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EP3SE80F1152I3N - Stratix III E FPGA 80K LE, 1152-FCBGA | Intel
EP3SE80F1152I3N

EP3SE80F1152I3N - Stratix III E FPGA 80K LE, 1152-FCBGA | Intel

The Intel EP3SE80F1152I3N is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) fabricated on a 65 nm process, integrating 80,000 logic elements, 3,200 Logic Array Blocks (LABs), and 6,843,392 bits of embedded memory in a 1152-ball Fine-pitch Chip-Scale Ball Grid Array (FCBGA). It provides 744 user I/O pins, supports a core voltage of 1.1 V with 1.2 V/3.3 V auxiliary supplies, and is offered in the industrial -40 °C to +100 °C temperature range. The device is positioned as a mid-density member of the Stratix III E family, targeting high-performance digital signal processing, high-speed serial interconnect, and parallel processing applications. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to implement arbitrary digital logic circuits by configuring an array of configurable logic blocks (CLBs), embedded multipliers, memory blocks, and high-speed transceivers, interconnected by a programmable routing fabric. FPGAs occupy a tier in the semiconductor hierarchy between Application-Specific Integrated Circuits (ASICs) and general-purpose processors, providing hardware-level performance with software-level reconfigurability. The Stratix III E family specifically enhances DSP capability and transceiver bandwidth versus the baseline Stratix III series. Key features include 500 MHz maximum internal clock frequency, integrated adaptive logic modules (ALMs), dedicated DSP blocks, up to 12 embedded transceivers depending on package, and support for external memory interfaces including DDR3, QDR II+, and RLDRAM II. The device also offers enhanced security via configuration bitstream encryption with AES, and supports partial reconfiguration for in-system logic updates. The 1152-ball FCBGA package provides a compact 35 mm × 35 mm footprint suitable for high-density PCB designs with multiple ground/power balls for low-impedance power delivery. The EP3SE80F1152I3N utilizes a low-power 65 nm process with enhanced power management features including programmable power technology that allows unused blocks to enter a low-quiescent state. Combined with 8-input fracturable ALMs and dedicated hardware multipliers, the device achieves an optimal performance-per-watt ratio for DSP-intensive designs such as baseband processing, video transcoding, and high-speed data acquisition. Typical applications include Software Defined Radio (SDR), high-performance computing accelerators, test and measurement equipment, medical imaging systems, military radar, and high-end broadcast video processing. The high logic density combined with rich DSP and memory resources makes the device particularly well-suited for multi-channel processing systems where multiple parallel data paths must be implemented in a single device. When designing with this FPGA, ensure proper power sequencing (1.1 V core before 2.5 V/3.3 V I/O), use at least 8 decoupling capacitors per power rail, and follow Altera's recommended PCB layout guidelines for FCBGA packages including microvia/stacked-via construction for breakout. Configuration via JTAG or a configuration device (EPCS/EPCQ) should also be planned early in the design cycle. This page synthesizes distributor pricing, same-brand Stratix III E drop-in alternatives, and practical design notes for engineers considering the EP3SE80F1152I3N for high-density programmable logic designs.

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EP3SE80F1152I4 - Stratix III E FPGA 80K LE 1152-FCBGA | Intel (Altera)
EP3SE80F1152I4

EP3SE80F1152I4 - Stratix III E FPGA 80K LE 1152-FCBGA | Intel (Altera)

The Intel (Altera) EP3SE80F1152I4 is a Stratix® III E family Field-Programmable Gate Array (FPGA) integrating 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/Os in a 1152-ball FineLine Ball-Grid Array (FCBGA) package. Manufactured on a 65 nm CMOS process and supplied from a 1.1 V core rail, the device targets high-performance digital signal processing, high-bandwidth bridging, and ASIC-prototype workloads. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines a sea of configurable logic blocks, dedicated hardware multipliers, embedded memory blocks, and high-speed serial transceivers on a single die. FPGAs belong to the broader programmable logic family (alongside CPLDs) and are widely used as flexible alternatives to ASICs because the same silicon can be reconfigured for different designs. Stratix III E devices specifically emphasize enhanced logic capacity and DSP throughput for telecom, defense, and high-performance computing systems. Key features of the EP3SE80F1152I4 include 3,200 Logic Array Blocks (LABs), 80,000 logic elements, 6,843,392 bits of RAM, 744 user I/Os, and an internal operating frequency up to 800 MHz. The 'I' speed grade and '4' device-grade indicator denote an industrial temperature range of -40 °C to +100 °C junction (per the Stratix III nomenclature). The 1152-ball FCBGA package supports vertical migration across Stratix III E densities (EP3SE50, EP3SE80, EP3SE110, EP3SE260) sharing the same 1152-ball footprint. Architecturally, the Stratix III E uses Altera's Adaptive Logic Module (ALM) and TriMatrix memory blocks, with dedicated DSP blocks delivering up to 600 MHz performance and high-speed transceivers for multi-gigabit serial links. The 65 nm process with 1.1 V core supply balances high performance against dynamic power, and the device supports JTAG IEEE Std 1149.1 boundary-scan test for production board test. Typical applications include high-performance digital signal processing, ASIC prototyping, telecom line cards, high-end video broadcast equipment, military radar and signal-intelligence systems, and PCIe Gen1/Gen2 endpoint or root-port designs. The large logic capacity and abundant I/O make it well suited to designs requiring wide parallel data buses or multiple high-speed serial channels. When designing with this FPGA, verify that your Quartus II design software supports the EP3SE80F1152I4 device variant and that the PCB footprint matches the 1152-ball FCBGA land pattern. Confirm pin assignment against the Stratix III device handbook and account for the industrial temperature grade when selecting cooling solutions for harsh environments. Stratix III devices are now in legacy lifecycle status with Intel, so for new designs consider Stratix V, Cyclone V, or Agilex 7 as successors.

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EP3SE80F1152I4L - Stratix III E FPGA 80K LE 1152-FCBGA | Intel
EP3SE80F1152I4L

EP3SE80F1152I4L - Stratix III E FPGA 80K LE 1152-FCBGA | Intel

The Intel (formerly Altera) EP3SE80F1152I4L is a high-density Stratix® III E family FPGA featuring 80,000 logic elements, 3,200 LABs, 744 user I/Os, and 6,843,392 bits of embedded memory, built on a 65nm process and housed in a 1152-ball flip-chip BGA (FC-FBGA) package. The 'I4' speed grade targets industrial temperature operation and the 'L' suffix denotes a lead-free, RoHS-compliant package. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as memory, transceivers, and DSP blocks. Stratix III E FPGAs sit at the upper end of the Stratix III family, engineered for high-performance ASIC prototyping, signal processing, and high-bandwidth I/O bridging. Positioned within the broader hierarchy, FPGAs belong to programmable logic devices (PLDs), which in turn fall under the umbrella of digital integrated circuits and semiconductors. Key features include 744 user I/O pins, 6,843,392 bits of on-chip RAM distributed across TriMatrix memory blocks, dedicated DSP blocks for high-throughput arithmetic, and integrated high-speed transceivers capable of operation up to 375 MHz core logic frequency. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL, allowing direct interface to DDR/DDR2 memory and a wide range of parallel peripherals. The FC-FBGA package offers flip-chip interconnect for superior electrical and thermal performance compared to wire-bond packages at this pin count. The EP3SE80F1152I4L uses TSMC's 65nm low-power process node and a 0.9V core supply. Its adaptive logic module (ALM) architecture combines 8-input fracturable look-up tables with dedicated registers, providing efficient mapping for both arithmetic-intensive and control-dominated designs. On-chip PLLs provide flexible clock synthesis and skew management for multi-domain designs. Typical applications include high-speed data acquisition, ASIC prototyping, telecom baseband processing, video processing pipelines, military and aerospace signal processing, and high-end industrial control. Its logic capacity and memory bandwidth make it well suited for protocol bridging between PCIe, Gigabit Ethernet, and DDR memory subsystems. When designing with this device, plan power sequencing for the 0.9V core and 1.2V/3.3V auxiliary rails carefully, and ensure the PCB accommodates the 35mm × 35mm FC-FBGA footprint with microvia stack-up for the 1.0mm pitch ball array. Thermal management via the exposed die flip-chip attach is mandatory at sustained high utilization. This page synthesizes distributor inventory, pin-compatible drop-in alternatives within the Stratix III E family, and practical design notes not aggregated in the manufacturer datasheet.

