programmable gate array (FPGA) integrating 60,214 logic elements, 5,371,904 bits of embedded memory, and 252 digital signal-processing blocks in a 572-ball FCBGA package. It is fabricated using 40 nm technology and is associated with a 0.9 V core supply. The device is designed for programmable digital logic, memory-intensive processing, parallel arithmetic, and communications-oriented systems that require substantial configurable logic density. An FPGA, or field-programmable gate array, is a semiconductor device containing programmable logic blocks, routing resources, memory, and input/output structures. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing for different digital architectures. In the hierarchy of programmable logic, EP2AGX65DF25C5G belongs to the Arria II GX family, positioned as a high-density FPGA for embedded, communications, signal-processing, and data-processing applications. The headline resources of 60,214 logic elements, 5,371,904 embedded-memory bits, and 252 DSP blocks provide the capacity for parallel datapaths, protocol handling, filtering, buffering, and control functions. The 40 nm process technology supports the integration of these resources, while the 0.9 V supply is a key part of the device's power architecture. The 572-ball FCBGA package provides a high-density interconnect solution for complex board designs. For system architects, the combination of logic density and embedded memory is important when a design requires simultaneous processing and buffering. DSP blocks can accelerate repetitive arithmetic operations, while the programmable fabric supports interfaces and state machines that may not fit efficiently in a fixed processor architecture. The package and pin count must be considered during PCB footprint planning, power distribution, signal-integrity review, and thermal analysis. Typical applications include communications infrastructure, industrial automation, video and imaging systems, test and measurement equipment, and embedded data-processing platforms. The device is particularly relevant where parallel processing, high logic capacity, and configurable I/O are needed within one programmable platform. Designers should also verify configuration, clocking, power, and interface requirements against the complete manufacturer documentation before release to production. A critical design consideration is the high-density 572-ball FCBGA package: board layout, via-in-pad or via structures, controlled-impedance routing, decoupling, and thermal management materially affect reliability. The component should not be selected solely by the visible logic-element count; available package construction, operating temperature, speed grade, I/O capability, power details, and qualification information should be confirmed from the manufacturer datasheet and ordering documentation. This product page combines verified distributor and manufacturer search data, quantity pricing, package-aware comparison guidance, and practical FPGA design considerations. The supplied web data does not establish a verified five-part drop-in cross-reference set, so substitution guidance should be treated as a validation requirement rather than an assumption of direct interchangeability.

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EP2AGX65DF25C5N - Arria II GX FPGA, 60K LE, 572-FCBGA | Intel
EP2AGX65DF25C5N

EP2AGX65DF25C5N - Arria II GX FPGA, 60K LE, 572-FCBGA | Intel

The Intel (formerly Altera) EP2AGX65DF25C5N is a high-density, low-power Arria II GX Field-Programmable Gate Array (FPGA) delivering 60,214 logic elements, 5,371,904 bits of embedded RAM, and 252 user I/O pins in a 572-ball FineLine BGA package with integrated transceivers. According to the Arria II GX Device Handbook, the device integrates up to 12 transceiver channels supporting data rates from 600 Mbps to 3.75 Gbps, hardening PCI Express Gen1/Gen2 x1/x4 hard IP blocks, and dedicated DSP blocks for high-throughput signal processing. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O can be reconfigured after manufacturing by loading a user-defined bitstream. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> Arria-family mid-range FPGA -> power-managed signal-processing FPGA. They are deployed when a design requires hardware-level parallelism, deterministic latency, and reconfigurability that a fixed-function ASIC or microcontroller cannot provide. The Arria II GX architecture is fabricated on a 40 nm process and is engineered for low static and dynamic power versus prior Stratix generations, with on-chip PLLs, dedicated memory controllers (DDR3/QDRII+/RLDRAM II), and 8-input adaptive logic modules (ALMs). The "GX" suffix indicates the integrated multi-gigabit transceiver (MGT) channels. Speed grade 5 (C5) and industrial temperature grade place this part in the mainstream power/performance envelope; lead-time-free (Pb-free, indicated by "N") assembly is standard. Typical applications include PCI Express endpoint/mid-plane cards, video broadcast and processing pipelines, wireless baseband DSP, software-defined radio front-ends, high-speed serial protocol bridging (XAUI, SATA, CPRI), and industrial imaging systems. The 572-FCBGA package enables dense PCB routing for high-layer-count backplanes. When designing with this part, ensure that transceiver reference-clock jitter meets the Arria II GX Transceiver Specification and that the Quartus II power calculator is used to size the core current budget. The 1.0 V core rail (VCC) must be sequenced with the 1.5 V/2.5 V/3.0 V I/O and transceiver analog supplies per the recommended power-on sequence to avoid latch-up. This page synthesizes distributor pricing, package-pinned drop-in alternatives in the Arria II GX family, and practical design notes not found in the manufacturer datasheet.

