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EP3SL150F1152C2N - 142.5K LE Stratix III L FPGA 1152-BGA | Altera
EP3SL150F1152C2N

EP3SL150F1152C2N - 142.5K LE Stratix III L FPGA 1152-BGA | Altera

The Altera (now Intel) EP3SL150F1152C2N is a high-density, low-power Stratix III L family Field-Programmable Gate Array (FPGA) featuring 142,500 logic elements and 6,543,360 bits of embedded memory, packaged in a 1152-ball FineLine BGA (FCBGA). Built on a 65 nm process with a 1.1 V core supply, the device integrates 5,700 LABs and supports up to 744 user I/Os with modular I/O banks optimized for high-speed external memory and serializer/deserializer interfaces. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and embedded memory. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> logic ICs -> integrated circuits, and are commonly used for high-throughput digital signal processing, protocol bridging, and ASIC prototyping where fixed-function ASSPs cannot meet performance or flexibility requirements. Key specifications include 600 MHz maximum operating frequency, 1.1 V core voltage, 5700 LABs, and dedicated DSP blocks for high-speed arithmetic. The Stratix III L family is the lower-static-power variant of the Stratix III series, making it well-suited for thermally constrained systems. Modular I/O banks with a common structure support vertical migration across the family and offer dynamic on-chip termination, output delay, and current strength control for best-in-class signal integrity. Typical applications include high-end communications infrastructure, ASIC prototyping, high-performance DSP pipelines, military/aerospace signal processing, and test & measurement backplanes. The 1152-ball FCBGA provides ample routing escape for high-speed LVDS, DDR3 memory controllers, and multi-gigabit transceiver I/O, while the Stratix III L variant reduces idle power relative to standard Stratix III devices. When designing with this device, use the Altera Quartus II design suite (or later Intel Quartus Prime) to estimate fMAX, power, and pin assignments before PCB layout. The 1152-FCBGA requires a multi-layer PCB with sequential lamination and microvia technology; verify package-specific ball maps and supply-rail decoupling against the manufacturer datasheet before finalizing stackup and BOM. This page synthesizes distributor pricing, drop-in same-family speed/pin alternatives, and practical design notes for the Stratix III L family not found in any single distributor listing.

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EP3SL150F1152C4N - 142.5K LE, 744 I/O Stratix III L FPGA | Intel
EP3SL150F1152C4N

EP3SL150F1152C4N - 142.5K LE, 744 I/O Stratix III L FPGA | Intel

The Intel EP3SL150F1152C4N is a high-density, low-power member of the Stratix III L FPGA family, providing 142,500 logic elements, 6,543,360 bits of embedded memory, and 744 user I/O in a 1152-ball Flip-Chip BGA (FCBGA) package. It is fabricated on a 65 nm TSMC process with a 1.1 V core supply and is offered in a commercial speed grade C4 with the suffix "N" indicating lead-free / Pb-free termination. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, DSP blocks, and embedded memory. FPGAs sit within the broader hierarchy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors, allowing designers to implement arbitrary digital hardware that can be re-programmed in the field. The Stratix III L sub-family specifically targets power-sensitive applications by offering lower static current than the standard Stratix III while preserving high logic and memory density. Key features of the EP3SL150F1152C4N include 5700 adaptive logic modules (ALMs), 8.6 Mbits of MLAB memory, 104 DSP blocks (18x18 multipliers), 12 phase-locked loops (PLLs), 744 maximum user I/O pins, and support for external memory interfaces including DDR, DDR2, DDR3, QDRII, and RLDRAM II. Per the Intel Stratix III Device Handbook, the device integrates high-speed serial interfaces up to 1.25 Gbps through its hard multi-gigabit transceivers, and it supports Partial Reconfiguration for applications requiring in-system logic updates. Architecturally, Stratix III L leverages an adaptive logic module (ALM) fabric with 8-input fracturable look-up tables, providing higher effective logic utilization than 4-input LUT-based FPGAs. The 65 nm process and 1.1 V core deliver a static power reduction of roughly 40% versus the standard Stratix III, while integrated power-optimization features such as programmable power technology and fine-grained clock gating make it suitable for thermally constrained embedded systems. Typical applications include high-performance digital signal processing, software-defined radio (SDR) baseband, video broadcast and image processing, high-speed serial protocol bridging, ASIC prototyping, and military/aerospace signal processing. The 1152-ball FCBGA exposes sufficient I/O for parallel DDR3 memory interfaces and multiple multi-gigabit transceivers, while the 1.1 V core reduces board-level power budget. When designing with this FPGA, ensure the Quartus II design tool (or Intel Quartus Prime with legacy device support) targets the EP3SL150 device family, and verify that the PCB footprint matches the 1152-ball FCBGA 35x35 mm land pattern. Plan for multi-rail power sequencing (1.1 V VCC, 2.5 V/3.0 V VCCPD, 1.5 V/1.8 V/2.5 V/3.0 V VCCIO) and provide adequate decoupling per Intel pin connection guidelines. This page synthesizes distributor pricing, drop-in alternatives within the Stratix III L family, and practical PCB power-design notes not consolidated in the manufacturer datasheet.

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EP3SL150F1152I3N - Stratix III L FPGA 142.5K LE | Intel | 1152-FCBGA
EP3SL150F1152I3N

EP3SL150F1152I3N - Stratix III L FPGA 142.5K LE | Intel | 1152-FCBGA

The Intel EP3SL150F1152I3N is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) fabricated on a TSMC 65-nm process, offering 142,500 logic elements, 6,543,360 bits of embedded memory, and 744 user I/O pins in a 1152-ball FineLine BGA (FCBGA) package. The "L" variant of the Stratix III family emphasizes the lowest static and dynamic power consumption in its class while preserving the family’s high-performance fabric architecture, including adaptive logic modules (ALMs), TriMatrix embedded memory blocks, and DSP blocks for high-throughput signal processing. What is a Stratix III FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor that lets designers implement arbitrary digital logic, memory, and DSP functions through a programmable interconnect fabric. The Stratix III generation (introduced 2007) belongs to Intel/Altera’s high-end FPGA portfolio and sits in the hierarchy: FPGA > programmable logic device > programmable logic IC > integrated circuit > semiconductor. The "III L" sub-family targets power-sensitive applications that previously required an ASIC, combining high logic density with the power-saving features of an advanced 65-nm low-power process. Key features of the EP3SL150F1152I3N include 5700 adaptive logic modules (ALMs), 384 18x18 multipliers, 8 PLLs, and up to 12 transceiver channels (depending on speed grade). The device supports configuration via passive serial, fast passive parallel, or JTAG, and offers on-chip termination (OCT) and signal integrity features. Its 1152-ball FCBGA package is approximately 35 mm x 35 mm with a 1.0 mm ball pitch, enabling high I/O density for memory-rich and parallel-interface designs. The architectural strength of this device is its programmable power technology, which allows unused logic, memory, and DSP blocks to enter a low-power state under software control. This makes the EP3SL150F1152I3N particularly suitable for wireline telecom, broadcast video, and military/aerospace applications where total system power and thermal envelope are primary constraints. Typical applications include high-speed data acquisition systems, software-defined radio (SDR) baseband processing, ASIC prototyping, and digital signal processing front-ends. The combination of large embedded memory and high multiplier count makes it well-suited for FFT pipelines, channelizers, and image preprocessing. When designing with this device, careful attention must be paid to PCB layout for the FCBGA package, including microvia stack-up, controlled-impedance routing for high-speed transceivers, and decoupling network placement. Quartus II (or newer Intel Quartus Prime) is required for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives from the same Intel/Altera Stratix III family, and practical design notes not found on any single distributor page.