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EP3SE80F1152I4LN - Stratix III E FPGA 80K LE 1152-FBGA | Intel
EP3SE80F1152I4LN

EP3SE80F1152I4LN - Stratix III E FPGA 80K LE 1152-FBGA | Intel

The Intel (formerly Altera) EP3SE80F1152I4LN is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) with 80,000 logic elements, 6,843,392 bits of embedded memory, 744 embedded multipliers (18x18), and a maximum operating frequency of 500 MHz, housed in a 1152-ball FineLine BGA (FC-FBGA) package with industrial-grade temperature range. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) -> integrated circuit (IC) -> semiconductor that allows hardware designers to configure digital logic blocks, interconnect, and I/O via a hardware description language after manufacture. FPGAs occupy a unique position between general-purpose microcontrollers and fixed-function ASICs: they offer massively parallel DSP performance, reconfigurable I/O protocols, and hardware-level latency, making them ideal for data-path-heavy workloads that CPUs handle inefficiently. Key features of the EP3SE80F1152I4LN include 8 transceivers, 488 user I/O pins, 1.1 V core voltage, 0.9 V supply option, 65 nm process technology, and four PLLs plus 48 global clocks for high-speed timing distribution. The I4 speed grade indicates an industrial temperature screening (-40C to +100C junction) with mid-tier performance placement. Architecturally, the Stratix III E family uses an Adaptive Logic Module (ALM) with 8-input fracturable look-up tables (LUTs), embedded DSP blocks for fixed/floating-point math, and TriMatrix embedded memory supporting single-port, simple dual-port, and true dual-port modes. Partial reconfiguration is supported, allowing portions of the fabric to be reprogrammed while the rest continues operating. Typical applications include high-speed digital signal processing (radar, software-defined radio), ASIC prototyping, wireline telecom line cards, broadcast video processing, and military/aerospace signal processing systems. The 1152-ball FBGA exposes enough I/O and transceiver bandwidth to drive multi-gigabit serial links. When designing with this part, plan power sequencing for the 1.1 V core (VCCINT) and 0.9 V analog supply separately, and verify signal integrity on the multi-row BGA escape. The Stratix III E is in production with mature Quartus II tooling, though newer designs should consider Cyclone V or Stratix 10 for lower power. This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the Stratix III E family, and practical design notes not consolidated in the manufacturer datasheet, providing unique selection and procurement guidance.

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EP3SE80F1152I4N - 80K LE Stratix III E FPGA, 1152-FCBGA | Intel
EP3SE80F1152I4N

EP3SE80F1152I4N - 80K LE Stratix III E FPGA, 1152-FCBGA | Intel

The Intel EP3SE80F1152I4N is a high-density Stratix III E family Field Programmable Gate Array (FPGA) integrating 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/Os in a 1152-ball flip-chip BGA (FCBGA) package. Built on a 65 nm CMOS process, it supports core logic operation at 1.1 V and I/O voltages across multiple banks, with a maximum internal clock frequency of 450 MHz. The device is offered in the industrial temperature grade (-40C to +100C junction), identified by the "I4" speed/temperature code. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, transceivers, and PLLs. Within the broader programmable logic hierarchy, FPGAs sit alongside CPLDs as the most flexible digital implementation medium: an FPGA can emulate any digital function up to its resource budget and is typically selected when ASIC NRE costs cannot be justified or when time-to-market is critical. The Stratix III E family targets high-performance digital signal processing, high-speed serial connectivity, and embedded processor applications. Key features of the EP3SE80F1152I4N include 80,000 logic elements, 6,843,392 embedded memory bits organized as M9K/M144K blocks, dedicated DSP blocks for fixed- and floating-point arithmetic, and high-speed transceivers supporting multi-gigabit serial protocols. The 1152-ball FCBGA package uses flip-chip interconnect to the substrate, providing superior electrical performance and thermal dissipation versus wire-bond equivalents. The architecture integrates hard IP such as PCI Express hard IP blocks, external memory interfaces (DDR/DDR2/QDRII), and multiple PLLs for clock management. Compared with earlier Stratix generations, Stratix III E devices introduce a programmable power technology that reduces dynamic power while preserving performance, addressing one of the historic disadvantages of high-density FPGAs in power-constrained systems. Typical applications include high-speed DSP pipelines (radar, software-defined radio, medical imaging), protocol bridging and packet processing in telecom/networking line cards, ASIC prototyping and emulation, and high-bandwidth data acquisition systems. The 744 user I/Os and 1.1 V core make it particularly well-suited to systems requiring parallel high-speed interfaces combined with on-chip processing. Designers should note that FCBGA packages require controlled-impedance PCB stackups, microvia or via-in-pad technology, and X-ray inspection of solder joints. Power estimation should be performed using the Quartus II PowerPlay early power estimator before logic synthesis to size voltage regulator rails and thermal solution correctly. This page synthesizes distributor pricing, drop-in same-family alternatives from the Site MPN list, and practical design notes not aggregated on any single distributor page.

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EP3SE80F780C2 - 80K LE Stratix III E FPGA, 488 I/O, 780-FCBGA | Intel
EP3SE80F780C2

EP3SE80F780C2 - 80K LE Stratix III E FPGA, 488 I/O, 780-FCBGA | Intel

The Intel (formerly Altera) EP3SE80F780C2 is a high-density Stratix III E field-programmable gate array (FPGA) with 80,000 logic elements, 6,843,392 bits of embedded memory, and 488 user I/Os, fabricated on a 65 nm process with a 1.1 V core supply and housed in a 780-ball flip-chip BGA (FC-FBGA) package. It belongs to the low-power, enhanced-logic Stratix III E family, with 3,200 logic array blocks (LABs) and 320 DSP blocks for high-throughput signal processing. A Stratix III E FPGA is a programmable logic device that combines a high-performance adaptive logic module (ALM) fabric, embedded memory (M9K and M144K blocks), embedded DSP blocks, transceivers, and rich clocking on a single die, allowing designers to implement complete system-on-chip solutions. Stratix III E sits below Stratix IV/V and above Cyclone families in the Altera/Intel FPGA hierarchy, targeting mid-range high-performance designs in communications, video processing, and digital signal processing where logic density and DSP throughput matter more than cost-per-unit. The 'E' suffix denotes the enhanced-logic / DSP-optimized variant without embedded transceivers. Key features include 80,000 logic elements (LEs), 6,843,392 embedded RAM bits, 488 user I/Os, and 320 DSP blocks. The device operates at a maximum core clock of 600 MHz and uses the Cyclone/Stratix-style configuration scheme with on-chip encryption support. The 780-ball FC-FBGA package exposes a wide pin budget for parallel external interfaces such as DDR2/DDR3 memory controllers, parallel LVDS buses, and high-speed control planes. The 65 nm low-power process, combined with programmable power technology that allows unused logic, memory, and DSP regions to be powered down, enables the device to fit into thermal envelopes that older 90 nm and 130 nm FPGAs of comparable density could not. On-chip termination, multi-standard I/O support (LVDS, LVPECL, HSTL, SSTL), and up to 12 phase-locked loops (PLLs) provide flexible clock and interface synthesis directly on the die. Typical applications include high-speed digital signal processing (radar, sonar, beamforming), wired/wireless communication line cards, video broadcast and image processing pipelines, ASIC prototyping/emulation, and industrial motion control. The 488 user I/Os are particularly suited to parallel memory buses and high-channel-count data acquisition front ends. When designing with this device, ensure the Quartus II design tool supports the EP3SE80 device variant and that the PCB land pattern follows Intel's 780-ball FC-FBGA 1.0 mm-pitch footprint. Designers should also plan thermal management carefully because BGA packages dissipate heat primarily through the PCB and any attached heatsink. This page synthesizes distributor pricing, same-package same-family alternatives, and practical design notes not found in the standalone manufacturer datasheet, helping engineers evaluate pin-compatible drop-in parts and make informed sourcing decisions.