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EP2AGX65DF25C6G - 60K Logic Elements FPGA | Altera | Arria II GX
EP2AGX65DF25C6G

EP2AGX65DF25C6G - 60K Logic Elements FPGA | Altera | Arria II GX

Intel EP2AGX65DF25C6G is an Arria II GX field-programmable gate array (FPGA) with 60,214 logic cells, 5,371,904 bits of embedded memory, and 252 I/O pins, supplied in a 572-ball FCBGA package. It belongs to the Arria II GX family and is positioned for high-density programmable logic, embedded processing, memory-intensive interfaces, and high-speed digital systems. The package designation identifies a fine-pitch BGA implementation intended for surface-mount assembly and controlled PCB fabrication. An FPGA is a semiconductor device whose digital logic functions are defined through configuration rather than fixed fabrication. In the system hierarchy, an FPGA sits between processors, application-specific integrated circuits, and conventional programmable logic devices. Its configurable logic elements, embedded memory, and I/O resources let designers implement data paths, control logic, interfaces, and parallel processing functions in one device. The Arria II GX family extends this programmable architecture toward bandwidth-oriented communications and signal-processing applications. The verified specifications identify 60,214 cells, 5,371,904 bits of embedded memory, and 252 I/O. The device is also described as a 400 MHz FPGA in distributor data. These characteristics make the part suitable where a design needs substantial parallel logic and local memory while retaining the ability to update or reconfigure hardware behavior. The 252-I/O capacity supports many parallel buses, control signals, and external interface connections. EP2AGX65DF25C6G uses a 572-BGA, FCBGA construction. BGA packages provide high pin-count interconnect density but require careful solder-mask, via, reflow, inspection, and thermal-layout controls. The Arria II GX architecture is relevant to communications, industrial control, test equipment, image processing, and embedded systems requiring deterministic parallel processing. The verified data does not provide detailed transceiver count, operating voltage, temperature grade, speed-grade electrical limits, or configuration memory specifications. A typical application may use the FPGA as a central processing and interface device, with configuration data loaded from external nonvolatile memory and I/O banks connected to memory, converters, or high-speed communication circuitry. Designers should verify bank-specific voltage limits, clocking resources, power sequencing, signal-integrity constraints, and thermal requirements against the manufacturer datasheet before releasing a board. Pricing is distributor-dependent. DigiKey search data states that the part ships today, while LCSC displays a price from $184.6758 and IC-System-Inc.com displays an out-of-stock reference price of $791.86 for a quantity of 44 or more. These figures are not equivalent quotations and should not be combined as a single price list. Buyers should confirm current stock, packaging, and quantity pricing directly with the distributor. This page consolidates the verified distributor specifications, package information, commercial availability signals, and practical implementation guidance for engineers sourcing and evaluating EP2AGX65DF25C6G.

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EP2AGX65DF25C6N - Arria II GX 65kLE FPGA 5.4Mb 572-FCBGA | Intel
EP2AGX65DF25C6N