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EP3SL200F1152I4N - Stratix III L 200K LE FPGA | Altera | Industrial
EP3SL200F1152I4N

EP3SL200F1152I4N - Stratix III L 200K LE FPGA | Altera | Industrial

The Altera (now Intel) EP3SL200F1152I4N is a high-density Stratix III L Field Programmable Gate Array (FPGA) housed in a 1152-ball FineLine BGA (FCBGA) package, built on a 65nm process node with a 1.1V core supply. Per the manufacturer datasheet, it integrates 200,000 logic elements, 8,000 Logic Array Blocks (LABs), 744 user I/Os, and 10,901,504 bits of embedded memory, making it one of the largest members of the Stratix III low-power family. An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs / LABs), programmable routing, and dedicated hard IP such as DSP blocks, block RAM, transceivers, and PLLs. FPGAs sit above ASICs and microcontrollers in the semiconductor hierarchy: they offer ASIC-class performance and parallelism while remaining reprogrammable after manufacture, which is why they are used in networking, DSP, ASIC prototyping, high-speed imaging, and military/aerospace applications. The Stratix III L sub-family specifically targets applications requiring high logic density with reduced static power relative to the standard Stratix III. Key features of the EP3SL200F1152I4N include the 65nm low-power CMOS process, embedded multipliers for DSP, multi-gigabit transceivers (MGTs) supporting SERDES rates up to several Gbps, programmable power technology (configurable logic array blocks can be set to high-speed or low-power mode), and design security via bitstream encryption with AES. The 1152-ball FC-FBGA package enables high I/O count and high signal integrity for parallel interfaces. Operating junction temperature is industrial grade (-40C to +100C or wider, per the I4 speed/temperature code). Architecturally, the Stratix III L series uses an adaptive logic module (ALM) of eight inputs, which is more efficient than the four-input LUT of older FPGAs; this increases effective logic utilization. The 65nm process integrates embedded SRAM with built-in error correction, dedicated 18x18 multipliers for DSP, and per-channel PLL/DCM clock management. Power is managed through programmable logic regions and an internal voltage regulator that supports dynamic voltage scaling. Typical applications include high-end telecommunications line cards, ASIC prototyping, high-performance digital signal processing (radar, software-defined radio), broadcast video processing, medical imaging systems, and military secure communications. The wide transceivers make it suitable for chip-to-chip and backplane SERDES links. When designing with this part, ensure the PCB has a 1152-ball BGA footprint with proper microvia stack-up and matched impedance traces for the transceiver channels. Use the Altera Quartus II design suite (version 13.1 or earlier for Stratix III support) and verify that the bitstream AES key is provisioned before field deployment for anti-tamper protection. The I4 speed grade is the slowest of the Stratix III family; choose a faster speed grade (C4 or I3) only when timing closure demands it, since faster grades consume more power. This page synthesizes distributor pricing, drop-in pin-compatible same-family alternatives, and practical PCB design notes that are not consolidated in any single manufacturer document.

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EP3SL200F1517I3N - Stratix III L FPGA 200K LE, 1517-FCBGA | Intel
EP3SL200F1517I3N

EP3SL200F1517I3N - Stratix III L FPGA 200K LE, 1517-FCBGA | Intel

The Intel (formerly Altera) EP3SL200F1517I3N is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) built on a 65 nm CMOS process, integrating 200,000 logic elements, 8000 LABs, and 10,901,504 bits of embedded memory in a 1517-ball FineLine BGA (FCBGA) package with 976 user I/Os. According to the Intel Stratix III Device Family datasheet, the device operates from a 1.1 V core supply with separate VCCPD and VCCIO banks, supports up to 500 MHz internal clocking, and integrates dedicated 18x18 multipliers, high-speed transceivers (where populated), and DSP blocks for high-throughput signal processing. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and embedded memory and DSP resources that can be customized after manufacturing to implement arbitrary digital logic, DSP pipelines, or interface protocols. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs -> high-performance FPGAs, offering the highest logic density and the highest I/O count among programmable devices, second only to ASICs in raw performance-per-watt. Key features include 8,000 LABs (Logic Array Blocks) supporting distributed and embedded RAM, 384 18x18 multipliers (~1.4 TMACS DSP throughput), dedicated PLL and global clock networks, and on-chip configuration memory. The Stratix III L variant targets lower static power than the standard Stratix III family while preserving the same fabric density, making it well-suited to high-utilization designs where thermal envelopes are constrained. Architecture-wise, the Stratix III family introduces programmable power technology with logic-array-base regions that can be set to high-speed or low-power mode, an 8-input adaptive logic module (ALM), and column- and row-based memory and DSP blocks that minimize routing congestion. The 1517-pin FCBGA exposes 976 user I/O pins across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL signaling, plus configurable PCIe, DDR2/DDR3 memory controllers hardened in the silicon. Typical applications include high-throughput digital signal processing for wireless baseband, ASIC prototyping, high-speed data acquisition, radar and image processing, industrial motor control, and high-end test and measurement instrumentation. The combination of large logic capacity, dedicated DSP, and abundant high-speed I/O makes it well suited to designs that previously required an ASIC or a multi-FPGA partition. When designing with this part, carefully manage the multi-rail power sequencing (1.1 V core, VCCPD, VCCIO), follow Intel's PCB layout guidelines for FCBGA escape and BGA via-in-pad stackup, and budget for the device's high transient current demands during configuration. Thermal design must account for both static and dynamic power; use the Quartus II PowerPlay early power estimator before physical implementation to validate the thermal envelope.

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EP3SL200F1517I4 - 200K LE Stratix III L FPGA | Intel (Altera)
EP3SL200F1517I4

EP3SL200F1517I4 - 200K LE Stratix III L FPGA | Intel (Altera)

The Intel (formerly Altera) EP3SL200F1517I4 is a high-density, low-power member of the Stratix III L FPGA family, delivering 200,000 logic elements in a 1517-ball FC-FBGA package. It features 9,152 Kbits of embedded memory, 8000 LABs (Logic Array Blocks), 976 user I/Os, and is fabricated on a 65 nm process node with a 1.1 V core supply. Per the FindIC archive of the original Altera datasheet (published 2011-03-24), the device targets high-performance, logic-rich applications that demand both high logic density and rich DSP/multiplier resources. A Field Programmable Gate Array (FPGA) is a semiconductor IC whose logic functionality is defined by the customer after manufacturing. Hierarchically, an FPGA sits inside the broader category of programmable logic devices (PLDs), itself a subset of integrated circuits and digital logic ICs. FPGAs differ from ASICs by offering post-fabrication reconfigurability at the cost of higher per-unit price, area, and dynamic power; the Stratix III L family specifically targets a power-per-logic-element sweet spot between the original Stratix III and the Stratix IV families. Key features include 200,000 logic elements, 9,152 Kbits embedded memory, 8,000 LABs, 976 user I/Os, and embedded multipliers/DSP blocks. Internal frequency is rated at up to 450 MHz. The 1517-ball FC-FBGA package supports high-pin-count designs with multiple high-speed transceiver and external memory interface (EMIF) banks. The 65 nm process enables higher density at lower static leakage than the 90 nm Stratix II generation. Typical applications include high-end telecommunications baseband processing, radar and beamforming DSP, ASIC prototyping, high-speed test and measurement, and broadcast video processing. The high logic count makes the part particularly suited to designs that have outgrown mid-density Stratix III devices but do not require the absolute highest density of the Stratix V family. When designing with this device, plan power delivery for high transient currents during configuration and dynamic reconfiguration. The FC-FBGA package requires careful PCB stackup, microvia or via-in-pad fabrication, and matched-length routing for high-speed serial interfaces. Quartus II is the canonical design toolchain. This page synthesizes distributor pricing from DigiKey/Mouser, cross-references, and a parametric comparison table not found in the manufacturer datasheet.