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EP3SE80F780C2N - Stratix III E FPGA, 80K LE, 780-FCBGA | Intel / Altera
EP3SE80F780C2N

EP3SE80F780C2N - Stratix III E FPGA, 80K LE, 780-FCBGA | Intel / Altera

The Intel (formerly Altera) EP3SE80F780C2N is a high-density Stratix III E Field-Programmable Gate Array (FPGA) built on a 65 nm process, delivering 80,000 logic elements (LE), 6,843,392 bits of embedded memory, and 488 user I/Os in a 780-ball flip-chip BGA (FC-FBGA) package. Operating at 1.1 V core with 0.9 V auxiliary supply, the device provides up to 600 MHz fabric operation and supports integrated transceivers, DSP blocks, and 3200 Logic Array Blocks (LABs) for high-performance parallel computing. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit in the broader taxonomy of programmable logic devices (PLD), distinct from ASICs because they can be reconfigured in the field after manufacture. Stratix III E belongs to the high-performance tier of FPGAs optimized for DSP, signal processing, and communications infrastructure. Key features of the EP3SE80F780C2N include 80K logic elements, 488 user I/Os, 6.84 Mbits of embedded memory (M9K/M144K blocks), 384 18x18 multipliers, integrated transceiver capability, and 3200 LABs. The 65 nm low-power process enables lower static power consumption versus prior Stratix generations, while the 780-ball FCBGA package offers high I/O density with flip-chip thermal performance. The architecture combines Adaptive Logic Modules (ALMs), tri-matrix memory blocks, and DSP blocks for high-bandwidth parallel arithmetic. Memory interfaces up to DDR3 and high-speed serial transceivers enable line-card, baseband, and high-performance DSP designs. The C2 speed grade balances performance and power for industrial and communications applications. Typical applications include high-speed networking line cards, baseband processing in wireless infrastructure, DSP acceleration in test and measurement equipment, ASIC prototyping, and high-speed serial protocol bridging. The 488 I/Os and abundant logic support multi-channel parallel interfaces. When designing with this device, ensure the PCB has matched-impedance routing for transceiver lanes and adequate via-in-pad or microvia technology for the FC-FBGA breakout. Thermal management via heatsink or airflow is essential at full transceiver utilization due to the flip-chip power density. This page synthesizes distributor pricing, Stratix III E cross-reference alternatives, and practical PCB layout guidance not found in the manufacturer datasheet alone.

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EP3SE80F780C3 - Stratix III E FPGA, 80K LE, 780-FBGA | Altera
EP3SE80F780C3

EP3SE80F780C3 - Stratix III E FPGA, 80K LE, 780-FBGA | Altera

The Altera (Intel) EP3SE80F780C3 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 80,000 logic elements, 6,843,392 bits of embedded memory, and 488 user I/O pins in a 780-ball FineLine BGA (FC-FBGA) package. Fabricated on a 65 nm TSMC low-power process, it operates from a 1.1 V core supply and supports internal clock frequencies up to 500 MHz, making it a flagship device for high-throughput DSP, serial connectivity, and embedded processing subsystems. An FPGA (Field Programmable Gate Array) is a programmable semiconductor containing an array of configurable logic blocks (CLBs), dedicated DSP slices, embedded memory, high-speed transceivers, and a programmable interconnect fabric. FPGAs sit between microcontrollers and ASICs in the silicon hierarchy: microcontroller -> microprocessor -> programmable logic -> FPGA -> ASIC. They are selected when designers need hardware-level parallelism and deterministic latency but cannot justify the NRE cost of a custom ASIC, and they are widely used in telecommunications infrastructure, high-performance computing, test and measurement, and aerospace/defense applications. The EP3SE80F780C3 integrates 3,200 Logic Array Blocks, up to 1,440 Kbits of MLAB memory, 270 embedded 18x18 multipliers, and Stratix III's signature Programmable Power Technology that dynamically lowers supply voltage on quiescent logic tiles. Hard IP blocks include PCI Express Gen1/Gen2 endpoints, multi-gigabit transceivers (per package variant), external memory interfaces supporting DDR/DDR2/QDRII, and dedicated PLL/DLL clock management. Designers target the device with Altera's Quartus II design suite, which provides IP cores, timing analysis, and the PowerPlay power optimization flow. Typical applications span high-speed serial protocol bridging, digital video broadcast head-ends, software-defined radio baseband processing, military radar front-end preprocessing, ASIC prototyping, and high-end medical imaging pipelines. Its 488 user I/O pins and abundant vertical migration paths within the Stratix III E family also make it a strong fit for production systems that previously used multiple smaller FPGAs to reach equivalent logic density. When designing with the EP3SE80F780C3, allocate sufficient PCB layers (typically 12+ layers with dedicated power and ground planes) to route the 780-ball FineLine BGA at 1.0 mm pitch, follow Altera's Stratix III pin connection guidelines for unused transceiver and clock pins, and use the Quartus II Early Power Estimator before board layout to validate thermal budgets. Stratix III E devices are also NRND - confirm lifetime-buy options with Intel/Altera before starting new designs. This page consolidates distributor pricing, drop-in vertical-migration alternatives within the Stratix III E family, and practical Quartus II design notes not found in the standalone datasheet, giving engineers a single reference for sourcing, replacement, and bring-up decisions.

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EP3SE80F780C3N - Stratix III 80K LE FPGA, 780-FBGA | Intel
EP3SE80F780C3N

EP3SE80F780C3N - Stratix III 80K LE FPGA, 780-FBGA | Intel

The Intel (formerly Altera) EP3SE80F780C3N is a high-density, low-power Field Programmable Gate Array (FPGA) from the Stratix III family, integrating 80,000 logic elements, 3200 Logic Array Blocks (LABs), and 488 user I/Os in a 780-pin FineLine Ball-Grid Array (FBGA-780) package. Built on a 40 nm TSMC process, this device targets performance-critical applications requiring transceiver-rich I/O, on-chip memory, and DSP blocks at commercial 0°C to 85°C operating temperature. What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks (memory, DSP, transceivers, PLLs) that can be reconfigured by the designer after manufacture. FPGAs sit between general-purpose microcontrollers (sequential, software-defined) and Application-Specific Integrated Circuits (ASICs) (fixed-function, high-volume) in the programmable-logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. They are widely used for hardware acceleration, high-speed signal processing, and prototyping ASICs. Key features include up to 488 user I/Os, embedded TriMatrix memory blocks, dedicated DSP blocks for high-throughput arithmetic, MultiTrack interconnect for predictable timing closure, and support for high-speed external memory interfaces including DDR3. The 'C3' speed grade places this device in the mid-tier performance bin, and 'N' suffix indicates lead-free / Pb-free assembly. Internal logic-array frequency is rated to 800 MHz in this family, and fabric performance scales with design and routing constraints. Typical applications include high-speed networking line cards, wireless baseband processing, military radar and electronic-warfare signal chains, medical imaging accelerators, ASIC prototyping, and high-performance computing offload engines. The large logic capacity and abundant I/O make it well suited to data-path-heavy designs that would otherwise require multiple smaller FPGAs. When designing with this part, plan power-rail sequencing carefully - Stratix III requires multiple supply rails (VCC, VCCPD, VCCPT, VCCA, VCCH, VCCL) with strict monotonic-ramp requirements. Use the Quartus II PowerPlay early-power estimator before PCB layout to avoid thermal redesigns late in the cycle. JTAG, MSEL, and configuration-pin planning should follow the Stratix III Handbook reference schematics verbatim for first-pass board success.