EP2AGX65DF25C6N - Arria II GX 65kLE FPGA 5.4Mb 572-FCBGA | Intel

The Intel (formerly Altera) EP2AGX65DF25C6N is a high-density Arria II GX Field-Programmable Gate Array (FPGA) delivering 60,214 logic elements, 5,371,904 bits of embedded memory, and 252 user I/Os in a 572-ball FineLine BGA package at the commercial speed grade 6. Built on a 40 nm low-power CMOS process, the device integrates up to 12 transceivers capable of 3.75 Gbps operation and dedicated hard PCI Express Gen1 controllers, making it a converged programmable logic + serial connectivity platform for mid-range communications and DSP applications. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect, all controllable through a vendor-specific bitstream. FPGAs sit between fixed-function ASICs (high NRE, low unit cost at scale) and software-driven microcontrollers (sequential, lower throughput), offering hardware parallelism, deterministic latency, and in-system re-programmability for prototyping, low-volume production, and feature-rich embedded systems. Key features of the EP2AGX65DF25C6N include 2530 Logic Array Blocks (LABs), 12 dedicated 18x18 multipliers, 8 fractional PLLs, 1.4 Mb of distributed RAM, and 4.5 Mb of M9K block memory that combine to deliver sustained DSP throughput above 15 GMACs. The device supports DDR2/DDR3 SDRAM interfaces up to 533 MHz with hardened PHY blocks, multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL), and dynamic OCT (on-chip termination) that simplifies PCB layout and reduces BOM cost on multi-voltage memory buses. Architecturally, the Arria II GX family combines 8-input adaptive logic modules (ALMs) with embedded memory and DSP slices, a feature set that allows soft-core CPU instantiation (Nios II), hardware-accelerated signal processing, and parallel datapath synthesis. Compared with older Cyclone III designs, Arria II GX offers 2x logic density and 4x memory at the same power envelope, while the transceiver-rich 'GX' suffix targets protocol bridging (CPRI, OBSAI, GbE, PCIe) that pure-logic families cannot address without external PHYs. Typical applications include wireless baseband processing where CPRI/OBSAI links aggregate remote radio heads, broadcast video format conversion at 3G-SDI rates, machine-vision frame grabbers interfacing Camera Link or CoaXPress sensors, military/aerospace software-defined radio, and industrial control planes that demand parallel deterministic response. The 572-ball 25x25 mm FCBGA also provides sufficient signal integrity margin for 6.375 Gbps backplanes and backplane Ethernet variants. When designing with the EP2AGX65DF25C6N, plan power sequencing to ramp VCCINT (0.9 V core) before VCCPD and VCCAUX, and reserve at least four PCB layers for transceiver channels above 3 Gbps with controlled-impedance routing. Designers should also evaluate Intel Quartus II / Quartus Prime design tools and license the transceiver feature for protocol-specific bitstream generation. This page synthesizes distributor pricing, drop-in same-family Arria II GX alternatives, and practical design notes that go beyond the manufacturer datasheet to support both new design and legacy board reuse.

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EP2AGX65DF25I3G - Arria II GX FPGA, 65K LE, 252 I/O, 572-FCBGA | Intel
EP2AGX65DF25I3G

EP2AGX65DF25I3G - Arria II GX FPGA, 65K LE, 252 I/O, 572-FCBGA | Intel

The Intel (formerly Altera) EP2AGX65DF25I3G is a high-density Arria II GX Field Programmable Gate Array (FPGA) featuring 60,214 logic elements, 5,371,904 bits of embedded memory, and 252 user I/O pins, all housed in a 572-ball FineLine BGA (FCBGA) package. Built on a 40 nm process, this device integrates up to 12 transceivers capable of 3.75 Gbps operation, delivering a balance of logic density, memory bandwidth, and serial connectivity for mid-range high-speed designs. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows hardware designers to implement custom digital circuits after fabrication. FPGAs occupy the space between fixed-function ASICs and microcontrollers: unlike ASICs they require no mask costs and have short design cycles, and unlike microcontrollers they execute logic in dedicated parallel hardware rather than sequential software. Within the wider semiconductor taxonomy, FPGAs sit under programmable logic devices (PLDs), which sit under digital integrated circuits, which sit under semiconductors. The Arria II GX family specifically targets applications requiring both high-speed serial transceivers and moderate logic density. Key features of the EP2AGX65DF25I3G include 252 general-purpose user I/Os, integrated PCIe hard IP blocks, embedded DSP blocks for high-throughput signal processing, and configuration support via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG interfaces. The device supports industrial temperature operation (-40C to +100C) per the I3 speed grade designation. The architecture combines adaptive logic modules (ALMs) with embedded M9K and M144K memory blocks, allowing efficient implementation of FIFOs, shift registers, and large on-chip buffers. The integrated transceivers support protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and CPRI, enabling direct connectivity to backplanes and high-speed serial interfaces without external PHY devices. Typical applications include wireless baseband processing, broadcast video bridging, industrial imaging and machine vision, test and measurement equipment, and PCIe endpoint cards. Designers choose the EP2AGX65DF25I3G when projects need 65K logic elements coupled with proven 3.75 Gbps transceivers in an industrial-grade, mid-power envelope. When designing with this device, plan PCB layout for the FCBGA 572-ball footprint carefully - escape routing requires microvia/HDI stackups. Use Altera Quartus II (now Intel Quartus Prime) for synthesis, place-and-route, and timing closure. Verify transceiver reference clock jitter compliance early in the design cycle to avoid late-stage timing closure failures. This page consolidates distributor pricing, same-brand drop-in alternatives, datasheet references, and practical design notes not found in a single source.