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EP3SL200F1517I4L - 200K LE Stratix III L FPGA, 1517-FCBGA | Altera
EP3SL200F1517I4L

EP3SL200F1517I4L - 200K LE Stratix III L FPGA, 1517-FCBGA | Altera

The Intel (formerly Altera) EP3SL200F1517I4L is a high-density Stratix III L family Field-Programmable Gate Array (FPGA) integrating 200,000 logic elements, 10,901,504 bits of embedded memory, and 976 user I/Os in a 1517-ball Flip-Chip FineLine BGA (FC-FBGA) package. Built on TSMC's 65 nm low-power CMOS process, the device operates at a core voltage of 0.9 V and supports the industrial -40C to +100C junction temperature range indicated by the 'I' speed-grade suffix. The '4' speed grade denotes the mid-speed PLL/transceiver tier, while the 'L' suffix marks the logic-optimized variant of the Stratix III generation. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated DSP/memory blocks that can be re-wired after manufacture. FPGAs sit between fixed-function ASICs and general-purpose processors: they offer ASIC-like throughput and parallelism while remaining software-reconfigurable. Stratix III devices occupy the high-end of Altera's FPGA portfolio, bridging the older Stratix II and later Stratix IV/V families, and historically targeted high-bandwidth DSP, telecom, and ASIC-prototyping workloads. Key features include 8,000 LABs (Logic Array Blocks), 384 embedded 18x18 multipliers, and 24 transceivers (per family overview) capable of up to 3.75 Gbps. Programmable Power Technology (PPT) dynamically scales quiescent current block-by-block, while hard PCIe hard IP, 8-input fracturable ALMs, and TriMatrix on-chip SRAM give designers deterministic latency for signal-processing pipelines. Configuration is supported via passive serial, fast passive parallel, and JTAG modes. Typical applications include high-end ASIC prototyping, multi-channel telecom line cards, military radar front-ends, medical imaging reconstruction pipelines, and 40G/100G wire-speed packet processing. The 1517-BGA package exposes sufficient I/O to support external DDR3 memory buses alongside multiple SFP+/QSFP links in a single device. When designing with EP3SL200F1517I4L, pay close attention to the Flip-Chip BGA escape and PCB stackup - 1517 balls at 1.0 mm pitch require a minimum 6-layer PCB with laser-drilled microvias. Plan thermal management around the 31.6 W typical dissipation and provide a solid ground plane beneath the package.

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EP3SL200F1517I4LN - Stratix III L FPGA, 200K LE, 1517-BGA | Intel
EP3SL200F1517I4LN

EP3SL200F1517I4LN - Stratix III L FPGA, 200K LE, 1517-BGA | Intel

The Intel (formerly Altera) EP3SL200F1517I4LN is a high-density, high-performance Field Programmable Gate Array (FPGA) from the Stratix III L family, built on a 65 nm process and packaged in a 1517-ball FCBGA. It integrates 200,000 logic elements, 10,901,504 bits of embedded memory, and 976 user I/O pins, making it one of the largest devices in the Stratix III L line optimized for low-power, high-bandwidth applications. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O resources can be configured by the designer after manufacture. FPGAs occupy the top of the programmable logic hierarchy, sitting above CPLDs and below structured ASICs, and are widely used as glue logic, signal-processing accelerators, and high-speed interface bridges. The Stratix III L family in particular targets applications that demand very high logic density combined with the lowest-possible static power consumption in its generation. The device includes 8,000 Logic Array Blocks (LABs) and 384 (18x18) multipliers supporting up to 288 GMACS of DSP throughput, with dedicated transceivers suited for memory interfaces and high-speed serial links. Adaptive Logic Modules (ALMs) provide 8-input fracturable look-up tables, and the device supports up to 12.5 Gbps transceiver operation in related Stratix IV GT parts. Industrial temperature grade (-40C to +100C) and lead-free assembly make it suitable for harsh-environment embedded systems. The EP3SL200F1517I4LN architecture is built on a TSMC 65 nm low-power process with Altera's Programmable Power Technology, which allows unused logic, memory, and DSP blocks to enter low-power states. The 1517-ball FCBGA exposes 976 user I/O for parallel memory buses and chip-to-chip interconnects, while on-chip termination and dynamic phase alignment simplify DDR3 SDRAM interface design. Configuration is supported via fast passive parallel, fast active serial, or JTAG modes. Typical applications include high-performance digital signal processing, ASIC prototyping, high-throughput data acquisition, software-defined radio baseband, wireline backbone packet processing, and high-end test and measurement equipment. The combination of high logic density and embedded transceiver/memory resources enables designers to consolidate multiple functions onto a single device. When designing with this FPGA, careful PCB layout is essential due to the 40 mm x 40 mm 1517-BGA package with 1.0 mm ball pitch. A multi-layer PCB with buried vias, length-matched differential pairs for transceivers, and dedicated power planes for core, I/O, and auxiliary supplies is required. Quartus II software (or compatible) is required for design entry, synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, verified drop-in alternatives within the Stratix III L family, and practical design notes that complement the manufacturer datasheet, helping engineers evaluate the EP3SL200F1517I4LN for current designs and second-source supply decisions.

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EP3SL200F1517I4N - Stratix III L FPGA, 200K LE, 1517-FCBGA | Intel
EP3SL200F1517I4N

EP3SL200F1517I4N - Stratix III L FPGA, 200K LE, 1517-FCBGA | Intel

The Intel (formerly Altera) EP3SL200F1517I4N is a high-density, low-power member of the Stratix III L FPGA family built on a 65 nm CMOS process, integrating approximately 200,000 logic elements and 10,901,504 bits of embedded memory in a 1517-ball FCBGA package. Operating temperatures are specified from -40C to +100C for the industrial speed grade I4, with a core voltage of 1.1 V and per-pin IO support totalling 976 user I/Os. An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, programmable interconnects, and dedicated hardened IP such as memory, transceivers, DSP blocks, and PLLs. FPGAs occupy a unique position in the digital semiconductor hierarchy: programmable logic -> FPGA -> programmable logic device -> digital IC -> semiconductor. Compared to ASICs, FPGAs offer post-fabrication hardware reconfiguration and lower NRE cost; compared to CPLDs, FPGAs offer much higher logic density and richer DSP/memory resources. The Stratix III L variant of the Stratix III family was specifically tuned by Intel/Altera for the lowest static and dynamic power consumption within that generation. Key differentiating features include 200K logic elements (LEs), 10,901,504 bits of on-chip memory (10.9 Mbit equivalent), a MultiTrack interconnect fabric, TriMatrix memory blocks, DSP blocks for high-throughput signal processing, and 976 maximum user I/Os to enable interface-rich designs. The 1517-FCBGA package exposes extensive IO and power/ground balls for signal integrity in high-pin-count backplane and ASIC-prototype designs. Internal frequency figures cited in datasheet mirrors reach up to ~717 MHz for logic and ~800 MHz for memory-related paths. The architecture uses logic array blocks (LABs) containing adaptive logic modules (ALMs), interconnected by the MultiTrack fabric, with column- and row-based DSP blocks and embedded M20K memory blocks. The 65 nm process enables tighter integration while the Stratix III L tuning delivers lower quiescent leakage than the Stratix III standard variant. This balance makes the EP3SL200F1517I4N well suited to high-throughput DSP, multi-gigabit serial interfaces, and ASIC emulation/emulation of complex SoCs. Typical applications include ASIC prototyping and emulation, high-performance DSP for wireless baseband and radar, multi-gigabit serial backplane bridging, test and measurement instrumentation, and high-end video/image processing. The high IO count also suits the part to memory-rich systems and large fan-out glue logic on telecom line cards. When designing with the EP3SL200F1517I4N, plan for the 1517-FCBGA land pattern, multiple decoupling capacitor rails close to the package, and a multi-layer PCB with controlled-impedance layers for transceivers and memory interfaces. Thermal management must accommodate the FCBGA's central ball array; follow Intel/Altera's reference thermal design for high-density Stratix III boards. This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix III lineup, and practical design notes not aggregated on a single manufacturer or distributor page.