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EP3SE80F780C4 - Stratix III E 80K LE FPGA, 488 I/O, FCBGA-780 | Altera
EP3SE80F780C4

EP3SE80F780C4 - Stratix III E 80K LE FPGA, 488 I/O, FCBGA-780 | Altera

The Altera (Intel) EP3SE80F780C4 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) housed in a 780-pin FC-FBGA (FCBGA-780) package. Built on a 65 nm process, the EP3SE80F780C4 integrates 80,000 logic elements, 6,843,392 RAM bits (~6.5 Mbit), 488 user I/Os, and 3,200 LABs/CLBs, with a core voltage of 1.1 V and maximum operating frequency support up to 450 MHz. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows engineers to implement arbitrary digital logic through configurable logic blocks (CLBs/LABs), programmable interconnect, block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy the highest flexibility tier of the programmable logic taxonomy: programmable logic → programmable logic device → semiconductor IC. Stratix III devices added Altera's Programmable Power Technology, allowing unused logic blocks to consume less power while active blocks run at full speed, addressing the historical ASIC-vs-FPGA trade-off. Key features of the EP3SE80F780C4 include 80,000 logic elements, 488 user I/Os (largest I/O count in the Stratix III E family 780-package options), 6.5 Mbit embedded memory, and selectable core voltage for low-power operation. The device supports up to 8 PLLs and multiple high-speed I/O standards including LVDS, making it suitable for high-throughput parallel interfaces. Operating temperature grade is commercial (0C to +85C), denoted by the C4 speed/temperature code. The architecture uses a tiered interconnect (HyperFlex-equivalent not present in Stratix III) combined with DSP blocks and TriMatrix on-chip memory to deliver high DSP throughput. Programmable Power Technology combined with selectable core voltage (1.1 V nominal, optionally 0.9 V for lower power) gives the lowest static power in its class for 65 nm high-performance FPGAs. Typical applications include high-performance digital signal processing, telecom baseband and packet processing, ASIC prototyping, high-end test and measurement instrumentation, broadcast video processing, and high-bandwidth data acquisition systems. The 488 I/O count supports wide parallel buses, multi-channel LVDS interfaces, and memory-rich designs. When designing with this FPGA, pay close attention to the large BGA thermal envelope and PCB stack-up requirements - 780-pin FC-FBGA requires microvia stack-up and controlled-impedance routing. Use Altera/Intel Quartus II software with the Stratix III device support to compile, simulate, and configure the device via JTAG or active serial configuration schemes. This page synthesizes distributor pricing, same-family Altera/Intel drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP3SE80F780C4L - 80K LE Stratix III E FPGA 780-FCBGA | Intel
EP3SE80F780C4L

EP3SE80F780C4L - 80K LE Stratix III E FPGA 780-FCBGA | Intel

The Intel (formerly Altera) EP3SE80F780C4L is a Stratix III E family Field-Programmable Gate Array (FPGA) housed in a 780-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) package, fabricated on a 65 nm process node and supplied at 0.9 V core. It delivers 80,000 logic elements, 6,843,392 bits of embedded memory, and 488 maximum user I/O pins, with a maximum internal clock frequency of 375 MHz. The 780-FCBGA package exposes 24 full-duplex transcever lanes operating up to 6.375 Gbps for high-speed serial connectivity. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect, all of which an engineer can reconfigure after manufacture to implement any digital circuit. FPGAs sit hierarchically between general-purpose microcontrollers (fixed architecture, software-driven) and application-specific integrated circuits (ASICs, fixed function), offering hardware-level parallelism and the ability to ship a generic silicon platform that is customized per end-product. The Stratix III E family targets high-performance, high-bandwidth applications such as wireline telecom, high-end DSP, and ASIC prototyping. Key differentiating features include 3200 Logic Array Blocks (LABs), 4 phase-locked loops (PLLs), 8.34375 Gbps maximum transceiver data rate, 488 user I/Os, and hard memory controllers. The device also integrates dedicated DSP blocks, high-speed transcevers, and the Adaptive Logic Module (ALM) architecture, which delivers roughly twice the logic capacity per LUT compared with the prior Stratix II generation. This combination of logic density and high-speed serial I/O targets throughput-intensive designs. Architecturally, the Stratix III E ALM is an 8-input adaptive structure that can be split into smaller LUTs, providing superior logic packing versus fixed 4-input LUTs. The transceiver tiles support multiple protocol Physical Coding Sublayers (PCS) including PCI Express Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, and SDI, removing the need for external PHY chips. The 65 nm process and 0.9 V core supply minimize dynamic power, while programmable power-rail gating lets unused logic cut quiescent draw, enabling the E family to hit higher performance at lower watts than Stratix II. Typical applications include high-speed serial protocol bridging (PCIe, XAUI, SRIO), ASIC and SoC prototyping, telecommunications line cards, military radar signal processing, broadcast video processing, and high-performance DSP accelerators. The 488 I/O pins and 24 transceiver channels also suit it to multi-port packet processors. Designers building high-throughput parallel pipelines benefit from the combination of ALM logic density, embedded RAM, and hard DSP blocks. Designers using this part must observe Stratix III E power-on sequencing (1.0 V, then VCCPD, then VCCAUX, then core VCC), ensure transceiver reference-clock jitter meets the protocol requirement, and respect FPGA-JTAG configuration timing during board bring-up. The device ships in the C4 (commercial, speed grade 4, enhanced power) variant with the C4L suffix denoting a lead-free / RoHS-compliant FC-FBGA package. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Stratix III E family and pin-compatible cross-brand FPGAs, and practical design notes that go beyond what the manufacturer datasheet alone provides.

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EP3SE80F780C4LN - 80K LE Stratix III E FPGA, 488 I/O, FCBGA-780
EP3SE80F780C4LN

EP3SE80F780C4LN - 80K LE Stratix III E FPGA, 488 I/O, FCBGA-780

The Intel (formerly Altera) EP3SE80F780C4LN is a high-density Stratix III Enhanced family Field-Programmable Gate Array (FPGA) delivering 80,000 logic elements, 3,200 Logic Array Blocks (LABs), and 6,843,392 bits of embedded memory in a 780-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. Operating on a 0.9 V core supply and fabricated on a 65 nm process node, the device supports up to 488 user I/O pins and is rated for the commercial temperature grade. The "C4" speed grade and "LN" lead-free, RoHS-compliant suffix identify a specific performance/reliability bin aimed at cost-sensitive high-volume designs. An FPGA is a programmable logic device that allows hardware designers to implement arbitrary digital circuits using a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers, all wired together by programmable routing. FPGAs sit alongside microcontrollers, ASICs, and ASSPs in the broader semiconductor/programmable logic taxonomy and are typically chosen when design requirements include high parallelism, evolving standards, or low-volume customization that cannot be cost-justified on a custom ASIC. The Stratix III generation introduced the Programmable Power Technology, allowing unused logic and routing tiles to be powered down to reduce dynamic consumption. Key features include a maximum internal operating frequency of 375 MHz, six independent I/O bank groups, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), and dedicated 18x18 hardware multipliers. The device integrates 18x18 multipliers, embedded memory blocks (M9K/M144K), and an extensive configuration infrastructure (active serial, passive parallel, fast passive parallel) tailored to high-throughput compute and signal-processing workloads. Hardware support for PCI Express Gen1, Gigabit Ethernet, and DDR2/DDR3 external memory interfaces is enabled through hard IP blocks. The EP3SE80F780C4LN is built on TSMC's 65 nm low-power process and is part of the broader Stratix III E family that scales from ~40K to ~120K logic elements. Compared with later Stratix IV/V families it lacks the higher transceivers-per-cm² density and the dedicated variable-precision DSP blocks, but it remains a low-cost option for legacy industrial, test & measurement, and prototyping platforms where the Quartus II design environment still fits the engineering workflow. Typical applications include high-speed digital signal processing (DSP), telecom baseband/protocol bridging, ASIC prototyping, industrial control and machine vision, and high-performance data-acquisition front ends. The 488 I/Os also make it a strong fit for display controller glue logic and broadcast video processing. When designing with this device, allocate sufficient PCB area for the FCBGA-780 footprint (29 mm × 29 mm body, 1.0 mm ball pitch), follow Intel's power-decoupling reference design, and validate the chosen speed grade against worst-case timing in Quartus II. This page synthesizes distributor pricing, drop-in Stratix III alternatives, and design considerations not always visible on the manufacturer datasheet cover.