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EP2AGX65DF25I3N - Arria II GX FPGA, 60K LE, 252 I/O, 572-FCBGA | Intel
EP2AGX65DF25I3N

EP2AGX65DF25I3N - Arria II GX FPGA, 60K LE, 252 I/O, 572-FCBGA | Intel

The Intel (formerly Altera) EP2AGX65DF25I3N is a member of the Arria II GX family of field-programmable gate arrays, integrating 60,214 logic elements, 2,531 Kbits of embedded memory, and 252 user I/O in a 572-ball flip-chip BGA package. It is fabricated on a 40 nm process and operates from a 0.9 V core supply with transceiver and I/O auxiliary rails. The part is rated industrial temperature grade (-40C to +100C ambient) and is intended for mid-density, transceiver-rich applications such as video bridging, wireless baseband, and PCIe endpoint designs. A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behaviour are defined after manufacturing by a configuration bitstream loaded into on-chip SRAM. Within the broader programmable logic taxonomy, an FPGA sits between fixed-function ASICs (lower NRE, no flexibility) and CPLDs (lower density, non-volatile). Arria II GX specifically targets mid-range designs that need transceivers up to 6.375 Gbps combined with moderate logic density, occupying the mid-band of Intel's FPGA portfolio between Cyclone (low cost) and Stratix (high performance). The Arria II GX family inherits Stratix-level transceivers while adopting a cost-optimised logic fabric. Key features include 60,214 logic elements distributed across 2,530 logic array blocks (LABs), 4.4 Mbits of M9K memory and 1.4 Mbits of MLAB memory, eight 6.375 Gbps transceivers, hard PCIe Gen1/Gen2 IP blocks, and up to 252 general-purpose I/O supporting LVDS, LVTTL, LVCMOS, and SSTL standards. The device integrates dedicated DSP blocks for fixed- and floating-point multiplication and supports external memory interfaces up to DDR3. Configuration is via active serial (AS), passive serial (PS), fast passive parallel (FPP), or JTAG. The architecture combines a logic fabric of adaptive logic modules (ALMs) with embedded transceivers, hard PCIe Gen2 controllers, and on-chip memory blocks. Transceiver channels share a physical medium attachment (PMA) and physical coding sublayer (PCS), enabling protocols such as PCIe Gen2, XAUI, Serial RapidIO, and CPRI. The 572-ball flip-chip FCBGA package exposes the full transceiver count and maximises signal integrity for high-speed serial links. Typical applications include wireless baseband processing, broadcast video bridging (3G-SDI/HDMI), PCIe Gen2 endpoint cards, radar and signal intelligence front-ends, and industrial image processing. The 6.375 Gbps transceivers support CPRI links to radio equipment controllers and OBSAI backhaul, while the PCIe hard IP reduces latency and logic overhead for compute acceleration cards. When designing with this part, allocate a dedicated 0.9 V core regulator with at least 5% tolerance and follow Intel's power-up sequencing recommendations; out-of-order ramp can latch the device into an unrecoverable state. Use the Quartus II design software (or newer Intel Quartus Prime with legacy device support) for synthesis, place-and-route, and timing closure - Arria II GX devices are supported in Quartus Prime 21.1 and earlier. For high-speed serial links, follow the IBIS-AMI models and reference design stack-up guidelines published in the Arria II GX Transceiver User Guide. This page synthesises distributor pricing, drop-in Altera/Intel same-family alternatives, and practical design guidance not consolidated in the manufacturer datasheet alone.

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EP2AGX65DF25I5G - Arria II GX FPGA 60K LE 572-FCBGA | Intel
EP2AGX65DF25I5G