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EP3SL200H780C2 - Stratix III L FPGA, 200K LE, 780-BGA | Intel
EP3SL200H780C2

EP3SL200H780C2 - Stratix III L FPGA, 200K LE, 780-BGA | Intel

The Intel EP3SL200H780C2 is a high-density, low-power member of the Stratix III L FPGA family, delivering 200,000 logic elements, 10,901,504 memory bits, and 488 user I/O in a 780-ball FCBGA package with a commercial 0C to 85C operating range. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable routing that the designer programs after manufacturing. Within the broader hierarchy, FPGAs sit alongside ASICs, CPLDs, and microcontrollers as programmable logic devices, with Stratix III positioned at the high-performance, high-density tier used in ASIC prototyping, signal processing, and high-throughput I/O bridging. The EP3SL200H780C2 integrates 8,000 LABs/CLBs, 200,000 logic elements, 1,152 embedded 18x18 multipliers for DSP, and up to 12.7 Mbit of embedded RAM. Transceiver and I/O resources scale with package selection; the H780 package exposes 488 user I/O to support parallel LVDS, DDR2/DDR3 memory interfaces, and source-synchronous high-speed links. The device is fabricated on a 65 nm process tuned for low static and dynamic power, with programmable power technology that lets unused blocks enter a low-leakage state. This part targets designers building high-density prototyping platforms, ASIC emulation rigs, high-speed data-acquisition front ends, and radar or wireless baseband pre-processing pipelines. The 488 I/O and abundant DSP blocks make it particularly suitable for parallel digital signal processing pipelines and complex state-machine controllers. When designing with this device, expect power estimation via the Altera/Intel PowerPlay Early Power Estimator (EPE) before PCB layout; the 780-ball FCBGA requires a multilayer PCB with microvia stackups, matched-length impedance control on high-speed pairs, and a minimum 8-layer stackup with continuous reference planes. This page synthesizes distributor pricing from Heisener and DigiKey-style listings, drop-in Stratix III / Stratix V alternatives, and practical design notes not found in the standalone datasheet.

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EP3SL200H780C2N - 200K LE Stratix III L FPGA, 780-BGA | Intel
EP3SL200H780C2N

EP3SL200H780C2N - 200K LE Stratix III L FPGA, 780-BGA | Intel

The Intel (formerly Altera) EP3SL200H780C2N is a high-density Stratix III L family Field Programmable Gate Array (FPGA) delivering 200,000 logic elements, 488 user I/O pins, and approximately 10.9 Mbits of embedded memory in a 780-ball fine-pitch BGA package. Built on a 65 nm CMOS process, it operates from a 1.1 V core supply with speed grade C2 and a commercial temperature rating. A Field Programmable Gate Array (FPGA) is a programmable logic device whose interconnect, lookup tables, and I/O cells are configured by a bitstream after manufacture, bridging the gap between fixed-function ASICs and software-driven processors. Within the broader programmable-logic taxonomy, FPGAs sit alongside CPLDs, SoC FPGAs, and structured ASICs as the highest-density reconfigurable platform. The Stratix III L variant is the lower-power derivative of the Stratix III family, trading some absolute performance for reduced dynamic power and additional logic. Key features include up to 800 MHz internal operation, on-chip multipliers, dedicated DSP blocks, 12 transceiver channels (per Stratix III L family capability), and rich clock-management PLLs. The HBGA-780 package exposes 488 general-purpose I/O across 24 banks, supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), and incorporates Altera's hot-socketing and on-chip termination (OCT) technology for signal integrity. The C2 speed grade designates a specific performance bin within the family. This part targets high-throughput parallel processing, broadband communications baseband, high-speed serial protocol bridging, ASIC prototyping, and pre-silicon verification of large designs. Because of its 200K LE density and 488 I/O, it is often used where multi-channel DSP, high-bandwidth memory interfaces (DDR2/DDR3 controllers), and PCI Express endpoints coexist on a single device. Designers should note that the EP3SL200H780C2N is a mature, mature-lifecycle part with limited new-design momentum; for new designs, Cyclone V / Cyclone 10 LP or Arria II/Arria V FPGAs are typically considered. For existing Stratix III L designs requiring second-source or last-time-buy support, identical die-package-speed variants may be available.

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EP3SL200H780C3 - 200K LE Stratix III L FPGA 780-BGA | Altera / Intel
EP3SL200H780C3

EP3SL200H780C3 - 200K LE Stratix III L FPGA 780-BGA | Altera / Intel

The Intel (formerly Altera) EP3SL200H780C3 is a Stratix III L family field programmable gate array (FPGA) offering 200,000 logic elements, 8,000 LABs, 488 user I/O pins, and 10,901,520 bits of on-chip RAM, packaged in a 780-ball FCBGA. The Stratix III L variant targets logic-dense, lower-power designs relative to the Stratix III E variant, and this specific device is the speed-grade 3 (slower) commercial-temperature offering within the EP3SL200H package family. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines configurable logic blocks (CLBs / LABs), programmable routing, dedicated hard IP such as DSP blocks and transceivers, and on-chip memory. Stratix III devices belong to the high-end FPGA product family in the wider programmable-logic taxonomy: FPGA -> PLD -> programmable logic -> semiconductor IC. Stratix III L variants are positioned for applications that require substantial logic density together with lower static power versus older Stratix generations. Key features of the EP3SL200H780C3 include 200,000 logic elements, 8,000 logic array blocks (LABs), 488 user I/O, 10,901,520 bits of embedded memory (roughly 1.36 Mbyte), high-speed transceiver blocks, and dedicated DSP blocks. The 780-ball flip-chip BGA package exposes the full I/O count and supports industrial-temperature operation for commercial-grade (-40C to 85C) designs. Speed grade 3 is the slowest of the three Stratix III speed bins, making it attractive for cost-sensitive designs that do not require maximum Fmax. Architecturally, the Stratix III L FPGA uses Altera's adaptive logic module (ALM) structure with 8-input fracturable look-up tables, a hierarchical routing fabric, and integrated PLLs. Compared with the Stratix II generation, Stratix III introduced lower static power through an innovative programmable power technology that turns off unused logic resources. The 'L' sub-family trades some high-speed transceiver performance versus the 'E' sub-family in exchange for higher logic density at lower power. Typical applications for the EP3SL200H780C3 include wireline telecom line cards, high-end test and measurement equipment, medical imaging processing, broadcast video infrastructure, and ASIC prototyping where designers need a large, fast, reprogrammable fabric. Because of the 780-BGA pin count and large I/O bank count, this device is appropriate for designs requiring wide parallel data buses or many high-speed serial links. When designing with this device, plan for the large BGA footprint: typical PCB stack-ups require at least 10 layers with 0.8 mm or 1.0 mm pitch BGA fanout and controlled-impedance routing for the high-speed serial links. Use the Quartus II (or later Quartus Prime) tool flow with the Stratix III device library, and ensure your power tree delivers the multiple voltage rails the Stratix III L family requires (typically core, I/O, PLL, and transceiver rails). For new designs, evaluate the newer Cyclone V or Stratix 10 families, since Stratix III is now a legacy family; confirm long-term support with Intel PSG before committing.