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EP3SE80F780C4N - Stratix III E FPGA 80K LE 780-FBGA | Intel
EP3SE80F780C4N

EP3SE80F780C4N - Stratix III E FPGA 80K LE 780-FBGA | Intel

The Intel (formerly Altera) EP3SE80F780C4N is a high-density Stratix III E Field Programmable Gate Array (FPGA) with 80,000 logic elements, 3,200 Logic Array Blocks (LABs) and 488 user I/Os, fabricated on a 65 nm process and supplied in a 780-ball FineLine BGA (FC-FBGA) package with 0.9 V core and 1.1 V I/O operation. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) whose logic fabric, routing and I/O are configured by the user after manufacture. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. They are used wherever application-specific logic, DSP, or high-speed serial I/O must be implemented without the cost and lead-time of an ASIC. The Stratix III E family, of which EP3SE80F780C4N is a member, targets high-end DSP, communication and signal-processing designs. Key features of the EP3SE80F780C4N include 80,000 logic elements, 6,843,392 bits of embedded memory (M9K/M144K TriMatrix blocks), 3,200 LABs, up to 488 user I/Os, and integrated transceivers/multipliers typical of the Stratix III E family. The 65 nm process enables higher density and lower static power than previous Stratix generations, while the 780-ball FC-FBGA supports dense board layouts with controlled-impedance signal routing for memory and LVDS interfaces. The architecture combines a logic fabric based on Adaptive Logic Modules (ALMs) with TriMatrix interconnect, dedicated DSP blocks, embedded memory and a flexible clock network. This allows the EP3SE80F780C4N to implement wide datapath designs such as baseband processing, video pipelines and protocol bridging while maintaining deterministic timing closure through the Quartus II timing analyser. Typical applications include wireless baseband and backhaul, high-performance digital signal processing, military radar and SDR prototyping, ASIC prototyping, test and measurement instrumentation, and high-speed memory interfaces. The wide I/O count and high logic density make it a common choice where multiple processor cores, memory controllers and custom logic must coexist on one silicon device. When designing with this device, allocate sufficient PCB area for power decoupling and use Altera's Stratix III power-estimator early in the schematic phase, because dynamic current at high toggle rates can exceed the conservative spreadsheet value. Vertical migration within the 780-pin BGA is supported, which lets designers reuse the same PCB layout across EP3SE50, EP3SE80, EP3SE110 and similar devices. This page synthesises distributor pricing, vertical-migration drop-in alternatives in the Stratix III E family and design notes not found in the standalone datasheet.

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EP3SE80F780I3 - 80K Logic Elements FPGA | Altera | Digital Systems
EP3SE80F780I3

EP3SE80F780I3 - 80K Logic Elements FPGA | Altera | Digital Systems

Altera EP3SE80F780I3 is a Stratix III E field-programmable gate array with 80,000 logic elements, 6,843,392 memory bits, and 488 user I/O pins, supplied in a 780-ball FCBGA package. The verified distributor listing identifies the device as an FPGA, while secondary specification data reports an internal frequency of 800 MHz, 0.9 V supply voltage, and a 0°C to 85°C operating-temperature range. These values should be confirmed against the original Altera datasheet before design release. A field-programmable gate array is a programmable semiconductor containing configurable logic, memory resources, interconnect, and input/output blocks. FPGA devices sit within the broader hierarchy of programmable logic devices, digital integrated circuits, and semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing, allowing designers to implement changing digital functions, interfaces, and data-processing pipelines without fabricating a new silicon device. The headline capacity of EP3SE80F780I3 is its 80,000 logic elements, supported by 6,843,392 memory bits and 488 user I/O pins. The large I/O count is significant for parallel data acquisition, communications equipment, industrial controllers, and test systems that need many external connections. The 780-ball FCBGA package provides a high-density surface-mount solution, but it also requires controlled PCB assembly, exact land-pattern compliance, and careful signal-integrity planning. The reported 800 MHz internal frequency indicates substantial digital processing capability, although the achievable system clock depends on the selected configuration, logic implementation, routing, and timing constraints. The 0.9 V supply voltage is consistent with a low-voltage, high-performance FPGA architecture. Designers must use the manufacturer power guidelines and perform board-level decoupling, distribution, and thermal analysis rather than assuming that the stated internal frequency can be sustained in every design. Typical applications include high-performance digital signal processing, communications infrastructure, industrial automation, video and imaging interfaces, test and measurement equipment, and reconfigurable computing. Its 488 user I/Os make it particularly relevant when a design must bridge many buses, converters, memories, or control interfaces. The 80,000 logic elements and reported 6,843,392 memory bits provide a useful resource baseline for partitioning datapaths, control logic, packet processing, and protocol bridges. A key design trade-off is package and power complexity. The 780-ball FCBGA footprint may create routing constraints, assembly yield concerns, and demanding power-delivery requirements. Engineers should validate pin assignments, configuration circuitry, clock distribution, decoupling, and thermal performance against the manufacturer documentation before beginning PCB layout. Secondary sources report an FBGA-1152 designation for the same search result, which conflicts with the primary distributor listing of 780-BBGA/FCBGA; the package designation must therefore be resolved from the official ordering information and package drawing. This page combines verified distributor identification, package and capacity details, application context, and explicit uncertainty markers. It does not infer missing timing, transceiver, voltage, or compliance specifications. Engineers can use the comparison and design sections to organize validation work, while the official manufacturer datasheet remains the controlling source for pinout, electrical limits, timing, configuration, and assembly requirements.

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EP3SE80F780I3N - 80K LEs Stratix III E FPGA, 488 I/O, 780-FBGA | Intel
EP3SE80F780I3N

EP3SE80F780I3N - 80K LEs Stratix III E FPGA, 488 I/O, 780-FBGA | Intel

The Intel EP3SE80F780I3N is a high-density Stratix III E family Field Programmable Gate Array (FPGA) offering 80,000 logic elements, 6,843,392 bits of embedded memory, and 488 user I/O pins, housed in a 780-ball Fine-Pitch Ball Grid Array (FBGA) package. It is fabricated on a 65 nm low-power CMOS process and operates from a 1.1 V core supply, delivering up to 500 MHz core performance for high-throughput digital signal processing, telecommunications, and ASIC-prototyping workloads. What is an FPGA? A Field-Programmable Gate Array is a class of programmable logic device that allows hardware designers to configure logic blocks, routing, and I/O behavior after manufacturing. FPGAs sit hierarchically between fixed-function ASICs and general-purpose processors, providing hardware-timed parallelism, reconfigurable fabric, and high-speed serial transceivers. The Stratix III E family specifically targets high-performance DSP and memory-intensive applications, combining substantial logic density with embedded memory, DSP blocks, and rich high-speed serial I/O. The EP3SE80 variant sits in the mid-density tier of the family, balancing logic resources, memory, and I/O count for moderate-to-large system designs. The device integrates up to 488 general-purpose I/Os supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. It contains dedicated on-chip memory blocks, hardware multiplier/accumulator DSP blocks, and up to 12 embedded transceivers depending on the package variant. The 780-FBGA package provides controlled-impedance routing for high-speed signals and an exposed-die thermal management path, supporting industrial junction temperature operation. Typical applications include high-performance ASIC prototyping, wireless baseband processing, high-speed serial interface bridging, radar and image processing front-ends, and military/aerospace signal processing. The combination of 80K logic elements and 6.8 Mbit embedded RAM enables large packet buffers and FFT scratchpad memories without external SRAM, while the 488 I/O support enables direct connection to DDR/DDR2/QDR II memories and parallel ADC/DAC interfaces. When designing with this FPGA, ensure power-rail sequencing respects the 1.1 V core / auxiliary supply relationship defined in the datasheet, and that the board's decoupling network meets the transient current demands of simultaneous logic-switching events. Programming via JTAG or the active serial configuration scheme requires a Quartus II-supported configuration device. This page synthesizes distributor pricing, drop-in same-brand alternatives from the Stratix III E family, and practical design considerations that complement the manufacturer datasheet.

