EPF10K130EFC484-3N vs EPF10K130EFC484-3 비교

다음의 상세 나란히 비교: EPF10K130EFC484-3N 제조: Intel 및 EPF10K130EFC484-3 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

사양 비교

파라미터 EPF10K130EFC484-3N EPF10K130EFC484-3
브랜드 Intel Intel
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 NRND NRND
재고 상태 In Stock In Stock
단가 (USD) $109.25 $178.92
Series FLEX-10KE —
Number of Logic Elements / Cells 6656 —
Total RAM Bits 65536 —
Typical Gate Count 130000 130,000 system gates
Number of I/O 369 —
Number of LABs/CLBs 832 —
Number of Embedded Array Blocks (EABs) 72 —
Speed Grade -3 (faster timing bin) -3
Operating Temperature Grade Commercial (0C to +70C) —
Core Voltage 2.5 V —
Process Technology 0.22 µm CMOS —
Package Type 484-BBGA (FineLine BGA) —
Package Dimensions 23 x 23 mm —
Ball Pitch 1.0 mm —
실장 유형 Surface Mount Surface Mount (BGA)
Configuration Memory SRAM-based (volatile, requires config device) —
RoHS 상태 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Configuration Interface JTAG / PS / PPS / Altera serial —
Family — FLEX 10KE
Logic Elements (LEs) — 6,656
Logic Array Blocks (LABs) — 832
Embedded Memory (EABs) — 16 x 4,096 bits (65,536 bits total)
Maximum User I/O — 369
Supply Voltage (Core) — 3.3 V
I/O Voltage Support — 5.0 V / 3.3 V / 2.5 V (multi-volt I/O)
Propagation Delay — 0.6 ns (per LE)
동작 온도 — 0 C to +70 C (commercial)
패키지 — 484-pin FBGA (FineLine BGA)
Configuration Method — SRAM-based, serial or parallel, requires external configuration device
Logic Family — CMOS (SRAM-based)

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