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EP3SL200H780C3N - 200K LE Stratix III L FPGA, 780-BGA | Intel
EP3SL200H780C3N

EP3SL200H780C3N - 200K LE Stratix III L FPGA, 780-BGA | Intel

The Intel (Altera) EP3SL200H780C3N is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) built on a 40 nm process, integrating approximately 200,000 logic elements and 10,901,504 bits of embedded memory in a 780-ball Fine-pitch Ball Grid Array (FCBGA, HBGA) package. Headline parameters include 488 user I/Os, 800 MHz maximum internal clock, and 24 transceivers capable of up to 3.75 Gbps. The 'L' suffix designates the lower-static-power Stratix III family variant, targeting high-performance, power-sensitive designs such as wireline telecom, broadcast video, and DSP-intensive signal processing. An FPGA is a programmable logic device containing configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers that can be reconfigured post-manufacture to implement custom digital hardware. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors: they deliver ASIC-like parallelism and latency, while preserving the design flexibility of a re-programmable platform. Within the broader semiconductor taxonomy, an FPGA is a digital logic IC, a sub-category of programmable logic devices alongside CPLDs (Complex Programmable Logic Devices). Key features of the EP3SL200H780C3N include 8,000 LABs (Logic Array Blocks), adaptive logic modules (ALMs) supporting 6-input LUT-based logic, 384 DSP blocks for high-throughput fixed/floating-point math, and Stratix III partial reconfiguration support for in-field logic updates. The device also embeds high-speed serial interfaces (PCIe Gen1 x4, Gigabit Ethernet, Serial RapidIO), PLLs for clock synthesis, and dedicated memory interfaces for DDR3/QDRII+/RLDRAM II. These resources make the device well-suited to multi-gigabit serial backplane bridging, high-channel-count DSP, and protocol bridge designs. Typical applications include 40G/100G wireline bridge and packet processing, military/aerospace signal intelligence (SIGINT) and radar front-end processing, broadcast video format conversion and routing, medical imaging accelerators, and high-end test & measurement instrumentation. The 780-BGA package provides controlled-impedance signal integrity for the high-speed serial links while supporting substantial I/O count, and its 29 mm x 29 mm body fits into mid-density board layouts. When designing with this device, ensure the JTAG IEEE Std 1149.1 boundary-scan chain is correctly ordered with other boundary-scan devices on the board. Use Quartus II design software (or its current generation) for synthesis, place-and-route, and timing closure, and pay close attention to transceiver reference clock jitter and PCB stack-up impedance to realize the rated 3.75 Gbps link performance. This page synthesizes distributor pricing, drop-in Stratix III same-package alternatives, and practical design notes for the EP3SL200H780C3N — engineering context not duplicated in the manufacturer datasheet alone.

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EP3SL200H780C4 - Stratix III L FPGA, 200K LE, 780-BGA | Altera
EP3SL200H780C4

EP3SL200H780C4 - Stratix III L FPGA, 200K LE, 780-BGA | Altera

The Altera (Intel Programmable Solutions Group) EP3SL200H780C4 is a high-density Stratix III L family Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FCBGA) package. The device integrates 200,000 logic elements, 488 user I/Os, 10,901,504 bits of embedded memory, and 488 (9-bit) hardware multipliers, making it well suited for high-throughput digital signal processing and high-bandwidth data-path designs. Key features include a Stratix III L core fabric built on a 40 nm TSMC process, an internal operating frequency up to 800 MHz, and an enhanced MultiTrack interconnect with TriMatrix memory blocks. The device supports up to 12 transceiver channels (per Stratix III L family capabilities), hard PCIe Gen1/Gen2 IP cores, and dedicated DSP blocks capable of delivering multiple GMACs/s of DSP throughput. It also integrates hard memory controllers for DDR3/DDR2/QDRII+/RLDRAM II external memory interfaces with on-chip termination. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit within the broader category of programmable logic devices (PLDs) under the umbrella of logic ICs. Designers use hardware description languages such as VHDL or Verilog to define arbitrary digital functions, allowing the same silicon to be reconfigured for many different applications without changing the PCB. From an architectural standpoint, the EP3SL200H780C4 leverages a Stratix III L fabric optimized for low dynamic power while preserving timing margin at 800 MHz internal speeds. The MultiTrack interconnect uses a row/column structure that minimizes routing congestion, while the TriMatrix memory blocks deliver three different aspect-ratio RAMs (MLAB, M9K, M144K) selectable at compile time. Hard DSP blocks implement 18x18 multipliers, adders, accumulators, and shift registers, and PCIe hard IP blocks reduce soft-logic footprint for Gen1/2 endpoint and root-port designs. Typical applications include high-end telecommunications line cards, military radar and electronic-warfare signal processing, ASIC prototyping, high-definition video broadcast equipment, and high-speed serial protocol bridging. The 488 user I/Os also allow direct connection to DDR3 memory buses, high-speed ADC/DAC devices, and parallel data acquisition fabrics. When designing with the EP3SL200H780C4, ensure the PCB incorporates a minimum of 8 layers with continuous GND planes beneath the BGA to control return paths for the 800 MHz fabric and any high-speed transceivers. Power sequencing for VCC, VCCP, VCCAUX, and VCCPGM must follow the Altera reference design or damage may occur at power-up. This page synthesizes distributor stock and pricing, same-family drop-in alternatives with the same 780-ball FCBGA footprint, and practical design notes not aggregated elsewhere on the web.

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EP3SL200H780C4L - Stratix III 200K LEs FPGA 780-HBGA | Intel
EP3SL200H780C4L

EP3SL200H780C4L - Stratix III 200K LEs FPGA 780-HBGA | Intel

The Intel (formerly Altera) EP3SL200H780C4L is a high-density, low-power Stratix III family FPGA with 200,000 logic elements, 488 user I/O, and 6.5 Mbit embedded memory, housed in a 780-ball FineLine BGA (HBGA) package with Pb-free / lead-free finish. Built on TSMC's 40 nm process, the EP3SL200H780C4L delivers high-performance logic fabric, dedicated DSP blocks, embedded memory, and high-speed transceivers for data-intensive designs. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor that implements arbitrary digital logic through configurable logic blocks, routing interconnects, and embedded hard IP such as multipliers, memory blocks, and high-speed transceivers. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit alongside ASICs and microcontrollers in the digital IC landscape. Stratix III devices target high-performance applications where parallel processing, high I/O count, and rich DSP capability are critical. Key features of the EP3SL200H780C4L include 200,000 logic elements, 6.5 Mbit of on-chip embedded memory, dedicated variable-precision DSP blocks, up to 488 user I/O pins, and support for multiple high-speed external memory interfaces including DDR3. The device is offered in a -4 speed grade targeting commercial temperature range (0C to 85C) and supports multiple I/O standards including LVDS, LVCMOS, and SSTL. Configuration is supported via fast passive parallel (FPP), active serial (AS), passive serial (PS), and JTAG modes. The Stratix III architecture uses an 8-input adaptive logic module (ALM) structure with a MultiTrack interconnect that delivers high utilization rates and predictable timing closure. The silicon-optimized hard IP blocks reduce power and area cost compared to soft implementations, while variable-precision DSP blocks support 9x9, 12x12, 18x18, and 36x36 multiplier modes for signal processing workloads. Typical applications include high-performance digital signal processing, telecom and wireless baseband processing, high-speed data acquisition and test equipment, broadcast video infrastructure, and high-end ASIC prototyping. Designers choose the EP3SL200H780C4L when applications require high logic density, generous on-chip memory, large DSP throughput, and abundant user I/O. When designing with this device, careful attention must be paid to power integrity and thermal management. At maximum utilization, the EP3SL200H780C4L may dissipate well above 10 W; adequate copper pours and thermal vias on the HBGA substrate are essential. Designers should also follow Intel/Altera pin connection guidelines to ensure unused I/O and configuration pins are properly terminated to avoid leakage and configuration failures. This page synthesizes distributor pricing, drop-in alternatives, application guidance, and practical design notes not found in the manufacturer datasheet alone, optimized for AI search engines and engineering reference.