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EP3SE80F780I4 - Stratix III E FPGA 80K LE 780-FCBGA | Intel
EP3SE80F780I4

EP3SE80F780I4 - Stratix III E FPGA 80K LE 780-FCBGA | Intel

The Intel (formerly Altera) EP3SE80F780I4 is a Stratix III E family Field-Programmable Gate Array (FPGA) housed in a 780-ball FC-FBGA package, integrating 80,000 logic elements (LE), 6,843,392 bits of embedded memory, 488 user I/Os, and 3,200 LABs on a 65 nm process node. The device supports core and I/O voltages around 1.1 V (per the Stratix III E datasheet family) and targets high-throughput DSP, telecommunications, and signal-processing designs where logic density and on-chip memory bandwidth are decisive. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs / LABs), programmable interconnect, and hardened IP such as transceivers, DSP blocks, and embedded memory. FPGAs belong to the programmable logic device (PLD) family and sit hierarchically above CPLDs in gate count and capability, parallel to ASICs in functionality but with field-reprogrammability. Stratix III E is a high-performance, low-power variant of the Stratix III generation, marketed by Altera (acquired by Intel in 2015) and now sold by Intel under the FPGA Smart Platform brand. Key features of the EP3SE80F780I4 include 80,000 logic elements, 6,843,392 memory bits, 488 user I/Os, an industrial temperature grade (-40 °C to +100 °C) indicated by the 'I' speed/temperature code, and the speed grade '4' (medium performance). The device exposes multiple PLLs, high-speed transceivers (per Stratix III E family), and dedicated DSP blocks optimized for fixed- and floating-point operations, and supports up to 800 MHz internal clock operation per the 65 nm Stratix III E process generation. Stratix III E FPGAs use a Programmable Power Technology that dynamically lowers core voltage on inactive blocks, reducing dynamic power up to 40% relative to the prior Stratix II generation. The architecture provides per-LAB clock enable, optional fine-grain power gating, and a multi-track routing fabric that minimizes congestion in high-utilization designs. The EP3SE80F780I4 ships in a flip-chip BGA with a 29 mm x 29 mm body and 1.0 mm ball pitch. Typical applications include high-throughput DSP pipelines (radar, beamforming, software-defined radio), wireline telecommunications line cards, ASIC prototyping, high-speed serial backplane bridging, and broadcast video processing. The 488 user I/Os also suit parallel memory expansion and high-channel-count data acquisition front-ends. When designing with this part, plan PCB stack-up for the 1.0 mm BGA pitch and provide adequate decoupling per Intel Stratix III E pin connection guidelines. For new designs, also evaluate the newer Stratix IV/V/10 families for lower power and higher logic density; the EP3SE80F780I4 is best deployed in mature designs or where Stratix III E firmware IP already exists. This page synthesizes distributor pricing, drop-in FPGA alternatives (including I/C/N temperature and speed grades), and Stratix III E PCB design notes not consolidated on any single manufacturer or distributor page.

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EP3SE80F780I4L - Stratix III E 80K LE FPGA 780-FCBGA | Intel
EP3SE80F780I4L

EP3SE80F780I4L - Stratix III E 80K LE FPGA 780-FCBGA | Intel

The Intel (formerly Altera) EP3SE80F780I4L is a high-density Stratix III E Field-Programmable Gate Array (FPGA) integrating 80,000 logic elements, 6,843,392 bits of embedded memory, and 488 maximum user I/Os in a 780-ball Flip-Chip BGA (FCBGA) package. According to the Stratix III Device Handbook, this device belongs to the performance-optimized E family targeting high-speed parallel processing, DSP-intensive designs, and memory-rich applications, with a maximum core clock performance of approximately 717 MHz. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as DSP slices, block RAM, PLLs, and high-speed transceivers. FPGAs sit at the top of the programmable logic hierarchy above CPLDs, enabling system architects to implement custom processor pipelines, hardware accelerators, and interface bridges that would otherwise require ASIC-level integration. The Stratix III family specifically uses a 40 nm process node and a programmable power technology that dynamically scales voltage and frequency per logic region to balance throughput and leakage. Key features of the EP3SE80F780I4L include 3200 LABs (Logic Array Blocks), 488 user I/Os, six full-duplex clock PLLs, 384 embedded multipliers (18x18), and support for external memory interfaces such as DDR3, DDR2, QDRII+, and RLDRAM II via dedicated PHY circuitry. The device also integrates 24 transceivers (per Stratix III E family) capable of up to 3.125 Gbps operation, making it suitable for serial RapidIO, PCIe Gen1, and custom high-speed serial links. Architecturally, the Stratix III E family uses Altera's adaptive logic modules (ALMs) - each ALM contains an 8-input fracturable look-up table, two dedicated adders, and shared arithmetic carry chains - which roughly double the effective logic capacity per LAB compared with prior generation Stratix II devices. The 780-FCBGA package provides high signal integrity for parallel memory buses and backplane connectivity, and supports industrial temperature operation (the I4L suffix denotes industrial-grade, low-power, speed grade 4). Typical applications include high-performance computing (HPC) nodes, software-defined radio (SDR) baseband processing, high-resolution video broadcast routers, ASIC prototyping emulators, 10G/40G line-card packet processing, and military/aerospace image processing platforms. The combination of 80K LEs and 6.8 Mbits of block RAM makes the EP3SE80F780I4L a strong fit for designs that need large on-chip buffering without external SRAM. When designing with this FPGA, allocate at least 10 layers of PCB stack-up with dedicated ground and power planes around the 780-ball BGA to control simultaneous-switching-noise on the 488 user I/Os. Use the Quartus II PowerPlay early power estimator before pin assignment to verify thermal envelopes - a fully utilized Stratix III E can reach 15 W without transceivers, exceeding the 780-FCBGA thermal limit without enhanced bottom-side thermal management. This page synthesizes distributor pricing, same-family Stratix III drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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EP3SE80F780I4LN - 80K LE Stratix III E FPGA, 780-FCBGA | Intel
EP3SE80F780I4LN

EP3SE80F780I4LN - 80K LE Stratix III E FPGA, 780-FCBGA | Intel

The Intel (formerly Altera) EP3SE80F780I4LN is a high-density Stratix III E Field Programmable Gate Array (FPGA) with 80,000 logic elements, 3,200 LABs, and 488 user I/Os, fabricated on a 65 nm process node and housed in a 780-ball FC-FBGA package. It integrates 6,843,392 bits of embedded memory, operates at a core voltage of 0.9 V, and supports a maximum internal clock frequency of 375 MHz. The device is specified over the industrial temperature range (–40 °C to +100 °C case), as indicated by the 'I' speed-grade designation in the part number. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream. Stratix III E sits within Altera's hierarchy as: FPGA -> programmable logic device (PLD) -> logic IC -> digital semiconductor. Compared with fixed-function ASICs, FPGAs accelerate time-to-market and enable in-system design changes, while compared with earlier FPGA generations Stratix III E achieves higher logic density per Watt thanks to its 65 nm low-power process and adaptive logic modules (ALMs). Key differentiating features of the EP3SE80F780I4LN include: 80,000 logic elements (LEs) for high-density datapath and control-plane designs; 3,200 LABs/CLBs for parallel architectural flexibility; 488 maximum user I/Os (in this F780 package variant) for wide memory and high-speed transceiver interfaces; and embedded memory of 6,843,392 bits distributed in M9K/M144K blocks. The 'I4' speed grade corresponds to an industrial temperature range, and the 'N' suffix indicates lead-free / Pb-free terminations compliant with current RoHS directives. Architecturally, the Stratix III E family uses Altera's adaptive logic module (ALM) building block, an 8-input fracturable LUT that can be reconfigured to implement any 7-input LUT or two independent 4-input LUTs. Combined with dedicated 18x18 multipliers, MLAB memory, and high-speed serial transceivers, the EP3SE80 enables DSP-intensive designs, memory-rich packet processing, and protocol bridging without external logic. The 780-FCBGA package provides ample signal integrity for high-speed DDR/DDR2/QDR II memory interfaces and LVDS-based chip-to-chip links. Typical applications for the EP3SE80F780I4LN include wireline telecommunications line cards, military and aerospace signal processing, high-performance DSP prototyping, broadcast video processing, and ASIC prototyping for system architects who need >70 KLE in a single device. The industrial temperature range also suits ruggedized computing and test-and-measurement platforms. When designing with this part, pay careful attention to power-rail sequencing for the 0.9 V core, 1.1 V PLL, and 1.8/2.5/3.3 V I/O banks, and follow Altera's Stratix III PowerPlay guidelines to estimate junction temperature with the device's thermal model. Designers new to Stratix III should use the Quartus II design software for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, package-level drop-in alternatives within the same Stratix III E family, and practical design notes that are not aggregated on the manufacturer product page.