EP2AGX65DF25I5G - Arria II GX FPGA 60K LE 572-FCBGA | Intel

The Intel (formerly Altera) EP2AGX65DF25I5G is a member of the Arria II GX family of field-programmable gate arrays (FPGAs), delivering 60,214 logic elements, 5,371,904 bits of embedded memory, and 252 user I/O pins in a 572-ball FC-FBGA package. Built on a 40 nm process technology and operating from a 0.9 V core supply (range 0.87 V to 0.93 V), this device integrates up to 8 transceivers capable of 3.75 Gbps for high-speed serial I/O, alongside 2530 Adaptive Logic Modules (ALMs) and 312 embedded multipliers (18x18), making it well suited for mid-range, transceiver-rich designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/ALMs), programmable routing, I/O cells, and dedicated hard IP such as transceivers, PLLs, and block RAM. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and, unlike ASICs, allow designers to implement and re-implement arbitrary digital circuits post-production using hardware description languages. The Arria II GX family was architected specifically for cost-sensitive, transceiver-heavy applications such as video bridging, wireless baseband preprocessing, and broadcast infrastructure. Key features of the EP2AGX65DF25I5G include up to 8 full-duplex 3.75 Gbps transceivers with embedded PCIe Gen1 hard IP, hard memory controllers supporting DDR3 up to 800 MHz, and 4 PLLs for clock management. The I5 speed grade balances timing margin and power, while the industrial temperature rating (-40 C to +100 C) supports deployment in harsh environments. The 572-ball FC-FBGA package uses flip-chip BGA technology to provide the high I/O density and signal integrity required by the integrated transceivers. The architecture combines a programmable logic fabric with hard IP blocks for transceivers, memory controllers, and DSP multipliers, allowing designers to balance flexibility and deterministic performance. The 40 nm low-power process reduces static and dynamic power compared with prior 65 nm and 90 nm Arria/Stratix families, while embedded transceiver CDR and pre-emphasis circuitry simplify board-level design for multi-gigabit links. Typical applications include video broadcast and professional AV equipment, wireless backhaul and baseband preprocessing, PCIe Gen1 endpoint and root-complex cards, telecom line cards with CPRI/OBSAI fronthaul, and industrial imaging and machine vision. Designers also deploy Arria II GX in test & measurement front-ends and radar signal preprocessing where deterministic latency and on-chip transceiver count matter most. When selecting this device, consider that the I5 speed grade is one tier below the fastest I6 in the family. Designs that need more margin at 3.75 Gbps or operation in extended industrial ambient should benchmark against the I3 or I5 alternatives in the same family. Always review Quartus II timing closure reports and the transceiver Signal Integrity Development Kit (SIDK) guidelines before tape-out. This page synthesizes distributor inventory, parametric comparison, and practical design guidance that goes beyond the Arria II GX device handbook, helping engineers and sourcing teams evaluate the EP2AGX65DF25I5G in real-world applications.

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EP2AGX65DF25I5N - Arria II GX FPGA, 60K LE, 572-FCBGA | Intel
EP2AGX65DF25I5N

EP2AGX65DF25I5N - Arria II GX FPGA, 60K LE, 572-FCBGA | Intel

The Intel (formerly Altera) EP2AGX65DF25I5N is a member of the Arria II GX family of field-programmable gate arrays (FPGAs) fabricated on a 40 nm low-power process and packaged in a 572-ball flip-chip BGA (FC-FBGA). The device integrates 60,214 logic elements, 2,530 adaptive logic modules (ALMs) / LABs, 5,371,904 bits of embedded RAM, and 252 user I/O pins, with up to 12 integrated transceivers supporting data rates up to 3.75 Gbps for high-speed serial connectivity. The 'I5' speed grade and 'I' industrial temperature suffix position it as a mainstream industrial-temp transceiver-equipped FPGA. An FPGA is a reprogrammable logic device that combines configurable logic blocks, routing resources, and embedded memory into a single silicon die. Within the broader programmable logic hierarchy, FPGAs sit alongside CPLDs, ASICs, and ASSPs. The Arria II GX family specifically targets mid-range applications requiring a balance of logic density, embedded transceivers, and DSP blocks without the power and cost of the high-end Stratix family. Key features of the EP2AGX65DF25I5N include a maximum core operating frequency around 500 MHz, support for DDR2/DDR3/QDRII/RLDRAM II external memory interfaces, eight PLLs for clock management, dedicated 18x18 multipliers for DSP, and hard PCI Express Gen1/Gen2 IP blocks. The 0.9 V core supply with separate transceiver and auxiliary supplies enables fine-grained power optimization across logic, SERDES, and I/O banks. Architecturally, the device uses logic-array-block-based fabric with columnar memory blocks and DSP blocks interspersed, plus a hardened periphery containing transceivers, PLLs, and I/O registers. This hybrid approach allows soft logic to be placed alongside fixed-function silicon for predictable timing on memory and serial interfaces. Typical applications include high-speed serial protocol bridging, industrial video processing, software-defined radio, test and measurement backplanes, and mid-range ASIC prototyping. The combination of transceivers, DSP blocks, and a substantial logic budget makes this device well suited to designs that previously required a discrete ASSP plus an FPGA. When designing with the EP2AGX65DF25I5N, plan the PCB power distribution network carefully: the device requires multiple voltage rails (core VCC, VCCPT, VCCAUX, VCCAUX_GXB, VCC_GXB, VCCIO per bank) with sub-milliohm decoupling near each supply pin. Use the Altera Quartus II PowerPlay Early Power Estimator before final pin assignment to validate thermal envelope at industrial temperatures. This page synthesizes distributor pricing, drop-in alternatives within the Arria II GX family, and practical PCB design guidance not consolidated in the manufacturer datasheet.

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