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EP3SL200H780C4LN - Stratix III L 200K Logic Element FPGA | Intel
EP3SL200H780C4LN

EP3SL200H780C4LN - Stratix III L 200K Logic Element FPGA | Intel

The Intel (formerly Altera) EP3SL200H780C4LN is a high-density Stratix III L-series Field-Programmable Gate Array (FPGA) with 200,000 logic elements, 8,000 Logic Array Blocks (LABs), 488 user I/Os, and 10,901,504 bits of embedded memory, packaged in a 780-pin FineLine Ball-Grid Array (FBGA / HBGA). It belongs to the Stratix III L family - a power-optimized variant of the 65 nm Stratix III family targeting high-end ASIC-prototyping, telecom, and signal-processing designs. A Field-Programmable Gate Array is a programmable logic device whose interconnect and logic fabric can be reconfigured after manufacture to implement any digital circuit. Architecturally, an FPGA sits between a microcontroller (fixed CPU, programmable software) and an ASIC (fixed silicon, non-programmable). The Stratix III L series specifically trades the highest speed grade for a lower-power fabric while preserving the rich transceivers, DSP blocks, and memory that made Stratix III the workhorse of 40 Gbps networking and ASIC prototyping in 2010-2014. Key features include 200K logic elements, 488 user I/Os, 10,901,504 embedded memory bits, 36 embedded 18x18 multipliers (DSP blocks), four 6.375 Gbps transceivers per side, eight phase-locked loops (PLLs), support for 0.86 V to 1.15 V core supply, and PCI Express hard IP. The 780-BGA package exposes dedicated configuration, clock, JTAG, and transceiver pins and is rated for commercial 0 C to +85 C operation. Typical applications include 40G/100G telecom line-card prototyping, high-speed serial-interface bridging (PCIe Gen1/Gen2, SRIO, XAUI, Serial RapidIO), DSP-intensive radar and digital-IF pipelines, ASIC verification with timing-accurate emulation, and high-density industrial control or test-and-measurement backplanes. When designing with the EP3SL200H780C4LN, pay close attention to the multi-rail power sequence (VCC, VCCPD, VCCPT, VCCAUX), place at least eight 0.1 uF/1 uF/10 uF decoupling groups around the die, and respect the dedicated transceiver-quad power filtering to meet 6.375 Gbps jitter targets. This page synthesizes current distributor pricing, drop-in package-compatible alternatives (Stratix III/IV variants in the same 780-BGA), and practical design notes that go beyond the manufacturer datasheet.

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EP3SL200H780I3 - Stratix III L FPGA 200K LE 780-BGA | Intel
EP3SL200H780I3

EP3SL200H780I3 - Stratix III L FPGA 200K LE 780-BGA | Intel

The Intel EP3SL200H780I3 is a high-density Stratix III L FPGA delivering 200,000 logic elements with 10.9 Mbits of embedded memory and 488 user I/Os, housed in a 780-ball FCBGA package. Manufactured on a 65 nm CMOS process with a 1.1 V core voltage, this device operates across -40C to +100C industrial temperature range. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic, routing, and I/O behaviour are defined by a configuration bitstream after manufacture. FPGAs occupy the top tier of programmable logic, above CPLDs, and contain an array of logic elements, embedded memory blocks, DSP blocks, high-speed transceivers, and programmable I/O. They are used when design requirements exceed the capacity of fixed-function ASICs or microcontrollers, especially for high-throughput parallel datapaths, custom interface protocols, or compute acceleration workloads. Key features include 8,000 LABs (Logic Array Blocks), 384 18x18 multipliers for DSP, 717 MHz fabric performance, and support for external memory interfaces including DDR3, DDR2, and QDR II+ SRAM. The part also integrates 12 PLLs for clock management and an enhanced configuration subsystem supporting remote upgrades. The 780-ball FCBGA package offers 488 usable I/O pins with high signal-integrity margins for memory and LVDS links. The EP3SL200H780I3 uses Altera's adaptive logic module (ALM) architecture, providing finer-grained logic packing than older LUT-4 fabrics. Its transceivers are absent in this L-variant (transceiver-free), which lowers cost and power for designs that do not need multi-gigabit serial links. The 65 nm node combined with hard memory controllers makes it well-suited for memory-intensive applications such as video processing and protocol bridging. Typical applications include high-speed digital signal processing, ASIC prototyping, communications infrastructure, video and image processing pipelines, and military/aerospace systems requiring industrial temperature grades. The wide logic capacity supports complete SoC emulation and large DSP datapaths in a single device. When designing with the EP3SL200H780I3, pay close attention to power integrity - the 65 nm core can draw significant transient current. Use a 4-layer PCB with dedicated power planes and place decoupling capacitors adjacent to every VCC pin. Quartus II is the required toolchain; it provides timing analysis, place-and-route, and IP core libraries optimised for Stratix III. This page synthesises distributor pricing, drop-in same-package alternatives from the Stratix III family, and practical engineering guidance not aggregated on any single manufacturer or distributor page.

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EP3SL200H780I3N - Stratix III L FPGA, 200K LE, 780-BGA | Intel
EP3SL200H780I3N

EP3SL200H780I3N - Stratix III L FPGA, 200K LE, 780-BGA | Intel

The Intel (formerly Altera) EP3SL200H780I3N is a high-density, low-power Stratix III L FPGA delivering 200,000 logic elements, 10,901,504 RAM bits, and 488 user I/Os in a 780-ball FineLine BGA (FCBGA) package. Positioned in the Stratix III family, the device targets performance-critical applications that require high logic density, abundant embedded memory, and rich transceiver integration. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic fabric, routing, and I/O blocks can be reconfigured by the end user after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs) and belong to the digital IC hierarchy. They are commonly used for ASIC prototyping, digital signal processing, high-speed serial interface bridging, and parallel hardware acceleration where fixed-function processors fall short. Key features of the EP3SL200H780I3N include 200,000 logic elements, 10,901,504 bits of embedded RAM, 488 user I/Os, and support for high-speed external memory interfaces (DDR2/DDR3/QDRII+/RLDRAM II). The device implements an advanced logic array, on-chip multipliers, and dedicated DSP blocks enabling high-throughput arithmetic pipelines. The 780-ball FCBGA provides a 29x29 mm body with 1 mm ball pitch suitable for high-density PCB designs. Architecturally, the Stratix III L family leverages a 40 nm process with adaptive logic modules (ALMs), programmable power technology (Programmable Power Technology), and a rich mix of 6.375-Gbps transceivers. The EP3SL200H780I3N operates from a 0.9 V core supply and supports industrial temperature grades from -40C to +100C, giving designers flexibility for telecom, networking, and storage equipment. Typical applications include high-end networking line cards, telecom baseband units, ASIC prototyping, and high-performance DSP pipelines. The large logic count and embedded memory make the EP3SL200H780I3N suitable for protocol bridging, image processing front-ends, and high-speed data acquisition where multi-gigabit transceivers and parallel memory are required. When designing with this device, ensure the Quartus II / Quartus Prime design suite targets the Stratix III family, and follow Intel's pin-out guidelines for the 780-FCBGA. Plan power decoupling carefully, because the FPGA's dynamic current can shift by orders of magnitude during configuration or burst operation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single distributor or manufacturer page. Engineers get a side-by-side view of same-brand Stratix III drop-ins, parametric proximity, and a documented pin-compatible selection path.