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EP3SE80F780I4N - Stratix III E FPGA 80K Cells 780-FCBGA | Intel
EP3SE80F780I4N

EP3SE80F780I4N - Stratix III E FPGA 80K Cells 780-FCBGA | Intel

The Intel EP3SE80F780I4N is a high-performance, low-power Field Programmable Gate Array from the Stratix® III E family, integrating 80,000 logic elements, 488 user I/Os, and up to 6,843,392 bits of embedded memory in a 780-ball FineLine Ball-Grid Array (FCBGA). Manufactured on a 65 nm process node with a 1.1 V core supply, the device targets throughput-critical applications where deterministic performance, abundant DSP blocks, and high-speed transceivers are required. The part operates across the industrial temperature range and is rated for speeds up to 450 MHz fabric operation. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as memory, DSP slices, PLLs, and high-speed transceivers. FPGAs belong to the broader class of programmable logic devices (PLDs), which sit between fixed-function ASICs and software-defined processors in the design hierarchy. The Stratix III E family specifically targets high-end digital signal processing, wireline communications, and military/aerospace systems where Stratix III GX-style transceiver-equipped cousins are not required. Key features include 3,200 Logic Array Blocks (LABs), 488 user I/Os, 6.8 Mbit embedded RAM, embedded DSP blocks for fixed- and floating-point arithmetic, programmable power technology that dynamically scales voltage and frequency per tile, and a comprehensive hard-memory controller subsystem. The 780-ball FCBGA package offers dense board integration with controlled-impedance signal escape, suitable for high-speed parallel interfaces such as DDR3, QDRII+, and RLDRAM II. Multi-gigabit transceivers are absent on the -E sub-family; designs requiring 6 Gbps+ serial links should evaluate Stratix III GX or Stratix IV parts instead. Architecturally, Stratix III E uses the Altera Adaptive Logic Module (ALM) - an 8-input fracturable LUT that can be partitioned into smaller LUTs to improve logic utilization. Combined with the programmable power technology and 65 nm low-power process, the family delivers high DSP throughput at substantially lower dynamic power than the preceding Stratix II. The device supports configuration via passive serial, fast passive parallel, and JTAG, with on-chip decompression and encryption via the advanced encryption standard (AES). Typical applications include high-performance digital signal processing for radar and electronic warfare, wireline backplane aggregation, test and measurement instrumentation, ASIC prototyping, and high-end image processing pipelines. Industrial and defense integrators value the combination of large logic capacity, abundant DSP resources, and military-grade temperature support. When designing with this device, pay close attention to power integrity - the FCBGA requires a multi-layer PCB with dedicated power and ground planes, and decoupling must follow the Stratix III Power Distribution Network design guidelines. Configuration scheme and pin assignments must be locked early in the design cycle because the 780-ball BGA footprint limits PCB rework options. This page synthesizes distributor pricing, same-family drop-in alternatives, and design guidance not collected in a single place by the manufacturer datasheet alone.

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EP3SL110F1152C4N - Stratix III L FPGA, 107.5K LE, 1152-FCBGA | Intel
EP3SL110F1152C4N

EP3SL110F1152C4N - Stratix III L FPGA, 107.5K LE, 1152-FCBGA | Intel

The Intel EP3SL110F1152C4N is a high-density Stratix III L Field Programmable Gate Array (FPGA) delivering 107,500 logic elements and 4,992,000 bits of embedded memory, housed in a 1152-ball FineLine Ball Grid Array (FCBGA) package. Operating at core speeds up to 500 MHz with 744 user I/O pins, the part is fabricated on a TSMC 65 nm low-power process and is rated for commercial temperature operation. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. Stratix III L is positioned in the Stratix III family hierarchy below the Stratix III E and above the Cyclone III families; it targets mid-density logic designs with low-power focus, with Stratix III E optimized for memory-rich applications and Cyclone III for cost-sensitive low-density designs. Key specifications include 744 maximum user I/O, 4,992,000 embedded RAM bits distributed across M9K and M144K blocks, 432 DSP blocks for fixed- and floating-point arithmetic, and 12 phase-locked loops (PLLs) supporting multiple clock domains. The device supports LVDS, LVTTL, LVCMOS, and SSTL I/O standards across 24 I/O banks, and integrates twelve 3.125 Gbps transceivers for high-speed serial connectivity. The Stratix III L architecture combines 65 nm process geometry with a programmable power technology that enables fine-grained power gating of unused logic, fabric, and transceivers. This results in static power roughly 50% lower than the prior Stratix II generation. The device integrates hard memory controllers, PCIe hard IP, and 8-input adaptive logic modules (ALMs) that implement any 6-input LUT plus two registers, maximizing logic utilization at the highest density. Typical applications include high-performance DSP for wireless baseband, radar and imaging signal processing, high-speed protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), ASIC prototyping, and test and measurement instrumentation. The device is widely used in defense, aerospace, and high-performance computing domains where logic density and signal-integrity performance outweigh power and unit cost. When designing with this part, ensure PCB layout follows Intel's FCBGA escape routing guidelines for the 1.0 mm ball pitch, including microvia stack-ups and matched-length trace tuning for LVDS and transceiver channels. Thermal management requires attention because 65 nm Stratix III devices under heavy utilization can exceed 10 W dissipation and demand a thermal relief copper pour under the package. This page synthesizes distributor pricing, drop-in alternatives within the Stratix III family, and practical board-design notes not consolidated in the manufacturer datasheet.

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EP3SL110F1152I3N - Stratix III L FPGA, 107.5K LE, 1152-BGA | Altera
EP3SL110F1152I3N

EP3SL110F1152I3N - Stratix III L FPGA, 107.5K LE, 1152-BGA | Altera

The Altera (Intel) EP3SL110F1152I3N is a Stratix III L family field-programmable gate array (FPGA) featuring 107,500 logic elements, 4,300 LABs, and 744 user I/Os, manufactured on a 65 nm process and housed in a 1152-ball flip-chip BGA (FC-FBGA) package. The device operates from a 1.1 V core supply and supports system speeds up to 500 MHz, making it suitable for high-throughput digital signal processing, high-speed serial interfaces, and parallel data-path designs. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines programmable logic blocks, configurable interconnect, and dedicated hard IP into a single semiconductor. The Stratix III L family sits within Altera's high-performance FPGA portfolio (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), positioned below Stratix V but above Cyclone families in density and transceiver capability. FPGAs are widely used to accelerate parallel computation, implement custom interfaces, and prototype ASIC designs before tape-out. Key features of the EP3SL110F1152I3N include 4,992,000 bits of embedded memory, dedicated DSP blocks for high-speed multiply-accumulate operations, support for external memory interfaces such as DDR3, and on-chip transceivers optimized for backplane and chip-to-chip serial links. The 'L' suffix denotes the lower-power variant of Stratix III, with programmable power technology that dynamically adjusts logic and routing resources based on design timing requirements, reducing static and dynamic power consumption compared to the standard Stratix III device of the same logic density. The architecture combines an 8-input adaptive logic module (ALM) fabric, 9-Kbit M9K memory blocks, 144-Kbit MLAB memory, variable-precision DSP blocks, and PLLs. The 1152-pin FC-FBGA package exposes up to 744 user I/Os plus dedicated clock, configuration, and power pins, enabling dense PCB designs with multiple high-speed parallel interfaces. Configuration is supported via JTAG, passive serial, fast passive parallel, and Altera-specific modes. Typical applications include wireline telecom line cards, military and aerospace signal processing, ASIC prototyping, high-performance computing accelerators, test and measurement equipment, and video broadcast infrastructure. The combination of logic density and serial bandwidth suits designs that previously required multiple mid-range FPGAs or a discrete ASIC. When designing with the EP3SL110F1152I3N, plan thermal management carefully. Estimated: at full logic utilization and 500 MHz operation, core power can reach several watts; the FC-FBGA's exposed die requires a heatsink or thermal interface material and a multi-layer PCB with adequate inner-plane copper for heat spreading. Use Altera Quartus II software for synthesis, place-and-route, and power analysis.

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EP3SL110F780C2N - Stratix III L FPGA, 107K LE, 780-FCBGA | Intel
EP3SL110F780C2N

EP3SL110F780C2N - Stratix III L FPGA, 107K LE, 780-FCBGA | Intel

The Intel EP3SL110F780C2N is a Stratix III L family Field-Programmable Gate Array (FPGA) housed in a 780-ball Fine-pitch Chip-Scale Ball Grid Array (FCBGA). Per the verified distributor data, the device integrates 107,500 logic elements (LEs), 4,992,000 bits of embedded memory, 4,300 LABs/CLBs, and 488 user I/Os in a single monolithic silicon die. An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose digital logic function is defined by the user after manufacturing, by loading a configuration bitstream into on-chip SRAM. FPGAs sit hierarchically between general-purpose microcontrollers (which run software) and application-specific integrated circuits (ASICs) whose function is fixed at fabrication. Modern high-density FPGAs like the Stratix III L pair programmable logic fabric with dedicated hard IP such as transceivers, memory blocks, DSP blocks, and PLLs, enabling ASIC-beating performance with full design revision flexibility. Key features of the EP3SL110F780C2N include 107,500 logic elements, 4.99 Mbits of distributed/embedded RAM, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) on its 488 user I/Os, 24 transceivers at up to 6.5 Gbps, and 312 embedded multipliers (18x18) for DSP workloads. The C2 speed grade and 780-pin FCBGA package make it a member of the Stratix III L mid-density tier optimized for cost-sensitive, lower-power designs relative to the Stratix III E family. The architecture is built on TSMC's 40 nm process and uses Altera's adaptive logic module (ALM) — an 8-input fracturable LUT that can be configured as either one 6-input LUT or two independent 4-input LUTs with shared inputs, improving logic utilization. Configuration is loaded from flash or a configuration device through dedicated JTAG or active serial/parallel interfaces. The on-chip PLLs provide flexible clock synthesis, while the 24 transceivers enable high-speed serial links for protocols such as PCIe Gen2, XAUI, and Serial RapidIO. Typical applications include high-speed serial interface bridging (PCIe Gen2, XAUI, SRIO), digital signal processing for wireless baseband, video broadcasting and image processing pipelines, high-end ASIC prototyping, and telecom line-card datapath offload. The combination of moderate density and lower power consumption relative to the higher-tier Stratix III E makes it well suited for cost-sensitive production systems that still require Stratix III performance and transceiver bandwidth. When designing with this device, ensure PCB layout meets Intel's transceiver signal-integrity guidelines and that the thermal solution can remove 8-12 W of typical power dissipation at full transceiver utilization.

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EP3SL110F780C4N - 107.5K Logic Elements Stratix III FPGA | Intel
EP3SL110F780C4N

EP3SL110F780C4N - 107.5K Logic Elements Stratix III FPGA | Intel

The Intel (formerly Altera) EP3SL110F780C4N is a high-density Stratix III L family Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FCBGA) package. It delivers 107,500 logic elements, 4,992,000 bits of embedded memory, 4,300 Logic Array Blocks (LABs), and 488 user I/Os. The device operates at a core voltage of 1.1 V with a maximum internal clock rate of 450 MHz, manufactured on a 65 nm process node. The speed grade is C4 (commercial, -4 tier), with an operating junction temperature window of 0 °C to 85 °C. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure digital logic, memory blocks, DSP slices, and high-speed transceivers after PCB fabrication. FPGAs sit in the broader hierarchy of digital semiconductors between ASICs and microcontrollers: they offer higher performance and parallelism than MCUs, yet retain the reprogrammability that distinguishes them from fixed-function ASICs. Stratix III devices specifically target high-end applications such as high-speed digital signal processing, high-bandwidth data path bridging, and ASIC prototyping where density, performance, and DSP throughput are paramount. Key features of the EP3SL110F780C4N include a logic element density of 107.5K, embedded memory of approximately 4.99 Mbits distributed across M9K memory blocks, configurable I/O standards supporting LVDS, LVTTL, LVCMOS, and SSTL, up to 12 transceivers (varies by device option), dedicated DSP blocks for high-speed multiply-accumulate operations, and integrated PLLs for clock synthesis and management. The FineLine BGA-780 package uses a 1.0 mm ball pitch and supports multilayer PCB designs with controlled-impedance routing. Architecturally, the Stratix III L family employs an adaptive logic module (ALM) topology, replacing the classical 4-input LUT architecture of prior generations. Each ALM packs eight inputs plus an embedded adder, giving 1.4x the effective logic capacity per LUT versus Stratix II. The 65 nm process with metal-layer optimization reduces dynamic power by up to 50 percent compared to the Stratix II generation, a key enabler for the Stratix III L sub-family. Typical applications for the EP3SL110F780C4N include ASIC prototyping and emulation, high-performance digital signal processing in wireless baseband, high-speed data acquisition systems, video broadcast and imaging pipelines, military secure communications, and test and measurement instrumentation. The 488 I/Os combined with multi-gigabit transceivers make it well-suited for telecom line-card bridging between custom ASICs and backplane SERDES. When designing with the EP3SL110F780C4N, ensure the PCB supports 1.0 mm BGA pitch fanout with microvia technology where appropriate. The 780-ball package demands 8- to 10-layer stack-up with continuous reference planes for power integrity. Use the Quartus II design software (version 13.1 or earlier; Intel provides a maintenance release path for legacy Stratix III) for place-and-route and timing closure; Altera device programming requires a JTAG or passive-serial configuration scheme. This page synthesizes verified distributor pricing, drop-in same-family and cross-family Stratix III alternatives sharing the 780-BGA footprint, and practical FPGA design notes not consolidated in a single place by the manufacturer datasheet.

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EP3SL110F780I4N - Stratix III L FPGA, 107.5K LE, 780-FCBGA | Intel
EP3SL110F780I4N

EP3SL110F780I4N - Stratix III L FPGA, 107.5K LE, 780-FCBGA | Intel

The Intel (formerly Altera) EP3SL110F780I4N is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) housed in a 780-ball Fine-pitch Chip-Scale Ball Grid Array (FCBGA) package. Per the verified distributor data, the device integrates approximately 107,500 logic elements (LEs) and 4,992 Kbits of embedded memory across 4,300 Logic Array Blocks (LABs), with 488 user I/O pins. It is fabricated on a 65 nm CMOS process and targets high-performance DSP, high-speed serial I/O, and memory-rich applications. The industrial temperature grade (suffix "I4" indicating -40C to +100C operating range) and "N" lead-free designator make it suitable for harsh-environment and RoHS-compliant designs. An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable routing, and dedicated silicon resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy a tier in the programmable logic hierarchy: programmable logic > FPGA > SRAM-based FPGA > high-density FPGA. They bridge the gap between general-purpose CPUs (sequential, software-defined) and ASICs (fixed-function, mass-produced), offering hardware-level parallelism with re-programmability. The Stratix III family specifically targets high-end applications requiring both logic density and high-speed serial connectivity. Key features of the EP3SL110F780I4N include support for up to 488 user I/Os, embedded transceiver capability for high-speed serial protocols, on-chip memory of nearly 5 Mbits, and up to 384 multipliers (18x18) for DSP workloads. The 780-pin FCBGA package provides high interconnect density required for routing hundreds of I/Os while maintaining a manageable footprint suitable for multi-layer PCB designs. Power management is enhanced through Stratix III's programmable power technology, which reduces dynamic power versus prior generations. Typical uses include high-speed digital signal processing, telecommunications infrastructure, video processing and broadcast equipment, high-performance ASIC prototyping, and aerospace/defense systems. The industrial temperature grade makes it suitable for outdoor or industrial-control applications where commercial-grade parts would fail. Its large logic capacity also enables integration of entire subsystems (CPU soft-cores, memory controllers, protocol bridges) into a single device, reducing BOM count and board complexity. When designing with the EP3SL110F780I4N, observe Stratix III power-up and configuration scheme requirements (typically using an external EPCS or enhanced configuration device, or JTAG). Maintain multi-layer PCB stack-up with continuous power and ground planes beneath the FCBGA to manage simultaneous-switching noise and to provide low thermal resistance for the top-side thermal pad. Always verify pin assignments against the latest Intel Quartus II pinout files before committing to layout. This page synthesizes distributor availability, Stratix III family member drop-in alternatives, and practical design notes not consolidated in any single manufacturer datasheet or catalog page.

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