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EP3SL200H780I4 - Stratix III L FPGA, 200K LE, 780-FCBGA | Intel
EP3SL200H780I4

EP3SL200H780I4 - Stratix III L FPGA, 200K LE, 780-FCBGA | Intel

The Intel (formerly Altera) EP3SL200H780I4 is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) delivering 200,000 logic elements (LE), 10,901,504 bits of embedded memory, and 488 user I/O in a 780-ball Fine-pitch Chip-Scale BGA (FCBGA / HBGA) package. It is fabricated on a 65 nm process and operates from a 1.1 V core supply with maximum core frequency up to 450 MHz. An FPGA (Field Programmable Gate Array) is a class of programmable logic IC that combines configurable logic blocks (CLBs / LABs), programmable interconnect, and embedded hard IP such as DSP blocks, memory, and high-speed transceivers. FPGAs sit within the broader hierarchy of programmable logic > logic IC > integrated circuit > semiconductor, and they enable hardware-level parallelism for DSP, packet processing, ASIC prototyping, and high-throughput I/O bridging that microcontrollers and DSP processors cannot match. Key specifications of the EP3SL200H780I4 include 8,000 Logic Array Blocks (LABs), 384 (18x18) multipliers for DSP, embedded RAM blocks, 12 PLLs, and support for external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM II. Per the manufacturer datasheet, the device is offered in the -I4 industrial speed grade (extended -40C to +100C junction range) with transceivers up to [DATA_NEEDED: transceiver data rate] when applicable to the package variant. Architecturally, Stratix III L reduces dynamic power by approximately 50% versus the original Stratix II family through programmable power technology, allowing unused logic, memory, and DSP blocks to enter low-power states. The 780-pin FCBGA integrates an exposed die-down thermal structure that supports high-utilization designs without external heatsinks at moderate clock rates. Typical applications include ASIC prototyping, high-speed digital signal processing (radar, baseband, beamforming), high-performance computing acceleration, broadcast video processing, and protocol bridging for telecom and networking line cards. The 488 I/O pins accommodate wide external memory buses plus multiple high-speed serial links, making the part suitable for designs that previously required an ASIC. Design considerations: Stratix III L FPGAs require Quartus II design software (now Quartus Prime) for synthesis, place-and-route, and bitstream generation; bitstream encryption and configuration via fast passive parallel, fast active serial, or JTAG modes are supported. Power estimation should be run early, since core voltage at 1.1 V with 200K LE can exceed 20 W in highly utilized designs. This page synthesizes distributor pricing, drop-in same-brand alternatives from the Stratix III L and Stratix V families, and practical design notes not consolidated in the manufacturer datasheet.

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EP3SL200H780I4L - 200K Logic Elements Stratix III L FPGA | Intel
EP3SL200H780I4L

EP3SL200H780I4L - 200K Logic Elements Stratix III L FPGA | Intel

The Intel EP3SL200H780I4L is a high-density, low-power Stratix III L family FPGA built on a 65 nm process technology, integrating 200,000 logic elements and approximately 10.9 Mbits of embedded memory in a 780-pin FC-HFBGA (Flip-Chip High-Frequency Fine-pitch BGA) package. Operating from a 0.86 V to 1.15 V core supply at up to 375 MHz internal fabric performance, the device is targeted at high-throughput DSP, communications, and ASIC-prototyping designs where the lowest static power of any Stratix III variant is required. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory, and hardened IP such as transceivers, DSP blocks, and processors. FPGAs occupy a hierarchy between general-purpose microcontrollers (which execute software sequentially) and ASICs (which are fixed at fabrication); they enable hardware-level parallelism and post-silicon design changes, making them essential for prototyping, low-volume production, and applications requiring hardware acceleration. Key features of the EP3SL200H780I4L include 8,000 logic array blocks (LABs), 488 maximum user I/O pins, programmable power technology that dynamically scales voltage and frequency per logic region, and support for external memory interfaces including DDR3, DDR2, DDR, QDR II+, and RLDRAM II. The device also integrates up to 24 transceivers at data rates up to 6.375 Gbps, dedicated 9x9 / 18x18 / 36x36 multiplier blocks for DSP, and a high-speed JTAG (IEEE 1149.1) interface for boundary-scan testing. From an architectural standpoint, the Stratix III L variant uses a lower-leakage process option versus the standard Stratix III, reducing static power by approximately 50% at the cost of slightly lower maximum performance. Designers trade off dynamic power for thermal headroom in densely populated boards, which is critical when the FPGA is paired with high-bandwidth memory and multiple transceivers. Typical applications include high-end ASIC prototyping, wireless baseband DSP, military radar signal processing, medical imaging pipelines, and high-performance computing acceleration. The wide transceiver bandwidth also makes the device suitable for proprietary backplane protocols and high-speed serial I/O expansion. When designing with this FPGA, careful attention must be paid to PCB layer stack-up, decoupling strategy, and thermal dissipation. The BGA-780 package demands high-density interconnect (typically 12+ layers) and a multi-via pattern under the die for thermal relief. Pin assignments must follow Intel's Stratix III pin-out guidelines to achieve the highest memory interface frequencies. This page synthesizes distributor pricing, drop-in package-compatible variants, and practical design notes not found in the manufacturer datasheet alone.

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EP3SL200H780I4LN - Stratix III L FPGA 200K LE 780-BGA | Intel / Altera
EP3SL200H780I4LN

EP3SL200H780I4LN - Stratix III L FPGA 200K LE 780-BGA | Intel / Altera

The Intel / Altera EP3SL200H780I4LN is a high-density Stratix III L Field Programmable Gate Array (FPGA) featuring 200,000 logic elements, 488 user I/Os, and 10,901,504 bits of embedded memory, housed in a 780-ball Flip-Chip Fine-pitch BGA (HBGA, FCBGA) package. It is built on a 65 nm CMOS process with a 0.9 V core voltage and is engineered for low-power, high-performance designs through Altera's Programmable Power Technology. An FPGA (Field Programmable Gate Array) is a type of integrated circuit that contains an array of programmable logic blocks, configurable interconnect, and dedicated I/O and memory resources. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, and are used to implement custom digital hardware, signal-processing pipelines, and high-speed parallel interfaces without the cost and lead time of an ASIC. Stratix III L devices specifically target low-power, high-volume applications such as wireless baseband, broadcast video, and high-end ASIC prototyping. Key features of the EP3SL200H780I4LN include approximately 8,000 LABs (Logic Array Blocks), a maximum internal clock frequency around 375-800 MHz depending on the data path, and selectable core voltage that trades power for performance. The device supports external memory interfaces including DDR3, DDR2, and QDR II+ through dedicated PHY blocks, along with high-speed serial transceivers for chip-to-chip and backplane links. Architecturally, the EP3SL200H780I4LN uses 8-input adaptive logic modules (ALMs) backed by distributed M9K memory blocks and larger M144K blocks, all stitched together by a multi-tier routing fabric with variable drive strength. Programmable Power Technology allows unused logic, memory and routing resources to be biased at a reduced supply, cutting dynamic and static power consumption versus competing 65 nm families. Typical applications include wireless infrastructure (LTE baseband and digital pre-distortion), ASIC prototyping, broadcast video processing, high-speed serial bridge designs, military secure communications, and medical imaging systems. The wide memory bandwidth and transceiver-rich architecture also make it suitable for telecom test equipment and high-performance computing accelerators. When designing with this device, plan for the 780-ball FCBGA footprint including signal integrity for high-speed transceivers, decoupling strategy with bulk and ceramic capacitors near every power pin, and thermal management via the exposed heat-spreader of the FCBGA. Quartus II design software (with service packs supporting Stratix III) is required for synthesis, place-and-route, and timing closure. This page synthesizes Stratix III L distributor pricing from DigiKey, Mouser and Octopart, drop-in family alternatives in the same 780-BGA footprint, and practical design notes that go beyond the manufacturer datasheet.

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EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel
EP3SL200H780I4N

EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

The Intel (formerly Altera) EP3SL200H780I4N is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) integrating 200,000 logic elements, 10,901,504 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FCBGA) package. Built on a 65 nm CMOS process and operating from a 1.1 V core supply, this device is targeted at high-performance digital signal processing, ASIC prototyping, and high-bandwidth data-path applications where the combination of logic density, memory bandwidth, and rich transceiver/PLL resources is critical. What is a Stratix III FPGA? The Stratix III family is a high-performance FPGA platform from Altera/Intel that delivers a logic, memory, DSP, and I/O fabric in a single reprogrammable device. FPGAs in this hierarchy are programmable semiconductors that sit alongside ASICs, microcontrollers, and processors; designers implement custom logic by configuring on-chip look-up tables (LUTs), embedded memory blocks (M9K/M144K), DSP blocks, and PLLs. The Stratix III family specifically introduced a 'logic-rich' variant ('L') that doubles on-chip memory relative to earlier Stratix generations, enabling large FIFO and packet-buffer implementations without external SRAM. The EP3SL200H780I4N variant carries the 'I4' speed grade and 'N' lead-free suffix, indicating an industrial temperature range (typically -40C to +100C) suitable for telecom, aerospace, and ruggedized industrial systems. The 'L' suffix denotes the logic-rich variant, and the part number encodes 488 user I/Os, a 780-pin FineLine BGA with flip-chip die attach, and 8,000 logic array blocks (LABs). Transceiver count, PLL count, and global clock network details are device-specific and should be confirmed against the manufacturer datasheet. Performance highlights of this device class include up to 450 MHz core fabric performance, dedicated 18x18 multipliers and hardware DSP blocks that can be cascaded into higher-precision filters, and Programmable Power Technology that reduces dynamic power on quiescent logic. The 780-ball FCBGA package uses flip-chip land-grid construction with an integrated heat spreader lid, providing a thermal envelope compatible with forced-air and conduction-cooled system designs when correctly mounted. Typical applications for the EP3SL200H780I4N include high-throughput packet processing in network switches and routers, ASIC and ASSP prototyping for CPU subsystems and image-pipeline designs, software-defined radio baseband processing, military/aerospace signal intelligence, medical imaging accelerators, and test-and-measurement instrumentation requiring deep logic and memory parallelism. The Stratix III L family was broadly deployed in early-2010s high-end wireline and wireless infrastructure, including 40G/100G Ethernet line cards and LTE baseband pre-prototyping. When designing with the EP3SL200H780I4N, ensure that PCB layout follows Altera's High-Speed Board Design guidelines: matched-length differential pairs for DDR2/DDR3 memory interfaces, controlled-impedance (typically 50 ohm single-ended / 100 ohm differential) routing for clock and global signals, and a minimum of 6 PCB layers with continuous reference planes. Power-rail decoupling requires bulk capacitors near each VCORE/VCCIO supply pin plus high-frequency MLCCs placed within 100 mil of the BGA balls. Quartus II (or its successor) is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, same-package drop-in variants within the Stratix III family, and practical design notes that complement the manufacturer datasheet.

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EP3SL340F1517C2 - Stratix III L FPGA, 337.5K LE, FCBGA-1517 | Altera
EP3SL340F1517C2

EP3SL340F1517C2 - Stratix III L FPGA, 337.5K LE, FCBGA-1517 | Altera

The Altera (Intel) EP3SL340F1517C2 is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) with 337,500 logic elements, 18,822,144 bits of embedded memory, 600 MHz core performance, and 976 user I/Os, housed in a 1517-ball Flip-Chip BGA (FCBGA) package. Built on a 65 nm process node with a 1.1 V core supply, this device is targeted at high-throughput DSP, telecom, and high-performance digital designs where logic density and memory bandwidth dominate. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/Os interconnected by a routed fabric. FPGAs occupy the programmable logic layer of the broader semiconductor hierarchy: FPGA -> programmable logic -> digital IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are post-fabrication reprogrammable, enabling rapid prototyping, hardware acceleration, and design iteration. Key features of the EP3SL340F1517C2 include 13,500 Logic Array Blocks (LABs), dedicated 18x18 multipliers, high-speed transceivers, and hard memory controllers. The device targets -40C to +100C commercial operating range (C2 suffix indicates 0C to +85C commercial grade per Stratix III nomenclature) and supports flexible I/O standards including LVDS, LVCMOS, and HSTL on the 976 user I/O pins. The Stratix III L architecture uses an adaptive logic module (ALM) that packs combinational and register logic more efficiently than older 4-input LUT architectures, and a Partial Reconfiguration region manager that allows on-the-fly bitstream swapping. Compared with the Stratix II predecessor, the L family cuts dynamic power by up to 50 percent through programmable power technology that gates unused logic and routing. Typical applications include high-end wireline telecom line cards, software-defined radio baseband processing, ASIC prototyping platforms, broadcast video processing, and high-frequency trading accelerators. The 1517-ball FCBGA package supports dense signal breakout for high-pin-count system designs. When designing with this FPGA, ensure your PCB supports the FCBGA-1517 land pattern with proper microvia stack-up and matched-impedance routing. The Quartus II design suite is the official toolchain for synthesis, place-and-route, and bitstream generation, and is mandatory for configuration file compatibility. This page synthesizes distributor pricing, Stratix III L family alternatives, and practical PCB layout guidance not found in the manufacturer datasheet alone.

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EP3SL340F1517C2N - Stratix III L FPGA 337.5K LE 1517-FCBGA | Intel
EP3SL340F1517C2N

EP3SL340F1517C2N - Stratix III L FPGA 337.5K LE 1517-FCBGA | Intel

The Intel (formerly Altera) EP3SL340F1517C2N is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) housed in a 1517-ball FineLine BGA (FCBGA) package. Built on a TSMC 65 nm process, it integrates 337,500 logic elements, 18,821,184 bits of embedded memory, 13,500 adaptive logic modules (ALMs/LABs), and 976 user I/O pins, and is rated for a maximum core clock frequency of 600 MHz at a 1.1 V core supply. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that combines configurable logic blocks, programmable interconnects, and dedicated hardware resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit in the hierarchy of programmable logic devices (PLD) alongside CPLDs and are the densest members, used to implement custom parallel datapaths, protocol bridges, signal-processing pipelines, and ASIC prototyping. The Stratix III L sub-family is the lower-static-power variant of Stratix III, optimized for power-sensitive applications without sacrificing logic density or DSP capability. Key features of the EP3SL340F1517C2N include 384 18x18 multipliers (configurable as 192 36x36 multipliers) for high-throughput DSP workloads, fractional PLLs for multi-domain clock generation, programmable power technology that dynamically tunes logic and routing quiescent power, and partial reconfiguration support. The 1517-ball FCBGA package provides substantial I/O bandwidth for memory, networking, and parallel bus interfaces, while the C2 speed grade and 0 °C to +85 °C commercial operating temperature envelope target mainstream embedded and compute-acceleration platforms. The architecture uses 8-input adaptive look-up tables (ALUTs) inside ALMs, delivering roughly 1.4x the logic capacity of a comparable Stratix II design at lower power. Combined with dedicated hard IP for PCI Express Gen1/Gen2, multiple 10/100/1000 Ethernet MACs, and high-speed DDR3 memory controllers (via soft IP), the EP3SL340F1517C2N is well suited for telecom line cards, military radar, medical imaging, and high-end ASIC prototyping. Typical applications include digital signal processing, high-speed data acquisition, software-defined radio (SDR), video and image processing, network packet processing, and ASIC/ASSP emulation. It is also deployed in aerospace and defense beamforming systems and in industrial machine vision where parallel processing throughput outweighs the cost-per-volume penalty of an FPGA. When designing with this device, pay close attention to power integrity - the FCBGA's high I/O count demands a fully balled power/ground array and multiple decoupling tiers (0402/0201 ceramics plus bulk polymer). Use Altera's PowerPlay early power estimator and the Quartus II design tools (now Intel Quartus Prime) for place-and-route, timing closure, and SignalTap logic analysis. This page synthesizes distributor pricing, parametric history, drop-in same-family alternatives, and practical design notes that are not aggregated on any single distributor listing for the EP3SL340F1517C2N.

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